A defoaming LED glue filling and packaging device and method

Abstract

The application discloses a defoaming type LED glue pouring packaging equipment and method, and relates to the technical field of LED packaging. The equipment comprises a frame body, a conveying mechanism arranged on the top of the frame body, an operation panel fixedly arranged on the outer surface of the frame body, and a suction mechanism fixedly arranged in the frame body. An adjusting mechanism is fixedly arranged at the middle of the top of the frame body, and a glue pouring mechanism is arranged on the movable end of the adjusting mechanism. The defoaming type LED glue pouring packaging equipment utilizes negative pressure of the suction mechanism to suck the workpiece on the conveying mechanism, prevents displacement of the LED workpiece to be packaged during the glue pouring operation, and cooperates the flow dispersing piece and the anti-foaming piece to avoid the generation of micro air bubbles caused by the collision of the glue liquid. The problem that the glue body is easily sucked with air when freely falling in the prior art is solved. After the glue pouring is completed, the electric valve is immediately closed to quickly cut off the glue, the problem of glue body wire drawing, needle head residual glue attachment and accumulation is effectively avoided, and the overall glue pouring packaging operation efficiency and production stability are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, specifically to an anti-foaming LED potting and packaging equipment and method. Background Technology

[0002] LED potting encapsulation refers to the process of assembling a light-emitting diode chip with supporting circuits, heat dissipation structures, and other components, and then sealing it by dripping epoxy resin onto the electrodes of the LED chip to provide protection and heat dissipation. The potting encapsulation effect not only affects the appearance and optical performance of the LED, but also directly affects its service life and reliability. However, existing LED potting encapsulation equipment still has technical defects in actual use.

[0003] For example, an LED packaging device with publication number CN117790651A can seal the lower end of the dispensing needle to prevent glue leakage and alleviate stringing during dispensing. It also incorporates a vibration structure to help some large air bubbles rise through cylinder vibration. However, in actual use, this technology relies on manual injection of glue into the cartridge. During dispensing, the glue falls freely into the cartridge cavity, easily drawing in a large area of ​​outside air. This air mixes with the glue, forming numerous air bubbles of varying sizes. Vibration alone can only remove large air bubbles, failing to eliminate the tiny interlayered air bubbles generated by the glue flow. Furthermore, the device uses pneumatic extrusion for forced dispensing. Since the cartridge is a closed structure, the rising air bubbles cannot escape and remain trapped inside the glue reservoir. High-pressure extrusion also compresses these tiny air bubbles, which are ultimately coated onto the LED chip surface along with the dispensing process. This results in air pockets and internal cavities in the encapsulation glue, severely affecting the flatness and density of the encapsulation and reducing the quality of the finished LED package.

[0004] In addition, some traditional LED potting and encapsulation equipment commonly suffers from problems such as glue stringing and residual glue adhering to the needle during continuous operation. Long-term exposure of glue can cause it to solidify and clump at the dispensing port, resulting in poor dispensing and uneven dispensing. At the same time, traditional LED potting and encapsulation equipment lacks a workpiece fixing mechanism. During the potting process, the LED workpiece to be encapsulated is easily displaced by the dispensing force and slight vibration of the equipment, causing problems such as potting position deviation and uneven glue coating thickness, which significantly reduces the overall potting and encapsulation efficiency and production stability. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a defoaming LED potting and encapsulation device, comprising:

[0006] The frame and the conveying mechanism installed on its top, the outer surface of the frame is fixedly installed with an operation panel, and the inside of the frame is fixedly installed with an adsorption mechanism. The adsorption mechanism is used to adsorb the workpiece on the conveying mechanism by negative pressure to prevent the LED workpiece to be encapsulated from shifting during the potting process.

[0007] An adjustment mechanism is fixedly installed at the middle of the top of the frame. A glue-dispensing mechanism is installed at the movable end of the adjustment mechanism. The glue-dispensing mechanism is used to perform glue dispensing operations on the workpiece to be glued.

[0008] The dispensing mechanism includes a glue cylinder for collecting and encapsulating the adhesive. A feeding hopper is fixedly installed at the center of the top of the glue cylinder for manual dispensing of the adhesive. A sealing plug is provided at the top of the feeding hopper to seal the top of the hopper after dispensing, reducing contact between the adhesive and outside air and preventing oxidation and contamination of the adhesive by external dust. A flow guide groove is provided on the inner wall of the feeding hopper to divert and guide the adhesive. A flow diffuser and an anti-foaming device are fixedly installed at the top and bottom of the inner cavity of the feeding hopper, respectively. The glue cylinder has several components: a flow diffuser to buffer and disperse the poured glue, reducing the impact of the falling glue; an anti-foaming component to prevent multiple streams of glue from colliding and entangling each other, inhibiting the formation of interlayer bubbles; a glue dispensing component rotatably mounted at the bottom of the glue cylinder to achieve uniform glue delivery; a driving component mounted on the outer surface of the glue cylinder, which is compatible with the glue dispensing component and drives the glue dispensing component to rotate, achieving controllable glue dispensing; and a vent hole fixedly mounted on the upper surface of the glue cylinder to allow the rising air to escape smoothly and prevent bubbles from becoming trapped.

[0009] The anti-foaming component includes a column, on the bottom of which a conical ring is fixedly installed. The conical ring can divert and block multiple streams of adhesive falling along the guide channel, preventing them from colliding with each other and preventing air from being trapped at the intersection of the adhesive streams to form tiny interlayer bubbles. A fixing plate is fixedly installed on the edge of the conical ring, and the fixing plate is fixedly installed at the bottom of the guide channel. A material passage hole is opened at the axis of the column, which is used to allow the adhesive to flow into the dispensing component below.

[0010] Preferably, the inner diameter of the glue tube gradually decreases from top to bottom, and the guide grooves are evenly distributed along the axis of the glue tube. The gradual decrease in the inner diameter of the glue tube from top to bottom allows the glue to slowly and orderly settle through the guide grooves, avoiding the glue from falling rapidly and entraining air.

[0011] Preferably, the diffuser includes an arc-shaped disc, which is fixedly installed on the inner wall of the glue cylinder. The arc-shaped disc has an upwardly convex arc structure for receiving the poured glue. A guide block is fixedly installed on the upwardly convex surface of the arc-shaped disc. The guide block plays a role in blocking and diverting the glue, guiding the glue to spread evenly in all directions. A guide plate is fixedly installed at the edge of the arc-shaped disc.

[0012] The guide block and guide plate are spaced apart. The guide plate is located inside the guide channel. The guide plate can guide the colloid into the guide channel to realize the diversion and orderly delivery of the colloid.

[0013] Preferably, the dispensing component includes a storage cone shell, which is used to buffer and store the adhesive. The storage cone shell is rotatably mounted at the bottom of the adhesive cylinder. A spiral guide plate is fixedly installed on the inner wall of the storage cone shell to guide the flowing adhesive and prevent turbulent flow and foaming. A fixing rod is fixedly installed at the axis of the spiral guide plate. A spiral conveying plate is fixedly installed on the top of the outer surface of the fixing rod. An electric valve is installed at the bottom of the storage cone shell to control the start and stop of dispensing and prevent residual adhesive from dripping from the dispensing port and adhesive stringing. A toothed ring is fixedly installed at the edge of the top of the storage cone shell.

[0014] Preferably, the spiral guide plate is disposed inside the material passage hole, and the spiral guide plate is sealed and adapted to the inner wall of the material passage hole. The spiral conveying plate rotates synchronously with the storage cone shell to realize the uniform downward conveying of the colloid.

[0015] Preferably, the driving component includes a frame plate, which is fixedly installed on the outer surface of the rubber cylinder. A motor is fixedly installed on the inner curved surface of the frame plate via a bracket. A gear is fixedly installed at the output end of the motor, and the gear meshes with a gear ring. Through the meshing of the gear and the gear ring, the rubber cylinder is driven to rotate stably as a whole.

[0016] Preferably, the conveying mechanism includes a motor and a drive shaft. The motor is fixedly mounted on the outer surface of the frame via a bracket. The drive shaft is rotatably mounted at both ends of the frame. One of the drive shafts is fixedly connected to the output end of the motor. A conveying roller is fixedly mounted on the outer surface of the drive shaft. A conveyor belt is drivenly mounted on the outer surface of the conveying roller. Adsorption holes are provided on the surface of the conveyor belt. The motor drives the drive shaft to rotate. The conveying roller and the conveyor belt work together to realize the automatic and continuous conveying of LED workpieces. The adsorption holes work together with the adsorption mechanism to realize the negative pressure fixation of the workpieces.

[0017] Preferably, the adsorption mechanism includes a negative pressure chamber, which is fixedly installed inside the frame. The top of the negative pressure chamber is pressed and adapted to the inner side of the conveyor belt. An air inlet is provided on the top of the negative pressure chamber. The negative pressure chamber is used to generate negative pressure suction. The air inlet connects the negative pressure chamber and the adsorption hole. The negative pressure suction is used to adsorb and fix the LED workpiece on the surface of the conveyor belt, preventing the workpiece from being displaced or shifted due to impact or vibration during glue dispensing.

[0018] Preferably, the adjustment mechanism includes a stand and a second motor. The second motor is fixedly mounted on the outer surface of the stand via a bracket. A lead screw is fixedly connected to the output end of the second motor. A guide rail is fixedly mounted on the inner side of the stand. A transmission block is drivenly mounted on the outer surface of the lead screw. The transmission block is slidably mounted inside the guide rail. A conical ring frame is fixedly mounted on the outer surface of the transmission block. The conical ring frame is fixedly mounted on the outer surface of the glue cylinder. The conical ring frame is used to fix the glue dispensing mechanism, thereby realizing the overall position adjustment of the glue dispensing mechanism to adapt to the glue dispensing needs of different positions.

[0019] A method for using a defoaming LED potting and encapsulation equipment comprises the following steps:

[0020] S1. Open the sealing plug and pour the encapsulating colloid into the feed hopper. The colloid first falls onto the arc-shaped plate. After being blocked and diverted by the guide block, it is guided into the guide groove along the guide plate. Multiple streams of colloid flow downwards along the guide groove. When it falls to the bottom, it is blocked and diverted by the cone ring. After the liquid level gradually rises, it flows into the colloid through the material passage. After the colloid is filled, close the sealing plug.

[0021] S2. Place the LED workpiece to be packaged on the surface of the conveyor belt, start motor one, motor one drives the transmission shaft and conveyor roller to rotate, drive the conveyor belt to move at a constant speed. When the area of ​​the LED workpiece to be potted moves to the bottom of the potting mechanism, motor one stops running. The negative pressure chamber generates negative pressure suction through the air inlet and adsorption hole to adsorb and fix the workpiece under negative pressure, preventing the workpiece from shifting during the potting process.

[0022] S3. Start motor two. Motor two drives the lead screw to rotate. Under the limiting and guiding action of the guide rail, the transmission block drives the conical ring frame and the overall glue dispensing mechanism to adjust the horizontal position to ensure accurate glue dispensing position.

[0023] S4. Start motor three. Motor three drives the gear meshing drive gear ring, so that the storage cone shell rotates as a whole. The spiral conveyor plate rotates synchronously, pushing the colloid downward to convey it. At the same time, the electric valve is opened to perform fixed-point glue filling.

[0024] This invention provides a defoaming LED potting and encapsulation device. It has the following beneficial effects:

[0025] (I) This defoaming LED potting and encapsulation equipment, through the setting of the diffuser and the anti-foaming component, allows the colloid to fall onto the arc-shaped plate during the filling process. Then, the colloid is evenly distributed into the guide channel by the guide block and guide plate and flows slowly. After the colloid reaches the end, it is blocked and distributed by the conical ring to avoid multiple colloids from entraining and absorbing air. After the liquid level rises steadily, the colloid flows out through the material passage and is stored inside the colloid. The diffuser and the anti-foaming component can significantly reduce the air entrainment from the source of colloid filling, effectively avoiding the generation of tiny interlayer bubbles caused by the convergence and collision of colloids. This solves the problem that the free fall of colloid in existing equipment easily entrains air, resulting in air pockets and cavities in the encapsulated colloid, which affects the flatness and structural density of the encapsulation. This significantly improves the quality of LED potting and encapsulation.

[0026] (II) This defoaming LED potting and encapsulation equipment, through the setting of the dispensing part and the vent hole, the gear meshing gear ring drives the entire material storage cone to rotate, and the spiral conveying plate pushes the glue downwards at a low pressure and uniform speed, which will not cause secondary squeezing and compression of residual micro air bubbles. At the same time, the vent hole solves the defects of traditional sealed glue storage chambers where air bubbles cannot be discharged and high pressure squeezing compresses air bubbles, causing air bubbles to be dispensed and encapsulated on the surface of LED chips along with glue, thus improving the reliability of LED encapsulation products.

[0027] (III) This defoaming LED potting and encapsulation equipment uses an electric valve to control the dispensing of adhesive. When potting begins, the electric valve opens and dispenses adhesive normally. After potting is completed, the electric valve closes immediately to quickly stop the dispensing. This effectively avoids problems such as adhesive stringing and residual adhesive buildup on the needle tip. It solves the problems of poor dispensing and uneven dispensing in traditional potting equipment during continuous operation, and greatly improves the overall potting and encapsulation efficiency and production stability.

[0028] (iv) The defoaming LED potting and encapsulation equipment, through the coordinated setting of the conveying mechanism and the adsorption mechanism, the LED workpiece to be encapsulated is conveyed to the designated potting station by the conveyor belt and then stops moving. The negative pressure chamber generates negative pressure suction through the air inlet and adsorbs and fixes the workpiece through the adsorption hole, so that the workpiece remains stable in position throughout the potting process and will not be displaced or skewed due to the dispensing force and slight vibration of the equipment. This solves the problem of easy workpiece displacement during traditional LED potting and encapsulation and effectively improves the potting position accuracy. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the appearance of the present invention;

[0031] Figure 3 This is a schematic diagram of the conveying mechanism structure of the present invention;

[0032] Figure 4 This is a schematic diagram of the adsorption mechanism of the present invention;

[0033] Figure 5 This is a diagram showing the positional relationship between the adjusting mechanism and the dispensing mechanism of the present invention;

[0034] Figure 6 This is a schematic diagram of the glue-dispensing mechanism of the present invention;

[0035] Figure 7 This is a partial cross-sectional view of the glue-dispensing mechanism of the present invention;

[0036] Figure 8 This is a schematic diagram of the diffuser structure of the present invention;

[0037] Figure 9 This is a schematic diagram of the anti-foaming component structure of the present invention;

[0038] Figure 10 This is a schematic diagram of the adhesive dispensing component structure of the present invention;

[0039] Figure 11 This is a schematic diagram of the driving component structure of the present invention.

[0040] In the diagram: 1. Frame; 2. Conveying mechanism; 21. Motor 1; 22. Drive shaft; 23. Conveying roller; 24. Conveyor belt; 25. Adsorption hole; 3. Adsorption mechanism; 31. Negative pressure chamber; 32. Air inlet; 4. Adjusting mechanism; 41. Vertical frame; 42. Motor 2; 43. Guide rail; 44. Lead screw; 45. Transmission block; 46. Conical ring frame; 5. Glue dispensing mechanism; 51. Glue cylinder; 52. Feed hopper; 53. Sealing plug; 54. Guide channel; 55. Dispersant; 51. Arc-shaped disc; 552. Guide block; 553. Guide plate; 56. Anti-foaming component; 561. Column; 562. Through hole; 563. Conical ring; 564. Fixing plate; 57. Dispensing component; 571. Storage cone shell; 572. Spiral guide plate; 573. Gear ring; 574. Fixing rod; 575. Spiral conveying plate; 576. Electric valve; 58. Vent hole; 59. Drive component; 591. Frame plate; 592. Motor 3; 593. Gear; 6. Operation panel. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings.

[0042] Example 1, please refer to Figure 1-4 This invention provides a technical solution: a defoaming LED potting and encapsulation device, comprising:

[0043] The frame 1 and the conveying mechanism 2 installed on its top are equipped with an operation panel 6 fixedly installed on the outer surface of the frame 1 and an adsorption mechanism 3 fixedly installed inside the frame 1. The adsorption mechanism 3 is used to adsorb the workpiece on the conveying mechanism 2 by negative pressure to prevent the LED workpiece to be encapsulated from shifting during the potting process.

[0044] The conveying mechanism 2 includes a motor 21 and a drive shaft 22. The motor 21 is fixedly mounted on the outer surface of the frame 1 by a bracket. The drive shaft 22 is rotatably mounted at both ends of the frame 1. One of the drive shafts 22 is fixedly connected to the output end of the motor 21. A conveying roller 23 is fixedly mounted on the outer surface of the drive shaft 22. A conveyor belt 24 is drivenly mounted on the outer surface of the conveying roller 23. An adsorption hole 25 is opened on the surface of the conveyor belt 24. The motor 21 drives the drive shaft 22 to rotate. The conveying roller 23 and the conveyor belt 24 work together to realize the automatic and continuous conveying of LED workpieces. The adsorption hole 25 work together with the adsorption mechanism 3 to realize the negative pressure fixation of the workpiece.

[0045] The adsorption mechanism 3 includes a negative pressure chamber 31, which is fixedly installed inside the frame 1. The top of the negative pressure chamber 31 is pressed and adapted to the inner side of the conveyor belt 24. An air inlet 32 ​​is provided on the top of the negative pressure chamber 31. The negative pressure chamber 31 is used to generate negative pressure suction. The air inlet 32 ​​connects the negative pressure chamber 31 and the adsorption hole 25. The negative pressure suction is used to adsorb and fix the LED workpiece on the surface of the conveyor belt 24 to prevent the workpiece from being displaced or shifted due to impact or vibration during glue dispensing.

[0046] Adjustment mechanism 4 is fixedly installed at the middle of the top of frame 1. The movable end of adjustment mechanism 4 is equipped with glue dispensing mechanism 5, which is used to dispense glue to the workpiece to be dispensed.

[0047] Example 2, based on Example 1, please refer to... Figure 5-7 As shown, the adjustment mechanism 4 includes a stand 41 and a second motor 42. The second motor 42 is fixedly mounted on the outer surface of the stand 41 by a bracket. A lead screw 44 is fixedly connected to the output end of the second motor 42. A guide rail 43 is fixedly mounted on the inner side of the stand 41. A transmission block 45 is drivenly mounted on the outer surface of the lead screw 44. The transmission block 45 is slidably mounted inside the guide rail 43. A conical ring frame 46 is fixedly mounted on the outer surface of the transmission block 45. The conical ring frame 46 is fixedly mounted on the outer surface of the glue cylinder 51. The conical ring frame 46 is used to fix the glue dispensing mechanism 5, thereby realizing the overall position adjustment of the glue dispensing mechanism 5 to adapt to the glue dispensing needs of different positions.

[0048] The dispensing mechanism 5 includes a glue cylinder 51 for collecting and storing the encapsulating glue. A feed hopper 52 is fixedly installed at the middle of the top of the glue cylinder 51 for manual glue dispensing. A sealing plug 53 is provided at the top of the feed hopper 52 to seal the top of the feed hopper 52 after dispensing, reducing the contact between the glue and the outside air and preventing the glue from oxidizing and being mixed with external dust. A guide groove 54 is provided on the inner wall of the feed hopper 52 to divert and guide the glue. A diffuser 55 and an anti-foaming component 56 are fixedly installed at the top and bottom of the inner cavity of the feed hopper 52, respectively. The diffuser 55 is used to buffer and disperse the poured colloid, and to dissipate the impact force of the falling colloid. The anti-foaming component 56 is used to block the collision and entrainment of multiple colloids and to suppress the formation of interlayer bubbles. The bottom of the glue cylinder 51 is rotatably equipped with a glue dispensing component 57, which is used to achieve uniform glue feeding. The outer surface of the glue cylinder 51 is equipped with a drive component 59, which is matched with the glue dispensing component 57. The drive component 59 is used to drive the glue dispensing component 57 to rotate, so as to achieve controllable glue dispensing. The upper surface of the glue cylinder 51 is fixedly equipped with a vent hole 58, which allows the rising air to be discharged smoothly and prevents bubbles from being trapped.

[0049] The inner diameter of the glue tube 51 gradually decreases from top to bottom, and the guide grooves 54 are evenly distributed along the axis of the glue tube 51. The gradual decrease in the inner diameter of the glue tube 51 from top to bottom allows the glue to slowly and orderly settle through the guide grooves 54, avoiding the glue from falling rapidly and entraining air.

[0050] Example 3, based on Examples 1 and 2, please refer to... Figure 8-11 As shown, the anti-foaming component 56 includes a column 561. A conical ring 563 is fixedly installed on the bottom of the outer surface of the column 561. The conical ring 563 can divert and block multiple streams of adhesive falling along the guide channel 54, prevent multiple streams of adhesive from colliding with each other, and prevent air from being trapped at the intersection of the adhesive streams to form tiny interlayer bubbles. A fixing plate 564 is fixedly installed on the edge of the conical ring 563. The fixing plate 564 is fixedly installed at the bottom end of the guide channel 54. A material passage hole 562 is opened at the axis of the column 561. The material passage hole 562 is used to allow the adhesive to flow into the lower dispensing component 57.

[0051] The diffuser 55 includes an arc-shaped disk 551, which is fixedly installed on the inner wall of the glue cylinder 51. The arc-shaped disk 551 adopts an upwardly convex arc structure to receive the poured glue. A guide block 552 is fixedly installed on the upwardly convex surface of the arc-shaped disk 551. The guide block 552 plays the role of blocking and diverting the glue, guiding the glue to spread evenly in all directions. A guide plate 553 is fixedly installed at the edge of the arc-shaped disk 551.

[0052] The guide block 552 and the guide plate 553 are arranged at intervals. The guide plate 553 is located inside the guide channel 54. The guide plate 553 can guide the colloid into the guide channel 54 to realize the diversion and orderly delivery of the colloid.

[0053] The dispensing component 57 includes a storage cone shell 571, which is used to buffer and store the adhesive. The storage cone shell 571 is rotatably installed at the bottom of the glue cylinder 51. A spiral guide plate 572 is fixedly installed on the inner wall of the storage cone shell 571. The spiral guide plate 572 is used to guide the flowing adhesive and prevent the adhesive from flowing turbulently and forming bubbles. A fixing rod 574 is fixedly installed at the axis of the spiral guide plate 572. A spiral conveying plate 575 is fixedly installed on the top of the outer surface of the fixing rod 574. An electric valve 576 is installed at the bottom of the storage cone shell 571. The electric valve 576 controls the start and stop of dispensing and prevents residual adhesive from dripping from the dispensing port and adhesive from stringing. A toothed ring 573 is fixedly installed at the edge of the top of the storage cone shell 571.

[0054] The spiral guide plate 572 is set inside the feed hole 562, and the spiral guide plate 572 is sealed and adapted to the inner wall of the feed hole 562. The spiral conveying plate 575 rotates synchronously with the storage cone shell 571 to realize the uniform downward conveying of the colloid.

[0055] The driving component 59 includes a frame plate 591, which is fixedly installed on the outer surface of the rubber cylinder 51. A motor 592 is fixedly installed on the inner curved surface of the frame plate 591 through a bracket. A gear 593 is fixedly installed at the output end of the motor 592. The gear 593 meshes with a gear ring 573. Through the meshing of the gear 593 and the gear ring 573, the rubber dispensing component 57 is driven to rotate stably as a whole.

[0056] A method for using a defoaming LED potting and encapsulation equipment comprises the following steps:

[0057] S1. Open the sealing plug 53 and pour the encapsulating colloid into the feed hopper 52. The colloid first falls onto the arc plate 551. After being blocked and diverted by the guide block 552, it is guided into the guide groove 54 along the guide plate 553. Multiple streams of colloid flow downward along the guide groove 54. When it falls to the bottom, it is blocked and diverted by the cone ring 563. After the liquid level of the colloid is gradually raised, it flows into the colloid part 57 through the feed hole 562. After the colloid is injected, close the sealing plug 53.

[0058] S2. Place the LED workpiece to be packaged on the surface of the conveyor belt 24, start the motor 21, the motor 21 drives the transmission shaft 22 and the conveyor roller 23 to rotate, and drive the conveyor belt 24 to move at a constant speed. When the area of ​​the LED workpiece to be potted moves directly below the potting mechanism 5, the motor 21 stops running. The negative pressure chamber 31 generates negative pressure suction through the air inlet 32 ​​and the adsorption hole 25 to adsorb and fix the workpiece under negative pressure, preventing the workpiece from shifting during the potting process.

[0059] S3. Start motor 42. Motor 42 drives lead screw 44 to rotate. Under the limiting and guiding action of guide rail 43, transmission block 45 drives tapered ring frame 46 and overall glue dispensing mechanism 5 to adjust the horizontal position to ensure accurate glue dispensing position.

[0060] S4. Start motor 3 592. Motor 3 592 drives gear 593 to mesh with drive gear ring 573, causing the storage cone shell 571 to rotate as a whole. The spiral conveyor plate 575 rotates synchronously, pushing the colloid downwards. Simultaneously, the electric valve 576 is opened for fixed-point dispensing.

[0061] During use, the operator pours the epoxy resin colloid for LED encapsulation into the feed hopper 52. The injected colloid first falls onto the arc-shaped disk 551. The convex arc structure of the arc-shaped disk 551 buffers the impact of the falling colloid. With the help of the guide block 552 to block and limit the flow, the colloid spreads evenly in all directions. The spread colloid is then guided into the guide groove 54 along the guide plate 553 on the edge of the arc-shaped disk 551. The glue cylinder 51 adopts a conical structure with the inner diameter gradually shrinking from top to bottom, so that the multiple streams of colloid after diversion can flow smoothly along the guide groove 54, effectively slowing down the falling speed of the colloid.

[0062] When the colloid flows to the bottom of the guide channel 54, it impacts the surface of the cone ring 563. The cone-shaped structure of the cone ring 563 guides the multiple downward flow of colloid, preventing them from merging and forming air bubbles. As the colloid is continuously injected, the colloid level inside the colloid cylinder 51 gradually rises. When the level exceeds the top of the column 561, the colloid automatically flows downward through the feed hole 562 and enters the storage cone shell 571 inside the dispensing part 57 for storage. After the colloid injection is completed, the sealing plug 53 is closed again to reduce the contact between the colloid and the outside air.

[0063] After the glue injection is completed, the operator places the LED encapsulation workpiece to be processed on the surface of the conveyor belt 24 and starts the motor 21. The output end of the motor 21 drives the transmission shaft 22 to rotate synchronously, and drives the conveyor belt 24 to run through the conveyor roller 23. When the LED workpiece moves to the designated glue injection area directly below the glue injection mechanism 5, the motor 21 stops running and starts the adsorption mechanism 3. The negative pressure chamber 31 works to generate a stable negative pressure. The negative pressure airflow passes through the air inlet 32 ​​and connects to the adsorption hole 25, thereby forming a uniform negative pressure adsorption on the LED workpiece on the conveyor belt 24 and restricting the displacement of the workpiece.

[0064] After the workpiece is fixed, start motor 42. Motor 42 drives lead screw 44 to rotate, causing transmission block 45 to move along guide rail 43. Simultaneously, it drives tapered ring frame 46 and glue dispensing mechanism 5 to make fine-tuning of their positions, ensuring accurate glue dispensing position in the future.

[0065] Start motor 592, which drives gear 593 to rotate continuously. Gear 593 meshes with the toothed ring 573 at the top of the storage cone 571, thereby driving the entire dispensing part 57 to rotate stably. The spiral guide plate 572 guides the glue to avoid turbulent flow and regeneration of air bubbles. At the same time, the spiral conveying plate 575 on the outside of the fixing rod 574 rotates synchronously with the storage cone 571, so that the glue is conveyed downward. Open the electric valve 576, and the glue drips quantitatively from the dispensing port of the electric valve 576 to coat the LED chip, completing the sealing and potting process.

[0066] After the glue-filling process of a single workpiece is completed, the electric valve 576 is closed to quickly cut off the flow of glue, prevent residual glue from dripping, stringing and sticking to the wall, and complete the defoaming glue-filling and encapsulation operation of a single complete LED workpiece.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A defoaming LED potting and encapsulation equipment, characterized in that, include: The frame (1) and the conveying mechanism (2) installed on its top, the outer surface of the frame (1) is fixedly installed with an operation panel (6), and the inside of the frame (1) is fixedly installed with an adsorption mechanism (3). Adjustment mechanism (4), the adjustment mechanism (4) is fixedly installed at the middle of the top of the frame (1), and the movable end of the adjustment mechanism (4) is equipped with a glue-drinking mechanism (5). The glue dispensing mechanism (5) includes a glue cylinder (51), a feed hopper (52) is fixedly installed at the middle of the top of the glue cylinder (51), a sealing plug (53) is provided at the top of the feed hopper (52), a guide groove (54) is provided on the inner wall of the feed hopper (52), a diffuser (55) and an anti-foaming component (56) are fixedly installed at the top and bottom of the inner cavity of the feed hopper (52) respectively, a glue dispensing component (57) is rotatably installed at the bottom of the glue cylinder (51), a driving component (59) is installed on the outer surface of the glue cylinder (51), the driving component (59) is adapted to the glue dispensing component (57), and a vent hole (58) is fixedly installed on the upper surface of the glue cylinder (51). The anti-foaming component (56) includes a column (561), a conical ring (563) is fixedly installed on the bottom of the outer surface of the column (561), a fixing plate (564) is fixedly installed on the edge of the conical ring (563), the fixing plate (564) is fixedly installed at the bottom end of the guide groove (54), and a material passage hole (562) is opened at the axis of the column (561).

2. The defoaming LED potting and encapsulation equipment according to claim 1, characterized in that: The inner diameter of the rubber tube (51) gradually decreases from top to bottom, and the guide groove (54) is evenly distributed along the axis of the rubber tube (51).

3. The defoaming LED potting and encapsulation equipment according to claim 2, characterized in that: The diffuser (55) includes an arc-shaped disk (551), which is fixedly installed on the inner wall of the rubber cylinder (51). A guide block (552) is fixedly installed on the upper convex surface of the arc-shaped disk (551), and a guide plate (553) is fixedly installed at the edge of the arc-shaped disk (551). The guide block (552) and the guide plate (553) are spaced apart, and the guide plate (553) is located inside the guide groove (54).

4. The defoaming LED potting and encapsulation equipment according to claim 3, characterized in that: The dispensing component (57) includes a storage cone shell (571), which is rotatably mounted on the bottom of the glue cylinder (51). A spiral guide plate (572) is fixedly installed on the inner wall of the storage cone shell (571). A fixing rod (574) is fixedly installed at the axis of the spiral guide plate (572). A spiral conveying plate (575) is fixedly installed on the top of the outer surface of the fixing rod (574). An electric valve (576) is installed at the bottom end of the storage cone shell (571). A toothed ring (573) is fixedly installed at the edge of the top of the storage cone shell (571).

5. The defoaming LED potting and encapsulation equipment according to claim 4, characterized in that: The spiral guide plate (572) is disposed inside the feed hole (562), and the spiral guide plate (572) is sealed and adapted to the inner wall of the feed hole (562).

6. The defoaming LED potting and encapsulation equipment according to claim 5, characterized in that: The drive unit (59) includes a frame plate (591), which is fixedly installed on the outer surface of the rubber cylinder (51). The inner curved surface of the frame plate (591) is fixedly installed with a motor (592) by a bracket. The output end of the motor (592) is fixedly installed with a gear (593), which meshes with a gear ring (573).

7. The defoaming LED potting and encapsulation equipment according to claim 6, characterized in that: The conveying mechanism (2) includes a motor (21) and a drive shaft (22). The motor (21) is fixedly mounted on the outer surface of the frame (1) by a bracket. The drive shaft (22) is rotatably mounted on both ends of the frame (1). One of the drive shafts (22) is fixedly connected to the output end of the motor (21). A conveying roller (23) is fixedly mounted on the outer surface of the drive shaft (22). A conveyor belt (24) is drivenly mounted on the outer surface of the conveyor roller (23). An adsorption hole (25) is opened on the surface of the conveyor belt (24).

8. The defoaming LED potting and encapsulation equipment according to claim 7, characterized in that: The adsorption mechanism (3) includes a negative pressure chamber (31), which is fixedly installed inside the frame (1). The top of the negative pressure chamber (31) is squeezed and adapted to the inner side of the conveyor belt (24). An air inlet (32) is provided on the top of the negative pressure chamber (31).

9. The defoaming LED potting and encapsulation equipment according to claim 8, characterized in that: The adjustment mechanism (4) includes a stand (41) and a second motor (42). The second motor (42) is fixedly installed on the outer surface of the stand (41) by a bracket. A lead screw (44) is fixedly connected to the output end of the second motor (42). A guide rail (43) is fixedly installed on the inner side of the stand (41). A transmission block (45) is driven on the outer surface of the lead screw (44). The transmission block (45) is slidably installed inside the guide rail (43). A conical ring frame (46) is fixedly installed on the outer surface of the transmission block (45). The conical ring frame (46) is fixedly installed on the outer surface of the rubber cylinder (51).

10. The defoaming LED potting and encapsulation equipment according to claim 9 is further described in a method of using the defoaming LED potting and encapsulation equipment, characterized in that... It consists of the following steps: S1. Open the sealing plug (53) and pour the encapsulating colloid into the feed hopper (52). The colloid first falls onto the arc plate (551). After being blocked and diverted by the guide block (552), it is guided into the guide groove (54) along the guide plate (553). Multiple streams of colloid flow downward along the guide groove (54). When it falls to the bottom, it is blocked and diverted by the cone ring (563). After the liquid level gradually rises, it flows into the colloid part (57) through the feed hole (562). After the colloid is injected, close the sealing plug (53). S2. Place the LED workpiece to be packaged on the surface of the conveyor belt (24), start the motor (21), the motor (21) drives the transmission shaft (22) and the conveyor roller (23) to rotate, and drive the conveyor belt (24) to move at a constant speed. When the area of ​​the LED workpiece to be potted moves to the bottom of the potting mechanism (5), the motor (21) stops running. The negative pressure chamber (31) generates negative pressure suction through the air inlet (32) and the adsorption hole (25) to perform negative pressure adsorption and fixation on the workpiece to prevent the workpiece from shifting during the potting process. S3. Start motor two (42). Motor two (42) drives the lead screw (44) to rotate. Under the limiting and guiding action of the guide rail (43), the transmission block (45) drives the conical ring frame (46) and the overall glue dispensing mechanism (5) to adjust the horizontal position to ensure accurate glue dispensing position. S4. Start motor three (592). Motor three (592) drives gear (593) to mesh with drive gear ring (573), causing the storage cone shell (571) to rotate as a whole. The spiral conveyor plate (575) rotates synchronously, pushing the colloid downwards and simultaneously opening the electric valve (576) for fixed-point glue filling.

Images