Memory module assembly tool

Abstract

The application provides a memory bank assembly tool, which comprises a support frame, a lifting structure and a press-fitting assembly. The support frame comprises a crossbeam extending along a first direction and arranged opposite a mainboard along a gravity direction, and the crossbeam is located above the mainboard, the first direction intersects the gravity direction; the lifting structure is arranged on the crossbeam and can move up and down along the gravity direction relative to the crossbeam; the press-fitting assembly comprises a support and a plurality of press-fitting structures, the support is connected to the lifting structure, the plurality of press-fitting structures are connected to the support, the support extends along the first direction, and the plurality of press-fitting structures are arranged along the first direction; during assembly of the memory bank, the lifting structure drives the support to move downward along the gravity direction, so as to drive the plurality of press-fitting structures to move downward, so that the plurality of press-fitting structures are pressed against the plurality of memory banks respectively, and the memory banks are assembled into corresponding card slots.

Description

Technical Field

[0001] This application relates to memory module assembly technology, and more particularly to a memory module assembly fixture. Background Technology

[0002] In the semiconductor manufacturing industry, after memory modules are assembled, they need to enter the subsequent testing process to verify module performance. Testing requires installing the memory modules into the motherboard slots. Current methods mostly involve manual pressing and assembly of each module individually. Manual assembly is prone to problems such as uneven force on the memory modules and improper insertion, resulting in low assembly efficiency and impacting the efficiency and yield of subsequent testing. Summary of the Invention

[0003] This application provides a memory module assembly fixture, which helps to improve the assembly efficiency, consistency and yield of assembling multiple memory modules.

[0004] The technical solution of this application embodiment is implemented as follows: This application provides a memory module assembly fixture for assembling multiple memory modules onto a motherboard. The motherboard has multiple slots arranged along a first direction. Each memory module is accommodated in a corresponding slot and protrudes upward from the slot. The memory module assembly fixture includes: A support frame includes a crossbeam extending along a first direction and disposed opposite to the main board along the direction of gravity, and the crossbeam is located above the main board, wherein the first direction intersects the direction of gravity. A lifting structure is provided on the crossbeam and is capable of moving up and down relative to the crossbeam along the direction of gravity; A press-fitting assembly includes a support member and multiple press-fitting structures. The support member is connected to the lifting structure, and the multiple press-fitting structures are connected to the support member. The support member extends along a first direction, and the multiple press-fitting structures are arranged along the first direction. During the assembly of memory modules, the lifting structure drives the support to move downward along the direction of gravity, thereby causing multiple pressing structures to move downward, so that the multiple pressing structures press against the multiple memory modules respectively, and assemble the memory modules into the corresponding slots.

[0005] In some embodiments, the press-fit assembly includes a guide structure, at least two connecting rods, and at least two stops. The guide structure has a plurality of guide holes arranged along the first direction. The connecting rods extend along the direction of gravity. The guide structure is connected to the bottom end of the connecting rods. The support member is movably sleeved on the connecting rods and is capable of reciprocating along the extension direction of the connecting rods. The stops are connected to the connecting rods and are located on the side of the support member opposite to the guide structure. The stops and the support member stop in the direction of gravity. The plurality of press-fit structures are provided with at least one of the connecting rods on each side of the first direction. During the downward movement of the support member, the memory module passes through the guide hole, the guide structure cooperates with the motherboard stop, and the support member moves downward relative to the connecting rod.

[0006] In some embodiments, the press-fit assembly further includes at least two elastic buffers, each elastic buffer being sleeved on each of the connecting rods, and the two ends of the elastic buffer abutting against the support and the guide structure, respectively.

[0007] In some embodiments, the press-fitting structure includes at least one press head with a groove at its bottom end. When the press-fitting structure presses against the memory module, the groove is used to receive the top end of the memory module, and the inner wall of the groove is used to horizontally limit the top end of the memory module.

[0008] In some embodiments, the inner wall of the groove includes two inclined surfaces disposed opposite each other along a first direction, the two inclined surfaces extending toward each other in an upward direction.

[0009] In some embodiments, at least one of the press-fitting structures includes at least two press heads spaced apart along a second direction that intersects the first direction and the direction of gravity, and the second direction is parallel to the length direction of the memory module.

[0010] In some embodiments, the support frame includes two vertical beam assemblies arranged opposite each other along the first direction and for being disposed on both sides of the motherboard in the first direction. Each vertical beam assembly includes a vertical beam body and a clamping structure. The two vertical beam bodies are connected to a crossbeam to support the crossbeam. The clamping structure is connected to the side of the vertical beam body facing the motherboard and is used to engage with the end of the motherboard in the first direction.

[0011] In some embodiments, the clamp structure includes a first locking part, a second locking part, and a side connecting part. The first locking part and the second locking part are arranged opposite to each other along the direction of gravity, and the first locking part is located below the second locking part. The position of the first locking part is lower than the bottom end of the vertical beam body. The first locking part is movably connected to the side connecting part and can reciprocate relative to the side connecting part along the first direction. The second locking part is connected to the side connecting part, and the side connecting part is connected to the vertical beam body. When the first latching portion is at least partially located on the side of the side connection portion facing the motherboard, the first latching portion and the second latching portion together clamp the end of the motherboard in the first direction.

[0012] In some embodiments, the side connection portion has a first through-channel, the first snap-fit ​​portion passes through the first through-channel, the first snap-fit ​​portion has a first abutment surface, the inner wall of the first through-channel has a second abutment surface, the first abutment surface is located on the side of the second abutment surface facing the motherboard; the clamp structure includes a first reset member, the first reset member extends along the first direction, the two ends of the first reset member abut against the first abutment surface and the second abutment surface respectively, during the process of the first snap-fit ​​portion moving away from the motherboard along the first direction, the first snap-fit ​​portion compresses the first reset member, the first reset member is used to provide the first snap-fit ​​portion with a restoring force for moving towards the motherboard along the first direction.

[0013] In some embodiments, the crossbeam has a second through-channel, the lifting structure includes a gear and a rack, the rack passes through the second through-channel along the direction of gravity and is connected to the support member, the gear is rotatably mounted on the crossbeam, the gear meshes with the rack, and the gear drives the support member to move along the direction of gravity through the rack.

[0014] In some embodiments, the lifting structure includes a handle connected to the gear and used to drive the gear to rotate under the action of an external force.

[0015] In some embodiments, the memory module assembly fixture includes a second reset member and a limiting part. The limiting part is connected to the rack, and the second reset member is sleeved on the rack and disposed between the limiting part and the crossbeam. During the downward movement of the rack along the direction of gravity, the limiting part compresses the second reset member, and the second reset member is used to provide a restoring force for the upward movement of the limiting part.

[0016] In some implementations, the memory module assembly fixture includes a first limiting member and a second limiting member, which are arranged opposite to each other along the direction of gravity. The first limiting member is connected to the lifting structure, and the second limiting member is connected to the crossbeam. During the process of the lifting structure moving downward relative to the crossbeam along the direction of gravity, the second limiting member is used to stop and cooperate with the first limiting member.

[0017] The memory module assembly fixture provided in this application utilizes a lifting structure to drive the pressing assembly downwards, causing each pressing structure to press against its corresponding memory module. By applying downward pressure to multiple memory modules simultaneously using multiple pressing structures, it facilitates the assembly of multiple memory modules at once, improving assembly efficiency. Furthermore, using a single support to simultaneously drive multiple pressing structures downwards ensures consistent pressure applied to the memory modules, improving the consistency of the fit between each memory module and its corresponding slot. This also helps to avoid problems such as uneven force, misalignment, incomplete assembly, and damage to contact pins caused by manual pressing, thus improving the consistency and yield of assembling multiple memory modules. After the memory modules are assembled, the lifting structure moves upwards, driving the pressing assembly upwards to facilitate the removal of the motherboard. Compared to manual pressing of individual modules in multiple steps, the memory module assembly fixture provided in this application significantly reduces the assembly time of a single motherboard, lowers labor intensity, significantly improves the overall production line cycle time, and is suitable for large-scale mass production. Attached Figure Description

[0018] Figure 1 A schematic diagram illustrating the interaction between a memory module assembly fixture and a motherboard, provided in some embodiments of this application; Figure 2 for Figure 1 The diagram shown omits the crossbeams, vertical beams, and part of the memory modules. Figure 3 This is a schematic diagram of the clamp structure provided in some embodiments of this application; Figure 4 for Figure 3 The structure shown is a cross-sectional view along the AA direction; Figure 5 This is a schematic diagram of a pressure head provided for some embodiments of this application.

[0019] Explanation of reference numerals in the attached figures 10. Support frame; 11. Crossbeam; 12. Vertical beam assembly; 121. Vertical beam body; 122. Clamp structure; 1221. First clamping part; 1221a. First abutment surface; 12211. Side part; 12212. Column part; 1222. Second clamping part; 1223. Side connecting part; 1223a. First through-passage; 1223b. Second abutment surface; 12231. Side plate; 12232. Protrusion; 1224. First resetting component; 20. Lifting structure; 21. Gear; 22. 23. Rack; 30. Handle; 31. Press-fit assembly; 32. Support; 33. Press-fit structure; 321. Press head; 3211. Groove; 3211a. Inclined surface; 33. Guide structure; 33a. Guide hole; 34. Connecting rod; 35. Stop; 36. Elastic buffer; 40. Second reset component; 50. Limiting component; 61. First limiting component; 62. Second limiting component; 100. Memory module; 200. Motherboard; 200a. Slot; X, First direction; Y, Second direction; Z, Gravity direction. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] The specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the specific technical features in this application will not be described separately.

[0022] In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate that the objects have the sameness or relationship. It should be understood that the directional descriptions "above," "below," "outside," and "inside" refer to the orientation under normal use conditions, while "left" and "right" refer to the left and right directions shown in the corresponding diagrams, which may or may not be the left and right directions under normal use conditions.

[0023] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. "A plurality of" means two or more.

[0024] To better illustrate the embodiments of this application, a first direction, a second direction, and a gravity direction are introduced in these embodiments. The first direction, the second direction, and the gravity direction intersect each other and are not coplanar. The first direction is... Figure 1 The direction indicated by X in the middle, the second direction is Figure 1 The direction indicated by Y is the direction of gravity. Figure 1 The direction indicated by Z in the middle.

[0025] For example, the first direction X and the second direction Y are perpendicular to the direction of gravity Z. It is understood that perpendicularity allows for certain assembly and manufacturing errors.

[0026] In the semiconductor manufacturing industry, after memory modules are assembled, they need to enter the subsequent testing process to verify module performance. Testing requires assembling the memory modules into the motherboard slots. Current methods mostly involve manual assembly, pressing each module individually. This manual assembly relies entirely on the operator's hand strength, pressing angle, and experience. Different operators have significantly different operating habits, force application, and pressing speeds. Even with the same operator performing multiple operations, it's impossible to guarantee that the pressure and stroke are completely consistent each time. Therefore, manual assembly is prone to inconsistent pressing depth and uneven force on individual memory modules, resulting in some modules not being properly inserted. This leads to insufficient contact between the memory module's contact pins and the motherboard slot contacts, causing subsequent testing issues such as poor contact, abnormal data read / write operations, and memory errors, significantly reducing product yield. In other words, manual assembly is not only inefficient but also has low yield, impacting the efficiency and yield of subsequent testing. Improving the assembly efficiency and accuracy of memory modules has become a key concern in the industry.

[0027] In view of this, this application provides a memory module assembly fixture for assembling multiple memory modules 100 onto a motherboard 200.

[0028] In the embodiments of this application, the memory module 100 is generally a DIMM (Dual In-line Memory Module) memory module, including types such as UDIMM (Unbuffered Dual In-line Memory Module), SODIMM (Small Outline Dual In-line Memory Module), RDIMM (Registered Dual In-line Memory Module), and LRDIMM (Load-Reduced Dual In-line Memory Module).

[0029] In some embodiments, such as Figure 2 As shown, the motherboard 200 has multiple slots 200a, which are arranged along a first direction X. Each memory module 100 is housed in its corresponding slot 200a and protrudes upward from the slot 200a. It should be noted that "each memory module 100 is housed in its corresponding slot 200a and protrudes upward from the slot 200a" means that each memory module 100 is pre-installed in the slot 200a, but at this point, the memory module 100 has not yet been fully assembled.

[0030] In the embodiments of this application, such as Figure 1 As shown, the memory module assembly fixture includes a support frame 10, a lifting structure 20, and a pressing assembly 30. The support frame 10 includes a crossbeam 11, which extends along a first direction X and is positioned opposite the motherboard 200 along the gravity direction Z, with the crossbeam 11 located above the motherboard 200. The lifting structure 20 is located on the crossbeam 11 and can move up and down relative to the crossbeam 11 along the gravity direction Z. The pressing assembly 30 includes a support member 31 and multiple pressing structures 32. The support member 31 is connected to the lifting structure 20, and the multiple pressing structures 32 are connected to the support member 31. The support member 31 extends along the first direction X, and the multiple pressing structures 32 are arranged along the first direction X. During the assembly of the memory module 100, the lifting structure 20 drives the support member 31 to move downwards along the gravity direction Z, thereby causing the multiple pressing structures 32 to move downwards, so that the multiple pressing structures 32 press against the multiple memory modules 100 respectively, assembling the memory modules 100 into the corresponding slots 200a.

[0031] The memory module assembly fixture provided in this application embodiment utilizes a lifting structure 20 to drive the pressing assembly 30 to move downwards, causing each pressing structure 32 to press against its corresponding memory module 100. By simultaneously applying downward pressure to multiple memory modules 100 using multiple pressing structures 32, the assembly of multiple memory modules 100 can be completed in one go, improving assembly efficiency. Furthermore, using the same support 31 to simultaneously drive multiple pressing structures 32 downwards synchronously ensures consistent pressure applied to the multiple memory modules 100 by the multiple pressing structures 32, thereby improving the consistency of the assembly and fit between each memory module 100 and its corresponding slot 200a. This also helps to avoid problems such as uneven force, misalignment, incomplete assembly, and damage to contact pins caused by manual pressing, thus improving the consistency and yield of assembling multiple memory modules 100. After the memory module 100 assembly is completed, the lifting structure 20 moves upwards, driving the pressing assembly 30 to move upwards as a whole, facilitating the removal of the motherboard 200. Compared to the manual pressing and multiple operations of individual memory modules, the memory module assembly fixture provided in this application embodiment can significantly shorten the assembly time of a single motherboard 200, reduce the intensity of manual labor, significantly improve the overall operation cycle of the production line, and adapt to the needs of large-scale mass production.

[0032] It should be noted that there are multiple pressing structures 32 and multiple slots 200a. The number of pressing structures 32 can be greater than or equal to the number of slots 200a. This facilitates pressing all memory modules 100 together at once. In this embodiment, the support frame 10 can remain relatively fixed to the motherboard 200, which helps reduce the movement of the motherboard 200 relative to the multiple pressing structures 32 in the first direction X. The number of pressing structures 32 can also be less than the number of slots 200a. All assembly operations can be completed by pressing in sections multiple times. Although multiple pressing is required to complete the installation of all memory modules 100, it is still beneficial to improve assembly efficiency compared to manually pressing one by one. In this embodiment, the motherboard 200 and the support frame 10 need to be able to move relative to each other in the first direction X, or the lifting structure 20 needs to move back and forth relative to the crossbeam 11 in the first direction X, so that the multiple pressing structures 32 can be aligned with the multiple memory modules 100 in different areas in the gravity direction Z.

[0033] In some embodiments, please refer to Figure 1 and Figure 2The press-fit assembly 30 includes a guide structure 33, at least two connecting rods 34, and at least two stop portions 35. The guide structure 33 has multiple guide holes 33a arranged along the first direction X. The connecting rods 34 extend along the gravity direction Z. The guide structure 33 is connected to the bottom end of the connecting rods 34. The support member 31 is movably sleeved on the connecting rods 34 and can reciprocate along the extension direction of the connecting rods 34. The stop portion 35 is connected to the connecting rods 34 and is located on the side of the support member 31 away from the guide structure 33. The stop portion 35 and the support member 31 stop and cooperate in the gravity direction Z. The multiple press-fit structures 32 are provided with at least one connecting rod 34 on each side of the first direction X. During the downward movement of the support member 31, the memory module 100 passes through the guide holes 33a, the guide structure 33 stops and cooperates with the motherboard 200, and the support member 31 moves downward relative to the connecting rods 34.

[0034] Understandably, the shape of the guide hole 33a is adapted to the contour of the memory module 100, and a gap is reserved between the wall of the guide hole 33a and the side wall of the memory module 100 to facilitate the passage of the memory module 100 through the guide hole 33a. This gap can be set according to actual assembly requirements.

[0035] In this embodiment, during the downward movement of the support member 31, before the guide structure 33 contacts the motherboard 200, the connecting rod 34 is hung on the support member 31 via the stop part 35. The support member 31 drives the connecting rod 34 and the guide structure 33 to approach the motherboard 200 simultaneously. After the guide structure 33 contacts the motherboard 200, the guide structure 33 first abuts against the motherboard 200 to achieve positioning. At the same time, the guide hole 33a, after being fixed in position, plays a certain limiting role for the memory module 100, which helps to suppress the shaking and displacement of the memory module 100 during the pressing process of the pressing structure 32, improves the alignment accuracy between the pressing structure 32 and the memory module 100, and thus improves the assembly yield. After assembly, the lifting structure 20 drives the support member 31 to move upward to cooperate with the stop part 35, thereby driving the connecting rod 34 and the guide structure 33 away from the motherboard 200.

[0036] In some embodiments, multiple press-fit structures 32 are provided with two connecting rods 34 on each side of the first direction X. The two connecting rods 34 are arranged opposite each other along the second direction Y. The two connecting rods 34 are beneficial to providing more stable support for the guide structure 33, and also to stabilizing the movement of the support member 31 relative to the connecting rods 34.

[0037] In some embodiments, the stop portion 35 is threadedly engaged with the connecting rod 34. This threaded engagement provides good connection strength and facilitates a detachable connection between the stop portion 35 and the connecting rod 34. This allows for the assembly of both the elastic buffer member 36 and the support member 31 onto the connecting rod 34, followed by the stop portion 35 engaging with the connecting rod 34 to stop and limit the movement of the support member 31. Furthermore, in this embodiment, by providing a threaded section on the connecting rod 34 and utilizing different positions of the stop portion 35 engaging with this threaded section, the assembly position of the stop portion 35 on the connecting rod 34 can be controlled, which is beneficial for controlling the distance between the support member 31 and the guide structure 33 in the height direction.

[0038] In some embodiments, the press-fit assembly 30 further includes at least two elastic buffers 36, each elastic buffer 36 being sleeved on each connecting rod 34, with both ends of the elastic buffer 36 abutting against the support member 31 and the guide structure 33, respectively. Thus, utilizing the buffering effect of the elastic buffer 36, after the guide structure 33 contacts the motherboard 200, the support member 31 continues to move downwards, and the elastic buffer 36 is compressed. On the one hand, the buffering effect of the elastic buffer 36 helps prevent the support member 31 from directly impacting the guide structure 33; on the other hand, the elastic buffer 36 can provide a restoring force for the support member 31. After the memory module 100 is assembled, the restoring force provided by the elastic buffer 36 helps the support member 31 quickly return to its stop position with the stop portion 35.

[0039] The elastic buffer 36 can be, for example, a spring or other elastic component.

[0040] In some embodiments, such as Figure 5 As shown, the pressing structure 32 includes at least one pressing head 321. The bottom end of the pressing head 321 has a groove 3211. When the pressing structure 32 presses against the memory module 100, the groove 3211 is used to accommodate the top end of the memory module 100, and the inner wall of the groove 3211 is used to limit the top end of the memory module 100 in the horizontal direction. In this way, when the pressing structure 32 presses down, the top end of the memory module 100 is accommodated in the groove 3211, and the inner wall of the groove 3211 restricts the horizontal displacement of the top end of the memory module 100, reducing the probability of relative displacement between the two during the pressing process of the pressing structure 32 against the memory module 100, which helps to improve the stability of the pressing structure 32 against the memory module 100.

[0041] In the embodiment with guide structure 33, the guide hole 33a of guide structure 33 and the groove 3211 of press-fit structure 32 together form a constraint on the memory module 100 at different positions along the height direction in the horizontal direction, which helps to further avoid the memory module 100 from tilting during the pressing process and improve the alignment accuracy between press-fit structure 32 and memory module 100.

[0042] For example, the inner wall of the groove 3211 includes two inclined surfaces 3211a arranged opposite each other along a first direction X, and the two inclined surfaces 3211a extend toward each other in an upward direction.

[0043] It is understandable that the distance between the bottom ends of the two inclined planes 3211a in the first direction X is greater than the thickness of the top of the memory module 100.

[0044] Thus, during the downward movement of the press-fit structure 32, the top of the memory module 100 can slide along the two inclined surfaces 3211a to achieve automatic centering. The two inclined surfaces 3211a form a guide inclined surface 3211a, which helps to further improve the stability of the fit between the memory module 100 and the groove 3211.

[0045] In some embodiments, at least one press-fit structure 32 includes at least two press heads 321, which are spaced apart along a second direction Y. The second direction Y intersects the first direction X and the gravity direction Z. The second direction Y is parallel to the length direction of the memory module 100.

[0046] Thus, the multiple pressure head 321 assemblies are arranged at intervals along the second direction Y, which is beneficial for applying pressure to multiple positions of the memory module 100 along its length, and for ensuring uniform force distribution along the length of the memory module 100, thereby improving assembly stability. Moreover, compared to using a single integral pressure head that extends along the second direction Y and can cover the top of the memory module 100, using multiple pressure heads 321 helps to reduce tooling costs.

[0047] It is understandable that memory modules have a thin-walled, elongated structure with a large span along their length. Using a single-piece pressure head would not only result in high material consumption, processing costs, and excessive tooling weight, but also make it difficult to guarantee the flatness of the pressure head during processing, easily leading to problems such as localized suspension and excessive localized pressure, resulting in uneven force distribution along the length of the memory module. This embodiment uses a multi-point distributed pressure head 321, which facilitates the formation of multiple pressure points along the length of the memory module 100, promoting more even force distribution on the elongated memory module 100. Furthermore, the distributed pressure head 321 is lightweight, easy to process, and easy to replace; a single damaged pressure head 321 can be replaced individually, reducing subsequent maintenance costs.

[0048] In some embodiments, the support frame 10 includes two vertical beam assemblies 12, which are arranged opposite each other along a first direction X and are used to be disposed on both sides of the main board 200 in the first direction X. The vertical beam assembly 12 includes a vertical beam body 121 and a clamping structure 122. The two vertical beam bodies 121 are connected to a horizontal beam 11 to support the horizontal beam 11. The clamping structure 122 is connected to the side of the vertical beam body 121 facing the main board 200 and is used to engage with the end of the main board 200 in the first direction X.

[0049] In this embodiment, the vertical beam body 121 provides support for the horizontal beam 11, and the clamp structure 122 is used to engage with the motherboard 200 to limit the position of the motherboard 200. This helps to reduce the shaking and displacement of the motherboard 200 during the assembly of the memory module 100, thereby reducing the shaking and displacement of the memory module 100 and improving assembly accuracy. It is understood that in this embodiment, the number of press-fit structures 32 is greater than or equal to the number of slots 200a.

[0050] The specific form of clamp structure 122 is not limited; in some implementation schemes, such as Figure 3 and Figure 4 As shown, the clamp structure 122 includes a first clamping part 1221, a second clamping part 1222, and a side connecting part 1223. The first clamping part 1221 and the second clamping part 1222 are arranged opposite each other along the gravity direction Z, and the first clamping part 1221 is located below the second clamping part 1222. The position of the first clamping part 1221 is lower than the bottom end of the vertical beam body 121. The first clamping part 1221 is movably connected to the side connecting part 1223 and can reciprocate relative to the side connecting part 1223 along the first direction X. The second clamping part 1222 is connected to the side connecting part 1223, and the side connecting part 1223 is connected to the vertical beam body 121. When the first clamping part 1221 is at least partially located on the side of the side connecting part 1223 facing the main board 200, the first clamping part 1221 and the second clamping part 1222 jointly clamp the end of the main board 200 in the first direction X.

[0051] In this embodiment, the position of the first latching part 1221 is lower than the bottom end of the vertical beam body 121, so that the movement of the first latching part 1221 in the first direction X will not interfere with the vertical beam body 121, and the first latching part 1221 is used to contact the support plane to achieve support for the vertical beam. When the clamp structure 122 needs to engage the motherboard 200, the first engaging part 1221 moves relative to the side connecting part 1223 in the first direction X toward the motherboard 200, so that the first engaging part 1221 and the second engaging part 1222 are positioned opposite each other in the gravity direction Z, thereby achieving the engagement of the clamp structure 122 with the motherboard 200. When the motherboard 200 needs to be removed, the first engaging part 1221 moves relative to the side connecting part 1223 in the first direction X toward the direction away from the motherboard 200, thereby releasing the engagement of the clamp structure 122 with the motherboard 200. It can be understood that when the clamp structure 122 releases its engagement with the motherboard 200, the projection of the first engaging part 1221 on the horizontal plane does not overlap with the projection of the motherboard 200.

[0052] The supporting surface can be the ground or the tabletop of the mounting platform, etc.

[0053] In other embodiments, the clamp structure 122 may include a first snap-fit ​​portion 1221, a second snap-fit ​​portion 1222, and a side connecting portion 1223. The first snap-fit ​​portion 1221 and the second snap-fit ​​portion 1222 are arranged opposite to each other along the gravity direction Z and are respectively connected to the side connecting portion 1223. At least one of the first snap-fit ​​portion 1221 and the second snap-fit ​​portion 1222 can be movable relative to the side connecting portion 1223 along the gravity direction Z, so that the distance between the first snap-fit ​​portion 1221 and the second snap-fit ​​portion 1222 along the gravity direction Z can be adjusted. This enables the clamp structure 122 to be separated from and snapped onto the main board 200, and also enables the clamp structure 122 to be matched with main boards 200 of different heights.

[0054] In an embodiment where the first latching portion 1221 can reciprocate along the first direction X relative to the side connecting portion 1223, please continue reading. Figure 3 and Figure 4 The side connection portion 1223 has a first through-channel 1223a, and a first snap-fit ​​portion 1221 passes through the first through-channel 1223a. The first snap-fit ​​portion 1221 has a first abutting surface 1221a, and the inner wall of the first through-channel 1223a has a second abutting surface 1223b. The first abutting surface 1221a is located on the side of the second abutting surface 1223b facing the motherboard 200. The clamp structure 122 includes a first reset member 1224, which extends along the first direction X. The two ends of the first reset member 1224 abut against the first abutting surface 1221a and the second abutting surface 1223b, respectively. During the movement of the first snap-fit ​​portion 1221 away from the motherboard 200 along the first direction X, the first snap-fit ​​portion 1221 compresses the first reset member 1224. The first reset member 1224 is used to provide a restoring force for the first snap-fit ​​portion 1221 to move along the first direction X toward the motherboard 200.

[0055] In this embodiment, when it is necessary to release the clamping structure 122 from the motherboard 200, an external force is applied to the first clamping part 1221, causing the first clamping part 1221 to move away from the motherboard 200 along the first direction X, thereby separating the first clamping part 1221 from the motherboard 200. During this process, the first clamping part 1221 compresses the first reset member 1224, which stores elastic potential energy. When it is necessary to realize the clamping structure 122 from the motherboard 200, the external force applied to the first clamping part 1221 can be removed. The elastic potential energy stored in the first reset member 1224 is used to drive the first clamping part 1221 to move towards the motherboard 200 along the first direction X, that is, to provide the first clamping part 1221 with a restoring force for moving towards the motherboard 200 along the first direction X.

[0056] In this embodiment, the clamp structure 122 is equipped with a first reset member 1224. The motherboard 200 can be unlocked by manually pulling the first locking part 1221. After releasing, it automatically resets and clamps. The clamping force is uniform and stable, and there will be no problems such as the motherboard 200 being squeezed and deformed or the clamping loosened due to uneven manual locking force. This is conducive to the rapid clamping of the motherboard 200, greatly simplifies the operation process and improves the work efficiency.

[0057] In some embodiments, the first snap-fit ​​portion 1221 includes a side portion 12211 and at least two column portions 12212, the at least two column portions 12212 being arranged at intervals along the second direction Y. The side portion 12211 is located on the side of the side connecting portion 1223 away from the vertical beam and is connected to the at least two column portions 12212. The side connecting portion 1223 has at least two first through channels 1223a, each column portion 12212 passing through the corresponding first through channel 1223a. The number of first reset members 1224 is the same as the number of column portions 12212, the first reset members 1224 being sleeved on the corresponding column portion 12212, and the column portion 12212 having a first abutment surface 1221a. In this embodiment, pulling the side portion 12211 causes it to move each column portion 12212 away from the motherboard 200 along the first direction X. Removing the external force applied to the side portion 12211, each column portion 12212 moves towards the motherboard 200 under the restoring force of its corresponding first reset member 1224. The multiple columns 12212 and the second limiting portion 50 work together to achieve locking of the end of the motherboard 200. In this embodiment, the multiple first reset members 1224 correspond one-to-one with the multiple columns 12212, allowing the multiple first reset members 1224 to collaboratively provide restoring force, which is beneficial for the overall restoring force and improves the reliability of the locking mechanism.

[0058] In some embodiments, such as Figure 3 As shown, the side connection portion 1223 includes a side plate 12231 and a protrusion 12232. The side plate 12231 is connected to the side of the vertical beam body 121 facing the main board 200, and the protrusion 12232 is connected to the side of the side plate 12231 away from the main board 200 and is located below the vertical beam. A first through-channel 1223a is formed in the side plate 12231 and the protrusion 12232. This makes it easier to make the side plate 12231 thinner. The protrusion 12232 and the side plate 12231 together form the first through-channel 1223a, so that the side connection portion 1223 can provide sufficient installation space for the first reset member 1224 in the first direction X.

[0059] For example, the bottom surface of the protrusion 12232 is flush with the bottom surface of the side plate 12231. In this way, the protrusion 12232 and the side plate 12231 can be supported together on the support plane, which helps to improve the stability of the support frame 10 on the support plane.

[0060] For example, the first reset member 1224 may be a spring. It is understood that the first reset member 1224 may also be other elastic members.

[0061] It is understandable that in other embodiments where the first engaging portion 1221 can reciprocate relative to the side connecting portion 1223 along the first direction X, the aforementioned first reset member 1224 may be omitted. Instead, an elastic buckle can be provided on the outer wall of the first engaging portion 1221, and multiple positioning grooves arranged along the first direction can be provided on the inner wall of the first through-channel 1223a. The elastic buckle can engage in any one of the positioning grooves, achieving relative fixation between the first engaging portion 1221 and the side connecting portion 1223. Under the action of external force pushing or pulling, the elastic buckle can disengage from the current positioning groove and slide into another positioning groove. In other words, the elastic buckle will disengage from the current positioning groove only when the pushing or pulling force acting on the first engaging portion 1221 is greater than the limiting force of the positioning groove on the elastic buckle. In this embodiment, the relative position of the first engaging portion 1221 and the side connecting portion 1223 is changed by utilizing the cooperation of the elastic buckle with different positioning grooves, thereby achieving movement of the first engaging portion 1221 relative to the side connecting portion 1223.

[0062] In some embodiments, the crossbeam 11 has a second through-channel, such as Figure 1 As shown, the lifting structure 20 includes a gear 21 and a rack 22. The rack 22 passes through the second through-channel along the gravity direction Z and is connected to the support member 31. The gear 21 is rotatably mounted on the crossbeam 11. The gear 21 meshes with the rack 22. The gear 21 drives the support member 31 to move along the gravity direction Z through the rack 22.

[0063] Figure 1 The dashed line in the diagram indicates the outline of gear 21. It represents the outline of gear 21 that is not visible from the current viewing angle and is obscured by crossbeam 11. It is not the actual appearance of the memory module assembly fixture.

[0064] In this embodiment, the gear 21 and rack 22 work together to achieve the reciprocating movement of the rack 22 in the gravity direction Z, thereby realizing the reciprocating movement of the support member 31 in the gravity direction Z. The gear 21 and rack 22 transmission has the characteristics of flexible stroke setting, high transmission efficiency, and direct linear displacement response, which facilitates precise control of the pressing stroke and pressing load. The second through-channel also helps to limit the rack 22 in the horizontal direction, which is beneficial to the stability of the rack 22's movement in the gravity direction Z.

[0065] For example, the lifting structure 20 includes a handle 23, which is connected to the gear 21 and is used to drive the gear 21 to rotate under the action of external force. In this way, the operator can directly drive the gear 21 to rotate manually through the handle 23, thereby controlling the pressing structure 32 to press down and lift. The structure is simple, easy to debug on site, and requires no additional power source.

[0066] It is understood that in other embodiments, the lifting structure 20 may also adopt a screw and nut pair structure, or a linear drive component such as a cylinder or hydraulic cylinder.

[0067] In some embodiments, such as Figure 1 As shown, the memory module assembly fixture includes a second reset member 40 and a limiting part 50. The limiting part 50 is connected to the rack 22, and the second reset member 40 is sleeved on the rack 22 and located between the limiting part 50 and the crossbeam 11. During the downward movement of the rack 22 along the direction of gravity Z, the limiting part 50 compresses the second reset member 40, which provides a restoring force for the upward movement of the limiting part 50. In this embodiment, during the assembly of the memory module 100, the limiting part 50 compresses the second reset member 40, which stores elastic potential energy. After the force on the gear 21 is removed, the elastic potential energy stored in the second reset member 40 is used to drive the limiting part 50 to move upward, that is, to provide a restoring force for the upward movement of the limiting part 50. The limiting part 50 drives the rack 22 to move upward, which in turn drives the support member 31 to move upward. Moreover, the addition of the second reset member 40 facilitates the automatic upward reset of the rack 22, eliminating the need for manual reverse rotation of the handle 23, further simplifying the work process and improving work efficiency.

[0068] For example, the limiting part 50 is connected to the top end of the rack 22.

[0069] For example, the second reset member 40 is a spring. It is understood that the second reset member 40 may also be other elastic members.

[0070] In some embodiments, the memory module assembly fixture includes a first limiting member 61 and a second limiting member 62, which are arranged opposite each other along the direction of gravity Z. The first limiting member 61 is connected to the lifting structure 20, and the second limiting member 62 is connected to the crossbeam 11. During the downward movement of the lifting structure 20 relative to the crossbeam 11 under gravity, the second limiting member 62 is used to stop the first limiting member 61. In this way, the second limiting member 62 can limit the downward movement of the first limiting member 61, thereby limiting the downward stroke of the lifting structure 20, that is, limiting the downward stroke of the support member 31, which also helps to prevent the support member 31 from colliding with the motherboard 200 or the guide structure 33.

[0071] In an embodiment where the lifting structure 20 includes a gear 21, a rack 22, and a limiting part 50, the first limiting member 61 is connected to the limiting part 50, that is, the limiting part 50 can provide an installation position for the first limiting member 61.

[0072] As an example, both the first limiting member 61 and the second limiting member 62 are columnar, such as cylindrical, square, etc.

[0073] In the description of this application, the references to terms such as "an embodiment," "some embodiments," "some implementations," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine different embodiments or examples described in this application, as well as features of different embodiments or examples.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A memory module assembly fixture for assembling multiple memory modules onto a motherboard, characterized in that, The motherboard has multiple slots arranged along a first direction. Each memory module is housed in its corresponding slot and protrudes upward from the slot. The memory module assembly fixture includes: A support frame includes a crossbeam extending along a first direction and disposed opposite to the main board along the direction of gravity, and the crossbeam is located above the main board, wherein the first direction intersects the direction of gravity. A lifting structure is provided on the crossbeam and is capable of moving up and down relative to the crossbeam along the direction of gravity; A press-fitting assembly includes a support member and multiple press-fitting structures. The support member is connected to the lifting structure, and the multiple press-fitting structures are connected to the support member. The support member extends along a first direction, and the multiple press-fitting structures are arranged along the first direction. During the assembly of memory modules, the lifting structure drives the support to move downward along the direction of gravity, thereby causing multiple pressing structures to move downward, so that the multiple pressing structures press against the multiple memory modules respectively, and assemble the memory modules into the corresponding slots.

2. The memory module assembly fixture according to claim 1, characterized in that, The press-fit assembly includes a guide structure, at least two connecting rods, and at least two stop portions. The guide structure has multiple guide holes arranged along the first direction. The connecting rods extend along the direction of gravity. The guide structure is connected to the bottom end of the connecting rods. The support member is movably sleeved on the connecting rods and can reciprocate along the extension direction of the connecting rods. The stop portions are connected to the connecting rods and are located on the side of the support member opposite to the guide structure. The stop portions and the support member stop in the direction of gravity. The multiple press-fit structures are provided with at least one of the connecting rods on both sides of the first direction. During the downward movement of the support member, the memory module passes through the guide hole, the guide structure cooperates with the motherboard stop, and the support member moves downward relative to the connecting rod.

3. The memory module assembly fixture according to claim 2, characterized in that, The press-fit assembly further includes at least two elastic buffers, each elastic buffer being sleeved on each of the connecting rods, and the two ends of the elastic buffer abutting against the support and the guide structure, respectively.

4. The memory module assembly fixture according to claim 1, characterized in that, The pressing structure includes at least one pressing head, the bottom end of which has a groove. When the pressing structure presses against the memory module, the groove is used to accommodate the top end of the memory module, and the inner wall of the groove is used to limit the top end of the memory module in the horizontal direction.

5. The memory module assembly fixture according to claim 4, characterized in that, The inner wall of the groove includes two inclined surfaces arranged opposite each other along a first direction, and the two inclined surfaces extend toward each other in an upward direction.

6. The memory module assembly fixture according to claim 1, characterized in that, At least one of the press-fitting structures includes at least two press heads, which are spaced apart along a second direction that intersects the first direction and the direction of gravity, and the second direction is parallel to the length direction of the memory module.

7. The memory module assembly fixture according to claim 1, characterized in that, The support frame includes two vertical beam assemblies, which are arranged opposite to each other along the first direction and are used to be located on both sides of the motherboard in the first direction. Each vertical beam assembly includes a vertical beam body and a clamping structure. The two vertical beam bodies are connected to a horizontal beam to support the horizontal beam. The clamping structure is connected to the side of the vertical beam body facing the motherboard and is used to engage with the end of the motherboard in the first direction.

8. The memory module assembly fixture according to claim 7, characterized in that, The clamp structure includes a first clamping part, a second clamping part, and a side connecting part. The first clamping part and the second clamping part are arranged opposite each other along the direction of gravity, and the first clamping part is located below the second clamping part. The position of the first clamping part is lower than the bottom end of the vertical beam body. The first clamping part is movably connected to the side connecting part and can reciprocate relative to the side connecting part along the first direction. The second clamping part is connected to the side connecting part, and the side connecting part is connected to the vertical beam body. When the first latching portion is at least partially located on the side of the side connection portion facing the motherboard, the first latching portion and the second latching portion together clamp the end of the motherboard in the first direction.

9. The memory module assembly fixture according to claim 8, characterized in that, The side connection portion has a first through-channel, the first snap-fit ​​portion passes through the first through-channel, the first snap-fit ​​portion has a first abutting surface, the inner wall of the first through-channel has a second abutting surface, and the first abutting surface is located on the side of the second abutting surface facing the motherboard. The clamp structure includes a first reset member extending along the first direction. The two ends of the first reset member abut against the first abutment surface and the second abutment surface, respectively. During the movement of the first snap-fit ​​portion away from the motherboard along the first direction, the first snap-fit ​​portion compresses the first reset member. The first reset member is used to provide a restoring force for the first snap-fit ​​portion to move towards the motherboard along the first direction.

10. The memory module assembly fixture according to claim 1, characterized in that, The crossbeam has a second through-channel, and the lifting structure includes a gear and a rack. The rack passes through the second through-channel along the direction of gravity and is connected to the support member. The gear is rotatably mounted on the crossbeam and meshes with the rack. The gear drives the support member to move along the direction of gravity through the rack.

11. The memory module assembly fixture according to claim 10, characterized in that, The lifting structure includes a handle, which is connected to the gear and is used to drive the gear to rotate under the action of external force.

12. The memory module assembly fixture according to claim 10, characterized in that, The memory module assembly fixture includes a second reset member and a limiting part. The limiting part is connected to the rack, and the second reset member is sleeved on the rack and located between the limiting part and the crossbeam. During the downward movement of the rack along the direction of gravity, the limiting part compresses the second reset member, and the second reset member is used to provide a restoring force for the upward movement of the limiting part.

13. The memory module assembly fixture according to claim 1, characterized in that, The memory module assembly fixture includes a first limiting member and a second limiting member, which are arranged opposite to each other along the direction of gravity. The first limiting member is connected to the lifting structure, and the second limiting member is connected to the crossbeam. During the process of the lifting structure moving downward relative to the crossbeam along the direction of gravity, the second limiting member is used to stop and cooperate with the first limiting member.

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