Bonding device

Abstract

The application relates to a bonding device, which comprises a beam, a slide and a bonding head. The slide comprises a first slide, a second slide and a flexible centering piece. The first slide and the second slide are arranged in an up-down interval. The flexible centering piece has a rigidity in a length direction greater than that in other directions, so that the first slide and the second slide move synchronously in the length direction. The bonding head comprises a first bonding head and a second bonding head arranged in a vertical direction. The first bonding head is arranged on the first slide, and the second bonding head is arranged on the second slide. In this way, the bonding precision of the electronic product can be improved. Moreover, the first slide and the second slide have good alignment performance under the action of the flexible centering piece.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to bonding devices. Background Technology

[0002] In advanced semiconductor packaging manufacturing, particularly in thermocompression bonding (TCB) and hybrid bonding, electronic components (e.g., chips) must be placed on a substrate with in-plane mounting precision on the order of hundreds of nanometers, while bonding forces on the order of tens to hundreds of Newtons are applied to the electronic components via bonding tools. In bonding apparatuses of related technologies, bonding tools for picking up and holding electronic components and actuators for applying bonding forces are mounted on a common bonding head. This bonding head is supported by a single integral carriage that moves along a crossbeam. Under the action of bonding forces, each structural component along the load path from the bonding tool to the ground undergoes elastic deformation. Since the bonding tool and actuator share the same carriage, and the carriage is slidably mounted on a single integral crossbeam, any such elastic deformation along the bonding force axis inevitably leads to parasitic deformation perpendicular to the bonding force axis. This parasitic deformation propagates in the form of in-plane displacement of the bonding tool relative to the substrate. This parasitic displacement sets a lower limit on the achievable in-plane mounting accuracy, resulting in lower bonding accuracy for the product, which cannot meet users' high requirements for bonding accuracy. Summary of the Invention

[0003] Therefore, it is necessary to provide a bonding device that improves the bonding accuracy of products in order to solve at least one problem in the related technology.

[0004] This application provides a bonding device, comprising:

[0005] The crossbeam includes a first split beam and a second split beam arranged at an interval between the upper and lower parts, with the first split beam located above the second split beam;

[0006] A carriage, comprising a first sliding frame, a second sliding frame, and a flexible centering member, wherein the first sliding frame and the second sliding frame are arranged vertically at intervals; the first sliding frame is slidably disposed on a first split beam along the length direction of the crossbeam, and the second sliding frame is slidably disposed on a second split beam along the length direction; the first sliding frame is connected to the second sliding frame via the flexible centering member; the flexible centering member has a stiffness greater along the length direction than in other directions, so that the first sliding frame and the second sliding frame move synchronously along the length direction; and

[0007] A bonding head, comprising a first bonding head and a second bonding head arranged sequentially in a vertical direction; the first bonding head is correspondingly disposed on the first sliding frame, and the second bonding head is correspondingly disposed on the second sliding frame; the first bonding head is used to apply bonding force to the second bonding head; the second bonding head can apply the bonding force to the electronic component below.

[0008] In one embodiment, the flexible centering member can attenuate vibrations and elastic deformations transmitted from the first sliding frame to the second sliding frame in various directions perpendicular to the length direction.

[0009] In one embodiment, the flexible centering element includes at least one or any combination of an elastic sheet, an elastic pad, and a flexible hinge.

[0010] In one embodiment, the elastic sheet is arc-shaped, and its two ends along its bending direction are respectively connected to the first sliding frame and the second sliding frame; or, the elastic sheet includes two elastic parts arranged at an angle and connected to each other, and the ends of the two elastic parts away from each other are respectively connected to the first sliding frame and the second sliding frame; or, the elastic sheet includes a main body and two connecting parts connected to the main body, and the two connecting parts are respectively connected to the first sliding frame and the second sliding frame, the main body is flat, the connecting parts are arc-shaped, and the two connecting parts are bent toward each other.

[0011] In one embodiment, at least two flexible centering members are provided, and the at least two flexible centering members are symmetrically arranged about the central axis of the carriage.

[0012] In one embodiment, the bonding device further includes a first power mechanism, which is mounted on at least one of the first split beam and the second split beam. The first power mechanism is connected to at least one of the first sliding frame and the second sliding frame. The first power mechanism is used to drive the first sliding frame and the second sliding frame to move along the length direction to adjust their positions along the length direction.

[0013] In one embodiment, the bonding device further includes a force transmitter connected to the first bonding head or the second bonding head and disposed between the first bonding head and the second bonding head to transmit the bonding force applied by the first bonding head to the second bonding head in the vertical direction, and the force transmitter does not provide mechanical constraints in any other direction besides the vertical direction.

[0014] In one embodiment, the bonding device further includes a support structure, to which both the first split beam and the second split beam are connected.

[0015] In one embodiment, there are two support structures, with the two ends of the first split beam and the second split beam respectively connected to the two support structures one-to-one.

[0016] In one embodiment, the support structure includes a first support member and a second support member spaced apart, the first support member being connected to the first split beam, and the second support member being connected to the second split beam.

[0017] In one embodiment, the bonding device further includes a slide, the bottom of the support structure is connected to the slide, and the top of the support structure is connected to the first split beam and the second split beam.

[0018] In one embodiment, the slide includes a first slide and a second slide arranged at intervals; the first support is connected to the first slide, and the second support is connected to the second slide.

[0019] In one embodiment, the first bonding head includes a first slider, a first worktable, and an actuator. The first slider is slidably disposed on the first sliding frame along the vertical direction. The first worktable is connected to the first slider and can drive the first slider to move and adjust its position along the vertical direction. The actuator is connected to the first worktable or the first slider and can apply a downward bonding force to the first worktable. The force transmission element is disposed at the bottom of the first worktable.

[0020] In one embodiment, the second bonding head includes a second slider, a second worktable, and a bonding tool; the second slider is slidably disposed on the second sliding frame along the vertical direction, the second worktable is connected to the second slider, the second worktable can drive the second slider to move and adjust its position along the vertical direction, the force transmission element is disposed on the top of the second worktable, the bonding tool is installed on the bottom of the second worktable, and the bonding tool is used to adsorb and hold the electronic component.

[0021] In one embodiment, the first bonding head further includes at least two off-axis vertical force applicators, each of which is connected to at least one of the first slider and the first worktable. The off-axis vertical force applicators are offset from the central axis of the first worktable and can apply a bonding force in the vertical direction to the first worktable.

[0022] In one embodiment, at least two of the off-axis vertical force applicators are symmetrically arranged about the central axis of the first worktable.

[0023] In one embodiment, the bonding apparatus further includes a stage located below the second bonding head, the stage being used to support the substrate and electronic components.

[0024] In one embodiment, the ratio of the stiffness of the flexible centering member along the length direction to the stiffness in each of the five degrees of freedom perpendicular to the length direction is 100 to 500.

[0025] In one embodiment, the damping ratio of the flexible centering member is ≥0.05 in at least one of the five degrees of freedom perpendicular to the length direction, and the damping is provided by one or more of the following: the inherent material damping of the flexible centering member, a viscoelastic damping layer integrated therewith, a constraint damping layer applied thereon, and a viscous damper arranged in parallel therewith.

[0026] In the aforementioned bonding device, the crossbeam, carriage, and bonding head are not designed as a single unit, but rather as separate units. This allows the first bonding head to provide downward bonding force during bonding, which is then transmitted to the electronic component below via the second bonding head, thus completing the bonding between the electronic component and the substrate. Furthermore, during the bonding process, the bonding force load path primarily transmits through the second bonding head, first bonding head, first carriage, and first separate beam sequentially to the first separate beam. The bonding force load path does not transmit to the second carriage or second separate beam, effectively preventing torsional deformation of the second bonding head, second carriage, and second separate beam. In other words, by decoupling the second bonding head from the bonding force load path at the structural level, the elastic and thermal deformation of the bonding force-bearing structural chain does not propagate to the second bonding head via any rigid mechanical path. This prevents displacement or orientation errors of the electronic component during the bonding process, improving the bonding accuracy of electronic products. Furthermore, when the first bonding head and the second bonding head move synchronously along the length direction, the first sliding frame and the second sliding frame are aligned in the vertical direction under the action of the flexible centering member, which is conducive to the alignment of the first bonding head and the second bonding head in the vertical direction and can be positioned at the target position, thereby further improving the accuracy, simplifying the structure and reducing the cost. Attached Figure Description

[0027] Figure 1 This is a structural diagram of the bonding device according to the first embodiment of this application.

[0028] Figure 2 This is a side view of the bonding device according to the first embodiment of this application.

[0029] Figure 3 This is a structural diagram of the carriage and flexible centering member in the bonding device of the first embodiment of this application.

[0030] Figure 4 for Figure 3 A side view of one embodiment.

[0031] Figure 5 for Figure 3 A side view of another embodiment.

[0032] Figure 6 for Figure 3 A side view of another embodiment.

[0033] Figure 7 This is a structural diagram of the bonding device according to the second embodiment of this application.

[0034] Figure 8 This is a side view of the bonding device according to the second embodiment of this application.

[0035] Figure 9 This is a structural diagram of the bonding device according to the third embodiment of this application.

[0036] Figure 10 This is a side view of the bonding device according to the third embodiment of this application.

[0037] Figure 11 This is a structural diagram of the bonding device according to the fourth embodiment of this application.

[0038] Figure 12 This is a side view of the bonding device according to the fourth embodiment of this application.

[0039] Figure 13 This is a structural diagram of the bonding device according to the fifth embodiment of this application.

[0040] Figure 14 This is a side view of the bonding device according to the fifth embodiment of this application.

[0041] Figure 15 This is a structural diagram of the bonding device according to the sixth embodiment of this application.

[0042] Figure 16 This is a side view of the bonding device according to the sixth embodiment of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Crossbeam; 11. First split beam; 111. First guide rail; 12. Second split beam; 121. Second guide rail; 20. Carriage; 21. First sliding frame; 22. Second sliding frame; 23. Flexible centering component; 231. Elastic part; 232. Main body; 233. Connecting part; 30. Keying head; 31. First keying head; 311. First slider; 312. First worktable; 313. Actuator; 314. Off-axis vertical force applicator; 32. Two bonding heads; 321, second slider; 322, second worktable; 323, bonding tool; 324, support; 33, force transmission component; 40, support structure; 41, first support component; 42, second support component; 50, slide; 51, first sliding block; 52, second sliding block; 60, stage; 100, electronic component; 200, substrate; F, bonding force load path; O, central axis; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] As described in the background section, the parasitic displacement generated during bonding in related technologies sets a lower limit on the achievable in-plane mounting accuracy. The reason for the low bonding accuracy of the product is that, during the bonding process of the bonding head providing bonding force to the electronic product, the bonding force load path will pass through the bonding head, carriage and crossbeam in sequence, causing torsional deformation defects in the crossbeam, which in turn causes displacement and orientation errors of the electronic components adsorbed below the bonding tool relative to the substrate.

[0047] Some related technologies propose routing the bonding force via an auxiliary support structure to bypass the XYZ motion stage. However, bonding devices typically retain a single, integral bonding head, and the bonding tool remains mechanically coupled to the actuator. This causes parasitic deformation due to the bonding force to continue contaminating the in-plane position of the bonding tool, preventing any improvement in bonding accuracy.

[0048] If the bonding tool and actuator are mechanically separated and mounted on two physically independent carriages, with each carriage slidably mounted on a separate crossbeam, then the two carriages must be strictly centered and aligned with each other in the direction perpendicular to the bonding force axis. However, if the two carriages are driven by independent motors and have independent position sensing, then conventionally, a complete electronic gantry control must be used to maintain synchronization of the two carriages along their in-plane motion axes. Therefore, this approach is computationally and theoretically costly, and introduces delays and tuning sensitivity, thus limiting the achievable motion bandwidth of the bonding tool.

[0049] Based on this, this application provides a bonding device that can reduce the displacement or orientation error of electronic components in electronic products, improve the bonding accuracy of products, and has the technical solution of positioning and simplifying structure.

[0050] The following will combine Figures 1 to 16 A bonding apparatus according to an embodiment of this application will be described in detail.

[0051] See Figure 1 and Figure 2 One embodiment of this application provides a bonding device, including a crossbeam 10, a slide 20, and a bonding head 30.

[0052] For example, the crossbeam 10 includes a first split beam 11 and a second split beam 12 arranged vertically at intervals. The first split beam 11 is located above the second split beam 12. The first split beam 11 and the second split beam 12 can be manufactured separately or can be manufactured as a single workpiece, provided that there is an interval between the first split beam 11 and the second split beam 12. No special restrictions are imposed here.

[0053] For example, the carriage 20 includes a first sliding frame 21, a second sliding frame 22, and a flexible centering member 23. The first sliding frame 21 and the second sliding frame 22 are arranged vertically at intervals. The first sliding frame 21 is slidably disposed on the first split beam 11 along the length direction of the crossbeam 10, and the first split beam 11 serves to support and guide the first sliding frame 21 along the length direction. The second sliding frame 22 is slidably disposed on the second split beam 12 along the length direction, and the second split beam 12 serves to support and guide the second sliding frame 22 along the length direction. Optionally, the first split beam 11 is provided with a first guide rail 111 extending along the length direction, and the first sliding frame 21 is slidably disposed on the first guide rail 111. The second split beam 12 is provided with a second guide rail 121 extending along the length direction, and the second sliding frame 22 is slidably disposed on the second guide rail 121.

[0054] In this embodiment, the first sliding frame 21 and the second sliding frame 22 are connected by the flexible centering member 23, forming an integral structural component. The flexible centering member 23 has a greater stiffness along its length than in other directions, allowing the first sliding frame 21 and the second sliding frame 22 to move synchronously along their length and be interconnected, thus achieving vertical positioning of the first sliding frame 21 and the second sliding frame 22. However, in this embodiment, the flexible centering member 23 does not provide any bonding force transmission function as a load-bearing component.

[0055] For example, the bonding head 30 includes a first bonding head 31 and a second bonding head 32 arranged sequentially in a vertical direction. The first bonding head 31 is correspondingly disposed on the first sliding frame 21, and the second bonding head 32 is correspondingly disposed on the second sliding frame 22. The first bonding head 31 is used to apply bonding force to the second bonding head 32. The second bonding head 32 can apply bonding force to the electronic component 100 below. The electronic component 100 includes, but is not limited to, a chip.

[0056] In the aforementioned bonding device, the crossbeam 10, slide 20, and bonding head 30 are not designed as a single unit, but rather as separate units. This allows the first bonding head 31 to provide a downward bonding force during bonding operations, which is then transmitted to the electronic component 100 below via the second bonding head 32, thereby completing the bonding between the electronic component 100 and the substrate 200. Furthermore, a bonding force load path F is generated during the bonding process; the bonding force load path F can be found in [reference needed]. Figure 1 The dotted line in the diagram represents the bonding force load path F. The load is transmitted sequentially through the second bonding head 32, the first bonding head 31, the first sliding frame 21, and the first split beam 11 to the first split beam 11, without being transmitted to the second sliding frame 22, the second split beam 12, or the flexible centering member 23. This effectively prevents torsional deformation of the second bonding head 32, the second sliding frame 22, and the second split beam 12. In other words, the second bonding head 32 is decoupled from the bonding force load path F at the structural level, ensuring that the elastic and thermal deformation of the bonding force-bearing structural chain does not propagate to the second bonding head 32 via any rigid mechanical path. This prevents displacement or attitude errors in the electronic component 100 during the bonding process, improving the bonding accuracy of the electronic product. Furthermore, when the first bonding head 31 and the second bonding head 32 move synchronously along the length direction, the first sliding frame 21 and the second sliding frame 22 are aligned in the vertical direction under the action of the flexible centering member 23, which is conducive to the alignment of the first bonding head 31 and the second bonding head 32 in the vertical direction and can be positioned at the target position, thereby further improving the accuracy and simplifying the device structure and reducing the cost.

[0057] Furthermore, the bonding device can operate at maximum bonding force without requiring feedforward or calibration table compensation for deformation of the upper link caused by bonding force.

[0058] Furthermore, based on the decoupling of the first bonding head 31 and the second bonding head 32 in the lateral direction, the first bonding head 31 can be designed for high bond force bearing capacity without considering its dynamic mass. The second bonding head 32 can be designed for low mass and high motion bandwidth without considering its bond force bearing capacity.

[0059] Please see Figure 1 and Figure 2 Based on the aforementioned embodiments, the bonding device further includes a support structure 40. Both the first split beam 11 and the second split beam 12 are connected to the support structure 40. The support structure 40 provides stable support for the first split beam 11 and the second split beam 12. Specifically, there are two support structures 40, with each end of the first split beam 11 and the second split beam 12 connected to one of the two support structures 40 respectively. Thus, the crossbeam 10 and the two support structures 40 constitute a gantry structure.

[0060] Please see Figure 1 , Figures 7 to 10 In some embodiments, the support structure 40 can be configured as a single unit, that is, the support structure 40 adopts a single support beam, support column or support rod.

[0061] It is understandable that when the support structure 40 supports the first split beam 11 and the second split beam 12, the bonding force load path F is also transmitted to the support structure 40 via the first split beam 11, and then to the ground by the support structure 40. To further optimize the bonding force load transmission path and completely decouple the load transmission path from the second bonding head 32, for example, the support structure 40 in this embodiment is designed as a split structure. Please refer to... Figures 11 to 16 For example, the support structure 40 includes a first support member 41 and a second support member 42 spaced apart. The first support member 41 and the second support member 42 may be, but are not limited to, support beams, support columns, or support rods; no particular limitation is imposed here, and they can be flexibly adjusted and set according to actual needs. The first support member 41 is connected to the first split beam 11, serving to bear and support the first split beam 11. The second support member 42 is connected to the second split beam 12, serving to bear and support the second split beam 12. Thus, the bonding force load path F is transmitted through the first split beam 11 to the first support member 41, but not to the second support member 42, preventing the load force transmission path from being transmitted through the first split beam 11 and the support structure 40 to the second bonding head 32.

[0062] Please see Figure 11 , Figure 13 and Figure 15Based on the aforementioned embodiment, there are two support structures 40. Two first support members 41 are connected to the two ends of the first split beam 11, and two second support members 42 are connected to the two ends of the second split beam 12. The combined structure of the two first support members 41 and the first split beam 11, and the combined structure of the two second support members 42 and the second split beam 12 are stacked or nested. Specifically, along the first direction X, both second support members 42 are located between the two first support members 41.

[0063] Please see Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 In any of the aforementioned embodiments, the bonding device further includes a slide 50. The slide 50 is slidably disposed on the ground, for example. The sliding direction of the slide 50 is perpendicular to the vertical direction and the length direction of the beam 10. In this embodiment, for ease of understanding and description, the length direction of the beam 10 is designated as the first direction X, which is also as follows: Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 As shown by the X arrow in any of the diagrams. Let the sliding direction of slide 50 be defined as the second direction Y, which is also as shown in the diagram. Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 As shown by the Y-arrow in any of the images. Let the vertical direction be the third direction Z, which is also as shown... Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 The Z-arrow is shown in any one of the images.

[0064] Please refer to the following: Figure 1 and Figure 2 Optionally, the flexible centering member 23 is a six-degree-of-freedom flexible member. Six degrees of freedom refers to the degree of freedom along six directions. The six directions include the first direction X, the second direction Y, the third direction Z, the rotation direction about the first direction X, the rotation direction about the second direction Y, and the rotation direction about the third direction Z.

[0065] It should be noted that the flexible centering component 23 not only plays a kinematic correlation role along the first direction X, but also provides other collaborative functions, including interference isolation, fault protection, and machine health monitoring. These will be described in detail below.

[0066] The flexible centering member 23 effectively mitigates vibration and deformation transmission, providing good interference isolation. For example, the flexible centering member 23 attenuates vibrations and elastic deformation transmitted from the first sliding frame 21 to the second sliding frame 22 in all directions perpendicular to the first direction X, maintaining the six-degree-of-freedom positioning accuracy of the bonding tool 323. More specifically, the stiffness of the flexible centering member 23 is configured to be substantially compliant in each of the five degrees of freedom perpendicular to the first direction X, thus achieving better vibration and elastic deformation mitigation. It is understood that any disturbance applied to the first sliding frame 21 in the five degrees of freedom perpendicular to the first direction X, such as the reaction force from the first worktable 312, thermal expansion mismatch between the first and second split beams 11 and 12, guide rail straightness errors, or load-bearing vibrations coupled to the first sliding frame 21, will not be forcibly transmitted to the second sliding frame 22, and consequently to the bonding tool 323, thus providing good interference isolation.

[0067] Building upon the aforementioned embodiments, to further enhance the transmission of vibration and deformation mitigation, this can be achieved by specifically adjusting the damping of one or more of the five degrees of freedom of the flexible centering member 23 perpendicular to the first direction X. For example, the flexible centering member 23 may be made of a material with inherent damping, an integrated viscoelastic damping layer, or a constrained damping layer; or, for another example, the flexible centering member 23 may be combined with a viscous damper.

[0068] Among them, the flexible centering component 23 can also limit relative displacement under various fault conditions. Specifically, under various fault conditions such as misoperation, motor malfunction, encoder failure, EMI interference of position loop signal, or accidental collision between the second bonding head 32 and the fixture or substrate 200, the flexible centering component 23 can also limit relative displacement to protect the first bonding head 31, the second bonding head 32, the first split beam 11, the second split beam 12, and the mechanical components such as the guide rails and sliders that cooperate with each other along the first direction X, the second direction Y, and the third direction Z from collision damage or plastic deformation.

[0069] To limit relative displacement, specifically, the flexible centering member 23 is configured to have a certain elastic working range in each of the six degrees of freedom. This can also be understood as the flexible centering member 23 being made of an elastic material. The elastic working range of the flexible centering member 23 is greater than the maximum expected relative displacement (also known as fault displacement) between the first sliding frame 21 and the second sliding frame 22 under various fault conditions, allowing it to elastically absorb fault displacement without causing permanent deformation.

[0070] Building upon the aforementioned embodiments, to further optimize the limiting effect on relative displacement, the bonding device also includes a buffer. The buffer is arranged in parallel with the flexible centering member 23, and is connected between the first sliding frame 21 and the second sliding frame 22. The number of buffers is not limited; it can be one, two, three, or more. The buffer has a preload and provides a buffering effect until the elastic limit of the flexible centering member 23 is reached, thereby providing secondary protective stopping.

[0071] The flexible centering component 23 serves to limit the offset along the first direction X under various fault conditions. In this way, the offset of the first sliding frame 21 and the second sliding frame 22 relative to the nominal centering position along the first direction X is limited, so as to avoid the worst-case misalignment of the second bonding head 32 relative to the target position on the substrate 200 under various fault conditions.

[0072] Among them, due to the flexible alignment component 23, measurable characteristic signals are generated for fault detection, debugging and machine health monitoring.

[0073] Specifically, the flexible centering member 23, by virtue of its stiffness along the first direction X, can generate a measurable characteristic signal in at least one of the following: (1) detecting a current signal that drives one or more first power mechanisms acting on the first slide frame 21 and the second slide frame 22 along the first direction X; and (2) a first direction X position signal reported by one or more position encoders mounted on the first slide frame 21 and the second slide frame 22 along the first direction X.

[0074] Understandably, the aforementioned characteristic signal can be used to indicate kinematic mismatch between the first sliding frame 21 and the second sliding frame 22 along the first direction X. Furthermore, this characteristic signal can be used by the control system of the bonding device in this embodiment, for purposes including but not limited to: fault detection (issuing a fault signal and stopping movement when the characteristic signal exceeds a predetermined threshold), commissioning (associating the characteristic signal with specific fault modes during commissioning and trial operation), and machine health monitoring (tracking long-term trends of the characteristic signal to predict wear, contamination, or degradation of guide rail bearings, connecting rod attachment points, or motor commutation). The threshold associated with fault detection is selected to be less than the reaction force along the first direction X at the elastic limit of the flexible centering member 23, i.e., stopping operation before any permanent deformation occurs in the flexible centering member 23.

[0075] It should be noted that the various functions of the aforementioned flexible alignment component 23 are exemplary, not exhaustive, of the collaborative functions that the flexible alignment component 23 can be specially tuned to perform. Those skilled in the art will recognize that, depending on the requirements of a particular bonding process or apparatus, the flexible alignment component 23 can be specially tuned to perform various other functions, including but not limited to: providing defined modal frequencies in one or more of the six degrees of freedom for input shaper or notch filter collaborative design purposes; providing specially tuned impedance in one or more degrees of freedom for energy dissipation during tuning; or providing specially tuned asymmetry to make one direction of motion superior to another. Whether the flexible alignment component 23 is specially tuned to perform any one, any combination, or all of the above functions, or any additional functions, all fall within the scope of protection of this application.

[0076] In some specific embodiments, the flexible centering member 23 may include, but is not limited to, at least one or any combination of elastic sheets, elastic pads, and flexible hinges. No particular limitations are imposed here, and the specific design can be flexibly adjusted and configured according to actual needs. It is understood that regardless of the structural form of the flexible centering member 23, its material, thickness, span, profile, and damping can be flexibly adjusted and configured to specifically tune the stiffness and damping in each of the six degrees of freedom, thereby achieving the various functions performed by the flexible centering member 23 in the above embodiments.

[0077] In this embodiment, the flexible centering member 23 is specifically exemplified by an elastic sheet. Elastic sheets can take many forms; please refer to [reference needed]. Figures 3 to 6 , Figures 4 to 6 for Figure 3 The side view of the structure shown illustrates three typical embodiments of the flexible centering member 23. However, it is worth noting that this is not a limitation; the elastic sheet can be flexibly adjusted and set into various other shapes according to actual needs. For example, Figure 4 As shown, the elastic sheet can be arc-shaped, and its two ends along its bending direction are connected to the first sliding frame 21 and the second sliding frame 22, respectively. Figure 5 As shown, the elastic sheet includes two elastic portions 231 arranged at an angle and connected to each other. The ends of the two elastic portions 231 away from each other are respectively connected to the first sliding frame 21 and the second sliding frame 22. Figure 6 As shown, the elastic sheet includes a main body 232 and two connecting parts 233 connected to the main body 232. The two connecting parts 233 are respectively connected to the first sliding frame 21 and the second sliding frame 22. The main body 232 is flat, and the connecting parts 233 are arc-shaped. The two connecting parts 233 are bent toward each other.

[0078] Of course, in other embodiments, the flexible centering member 23 can also be a flexible hinge, specifically a flexible hinge with a notch, or a double parallelogram flexible hinge or a viscoelastic damping flexible hinge, etc. The flexible centering member 23 can also be configured as a stacked spring assembly, a cylindrical pin, or other structural forms, without particular limitation.

[0079] The number of flexible centering components 23 can be one or more, and there is no specific limitation here.

[0080] For example, at least two flexible centering members 23 are provided, and the at least two flexible centering members 23 are symmetrically arranged about the central axis O of the carriage 20. Specifically, there are two flexible centering members 23, which are located on both sides of the carriage 20 along the first direction X. Each flexible centering member 23 realizes the mechanical connection between the first sliding frame 21 and the second sliding frame 22.

[0081] It should be noted that the first sliding frame 21 and the second sliding frame 22 can each be machined and mechanically fixed together with the flexible centering member 23. Alternatively, the flexible centering member 23 can also be integrally machined with at least one of the first sliding frame 21 and the second sliding frame 22, without any particular limitation.

[0082] It is worth noting that, in the case of integral processing, at least one of the first sliding frame 21 and the second sliding frame 22 can be manufactured as a single workpiece together with the flexible centering member 23 by means of, for example, electrical discharge machining (EDM), waterjet cutting, laser cutting, additive manufacturing or conventional machining of a single piece of material.

[0083] For example, the ratio of the stiffness of the flexible centering member 23 along its length to the stiffness in each of the five degrees of freedom perpendicular to the length direction is between 100 and 500. Specifically, the ratio may include, but is not limited to, 100, 150, 200, 250, 300, 350, 400, 450, or 500, etc., and is not limited here. It can be flexibly adjusted and set according to actual needs.

[0084] It should be noted that this application decouples the bonding head 30 from the bonding force load path F at the architectural level, and uses a flexible centering member 23 to achieve centering and isolation between the two halves. The applicability of this architecture does not depend on the specific value of the bonding force, nor on the specific value of the in-plane mounting accuracy. Any bonding force value, stiffness ratio, damping ratio, deflection or displacement value (e.g., 10, 100 nm, etc.) appearing in this specification, as well as the force and accuracy orders described in the background art, are merely illustrative and do not constitute a limitation on the scope of protection of this application. This application is also applicable to bonding processes with smaller bonding forces and bonding processes with lower mounting accuracy requirements; all applications using the architecture described in this application, regardless of their bonding force magnitude or mounting accuracy requirements, fall within the scope of protection of this application.

[0085] For example, the damping ratio of the flexible centering member is ≥0.05 in at least one of the five degrees of freedom perpendicular to the length direction. The damping is provided by one or more of the following: the inherent material damping of the flexible centering member, a viscoelastic damping layer integrated therewith, a constraint damping layer applied thereon, and a viscous damper arranged in parallel therewith.

[0086] In some embodiments, the bonding device further includes a first power mechanism. The first power mechanism includes, but is not limited to, a linear motor. The first power mechanism is connected to at least one of the first sliding frame 21 and the second sliding frame 22, and is used to drive the first sliding frame 21 and the second sliding frame 22 to move along the length direction to adjust their position along the length direction. Thus, under the action of the first power mechanism, the bonding head 30 can be driven to move along the first direction X on the crossbeam 10 to adjust its position.

[0087] It is understandable that, based on the stiffness of the flexible centering member 23 along the first direction X, the first sliding frame 21 and the second sliding frame 22 can be kinematically associated along the first direction X. Therefore, in this embodiment, there can be only one first power mechanism, which can be connected to either the first sliding frame 21 or the second sliding frame 22. More specifically, one of the first sliding frame 21 and the second sliding frame 22 is provided with the first power mechanism, and the other can be configured with an auxiliary power mechanism that drives along the first direction X. The power of the auxiliary power mechanism is weaker than that of the first power mechanism, and it mainly plays an auxiliary compensation role. This makes the first sliding frame 21 and the second sliding frame 22 have better synchronization along the first direction X.

[0088] Of course, there can also be two first power mechanisms, one of which is connected to the first sliding frame 21 and the other is connected to the second sliding frame 22. In particular, when the stiffness of the flexible centering member 23 in the first direction X is on the same order of magnitude or lower than the stiffness of at least one of the other five degrees of freedom, that is, when the stiffness of the flexible centering member 23 is insufficient to achieve the kinematic association between the first sliding frame 21 and the second sliding frame 22 along the first direction X, there need to be two or more first power mechanisms, and the two first power mechanisms work together to achieve the kinematic association between the first sliding frame 21 and the second sliding frame 22 along the first direction X.

[0089] In some specific embodiments, two first power mechanisms are provided. The flexible centering member 23 achieves the kinematic association between the first sliding frame 21 and the second sliding frame 22 along the first direction X through its own stiffness and the power coordination of the two first power mechanisms. Furthermore, each first power mechanism is equipped with a position encoder to realize fault detection, debugging, and machine health monitoring functions.

[0090] Specifically, in the case of generating a measurable characteristic signal indicating kinematic mismatch between the first sliding frame 21 and the second sliding frame 22 along the first direction X, any working condition that causes the first sliding frame 21 and the second sliding frame 22 to tend to separate along the first direction X, such as jamming of the guide rail bearings on the first sliding frame 21 or the second sliding frame 22, transient torque mismatch between the two first power mechanisms, commutation burrs of the position encoder, or the presence of an obstacle in the path of one of the first sliding frames 21 and the second sliding frame 22, will result in a reaction force of the flexible centering member 23 along the first direction X, which can be represented by the current signal of each first power mechanism or the position signal sensed by each position encoder.

[0091] Wherein, if the characteristic signal is represented by a current signal, the fault detection circuit is configured to monitor at least one of the following: (1) the difference between the current signals of the two first power mechanisms; (2) the ratio between the current signals of the two first power mechanisms; (3) the asymmetry between the current signals of the two first power mechanisms, and to issue a fault signal when the difference, ratio, or asymmetry exceeds a predetermined threshold. Furthermore, the monitored quantities can be further recorded and correlated with operating events for debugging purposes during commissioning and trial operation, and can be tracked over time for machine health monitoring.

[0092] Wherein, if the characteristic signal is represented as a position signal along the first direction X, the fault detection circuit is configured to monitor at least one of the following: (1) the difference between the positions reported by the two position encoders along the first direction X; (2) the ratio between the positions reported by the two position encoders along the first direction X; (3) the asymmetry between the positions reported by the two position encoders along the first direction X, and to issue a fault signal when the difference, ratio, or asymmetry exceeds a predetermined threshold. Furthermore, the monitored quantities can be further recorded and correlated with operational events for debugging purposes during commissioning and trial operation, and can be tracked over time for machine health monitoring.

[0093] The predetermined threshold is selected as the threshold at which the reaction force of the flexible centering member 23 along the first direction X is less than the elastic limit value. The elastic limit value can be understood as the reaction force value at which the flexible centering member 23 will undergo permanent deformation after exceeding the reaction force in the first direction X. In this way, the device stops operating before any permanent deformation occurs in the flexible centering member 23, allowing it to continue to perform its various functions normally after the fault is cleared.

[0094] Please continue reading. Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 In any one of the sets, the bottom of the support structure 40 is connected to the slide 50, and the top of the support structure 40 is connected to the first split beam 11 and the second split beam 12. Under the sliding action of the slide 50, the support structure 40, the crossbeam 10, and the bonding head 30 can be moved and adjusted in the second direction Y.

[0095] To enable the sliding block 50 to move and adjust its position along the second direction Y on the ground, the bonding device may, for example, include a second power mechanism. The second power mechanism may include, but is not limited to, a linear motor. The second power mechanism is connected to the sliding block 50 to drive it to move and adjust its position along the second direction Y. When the sliding block 50 is configured as a first sliding block 51 and a second sliding block 52, two second power mechanisms are correspondingly configured, one connected to the first sliding block 51 and the other connected to the second sliding block 52.

[0096] Please see Figure 11 , Figure 13 and Figure 15 In some embodiments, when the support structure 40 specifically includes a first support member 41 and a second support member 42, the bottom of each of the beams of the first support member 41 and the second support member 42 is connected to the slide block 50, and is supported by the slide block 50 and driven to move along the second direction Y.

[0097] To further optimize the bonding force load transmission path and completely decouple the load transmission path from the second bonding head 32, the slide 50 in this embodiment is, for example, designed as a split unit. For details, please refer to... Figure 11 and Figure 15 The slide 50 includes a first slide 51 and a second slide 52. The first slide 51 and the second slide 52 are spaced apart and slide along the ground. The bottom of the first split beam 11 is connected to the first slide 51, and the bottom of the second split beam 12 is connected to the second slide 52.

[0098] Please refer to the following: Figure 11 and Figure 15 Wherein, when the slide 50 includes a first slide 51 and a second slide 52, the first slide 51 and the second slide 52 can be arranged at the same height position along the third direction Z (e.g., Figure 11 As shown), it can also be arranged at different heights along the third direction Z (e.g. Figure 15 As shown in the figure, no special restrictions are imposed here, and the specific settings can be flexibly adjusted and configured according to actual needs.

[0099] Please refer to the following: Figure 1 , Figure 7 and Figure 13 Alternatively, the slide 50 can be designed as a single unit. That is, the slide 50 is not divided into a first slide 51 and a second slide 52, but a single slide 50 is used, which can support the support structure 40 and drive the support structure 40 to slide along the second direction Y.

[0100] Please see Figure 9 ,and Figure 1 , Figure 7 , Figure 11 , Figure 13 and Figure 15 In contrast, a key difference is that in some embodiments, the slide 50 can be omitted. That is, the support structure 40 is directly fixed to the ground or other various support surfaces.

[0101] Please continue reading. Figure 9 Based on the aforementioned embodiments, in order to facilitate the adjustment of the positions of the bonding head 30 and the electronic component 100 along the second direction Y, the bonding apparatus further includes a stage 60. The stage 60 is located below the second bonding head 32 and is used to support the substrate 200 and the electronic component 100. The stage 60 is movable along the second direction Y, thereby allowing the electronic component 100 to be adjusted in position along the second direction Y.

[0102] Please continue reading. Figure 1 and Figure 2The bonding device also includes a force transmission element 33. The force transmission element 33 is connected to the first bonding head 31 or the second bonding head 32 and is disposed between the first bonding head 31 and the second bonding head 32 to transmit the bonding force applied by the first bonding head 31 to the second bonding head 32 in the vertical direction, and the force transmission element does not provide mechanical constraints in any other direction besides the vertical direction.

[0103] Please see Figure 1 and Figure 2 In some embodiments, the first bonding head 31 includes a first slider 311, a first worktable 312, and an actuator 313. The first slider 311 is slidably mounted on the first sliding frame 21 in the vertical direction. The first worktable 312 is connected to the first slider 311, and the first worktable 312 can drive the first slider 311 to move and adjust its position in the vertical direction. That is, the first worktable 312 is equipped with a power mechanism such as a linear motor, which can provide power for moving and adjusting its position in the vertical direction. There are many specific methods, which will not be elaborated here. The actuator 313 is connected to the first worktable 312 or the first slider 311, and the actuator 313 can apply a downward bonding force to the first worktable 312. The force transmission element 33 is disposed at the bottom of the first worktable 312. Specifically, during actual operation, the first worktable 312 can drive the first slider 311 to slide in the vertical direction and then adjust its position. After the position is adjusted, the actuator 313 can provide bonding force to the first worktable 312, and the first worktable 312 transmits the bonding force to the second bonding head 32 below in the vertical direction through the force transmission member 33.

[0104] In some embodiments, the second bonding head 32 includes a second slider 321, a second worktable 322, and a bonding tool 323. The second slider 321 is slidably disposed on the second sliding frame 22 in the vertical direction. The second worktable 322 is connected to the second slider 321, and the second worktable 322 can drive the second slider 321 to move in the vertical direction to adjust its position. That is, the second worktable 322 is equipped with a power mechanism such as a linear motor, which can provide power for moving in the vertical direction to adjust its position. There are many specific methods, which will not be elaborated here. The force transmission component 33 is disposed on the top of the second worktable 322, and the bonding tool 323 is mounted on the bottom of the second worktable 322. The bonding tool 323 is used to attract and hold the electronic component 100. Specifically, in actual operation, the second worktable 322 can drive the second slider 321 to slide in the vertical direction, thereby adjusting the position of the bonding tool 323 in the vertical direction so that the bonding tool 323 can attract and hold the electronic component 100. After the electronic component 100 is held in place by the bonding tool 323 and the position of the first bonding head 31 is adjusted in the vertical direction, the first bonding head 31 provides bonding force to the second bonding head 32. The bonding force is transmitted to the electronic component 100 in the vertical direction through the bonding tool 323, so as to realize the bonding between the electronic component 100 and the substrate 200.

[0105] Based on the foregoing embodiments, the second bonding head 32 further includes a support 324 disposed between the second worktable 322 and the bonding tool 323. The support 324 is mounted on the bottom of the second worktable 322, and the bonding tool 323 is mounted on the support 324, that is, indirectly mounted on the second worktable 322.

[0106] Please see Figure 7 and Figure 8 In some embodiments, the first bonding head 31 further includes at least two off-axis vertical force applicators 314. Each off-axis vertical force applicator 314 is connected to at least one of the first slider 311 and the first worktable 312. The off-axis vertical force applicator 314 is offset from the central axis O of the first worktable 312, and the off-axis vertical force applicator 314 can apply a bonding force in the vertical direction to the first worktable 312. In this way, both the actuator 313 and the off-axis vertical force applicator 314 can apply a bonding force in the vertical direction to the first worktable 312, so that either the actuator 313 or the off-axis vertical force applicator 314 can be selected to work according to actual needs, or the actuator 313 and the off-axis vertical force applicator 314 can be selected to work simultaneously.

[0107] The bonding force applied by the actuator 313 in the vertical direction is greater than the bonding force applied by the off-axis vertical force applicator 314 in the vertical direction. The bonding forces that can be applied by the two are at two different levels, so one of them can be flexibly selected to work according to actual needs.

[0108] Based on the aforementioned embodiment, at least two off-axis vertical force applicators 314 are symmetrically arranged about the central axis O of the first worktable 312. Thus, when the at least two off-axis vertical force applicators 314 operate synchronously, the applied bonding force is transmitted along the central axis O of the first worktable 312 to the second worktable 322.

[0109] To more clearly illustrate the bonding apparatus of this application, the operation method of the bonding apparatus will be described below: During operation, the first sliding frame 21 and the second sliding frame 22 are translated together along the first direction X to position the bonding tool 323 above the target position on the substrate 200. The flexible alignment member 23 cooperates with the first direction X drive arrangement to maintain the positioning of the first sliding frame 21 and the second sliding frame 22 along the third direction Z during translation and move synchronously to the target position along the first direction X. Subsequently, the actuator 313 of the first bonding head 31 is actuated, so that the bonding force is transmitted vertically to the second bonding head 32 via the laterally compliant force transmission member 33. The bonding force load path F is limited to the first bonding head 31, the first sliding frame 21, the first split beam 11, and the support structure 40. This path does not pass through the second sliding frame 22 or the second split beam 12. That is, the elastic deformation and thermal deformation of the upper structural chain will not be transmitted to the bonding tool 323 of the second bonding head 32 through any rigid mechanical path.

[0110] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0111] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0112] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0113] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0114] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0115] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A bonding device, characterized in that, include: The crossbeam includes a first split beam and a second split beam arranged at an interval between the upper and lower parts, with the first split beam located above the second split beam; A carriage, comprising a first sliding frame, a second sliding frame, and a flexible centering member, wherein the first sliding frame and the second sliding frame are arranged vertically at intervals; the first sliding frame is slidably disposed on a first split beam along the length direction of the crossbeam, and the second sliding frame is slidably disposed on a second split beam along the length direction; the first sliding frame is connected to the second sliding frame via the flexible centering member; the flexible centering member has a stiffness greater along the length direction than in other directions, so that the first sliding frame and the second sliding frame move synchronously along the length direction; and A bonding head, comprising a first bonding head and a second bonding head arranged sequentially along a vertical direction; the first bonding head is correspondingly disposed on the first sliding frame, and the second bonding head is correspondingly disposed on the second sliding frame; The first bonding head is used to apply bonding force to the second bonding head; the second bonding head can apply the bonding force to the electronic component below.

2. The bonding apparatus according to claim 1, characterized in that, In each direction perpendicular to the length direction, the flexible centering member can attenuate vibrations and elastic deformations transmitted from the first sliding frame to the second sliding frame.

3. The bonding apparatus according to claim 1, characterized in that, The flexible centering element includes at least one or any combination of an elastic sheet, an elastic pad, and a flexible hinge.

4. The bonding apparatus according to claim 3, characterized in that, The elastic sheet is arc-shaped, and its two ends along its bending direction are respectively connected to the first sliding frame and the second sliding frame; or, the elastic sheet includes two elastic parts that are arranged at an angle and connected to each other, and the ends of the two elastic parts away from each other are respectively connected to the first sliding frame and the second sliding frame; or, the elastic sheet includes a main body and two connecting parts connected to the main body, and the two connecting parts are respectively connected to the first sliding frame and the second sliding frame, the main body is flat, the connecting parts are arc-shaped, and the two connecting parts are bent toward each other.

5. The bonding apparatus according to claim 1, characterized in that, The flexible centering member is provided in at least two parts, and the at least two flexible centering members are symmetrically arranged about the central axis of the carriage.

6. The bonding apparatus according to claim 1, characterized in that, The bonding device further includes a first power mechanism, which is installed on at least one of the first split beam and the second split beam. The first power mechanism is connected to at least one of the first sliding frame and the second sliding frame. The first power mechanism is used to drive the first sliding frame and the second sliding frame to move along the length direction to adjust their positions along the length direction.

7. The bonding apparatus according to claim 1, characterized in that, The bonding device further includes a support structure, to which both the first split beam and the second split beam are connected.

8. The bonding apparatus according to claim 7, characterized in that, There are two support structures, and the two ends of the first split beam and the second split beam are respectively connected to the two support structures one by one.

9. The bonding apparatus according to claim 7, characterized in that, The support structure includes a first support member and a second support member spaced apart, the first support member being connected to the first split beam, and the second support member being connected to the second split beam.

10. The bonding apparatus according to claim 9, characterized in that, The bonding device further includes a slide, the bottom of the support structure is connected to the slide, and the top of the support structure is connected to the first split beam and the second split beam.

11. The bonding apparatus according to claim 10, characterized in that, The slide includes a first slide and a second slide arranged at intervals; the first support is connected to the first slide, and the second support is connected to the second slide.

12. The bonding apparatus according to claim 1, characterized in that, The bonding device further includes a force transmission element connected to the first bonding head or the second bonding head and disposed between the first bonding head and the second bonding head to transmit the bonding force applied by the first bonding head to the second bonding head in the vertical direction, and the force transmission element does not provide mechanical constraints in any other direction besides the vertical direction.

13. The bonding apparatus according to claim 12, characterized in that, The first bonding head includes a first slider, a first worktable, and an actuator. The first slider is slidably disposed on the first sliding frame along the vertical direction. The first worktable is connected to the first slider. The first worktable can drive the first slider to move and adjust its position along the vertical direction. The actuator is connected to the first worktable or the first slider. The actuator can apply a downward bonding force to the first worktable. The force transmission element is disposed at the bottom of the first worktable.

14. The bonding apparatus according to claim 13, characterized in that, The second bonding head includes a second slider, a second worktable, and a bonding tool; the second slider is slidably disposed on the second sliding frame along the vertical direction, the second worktable is connected to the second slider, the second worktable can drive the second slider to move and adjust its position along the vertical direction, the force transmission element is disposed on the top of the second worktable, the bonding tool is installed on the bottom of the second worktable, and the bonding tool is used to adsorb and hold the electronic component.

15. The bonding apparatus according to claim 13, characterized in that, The first bonding head further includes at least two off-axis vertical force applicators, each of which is connected to at least one of the first slider and the first worktable. The off-axis vertical force applicator is offset from the central axis of the first worktable and can apply a bonding force in the vertical direction to the first worktable.

16. The bonding apparatus according to claim 15, characterized in that, At least two of the off-axis vertical force applicators are symmetrically arranged about the central axis of the first worktable.

17. The bonding apparatus according to any one of claims 1 to 16, characterized in that, The bonding apparatus further includes a stage located below the second bonding head, the stage being used to support the substrate and electronic components.

18. The bonding apparatus according to any one of claims 1 to 16, characterized in that, The ratio of the stiffness of the flexible centering member along the length direction to the stiffness in each of the five degrees of freedom perpendicular to the length direction is between 100 and 500.

19. The bonding apparatus according to any one of claims 1 to 16, characterized in that, The damping ratio of the flexible centering member in at least one of the five degrees of freedom perpendicular to the length direction is ≥ 0.05, wherein the damping is provided by one or more of the following: the inherent material damping of the flexible centering member, a viscoelastic damping layer integrated therewith, a constraint damping layer applied thereon, and a viscous damper arranged in parallel therewith.

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