A semiconductor chip high voltage resistance testing device

Abstract

The application relates to the technical field of semiconductor chip detection, in particular to a high-pressure-resistant testing device for semiconductor chips. The device comprises a detection frame, a high-pressure detector, a positioning and correcting assembly and a lifting fixer. In the application, the split linkage type positioning and correcting assembly composed of the upper corrector and the lower corrector is arranged, the second groove in the inner wall surface of the upper corrector is used for horizontally guiding the downward moving chip, the ball on the positioning cylinder is matched with the inclined surface, the fixed seat can horizontally float and displace relative to the connecting rod in the movable cavity, the horizontal alignment of the bottom electrode of the chip and the detection probe is automatically completed before the chip contacts the detection probe, the chip horizontal displacement problem caused by the coarse positioning of the placing groove in the prior art is effectively avoided, the hidden danger that the detection probe bears the lateral force due to the position deviation is eliminated, and the contact accuracy and the testing reliability of the high-pressure-resistant testing are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip testing technology, and more specifically, to a semiconductor chip high voltage withstand testing device. Background Technology

[0002] Semiconductor chip testing is a process that uses probes, electrical measurements, optical observations, and other methods to conduct parameter, functional, and defect tests on wafers and chips. Its purpose is to screen out defective products, verify electrical performance and reliability, and ensure that finished chips meet usage standards.

[0003] Existing devices for high-voltage withstand testing of chips, such as CN208833876U, disclose a semiconductor chip high-voltage withstand testing device, including a base, a support plate, and fixed support rods. The support plate is set on the base, and a placement plate is provided at the upper end of the support plate. The four corners of the bottom of the placement plate are connected to the top of the support plate through support rods, and a high-voltage testing device is provided between the four support rods. An insulating block is provided in the middle of the placement plate, and multiple placement grooves are provided in the insulating block. Two probe holes are provided at the bottom of each of the multiple placement grooves. A detection probe is provided at the top of the high-voltage testing device corresponding to the position of the probe hole. A pressing plate is provided at the upper end of the placement plate, and a pressing block is provided at the bottom of the pressing plate corresponding to the positions of the multiple placement grooves.

[0004] The aforementioned testing apparatus uses placement grooves on a placement plate to accommodate the chip, and a pressing plate drives a pressure block to press the chip down, bringing it into contact with the detection probe emerging from the probe hole to improve contact performance. However, the problem is that this approach only uses the grooves for coarse chip positioning. The assembly gap between the grooves and the chip causes uncertain horizontal offset of the chip, resulting in misalignment between the bottom electrode of the chip and the detection probe. Although downward pressure can force contact, it cannot actively correct the horizontal position deviation of the chip before contact. In the offset state, the detection probe will be subjected to lateral force, which is prone to skew under the large contact stress of high-voltage testing, affecting contact stability and testing accuracy, and even damaging the probe. This makes it difficult to meet the requirements of high-voltage testing for precise alignment and probe stability. Summary of the Invention

[0005] The purpose of this invention is to solve the problem in the prior art where, when a semiconductor chip high-voltage withstand test device uses a groove to coarsely position the chip, the assembly gap causes the chip's horizontal position to shift and cannot be actively corrected before contact. This causes the test probe to be subjected to lateral force, which easily leads to probe skew under the large contact stress of high-voltage testing, thus affecting the probe's contact stability and test accuracy, and even causing probe damage.

[0006] To achieve the above objectives, the present invention provides a high-voltage withstand testing device for semiconductor chips, including a detection frame and a high-voltage detector, a positioning and correction component, and a lifting and fixing device disposed on the detection frame. The positioning and correction component includes a lower corrector located above the high-voltage detector and an upper corrector located above the lower corrector. The upper corrector and the lower corrector are elastically connected and slide vertically together. The lower corrector is installed above the high-voltage detector, and the detection probe of the high-voltage detector passes through the lower corrector. After the lifting and fixing device initially fixes the chip, it drives the chip to pass through the upper corrector and contact the inner wall surface of the upper corrector, guiding the chip to change its horizontal position so that the bottom of the chip is accurately aligned with the detection probe. When the lifting and fixing device drives the upper corrector to move downward, the downward movement of the upper corrector will drive the lower corrector to fix the detection probe.

[0007] As a further improvement to this technical solution, the detection frame includes a base and a bracket fixed on the base. A U-shaped support plate is fixedly connected to the top of the base. The high-voltage detector is embedded in the support plate. The detection probe of the high-voltage detector passes upward into the lower corrector. The lifting and fixing device includes a lifting component fixed to the top of the bracket and a fixing component movably installed with the bottom of the lifting component. The fixing component is used to fix the chip and is located above the upper corrector.

[0008] As a further improvement to this technical solution, the movable installation method of the lifting component and the fixing component is a combination of plugging and suction.

[0009] As a further improvement to this technical solution, the fixing component includes multiple fixing seats and a connecting rod disposed on the top of the fixing seats. The connecting rod is used to movably connect with the bottom of the lifting component. The four corners of the bottom of the fixing seat have downward extending edges for locking the four corners of the chip. The contact surface between the bottom of the fixing seat and the top of the chip is perpendicular to the detection probe.

[0010] As a further improvement to this technical solution, the lifting component includes a top plate fixedly connected to the top of the bracket. Multiple hydraulic cylinders are provided at both ends of the top plate. A lifting plate is connected to the telescopic rod at the bottom of the hydraulic cylinder. Multiple pressure rods are fixedly connected to the lifting plate. The bottom of the pressure rod is disc-shaped. A corresponding insertion groove is provided at the top of the connecting rod. The bottom of the pressure rod is inserted into the insertion groove.

[0011] As a further improvement to this technical solution, the top of the pressure rod is connected to an air extraction pipe, and an air port for gas to pass through is opened inside the pressure rod. The contact surface between the insertion groove and the bottom of the pressure rod is a smooth plane.

[0012] As a further improvement to this technical solution, the upper corrector includes an upper plate located above the lower corrector. The upper plate has a second groove extending through its upper and lower surfaces at a position directly above the detection probe. The second groove is a through groove that is wider at the top and narrower at the bottom, and the wider part at the top and the narrower part at the bottom are smoothly transitioned by a slope. The fixed seat has a movable cavity with an inverted "T" cylindrical groove. The connecting rod is held in the movable cavity by a set annular edge, and the connecting rod can move within the movable cavity, so that the fixed seat can undergo horizontal displacement relative to the connecting rod. A positioning cylinder is fixedly connected to the outer wall of the fixed seat near the top end, and the end of the positioning cylinder that contacts the inner wall of the second groove is provided with a ball bearing.

[0013] As a further improvement to this technical solution, the inner walls of both ends of the receiving plate are provided with slots. The lower corrector includes a lower plate and an upper plate covering the top of the lower plate. The outer walls of both sides of the lower plate and the upper plate are connected with locking teeth. The lower plate and the upper plate are snapped into the receiving plate through the cooperation of the locking teeth and the slots. The lower plate and the upper plate are provided with a first groove directly above the detection probe. The bottom of the lower plate is provided with an opening for the detection probe to pass through. A pair of horizontally sliding correction plates are provided in the first groove. Multiple first lugs are connected to the edge of the lower plate. A spring is sleeved on the sliding rod of the first lug. The edge of the upper plate is correspondingly connected with a second lug. The sliding rod slides through the second lug. The top of the spring contacts the bottom of the second lug. A fitting plate is also inserted and fitted at the edge of the upper plate. The upper plate is slidably fitted with the correction plate through the fitting plate.

[0014] As a further improvement to this technical solution, the correction plate is provided with round shaft protrusions at both ends, the bottom end of the fitting plate passes through the edges of the lower plate and the upper plate, and the fitting plate is provided with an "eight"-shaped sliding groove that runs through its surface. The round shaft protrusions are located in the sliding groove and slide and guide the sliding groove.

[0015] As a further improvement to this technical solution, the contact area between the calibration plate and the detection probe is provided with an enclosing part, which is a plate structure with a semi-circular groove.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. In this semiconductor chip high voltage withstand testing device, a split linkage positioning and correction component consisting of an upper and lower corrector is set up. The second groove on the inner wall of the upper corrector is used to guide the downward moving chip horizontally. With the help of the ball bearings on the positioning cylinder and the inclined surface, the fixed seat can float horizontally relative to the connecting rod in the movable cavity. Thus, the bottom electrode of the chip and the detection probe are automatically aligned horizontally before the chip contacts the detection probe. This effectively avoids the problem of chip horizontal displacement caused by relying solely on the placement of the groove for coarse positioning in the prior art, eliminates the hidden danger of the detection probe being subjected to lateral force due to positional deviation, and improves the contact accuracy and test reliability of the high voltage withstand test.

[0018] 2. In this semiconductor chip high voltage withstand testing device, the upper plate of the upper calibrator forms a sliding guide linkage with the calibration plate in the lower calibrator through the fitting plate. When the chip moves down to the position, the lifting plate continues to push the upper plate to overcome the spring force and move down, driving the fitting plate to descend synchronously. The "eight"-shaped sliding groove on the fitting plate cooperates with the round shaft protrusion of the calibration plate to drive the two calibration plates to close towards each other, forming a circumferential clamping and fixing of the detection probe that passes through the first groove.

[0019] The aforementioned probe clamping action occurs before the bottom of the chip contacts the detection probe, providing stable radial support for the detection probe and resisting probe misalignment that may be caused by large contact stress during high-voltage testing. This ensures stable contact between the probe and the chip electrode, avoiding test failure or probe damage caused by probe misalignment. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram showing the cooperation between the detection frame and the high-voltage detector structure of the present invention;

[0022] Figure 3 This is a schematic diagram showing the cooperation between the bracket and the lifting fixation device of the present invention;

[0023] Figure 4 This is a schematic diagram showing the structural cooperation between the lifting component and the fixing component of the present invention;

[0024] Figure 5 This is a cross-sectional schematic diagram of the mating part of the pressure bar and the fixing component structure of the present invention;

[0025] Figure 6 This is a schematic diagram showing the structural cooperation of the base, high-voltage detector, and positioning correction component of the present invention;

[0026] Figure 7 This is a schematic diagram showing the structural cooperation between the lower and upper orthodontic devices of the present invention;

[0027] Figure 8This is a schematic diagram showing the disassembled structure of the lower orthodontic device of the present invention;

[0028] Figure 9 This is a schematic cross-sectional view of the disassembled lower and upper orthodontic structures of the present invention;

[0029] Figure 10 This is a schematic diagram of the device structure in an active state according to the present invention.

[0030] The meanings of the labels in the diagram are as follows:

[0031] 1. Testing frame; 11. Base; 12. Bracket; 13. Receiving plate; 131. Slot;

[0032] 2. High-voltage detector; 21. Detection probe;

[0033] 3. Positioning and correction components; 31. Lower orthodontic appliance; 311. Lower plate; 312. Upper plate; 313. Clamping teeth; 314. First groove; 315. Through opening; 316. Correction plate; 317. Enclosing part; 318. First lug; 319. Spring; 32. Upper orthodontic appliance; 321. Upper plate; 322. Fitting plate; 323. Second lug; 324. Second groove;

[0034] 4. Lifting and fixing device; 41. Lifting component; 411. Top plate; 412. Telescopic rod; 413. Lifting plate; 414. Pressure rod; 4141. Air inlet; 415. Air extraction pipe; 42. Fixing component; 421. Fixing base; 422. Connecting rod; 423. Movable cavity; 424. Positioning cylinder; 425. Ball bearing; 426. Chip; 427. Insertion slot. Detailed Implementation

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] Please see Figure 1 , Figure 3 , Figure 7 As shown, the purpose of this embodiment is to provide a semiconductor chip high-voltage withstand testing device, including a detection frame 1 and a high-voltage detector 2, a positioning and correction component 3, and a lifting and fixing device 4 disposed on the detection frame 1. The positioning and correction component 3 includes a lower corrector 31 located above the high-voltage detector 2 and an upper corrector 32 located above the lower corrector 31. The upper corrector 32 and the lower corrector 31 are elastically connected and slide vertically together. The lower corrector 31 is installed above the high-voltage detector 2, and the detection probe 21 of the high-voltage detector 2 passes through the lower corrector 31. After the lifting and fixing device 4 initially fixes the chip 426, it drives the chip 426 to pass through the upper corrector 32 and contact the inner wall of the upper corrector 32, guiding the chip 426 to change its horizontal position so that the bottom of the chip 426 is accurately aligned with the detection probe 21. When the lifting and fixing device 4 drives the upper corrector 32 to move down, the downward movement of the upper corrector 32 will drive the lower corrector 31 to fix the detection probe 21, so as to avoid the contact stress caused by the bottom of the chip 426 contacting the detection probe 21 and thus ensure the stability of the high voltage resistance test.

[0039] The above structure is disclosed below:

[0040] like Figure 2 , Figure 3 As shown, the detection frame 1 includes a base 11 and a bracket 12 fixed to the base 11 by bolts or other means. A U-shaped support plate 13 is fixedly connected to the top of the base 11. A high-voltage detector 2 is embedded in the support plate 13. The top of the detection probe 21 of the high-voltage detector 2 passes upward into the lower corrector 31. The lifting and fixing device 4 includes a lifting component 41 fixed to the top of the bracket 12 and a fixing component 42 movably installed to the bottom of the lifting component 41. The fixing component 42 is used to fix the chip 426 and is located above the upper corrector 32. The movable installation method of the lifting component 41 and the fixing component 42 is a combination of plugging and suction, so that when the lifting component 41 descends, it can apply a stable downward pressure to the chip 426 through the fixing component 42.

[0041] To secure the chip 426 and ensure that its bottom is perpendicular to the detection probe 21 during subsequent pressure reduction, as follows: Figure 4 , Figure 5 As shown, the fixing component 42 includes multiple fixing seats 421 and a connecting rod 422 disposed on the top of the fixing seats 421. The connecting rod 422 is used to movably connect with the bottom of the lifting component 41. The four corners of the bottom of the fixing seat 421 have downwardly extending extension edges for locking the four corners of the chip 426. The contact surface between the bottom of the fixing seat 421 and the top of the chip 426 is perpendicular to the detection probe 21. After inserting the chip 426 into the bottom of the fixing seat 421 so that the extension edges lock the four corners of the chip 426, thereby fixing the chip 426, the fixing seat 421 is movably connected to the bottom of the lifting component 41 through the connecting rod 422, which can reduce the difficulty of fixing the chip 426 to the device.

[0042] The lifting component 41 includes a top plate 411 fixedly connected to the top of the bracket 12 by bolts or other means. Multiple hydraulic cylinders are installed at both ends of the top plate 411. A lifting plate 413 is connected to a telescopic rod 412 at the bottom of each hydraulic cylinder. Multiple pressure rods 414 are fixedly connected to the lifting plate 413. The bottom of each pressure rod 414 is disc-shaped, and a corresponding insertion groove 427 is provided on the top of a connecting rod 422. The bottom of the pressure rod 414 engages with the insertion groove 427. After the fixing component 42, on which the chip 426 is fixed, is quickly connected to the pressure rod 414 via the insertion method, the telescopic rod 412 of the hydraulic cylinder drives the lifting plate 413 to move downwards, allowing the chip 426 to pass downwards through the upper corrector 32. To improve the stability of the connection with the fixing member 42 and further ensure that the bottom of the chip 426 is perpendicular to the detection probe 21 when it contacts the detection probe 21, thus preventing the detection probe 21 from tilting due to downward pressure, a suction pipe 415 is connected to the top of the pressure rod 414, and an air port 4141 for gas passage is opened inside the pressure rod 414. The contact surface between the insertion groove 427 and the bottom of the pressure rod 414 is a smooth plane. After the bottom of the pressure rod 414 is inserted and combined with the insertion groove 427 by suction, the suction pipe 415 evacuates air from the gap between the pressure rod 414 and the insertion groove 427 through the air port 4141, thereby achieving negative pressure adsorption and fixation between the bottom of the pressure rod 414 and the insertion groove 427. This ensures a stable connection between the lifting member 41 and the fixing member 42 during the downward movement of the chip 426, preventing the bottom of the chip 426 from not being perpendicular to the detection probe 21 due to loose connection, and preventing damage to the detection probe 21.

[0043] During the downward movement of chip 426, its horizontal position needs to be adjusted to ensure accurate alignment between the bottom of chip 426 and detection probe 21. For example... Figure 5 , Figure 9As shown, the upper corrector 32 includes an upper plate 321 located above the lower corrector 31. The upper plate 321 has a second groove 324 extending through its upper and lower surfaces at a position directly above the detection probe 21. The second groove 324 is a through groove that is wider at the top and narrower at the bottom, and the wider part at the top and the narrower part at the bottom are smoothly transitioned by a slope. The fixed seat 421 has a movable cavity 423 with an inverted "T" cylindrical groove. The connecting rod 422 is locked in the movable cavity 423 by a set annular edge, and the connecting rod 422 can move in the movable cavity 423, so that the fixed seat 421 can undergo horizontal displacement relative to the connecting rod 422. A positioning cylinder 424 is fixedly connected to the outer wall of the fixed seat 421 near the top. The contact end of the positioning cylinder 424 with the inner wall of the second groove 324 is provided with a ball bearing 425. When the lifting plate 413 drives the chip 426 downward through the second groove 324, the ball 425 contacts the inclined surface of the second groove 324 and pushes the fixed seat 421 to make a horizontal displacement relative to the connecting rod 422 under the guidance of the inclined surface, that is, change the horizontal position of the chip 426, thereby ensuring that the chip 426 can be accurately aligned with the detection probe 21.

[0044] When chip 426 is driven down to contact detection probe 21, in order to prevent detection probe 21 from tilting under the large contact stress of high voltage testing, such as Figure 2 , Figure 6 , Figure 7 , Figure 8 , Figure 9As shown, the inner walls of both ends of the receiving plate 13 are provided with slots 131. The lower corrector 31 includes a lower plate 311 and an upper plate 312 covering the top of the lower plate 311. The outer walls of both sides of the lower plate 311 and the upper plate 312 are connected with locking teeth 313. The lower plate 311 and the upper plate 312 are snapped into the receiving plate 13 through the cooperation of the locking teeth 313 and the slots 131. The lower plate 311 and the upper plate 312 are provided with a first groove 314 located directly above the detection probe 21, and the bottom of the lower plate 311 is provided with a groove for the detection probe 21 to pass through. The opening 315 has a first groove 314 with a pair of horizontally sliding correction plates 316. The lower plate 311 has multiple first lugs 318 connected to its edge. A spring 319 is fitted on the slide rod of the first lug 318. The upper plate 321 has a corresponding second lug 323 connected to its edge. The slide rod slides through the second lug 323. The top of the spring 319 contacts the bottom of the second lug 323. A fitting plate 322 is also inserted and fitted at the edge of the upper plate 321. The upper plate 321 slides with the correction plate 316 through the fitting plate 322. When the chip 426 moves down to the bottom of the second groove 324, the bottom of the lifting plate 413 contacts the top of the upper plate 321. Driven by the hydraulic cylinder, the lifting plate 413 drives the upper plate 321 to move down along the slide bar against the elastic force of the spring 319. This causes the upper plate 321 to drive the two correction plates 316 to move closer to each other through the fitting plate 322. When the bottom of the chip 426 contacts the top of the detection probe 21, the two correction plates 316 just surround and clamp the part of the detection probe 21 located in the first groove 314, thereby preventing the detection probe 21 from tilting under the large contact stress of the high-pressure test, ensuring contact stability and test accuracy.

[0045] The calibration plate 316 has round shaft protrusions at both ends. The bottom end of the fitting plate 322 passes through the edges of the lower plate 311 and the upper plate 312, and the fitting plate 322 has an "eight"-shaped sliding groove that runs through its surface. The round shaft protrusions are located in the sliding groove and slide in a guide engagement with the groove. The contact area between the calibration plate 316 and the detection probe 21 is provided with an enclosing part 317, which is a plate structure with a semi-circular groove. When the upper plate 321 moves down, it simultaneously drives the fitting plate 322 down. Under the sliding guidance of the fitting plate 322 and the round shaft protrusions, the two calibration plates 316 in the first groove 314 approach each other until the enclosing parts 317 of the two calibration plates 316 contact each other, forming a complete circular groove that encloses the detection probe 21, thereby ensuring the stability of the detection probe 21.

[0046] In summary, the usage process of this device is as follows: Figure 10As shown, firstly, the chip 426 to be tested is inserted between the extended edges of the bottom of the mounting base 421, so that the top surface of the chip 426 is in contact with the bottom surface of the mounting base 421, with its bottom electrode facing downwards. Then, the connecting rod 422 at the top of the mounting base 421 is inserted into the bottom of the pressure rod 414 through the insertion groove 427, and air is drawn out using the suction pipe 415, so that the pressure rod 414 and the insertion groove 427 are locked together by negative pressure adsorption, thus completing the fixation of the chip 426 and the connection with the lifting component 41.

[0047] Next, the hydraulic cylinder of the lifting component 41 drives the lifting plate 413 to descend, moving the chip 426 toward the detection probe 21. When the chip 426 enters the second groove 324 of the upper corrector 32, the ball bearing 425 on the positioning cylinder 424 first contacts the inclined surface of the second groove 324. The horizontal component force provided by the inclined surface pushes the fixed seat 421 to slide horizontally relative to the connecting rod 422 in the movable cavity 423, thereby automatically correcting the horizontal position of the chip 426 and making the bottom electrode of the chip 426 precisely aligned with the detection probe 21.

[0048] When the chip 426 descends with the mounting base 421 to the bottom of the second groove 324, the lower surface of the lifting plate 413 contacts the top of the upper plate 321. The hydraulic cylinder continues to press down, and the lifting plate 413 pushes the upper plate 321 to move downward along the slide bar of the first lug 318, overcoming the elastic force of the spring 319. As the upper plate 321 moves downward, it drives the fitting plate 322 to move downward synchronously. The "eight"-shaped sliding groove on the fitting plate 322 drives the two correction plates 316 in the first groove 314 to slide towards each other through the round shaft protrusion until the two enclosing parts 317 close together, forming a complete circular cavity, which circumferentially clamps and fixes the detection probe 21 inserted therein.

[0049] Subsequently, the lifting plate 413 continues to push the fixing base 421 and the chip 426 downwards until the bottom electrode of the chip 426 reliably contacts the top of the detection probe 21, which has been securely clamped. At this point, the high-pressure withstand test can be performed. After the test is completed, the hydraulic cylinder drives the lifting plate 413 to rise, and the upper plate 321 returns to its original position under the restoring force of the spring 319. The fitting plate 322 drives the two correction plates 316 to separate in opposite directions, releasing the clamp on the detection probe 21. At the same time, the chip 426 rises with the fixing base 421 and exits the upper corrector 32. The negative pressure of the suction pipe 415 is disconnected, and the fixing base 421 and the chip 426 can be removed from the pressure rod 414, completing the entire test process.

[0050] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip high voltage withstand testing device, characterized in that: The system includes a detection frame (1) and a high-voltage detector (2) mounted on the detection frame (1), a positioning and correction assembly (3), and a lifting and fixing device (4). The positioning and correction assembly (3) includes a lower corrector (31) located above the high-voltage detector (2) and an upper corrector (32) located above the lower corrector (31). The upper corrector (32) and the lower corrector (31) are elastically connected and slide vertically together. The lower corrector (31) is mounted above the high-voltage detector (2). The high-voltage detector (2) detects... The probe (21) passes through the lower corrector (31). After the lifting and fixing device (4) initially fixes the chip (426), it drives the chip (426) to pass through the upper corrector (32) and contact the inner wall of the upper corrector (32), guiding the chip (426) to change its horizontal position so that the bottom of the chip (426) is accurately aligned with the probe (21). When the lifting and fixing device (4) drives the upper corrector (32) to move down, the downward movement of the upper corrector (32) will drive the lower corrector (31) to fix the probe (21).

2. The semiconductor chip high voltage withstand testing device according to claim 1, characterized in that: The detection frame (1) includes a base (11) and a bracket (12) fixed on the base (11). A support plate (13) with an overall U-shaped structure is fixedly connected to the top of the base (11). The high voltage detector (2) is embedded in the support plate (13). The top of the detection probe (21) of the high voltage detector (2) is inserted upward into the lower corrector (31). The lifting and fixing device (4) includes a lifting component (41) fixed to the top of the bracket (12) and a fixing component (42) movably installed with the bottom of the lifting component (41). The fixing component (42) is used to fix the chip (426), and the fixing component (42) is located above the upper corrector (32).

3. The semiconductor chip high voltage withstand testing device according to claim 2, characterized in that: The lifting component (41) and the fixing component (42) are installed in a combination of plug-in and suction.

4. The semiconductor chip high voltage withstand testing device according to claim 3, characterized in that: The fixing component (42) includes multiple fixing seats (421) and a connecting rod (422) disposed on the top of the fixing seat (421). The connecting rod (422) is used to movably connect with the bottom of the lifting component (41). The four corners of the bottom of the fixing seat (421) extend downward to have four corner extension edges for locking the chip (426). The bottom of the fixing seat (421) and the top contact surface of the chip (426) are perpendicular to the detection probe (21).

5. The semiconductor chip high voltage withstand testing device according to claim 4, characterized in that: The lifting component (41) includes a top plate (411) fixedly connected to the top of the bracket (12). Multiple hydraulic cylinders are provided at both ends of the top plate (411). The telescopic rod (412) at the bottom of the hydraulic cylinder is connected to a lifting plate (413). Multiple pressure rods (414) are fixedly connected to the lifting plate (413). The bottom of the pressure rod (414) is disc-shaped. The top of the connecting rod (422) is provided with a corresponding insertion groove (427). The bottom of the pressure rod (414) is inserted into the insertion groove (427).

6. The semiconductor chip high voltage withstand testing device according to claim 5, characterized in that: The top of the pressure rod (414) is connected to an air extraction pipe (415), and an air port (4141) for gas to pass through is opened in the pressure rod (414). The contact surface between the insertion groove (427) and the bottom of the pressure rod (414) is a smooth plane.

7. The semiconductor chip high voltage withstand testing device according to claim 5, characterized in that: The upper corrector (32) includes an upper plate (321) located above the lower corrector (31). The upper plate (321) has a second groove (324) that runs through its upper and lower surfaces, located directly above the detection probe (21). The second groove (324) is a through groove that is wider at the top and narrower at the bottom, and the upper and lower parts are smoothly transitioned by a slope. The fixed seat (421) has a movable cavity (423) with an inverted "T" cylindrical groove. The connecting rod (422) is locked in the movable cavity (423) by a set annular edge, and the connecting rod (422) can move in the movable cavity (423), so that the fixed seat (421) can undergo horizontal displacement relative to the connecting rod (422). The outer wall of the fixed seat (421) near the top is fixedly connected to a positioning cylinder (424). The end of the positioning cylinder (424) that contacts the inner wall of the second groove (324) is provided with a ball (425).

8. The semiconductor chip high voltage withstand testing device according to claim 7, characterized in that: The receiving plate (13) has slots (131) on its inner walls at both ends. The lower corrector (31) includes a lower plate (311) and an upper plate (312) that covers the top of the lower plate (311). The outer walls of both sides of the lower plate (311) and the upper plate (312) are connected with teeth (313). The lower plate (311) and the upper plate (312) are snapped into the receiving plate (13) by the cooperation of the teeth (313) and the slots (131). The lower plate (311) and the upper plate (312) are both provided with a first groove (314) located directly above the detection probe (21). The bottom of the lower plate (311) is provided with a passage for the detection probe (21) to pass through. The first groove (314) is provided with a pair of horizontally sliding correction plates (316). The lower plate (311) is connected to a plurality of first lugs (318) on its edge. A spring (319) is sleeved on the sliding rod of the first lug (318). The upper plate (321) is connected to a second lug (323) on its edge. The sliding rod slides through the second lug (323). The top of the spring (319) contacts the bottom of the second lug (323). A fitting plate (322) is also inserted and fitted at the edge of the upper plate (321). The upper plate (321) slides and fits with the correction plate (316) through the fitting plate (322).

9. The semiconductor chip high voltage withstand testing device according to claim 8, characterized in that: The correction plate (316) has round shaft protrusions at both ends. The bottom end of the fitting plate (322) passes through the edges of the lower plate (311) and the upper plate (312). The fitting plate (322) has an "eight" shaped sliding groove that runs through its surface. The round shaft protrusions are located in the sliding groove and slide guide with the sliding groove.

10. The semiconductor chip high voltage withstand testing device according to claim 8, characterized in that: The calibration plate (316) has an enclosing part (317) at the contact point with the detection probe (21), and the enclosing part (317) is a plate structure with a semi-circular groove.

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