Device for disassembling and assembling memory bank and using method thereof
By designing a memory stick disassembly device that integrates disassembly and presses the components, and using a robotic arm to control its work, the problems of unstable and high cost of memory stick disassembly and high in the prior art are solved, and fast and automated memory stick disassembly and assembly are achieved.
Patent Information
- Application Number
- CN202411848681.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-03-07
AI Technical Summary
The existing memory stick disassembly and assembly technology relies on the adapter card, which is unstable in operation, increases the testing cost, and cannot be used in some scenarios, which cannot meet the users' quick disassembly and assembly needs.
A device including a fixing seat, a disassembly assembly and a pressing assembly is designed to control the disassembly assembly and pressing assembly through a robotic arm to realize the rapid disassembly and assembly of the memory stick. The disassembly assembly includes a mounting base, a disassembly cylinder and a disassembly claw. The pressing assembly includes a pressing base and a pressing block to ensure the stable installation and removal of the memory stick.
It realizes rapid and automated disassembly of memory sticks, reduces operational complexity and cost, improves work efficiency, and is suitable for various memory stick specifications without additional tools.
Smart Images

Figure CN119567178A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of memory stick disassembly and assembly, and in particular to a device for disassembly and assembly of a memory stick and a method for using the device. Background Art
[0002] In the current practice of computer hardware maintenance and upgrade, the process of removing memory sticks usually relies on adapter cards as auxiliary tools. The original intention of the design of adapter cards was to provide a compatibility solution so that memory sticks of different specifications or types can be adapted to specific memory slots. This solution has expanded the flexibility of the hardware to a certain extent, allowing users to upgrade the memory without replacing the motherboard. However, the existing operation does not have the function of opening the memory slot and grabbing the memory stick at the same time; in addition, the use of adapter cards increases the instability of the test and the additional cost, and adapter cards cannot be used in some scenarios, resulting in failure to meet the use needs. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a device for disassembling and assembling a memory stick and a method for using the device.
[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0005] In a first aspect, an embodiment of the present invention provides a device for disassembling and assembling a memory stick, comprising: a fixing seat, a disassembly assembly and a pressing assembly, wherein the disassembly assembly is installed in the vertical direction of the fixing seat, and the pressing assembly is installed in the horizontal direction of the fixing seat, the disassembly assembly is used to disassemble or place the memory stick, and the pressing assembly is used to press the memory stick to complete the installation of the memory stick, the fixing seat is transmission-connected to an external robotic arm, and the robotic arm is used to control and switch the operation of the disassembly assembly or the pressing assembly.
[0006] In a specific embodiment, the disassembly assembly includes a mounting seat, a disassembly cylinder and two disassembly claws, the mounting seat is connected to the fixed seat, the disassembly cylinder is connected to the mounting seat, the two disassembly claws are respectively connected to the two sides of the disassembly cylinder, and the disassembly cylinder works to make the two disassembly claws form an open or closed state.
[0007] In a specific embodiment, an oblique shovel is provided at the end of the disassembly claw, and the oblique shovel is used to push open the buckle of the memory slot or hook the notch of the memory stick.
[0008] In a specific embodiment, an anti-skid layer is further provided on the outer side of the angled shovel.
[0009] In a specific embodiment, the disassembly cylinder is further connected to a mounting plate, both ends of the mounting plate are connected to limit plates, and the disassembly claw is located between the two limit plates.
[0010] In a specific embodiment, a sliding groove is provided on the limiting plate, the disassembly claw is slidably connected to the sliding groove via a pin shaft, a tension spring is sleeved on the pin shaft, and the tension spring is also connected to the limiting plate.
[0011] In a specific embodiment, a linear bearing is further provided between the mounting seat and the fixing seat, and a spring is sleeved on the linear bearing.
[0012] In a specific embodiment, the pressing assembly includes a pressing seat and a pressing block, the pressing seat is connected to the fixing seat, and the pressing block is connected to the pressing seat.
[0013] In a specific embodiment, a connecting column is further provided between the pressing seat and the fixing seat, and a spring is sleeved on the connecting column.
[0014] The device for disassembling and assembling a memory stick of the present invention has the following beneficial effects compared with the prior art: by integrating a disassembly component and a pressing component, the disassembly and installation operations of the memory stick are respectively responsible, and the switching and control of the two are achieved through a mechanical arm on a fixed base. This integrated design greatly simplifies the operating process, and the memory stick can be quickly disassembled and assembled without the need for additional tools or adapter cards, thereby improving work efficiency.
[0015] In a second aspect, an embodiment of the present invention provides a method for using a device for disassembling and assembling a memory module, comprising the following steps:
[0016] If the memory stick needs to be removed, the robot arm drives the disassembly assembly to move to the memory slot area, and then the disassembly cylinder drives the two disassembly claws to open to push open the buckle of the memory slot, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the memory stick, and then the robot arm drives the disassembly assembly upward to take out the memory stick, completing the removal of the memory stick;
[0017] If a memory stick needs to be installed, the robotic arm drives the disassembly assembly to the position for placing a new memory stick, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the new memory stick, and then the robotic arm drives the disassembly assembly to the memory slot area, and drives the disassembly assembly downward to insert the new memory stick into the memory slot, and then the disassembly cylinder drives the two disassembly claws to open to release the new memory stick, and then the robotic arm switches the pressing assembly to work, and drives the pressing block downward to press the new memory stick until the buckle of the memory slot locks the new memory stick to complete the installation of the memory stick.
[0018] The method for using the device for disassembling and assembling a memory stick of the present invention has the following beneficial effects compared with the prior art: through the coordinated work of the mechanical arm, the disassembly assembly and the pressing assembly, the rapid and automated disassembly and assembly of the memory stick is achieved, and both the disassembly and installation processes are completed through precise mechanical movements, which greatly improves work efficiency and reduces the tediousness and time-consuming manual operations.
[0019] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0021] Figure 1 A front perspective schematic diagram of a device for disassembling and assembling a memory stick provided by the present invention;
[0022] Figure 2 A back perspective schematic diagram of the device for disassembling and assembling a memory stick provided by the present invention;
[0023] Figure 3 An exploded schematic diagram of the device for disassembling and assembling a memory stick provided by the present invention;
[0024] Figure 4 An exploded schematic diagram of the disassembly assembly provided by the present invention;
[0025] Figure 5 A schematic diagram of the structure of the pressing assembly provided by the present invention;
[0026] Figure 6 A schematic diagram of an application scenario of the device for disassembling and assembling a memory stick provided by the present invention;
[0027] Figure 7 A schematic flow chart of a method for using the device for disassembling and assembling a memory stick provided by the present invention. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.
[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.
[0035] See also Figures 1 to 6 In the specific embodiment shown, the present invention discloses a device for disassembling and assembling a memory stick, comprising: a fixing seat 10, a disassembly assembly 20 and a pressing assembly 30, wherein the disassembly assembly 20 is installed in the vertical direction of the fixing seat 10, and the pressing assembly 30 is installed in the horizontal direction of the fixing seat 10, the disassembly assembly 20 is used to disassemble or place the memory stick, and the pressing assembly 30 is used to press the memory stick to complete the installation of the memory stick, and the fixing seat 10 is transmission-connected to an external mechanical arm, and the mechanical arm is used to control and switch the operation of the disassembly assembly 20 or the pressing assembly 30.
[0036] Specifically, by integrating the disassembly component 20 and the pressing component 30, they are responsible for the disassembly and installation operations of the memory stick respectively, and the switching and control of the two are realized by the mechanical arm on the fixing seat 10. This integrated design greatly simplifies the operation process, and the memory stick can be quickly disassembled and assembled without additional tools or adapter cards, thereby improving work efficiency. In addition, the disassembly component 20 is designed with a special mechanism that can automatically open the buckle of the memory slot and firmly grasp the memory stick at the same time, avoiding the risk of damage that may be caused by manual operation; at the same time, the pressing component 30 can accurately press the memory stick into the memory slot to ensure that it is installed in place, thereby improving the accuracy and safety of the operation. In addition, the device can directly support standard memory sticks, without the need for adapter cards as intermediate media, and without the need to purchase and maintain adapter cards, thereby reducing costs.
[0037] More specifically, the fixed seat 10 is connected to the robot arm through the fixed head 40, and the disassembly component 20 and the pressing component 30 are staggered at 90 degrees to prevent mutual interference. That is to say, by disassembling the component 20 and the pressing component 30 at 90 degrees, the mutual interference that may occur between the two during operation is effectively avoided. This design not only optimizes the overall spatial layout of the device, but also ensures that each component can operate independently and efficiently, thereby improving the overall stability and reliability. In addition, while maintaining functionality, this staggered distribution design also enhances the compactness of the device. By rationally utilizing space, the device as a whole becomes more compact and lightweight. In addition, the fixed seat 10 is connected to the robot arm through the fixed head 40. This connection method not only ensures a stable connection between the fixed seat 10 and the robot arm, but also enables the device to be positioned and operated more accurately. The design of the fixed head 40 may include a locking mechanism or an adjustment mechanism to further increase the stability and flexibility of the connection.
[0038] See also Figures 1 to 4 As shown, in one embodiment, the disassembly assembly 20 includes a mounting seat 21, a disassembly cylinder 22 and two disassembly claws 23, the mounting seat 21 is connected to the fixed seat 10, the disassembly cylinder 22 is connected to the mounting seat 21, and the two disassembly claws 23 are respectively connected to the two sides of the disassembly cylinder 22 by transmission, and the disassembly cylinder 22 works to make the two disassembly claws 23 form an open or closed state.
[0039] Specifically, through the drive of the disassembly cylinder 22, the two disassembly claws 23 can quickly and accurately form an open or closed state. This design ensures the stability and accuracy of the memory bar during the disassembly and assembly process, and effectively avoids damage to the memory bar or memory slot due to improper operation. In addition, the disassembly assembly 20 is composed of a mounting seat 21, a disassembly cylinder 22 and two disassembly claws 23, and has a compact structure and a reasonable design. This compact structure not only makes the entire device more lightweight and flexible, but also facilitates integration with other components or systems, thereby improving the overall compatibility and adaptability. In addition, the automatic control of the disassembly cylinder 22 makes the opening and closing operation of the disassembly claw 23 simple and fast, without manual operation, which not only improves work efficiency, but also reduces operational errors caused by human factors, and improves the overall automation level. In addition, the two disassembly claws 23 are respectively connected to the two sides of the disassembly cylinder 22 by transmission, and can be evenly stressed, ensuring sufficient stability and reliability when grabbing the memory bar; at the same time, the shape and material of the disassembly claw 23 can also be customized according to the specific size and characteristics of the memory bar to further improve the accuracy and firmness of the grab.
[0040] See also Figures 1 to 4As shown, in one embodiment, an oblique shovel 231 is provided at the end of the disassembly claw 23, and the oblique shovel 231 is used to push open the buckle of the memory slot or hook the notch of the memory stick.
[0041] Specifically, the oblique shovel 231 provided at the end of the disassembly claw 23 can accurately push open the buckle of the memory slot or hook the notch of the memory stick. This design significantly improves the accuracy and efficiency of the disassembly process, ensuring that the memory stick can be smoothly and non-destructively removed from the memory slot. In addition, the design of the oblique shovel 231 enables the disassembly claw 23 to apply force in a softer and more uniform manner when pushing open the buckle or hooking the notch, which not only avoids damage to the memory stick or memory slot caused by direct violent disassembly, but also prolongs the service life of the memory stick and memory slot. In addition, the existence of the oblique shovel 231 simplifies the disassembly process and reduces the difficulty of operation. The disassembly of the memory stick can be easily completed without the use of additional tools or skills, which improves the convenience of operation. In addition, the oblique shovel 231 is usually made of high-strength, wear-resistant materials, which can withstand multiple disassembly operations without being easily damaged, which improves the durability and reliability of the disassembly claw 23 and ensures the stability and durability of the disassembly process.
[0042] See also Figure 4 As shown, in one embodiment, an anti-skid layer 232 is further provided on the outer side of the oblique shovel 231 .
[0043] Specifically, the presence of the anti-skid layer 232 significantly enhances the friction of the oblique shovel 231 when pushing open the memory slot buckle, effectively preventing the slipping phenomenon caused by smooth surface or improper operation. This improvement ensures that the disassembly claw 23 can stably and accurately perform the disassembly action, and improves the overall stability of the operation. In addition, the reduction of slipping means that the possibility of operating errors is greatly reduced, which not only avoids damage to the memory bar or memory slot due to improper operation, but also reduces the additional wear caused by repeated attempts to disassemble, and prolongs the service life of the memory bar and memory slot. In addition, the design of the anti-skid layer 232 makes the disassembly process smoother and easier to control, reducing the difficulty and complexity of the operator's operation, which improves the operator's experience of use and enhances the operator's satisfaction and trust in the product. In addition, the design of the anti-skid layer 232 enables the disassembly claw 23 to maintain good operating performance in different working environments and conditions. Whether it is a wet, greasy or dusty environment, the anti-skid layer 232 can provide sufficient friction to ensure the smooth progress of the disassembly process. In addition, since the anti-skid layer 232 reduces the direct friction and wear between the oblique shovel 231 and the memory slot buckle, it also indirectly extends the service life of the disassembly claw 23, which reduces the maintenance cost of the operator and improves the cost performance of the product.
[0044] See also Figures 1 to 4As shown, in one embodiment, the disassembly cylinder 22 is further connected to a mounting plate 24 , both ends of the mounting plate 24 are connected to limit plates 25 , and the disassembly claw 23 is located between the two limit plates 25 .
[0045] Specifically, a mounting plate 24 is connected to the disassembly cylinder 22, and the limiting plates 25 are connected to both ends of the mounting plate 24, so as to form a stable frame structure. The disassembly claw 23 is located between the two limiting plates 25. Such a design effectively limits the lateral movement of the disassembly claw 23 during the disassembly process, enhances the stability of the overall structure, and ensures the accuracy and reliability of the disassembly action. In addition, the existence of the limiting plate 25 not only limits the movement range of the disassembly claw 23, but also plays a role in protecting the disassembly claw 23 and surrounding components. During the disassembly process, even if an unexpected situation occurs, the limiting plate 25 can prevent the disassembly claw 23 from excessively moving and damaging the memory bar, slot or other adjacent components. In addition, the stable frame structure enables the disassembly claw 23 to be more accurately positioned at the buckle position of the memory slot, reduces disassembly errors caused by shaking or offset, improves the accuracy and efficiency of disassembly, and ensures that the memory bar can be smoothly and non-destructively removed from the memory slot.
[0046] See also Figure 4 As shown, in one embodiment, a sliding groove 251 is provided on the limiting plate 25 , and the disassembly claw 23 is slidably connected to the sliding groove 251 via a pin shaft 26 . A tension spring 27 is sleeved on the pin shaft 26 , and the tension spring 27 is also connected to the limiting plate 25 .
[0047] Specifically, the position heights of different memory sticks have tolerances. When the disassembly claw 23 reaches the predetermined position, if the buckle of the memory slot is higher, the disassembly claw 23 can be moved upwards through the cooperation of the sliding groove 251, the pin 26 and the tension spring 27, so as not to damage the buckle of the memory slot. In other words, by setting the sliding groove 251 on the limit plate 25, and slidingly connecting the disassembly claw 23 in the sliding groove 251 through the pin 26, and cooperating with the use of the tension spring 27, this design gives the disassembly claw 23 the ability to self-adaptively adjust its height. When the disassembly claw 23 reaches the predetermined position, if the position of the buckle of the memory slot is too high due to the tolerance, the disassembly claw 23 can automatically move upwards under the action of the tension spring 27 to ensure accurate docking with the buckle, thereby avoiding damage to the buckle caused by hard contact. In addition, due to the tolerance of the height of the memory stick, the traditional disassembly method may cause damage due to the inability to accurately match, while the present design effectively improves the fault tolerance of the disassembly process through the clever cooperation of the sliding groove 251, the pin 26 and the tension spring 27. Even if the position of the memory stick is deviated, the disassembly can be completed smoothly, reducing the difficulty of operation and the risk of error. In addition, the design automatically adjusts the height of the disassembly claw 23 to avoid the friction and damage caused by the hard collision between the disassembly claw 23 and the buckle, effectively protects the integrity of the memory slot and the buckle, and prolongs the service life of the memory stick and the memory slot. In addition, the design of the sliding groove 251 and the pin 26 enables the disassembly claw 23 to move flexibly during the disassembly process, while the tension of the tension spring 27 ensures the stability of the disassembly claw 23 during the movement, avoiding disassembly errors caused by shaking or offset. In addition, there is no need to manually adjust the height of the disassembly claw 23, which can automatically adapt to memory sticks of different heights, simplifying the operation process and improving the disassembly efficiency, which is particularly important for maintenance or upgrade work that requires a large number of memory sticks to be disassembled.
[0048] See also Figure 3 As shown, in one embodiment, a linear bearing 28 is further provided between the mounting seat 21 and the fixing seat 10 , and a spring is sleeved on the linear bearing 28 .
[0049] Specifically, the spring sleeved on the linear bearing 28 plays a key role in buffering and shock absorption. During the disassembly or installation process, when encountering impact force or vibration, the spring can absorb and disperse this energy, effectively reducing the impact and damage to the mounting seat 21, the fixing seat 10 and the connected parts, and improving the stability and reliability of the entire device. In addition, in addition to buffering and shock absorption, the spring also provides an overpressure protection function; when subjected to excessive pressure or force, the spring can undergo elastic deformation, thereby absorbing and dispersing this part of the additional pressure, preventing the parts from being damaged due to excessive load, which is of great significance for protecting precision parts and extending the life of the device.
[0050] See also Figures 1 to 6As shown, in one embodiment, a first photoelectric sensor 50 is further provided between the two limit plates 25, and the first photoelectric sensor 50 is located between the two disassembly claws 23 to detect the memory bar in real time and avoid abnormal falling during transportation. That is to say, by providing the first photoelectric sensor 50 between the two limit plates 25 and locating it between the two disassembly claws 23, the existence status of the memory bar can be detected in real time. This real-time monitoring mechanism ensures the safety and reliability of the memory bar during transportation, and effectively avoids damage or loss caused by abnormal falling of the memory bar. In addition, the application of the first photoelectric sensor 50 improves the accuracy of the memory bar transportation process. When the sensor detects the memory bar, it can ensure that the disassembly claw 23 has correctly clamped the memory bar and is ready for transportation. This confirmation mechanism reduces transportation errors caused by improper operation or equipment failure, and improves the reliability and efficiency of the overall operation. In addition, the integration of the first photoelectric sensor 50 enables the device to better support automation and intelligent control. By integrating with the control system, the first photoelectric sensor 50 can transmit the status information of the memory bar in real time, thereby realizing accurate control and optimization of the transportation process. This integrated design helps to improve the overall performance and flexibility of the system.
[0051] See also Figures 1 to 6 As shown, in one embodiment, a second photoelectric sensor 60 is further provided on the fixing seat 10, and a sensing plate 70 corresponding to the second photoelectric sensor 60 is provided on the mounting seat 21. If the position of the memory bar is biased or in other abnormal states, causing the mechanical arm to press down, the disassembly claw 23 may directly damage the memory slot if it fails to catch the memory bar. By providing the second photoelectric sensor 60, when the memory bar is not caught, the disassembly claw 23 will lift up so that the sensing plate 70 triggers the second photoelectric sensor 60, and the mechanical arm stops working, thereby protecting the memory slot. In other words, by providing the second photoelectric sensor 60 on the fixing seat 10 and providing the corresponding sensing plate 70 on the mounting seat 21, it is possible to accurately detect whether the memory bar is correctly caught. When the position of the memory bar is offset or in other abnormal states, the second photoelectric sensor 60 can respond quickly to ensure that the mechanical arm and the disassembly claw 23 will not continue to press down without the memory bar, thereby avoiding potential damage to the memory slot. When the disassembly claw 23 fails to successfully grab the memory stick, the mechanical arm will immediately stop pressing down and trigger the second photoelectric sensor 60 through the induction plate 70. This mechanism effectively prevents the memory slot from being damaged due to misoperation or equipment failure, and protects the integrity and reliability of the computer hardware. In addition, the introduction of the second photoelectric sensor 60 not only improves the accuracy of the operation, but also significantly enhances the safety of the operation. Through the real-time monitoring and feedback mechanism, the system can stop working in time before potential danger occurs, avoiding accidental damage or personal injury caused by equipment failure or human error.
[0052] See also Figure 5 As shown, in one embodiment, the pressing assembly 30 includes a pressing seat 31 and a pressing block 32 , the pressing seat 31 is connected to the fixing seat 10 , and the pressing block 32 is connected to the pressing seat 31 .
[0053] Specifically, the designed pressing assembly 30, especially the pressing block 32, can accurately align the buckle position of the memory slot and apply sufficient pressure to ensure that the memory stick is firmly locked in the buckle. This precise installation method avoids the loosening or damage of the memory stick caused by improper manual operation, and improves the accuracy and reliability of the installation. In addition, the introduction of the pressing assembly 30 greatly simplifies the installation process of the memory stick. The operator does not need to perform complicated operations or alignment steps. He only needs to insert the memory stick into the slot and then complete the installation through the pressing assembly 30. This not only improves the installation efficiency, but also reduces the difficulty of operation, so that non-professionals can easily complete the installation. In addition, since the pressing assembly 30 can quickly and accurately complete the pressing and locking actions of the memory stick, the installation efficiency is greatly improved, which is particularly important for computer assembly lines or maintenance work that require a large number of memory sticks to be installed, and can significantly shorten working time and reduce labor costs.
[0054] See also Figure 5 As shown, in one embodiment, a connecting column 33 is further provided between the pressing seat 31 and the fixing seat 10 , and a spring is sleeved on the connecting column 33 .
[0055] Specifically, the spring sleeved on the connecting column 33 plays a key role in buffering and shock absorption between the pressing seat 31 and the fixing seat 10. When the pressing seat 31 is subjected to external force, the spring can absorb and disperse the energy, effectively reducing the impact on the fixing seat 10 and its connected parts, thereby protecting the stability and integrity of the entire device. In addition, the introduction of the spring allows the pressing seat 31 to have a certain degree of floating during the pressing process, which can better adapt to memory sticks of different specifications and sizes. Even if there is a slight size difference or installation deviation between the memory stick and the memory slot, the spring can compensate for these differences through its elastic deformation, ensuring that the memory stick can be smoothly and firmly installed in place. In addition, due to the buffering effect of the spring, pressure can be applied more smoothly and slowly when pressing the memory stick, avoiding installation errors or damage caused by rapid or violent pressing actions, which helps to improve the installation accuracy of the memory stick and ensure that the memory stick can be correctly and reliably locked in the memory slot.
[0056] See also Figure 2 and Figure 5As shown, in one embodiment, a pressure sensor 80 is also provided on the pressing seat 31. When the pressing block 32 presses the memory stick, the pressure sensor 80 can monitor the pressure data in real time. When the pressure data is consistent with the set data, the mechanical arm stops working. In order to prevent the failure of the pressure sensor 80 and the damage to the memory stick caused by overpressure, the spring on the connecting column 33 plays a role in preventing damage by appropriate overpressure. That is to say, by arranging the pressure sensor 80 on the pressing seat 31, the system can monitor the pressure data applied by the pressing block 32 to the memory stick in real time. When the pressure reaches the preset value, the mechanical arm will automatically stop working, thereby ensuring that the pressure on the memory stick during the installation process is accurately controlled within a safe range. This precise control helps to avoid damage to the memory stick due to excessive pressure. In addition, the introduction of the pressure sensor 80 significantly improves the safety of the memory stick installation process. By monitoring the pressure data in real time, the system can stop working in time when the pressure is abnormal, preventing damage to the memory stick due to overpressure. In addition, in addition to the pressure sensor 80, the spring on the connecting column 33 also provides an additional overpressure protection mechanism. Even if the pressure sensor 80 fails for some reason, the spring can absorb and disperse the additional pressure through its elastic deformation, thereby preventing the memory bar from being damaged by excessive pressure. This dual protection mechanism further enhances the reliability and stability of the system.
[0057] See also Figure 7 As shown, an embodiment of the present invention provides a method for using a device for disassembling and assembling a memory stick, comprising the following steps:
[0058] S1, if the memory bar needs to be removed, the robot arm drives the disassembly assembly to move to the memory slot area, and then the disassembly cylinder drives the two disassembly claws to open to push open the buckle of the memory slot, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the memory bar, and then the robot arm drives the disassembly assembly upward to take out the memory bar, completing the disassembly of the memory bar;
[0059] S2, if a memory stick needs to be installed, the robotic arm drives the disassembly assembly to move to the position for placing a new memory stick, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the new memory stick, and then the robotic arm drives the disassembly assembly to move to the memory slot area, and drives the disassembly assembly downward to insert the new memory stick into the memory slot, and then the disassembly cylinder drives the two disassembly claws to open to loosen the new memory stick, and then the robotic arm switches the pressing assembly to work, and drives the pressing block downward to press the new memory stick until the buckle of the memory slot locks the new memory stick to complete the installation of the memory stick.
[0060] Specifically, through the coordinated work of the mechanical arm, the disassembly assembly and the pressing assembly, the memory stick can be quickly and automatically disassembled and assembled. Both the disassembly and the installation process are completed through precise mechanical movements, which greatly improves work efficiency and reduces the tediousness and time-consuming manual operation. In addition, during the disassembly process, the disassembly claw first opens the buckle of the memory slot and then hooks the notch of the memory stick through the precise opening and closing movements, thus avoiding damage to the memory stick or the memory slot caused by improper operation; similarly, during the installation process, the precise pressing of the pressing assembly ensures that the memory stick can be firmly inserted and locked in the memory slot, thus protecting the integrity of the hardware. In addition, through automated and mechanized operations, the operating process of disassembling and assembling the memory stick is greatly simplified. The operator does not need to have professional skills and experience, and can complete the disassembly and assembly of the memory stick by simply following simple instructions, which reduces the skill requirements for the operator and improves the convenience and ease of operation.
[0061] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.
Claims
1. A device for disassembling and assembling a memory stick, characterized in that: include: A fixing seat, a disassembly assembly and a pressing assembly, wherein the disassembly assembly is installed in the vertical direction of the fixing seat, and the pressing assembly is installed in the horizontal direction of the fixing seat. The disassembly assembly is used to disassemble or place a memory stick, and the pressing assembly is used to press the memory stick to complete the installation of the memory stick. The fixing seat is transmission-connected to an external robotic arm, and the robotic arm is used to control and switch the operation of the disassembly assembly or the pressing assembly.
2. The device for disassembling and assembling a memory stick according to claim 1, characterized in that: The disassembly assembly includes a mounting seat, a disassembly cylinder and two disassembly claws. The mounting seat is connected to the fixed seat, the disassembly cylinder is connected to the mounting seat, and the two disassembly claws are respectively connected to the two sides of the disassembly cylinder by transmission. The disassembly cylinder works to make the two disassembly claws form an open or closed state.
3. The device for disassembling and assembling a memory stick according to claim 2, characterized in that: An oblique shovel is provided at the end of the disassembly claw, and the oblique shovel is used to push open the buckle of the memory slot or hook the notch of the memory stick.
4. The device for disassembling and assembling a memory stick according to claim 3, characterized in that: The outer side of the oblique shovel is also provided with an anti-skid layer.
5. The device for disassembling and assembling a memory stick according to claim 3, characterized in that: The disassembly cylinder is also connected to a mounting plate, both ends of the mounting plate are connected to limit plates, and the disassembly claw is located between the two limit plates.
6. The device for disassembling and assembling a memory stick according to claim 5, characterized in that: The limiting plate is provided with a sliding groove, the disassembly claw is slidably connected to the sliding groove via a pin shaft, a tension spring is sleeved on the pin shaft, and the tension spring is also connected to the limiting plate.
7. The device for disassembling and assembling a memory stick according to claim 2, characterized in that: A linear bearing is also arranged between the mounting seat and the fixing seat, and a spring is sleeved on the linear bearing.
8. The device for disassembling and assembling a memory stick according to claim 1, characterized in that: The pressing assembly comprises a pressing seat and a pressing block, wherein the pressing seat is connected to the fixing seat, and the pressing block is connected to the pressing seat.
9. The device for disassembling and assembling a memory stick according to claim 8, characterized in that: A connecting column is further provided between the pressing seat and the fixing seat, and a spring is sleeved on the connecting column.
10. A method for using a device for disassembling and assembling a memory stick, characterized in that: The following steps are involved: If the memory stick needs to be removed, the robot arm drives the disassembly assembly to move to the memory slot area, and then the disassembly cylinder drives the two disassembly claws to open to push open the buckle of the memory slot, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the memory stick, and then the robot arm drives the disassembly assembly upward to take out the memory stick, completing the removal of the memory stick; If a memory stick needs to be installed, the robotic arm drives the disassembly assembly to the position for placing a new memory stick, and then the disassembly cylinder drives the two disassembly claws to close to hook the notch of the new memory stick, and then the robotic arm drives the disassembly assembly to the memory slot area, and drives the disassembly assembly downward to insert the new memory stick into the memory slot, and then the disassembly cylinder drives the two disassembly claws to open to release the new memory stick, and then the robotic arm switches the pressing assembly to work, and drives the pressing block downward to press the new memory stick until the buckle of the memory slot locks the new memory stick to complete the installation of the memory stick.
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