Modular high-low voltage switch cabinet anti-creeping insulation protection structure

Abstract

The application relates to a modular high-low voltage switch cabinet anti-creeping insulation protection structure, which comprises a support bottom plate of a switch cabinet and a rear inner wall of the switch cabinet, an anti-creeping insulation structure formed by mortise and tenon connection of six insulation modules is arranged at the upper end of the support bottom plate, a high-thermal-conductivity insulation layer and a nonlinear field intensity homogenization layer are sequentially coated on the inner surface of the insulation module, and a hydrophobic microporous breathing layer is coated on the outer surface of the insulation module; a labyrinth sealing structure is arranged at the upper and lower ends of the module, and a semiconductor pressure equalizing part is arranged in a sealing groove of the labyrinth sealing structure; a pressure relief cavity with a pressure relief channel and a pressure relief port is arranged in the insulation body, and a passive wireless sensing unit is arranged in a lower packaging cavity; through the synergistic effect of modular mortise and tenon connection, labyrinth sealing, multi-layer functional coating, semiconductor pressure equalizing active dredging and built-in sensing early warning, the application realizes all-around protection of insulation sealing, electric field homogenization, creeping dredging, fault pressure relief, state sensing and visualized early warning, and remarkably improves the operation safety and maintenance convenience of the switch cabinet.

Description

Technical Field

[0001] This invention relates to the field of high and low voltage switchgear technology, and in particular to a modular high and low voltage switchgear leakage protection insulation structure. Background Technology

[0002] High and low voltage switchgear is a key piece of equipment for control and protection circuits in power systems, and its insulation performance is directly related to the operational safety of the power grid. However, existing switchgear generally uses SF6 gas insulation, or sprays an insulation layer on the inner wall of the cabinet or adds a leakage current protection device, lacking a systematic modular insulation protection structure, which is not environmentally friendly and poses a risk of leakage. Furthermore, the surfaces of insulating components and live parts inside the switchgear are prone to condensation due to excessive humidity, which can breed mold, reduce electrical insulation strength, and accelerate the corrosion of metal conductive parts. Therefore, we designed a modular high and low voltage switchgear leakage protection insulation structure.

[0003] Chinese utility model patent CN202520920361.1 discloses a leakage-proof insulation protection structure for high and low voltage distribution cabinet housings. The structure includes a distribution cabinet housing, high and low voltage distribution terminal plates, galvanized plates, and assembly components. The galvanized plates are threadedly fastened to the mounting points on the distribution cabinet housing, and the high and low voltage distribution terminal plates penetrate the mounting points on the galvanized plates. In this utility model, a flexible connection cover protects the installation on the insulating plate and the galvanized plate. The flexible connection cover provides fire and dust protection for the polycarbonate, epoxy resin, and other engineering plastics at the high and low voltage distribution cabinet housing terminals. When the high and low voltage distribution cabinet housing terminals are damaged... The high and low voltage distribution terminal blocks can be disassembled and installed by connecting them to the high and low voltage distribution cabinet housing via insulating plates and galvanized plates. It does not require replacing the entire high and low voltage distribution cabinet housing terminal module. Installation can be done in one go via the high and low voltage distribution cabinet housing terminals on insulating plates and galvanized plates. However, this utility model has the following problems: First, it does not have a modular anti-leakage insulation structure. It simply sprays an insulation layer or adds a protective shell, resulting in poor insulation and low maintainability. It lacks in-depth intervention on the complex internal electrical structure and fault mechanism. Second, it does not have active guidance and real-time monitoring of leakage current. It is a passive protection and lacks perception of the internal state. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by setting up six interconnected insulating modules, a semiconductor voltage equalization component, a pressure relief chamber, a passive wireless sensing unit, and an luminous indicator window in the labyrinthine sealing groove. This solves the technical problems in existing high and low voltage switchgear where the insulation coating protection performance deteriorates rapidly in humid and hot environments, lacks active guidance and real-time monitoring of leakage current, uneven field strength, lack of leakage current guidance, lack of perception of internal state, and potential electric field hazards that may induce breakdown.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A modular high and low voltage switchgear leakage protection structure includes a switchgear, a supporting base plate on the rear inner wall of the switchgear, a leakage protection insulation structure centrally located at the upper end of the supporting base plate, a conductive shielding cover surrounding the leakage protection insulation structure, and a live conductor inside the leakage protection insulation structure. The leakage protection insulation structure consists of six interconnected insulating modules with tenon joints. Labyrinth-type sealing structures are provided at both the upper and lower ends of the insulating modules located at the front, rear, left, and right sides. Each labyrinth-type sealing structure includes a labyrinth-type sealing groove. A semiconductor voltage equalizing element is adapted to be laid at the bottom of the labyrinth-type sealing groove. The outer surface of the semiconductor voltage equalizing element is coated with a hydrophobic coating, and one end of the semiconductor voltage equalizing element extends close to the live conductor, while the other end is connected to a grounding wire. The lower end of the grounding wire is connected to a grounding terminal.

[0006] As a preferred embodiment, the lower end of the insulating module located at the upper and lower positions is fitted with a labyrinth-type protrusion, and a gas-generating arc-extinguishing layer is provided between the labyrinth-type protrusion and the labyrinth-type sealing groove.

[0007] As a preferred embodiment, the insulating module includes an insulating body, the side of the insulating body near the charged body is coated with a nonlinear field strength homogenization layer, and the side of the insulating body away from the charged body is coated with a hydrophobic microporous breathing layer. The side of the nonlinear field strength homogenization layer near the charged body is coated with a high thermal conductivity insulating layer. A floating capacitor shielding ring is provided between the nonlinear field strength homogenization layer and the high thermal conductivity insulating layer, and is arranged circumferentially around the charged body. A gas discharge tube is connected in series with the floating capacitor shielding ring through a wire, and the other end of the gas discharge tube is electrically connected to the semiconductor voltage equalization device. As a preferred embodiment, a pressure relief cavity is provided on the upper side of the interior of the insulating body, and pressure relief channels are provided at both the upper and lower ends of the pressure relief cavity. A pressure relief port is provided at the front end of the pressure relief cavity, and the end of the pressure relief channel away from the pressure relief cavity is connected to a labyrinth seal groove.

[0008] As a preferred embodiment, an encapsulation cavity is provided on the lower inner side of the insulating body, and a passive wireless sensing unit is provided inside the encapsulation cavity.

[0009] As a preferred embodiment, the insulating module has an indicator window on its surface away from the charged body, and a light-emitting element is provided inside the indicator window. The light-emitting element is electrically connected to a semiconductor voltage equalizer.

[0010] As a preferred embodiment, the conductive shield is connected to the insulating body via a standardized interface, and the outer surface of the conductive shield is provided with an insulating layer, and the outer surface of the conductive shield is adapted to be provided with a pressure relief external interface, which is adapted to be connected to a pressure relief port.

[0011] As a preferred embodiment, the upper end of the support base plate is provided with symmetrical sliding grooves, and the sliding grooves are adapted to provide sliders, which are located at the bottom of the leakage-proof insulation structure.

[0012] As a preferred embodiment, the tenon side of the insulating module is provided with a countersunk hole, and a shape memory alloy wedge-shaped locking block is connected to the countersunk hole by a compression spring. The protruding end of the shape memory alloy wedge-shaped locking block is provided with a guide slope. The inner wall of the mortise corresponding to the countersunk hole is provided with a matching locking blind hole. A piezoelectric thin film sensor is attached to the bottom of the locking blind hole, and the signal output terminal of the piezoelectric thin film sensor is electrically connected to a passive wireless sensing unit.

[0013] As a preferred embodiment, the bottom of the pressure relief chamber is provided with a one-way metal rupture disc, the interior of the pressure relief chamber is staggered with porous ceramic baffles along the gas flow direction, and the gas channels of adjacent layers of porous ceramic baffles are staggered. The surface of the porous ceramic baffles is coated with a high-temperature resistant insulating coating, and the burst pressure threshold of the one-way metal rupture disc is 0.35-0.45 MPa.

[0014] The beneficial effects of this invention are: (1) In this invention, six insulating modules are connected by mortise and tenon joints to construct a three-dimensional protective cavity, which upgrades the insulation function from a surface coating to a detachable structural component, solving the maintenance problem of the entire structure being scrapped after the traditional protective layer is damaged. On this basis, the labyrinth-type sealing structure set at the module connection is not a simple superposition, but uses the inherent splicing gap of the mortise and tenon joint as a sealing path carrier, combining the connection structure and the sealing structure into one, so that the tortuous sealing path can block the capillary penetration of moisture without occupying additional space. The mechanical connection function of the mortise and tenon and the barrier function of the labyrinth seal are deeply coupled on the same physical interface, which not only ensures the assembly accuracy, but also improves the long-term insulation stability in humid and hot environments. Its comprehensive effect is far superior to the simple combination of "independent mortise and tenon connection + independent sealing ring".

[0015] (2) In this invention, the semiconductor voltage equalization component is laid on the bottom of the labyrinth-type sealing groove, so that it can simultaneously perform two originally separate functions: on the one hand, it is close to the charged body at the bottom of the groove, so that it can directly sense and smooth the distorted electric field; on the other hand, the sealing groove is used as a natural accommodating space, so that the voltage equalization component can complete the directional conduction of leakage current without separate installation; the spatial accommodating function of the sealing groove and the electric field regulation function of the voltage equalization component are superimposed in the same physical position, so that the electric field homogenization and leakage current conduction are completed simultaneously, avoiding the need to open additional grooves or occupy internal space for installing the voltage equalization component, and solving the technical contradiction of voltage equalization and sealing being independent and competing for space in the traditional solution.

[0016] (3) In this invention, the pressure relief channel is directly connected to the labyrinth-type sealing groove, so that the sealing structure plays completely opposite roles in normal operation and fault state but can be seamlessly switched: During normal operation, the tortuous path of the labyrinth sealing groove blocks external moisture; when a fault occurs, the same path reverses to become the priority release channel for high-pressure gas, and the pressure relief chamber buffers and cools the gas before directional discharge; the sealing barrier function and the pressure relief conduction function are achieved in two states on the same structure, without the need for additional valves or moving parts; at the same time, the passive wireless sensing unit senses the insulation status in real time, and the luminous indicator window reflects the health level on the spot, so that the structure integrates sealing, pressure relief, buffering, sensing and early warning into one, compressing the functions that traditionally require five independent devices into one modular structure, and improving space utilization and system reliability at the same time.

[0017] (4) The present invention adds a shape memory alloy locking block and a piezoelectric film to the mortise and tenon joint, upgrading the mortise and tenon structure from a purely mechanical connection to a self-locking + self-sensing intelligent node; the anti-loosening function of the locking block and the sensing function of the piezoelectric film share the same locking blind hole space, and the positive pressure generated when the locking block is locked is just the excitation source of the piezoelectric film, so that the connection status can be continuously monitored without additional power supply; once loosened, the signal is immediately uploaded to the passive wireless sensing unit; this design transforms the mortise and tenon joint from a passive connector to an active status reporting node, filling the technical gap of lacking online sensing means of connection status in modular insulation structures, and the sensing process does not require an independent power supply and additional wiring.

[0018] (5) The present invention sets up a multi-stage porous ceramic baffle and a one-way rupture disc in the pressure relief chamber. The two complement each other and work in sequence: the baffle provides resistance to slow down and cool down the gas flow and filter conductive particles, while the rupture disc keeps it completely sealed before the pressure accumulates to the threshold. The continuous cooling and filtering function of the baffle and the transient directional opening function of the rupture disc form a time relay, cooling and purifying first and then releasing in a controllable manner, so that the pressure relief chamber is upgraded from a single containment space to a multi-functional arc extinguishing device that integrates baffle deceleration, forced cooling, particle filtration, normal sealing and overpressure opening. The introduction of the rupture disc solves the inherent problem of sealing failure caused by the constant opening of the pressure relief groove.

[0019] (6) The present invention embeds a floating capacitor shielding ring inside the insulating body and connects it in series with a gas discharge tube, so that it forms a dual protection architecture of active and passive cooperation with the semiconductor voltage equalization component: the shielding ring smooths the high-frequency distortion of the space around the charged body, and the voltage equalization component performs nonlinear material adaptive adjustment of the local field strength concentration point. The two complement each other in terms of their action area and response mechanism. At the same time, the gas discharge tube provides an auxiliary discharge path for transient overvoltage that is independent of the main channel of the grounding conductor. The main channel composed of the voltage equalization component and the grounding conductor undertakes the conventional leakage current conduction, and the auxiliary channel composed of the shielding ring, gas tube, voltage equalization component and grounding conductor undertakes the transient overvoltage impulse discharge. This architecture enables the present invention to have four capabilities at the same time: static field strength uniformity, high-frequency distortion smoothing, conventional leakage current conduction and transient overvoltage discharge. The above comprehensive protection effect cannot be achieved by a single voltage equalization component or a single shielding ring.

[0020] In summary, this equipment has the advantages of simple structure and good insulation and pressure relief effect, and is especially suitable for the field of high and low voltage switchgear technology. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the high and low voltage switchgear.

[0023] Figure 2 A schematic diagram of the explosion structure of the leakage-proof insulation structure and the conductive shielding cover.

[0024] Figure 3 This is a schematic diagram of the coating structure of the insulation module.

[0025] Figure 4 This is a schematic diagram of the labyrinth-type sealing structure.

[0026] Figure 5 This is a cross-sectional structural diagram of the insulation module.

[0027] Figure 6 This is a structural diagram of the mortise portion of the insulation module. Detailed Implementation

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0029] Example 1 like Figures 1 to 6As shown, this invention provides a modular high and low voltage switchgear leakage protection structure, including a switchgear 1, which serves as the load-bearing shell of the entire protective structure, providing installation space and basic protection for all internal components. A supporting base plate 2 is provided on the rear inner wall of the switchgear 1, serving as a mounting base for fixing the leakage protection insulation structure 3 centrally, ensuring its precise and stable position within the cabinet and bearing its weight. The leakage protection insulation structure 3 is centrally located at the upper end of the supporting base plate 2, directly enclosing the live parts and undertaking the main insulation protection task. A conductive shielding cover 4 is provided around the leakage protection insulation structure 3, forming an external electromagnetic barrier. This effectively shields the influence of the electric field generated by the internal live parts on external equipment, while preventing external electromagnetic interference from intruding. The internal fault arc provides a certain degree of physical isolation and protection. The internal structure of the anti-leakage insulation structure 3 contains a live conductor, which can be the busbar compartment, circuit breaker compartment, cable compartment, or low-voltage control compartment in a high- or low-voltage switchgear. The anti-leakage insulation structure 3 consists of six interconnected insulation modules 31, forming a closed and detachable three-dimensional protective cavity. This modular design facilitates convenient installation and easy maintenance. One side of the insulation module 31 forming the protective cavity has multiple mounting holes, allowing components to be fixed within the cavity. The upper and lower ends formed by the insulation modules 31 on the front, back, left, and right sides are equipped with labyrinth-style sealing structures 33, effectively blocking moisture from the external environment by extending and tortuous gas and liquid paths. To prevent condensation and dirt dust from penetrating the insulation structure and causing creepage or flashover on the insulation surface due to moisture or contamination, the labyrinth-type sealing structure 33 includes a labyrinth-type sealing groove 331, which serves as a sealed receiving cavity and cooperates with labyrinth-type protrusions to form a complete labyrinth-type sealing structure 33. Its tortuous groove design can block and slow down the intruding gas and liquid multiple times, achieving a throttling and blocking effect. The bottom of the labyrinth-type sealing groove 331 is adapted to lay a semiconductor voltage equalizing element 332. One end is close to the charged body, which can sense and equalize the distorted electric field around the charged body and eliminate local field strength concentration. The other end is connected to the grounding wire 333, which is equivalent to a current guide, which can quickly and directionally introduce the weak leakage current generated by ionization into the ground wire, preventing it from creeping or flashing on the insulation. The outer surface of the semiconductor equalizing element 332 is coated with a hydrophobic coating, which combines organic functional resin with inorganic nanoparticles to construct a multi-level micro-nano structure. This prevents condensation droplets from forming a water film on the surface of the equalizing element, thereby avoiding surface discharge caused by the water film. At the same time, it also protects the equalizing element from chemical corrosion. One end of the semiconductor equalizing element 332 extends to a position close to the charged body, and the other end is connected to a grounding wire 333. The lower end of the grounding wire 333 is connected to a grounding terminal 334. The grounding wire 333 reliably guides the leakage current or induced charge captured by the semiconductor equalizing element 332 into the grounding grid of the earth through the grounding terminal 334, ensuring that the cabinet and all accessible parts maintain the ground potential and achieving the ultimate safety guarantee.

[0030] Furthermore, such as Figure 4 As shown, a labyrinthine protrusion is fitted at the lower tenon-and-mortise connection position of the insulation module 31, which serves as a sealing component. This protrusion and mortise engage with the labyrinthine sealing groove 331, forming a tortuous and extended sealing path. This structure effectively extends the path length for external moisture and dirt to penetrate the insulation structure and increases the difficulty of their passage, thus significantly improving the sealing effect. Simultaneously, the engagement of the protrusion and the groove enhances the mechanical strength and positioning accuracy of the tenon-and-mortise connection between modules. An arc-extinguishing layer 35 is provided between the labyrinthine protrusion and the labyrinthine sealing groove 331. When an arc fault occurs inside the switchgear, the high-temperature arc generated... The temperature will excite the gas-generating materials in the gas-generating arc-extinguishing layer 35, such as nitrogen-containing organic compounds like melamine and melamine resin, causing them to decompose rapidly and release a large amount of high-pressure gases, such as nitrogen and water vapor. These gases fill the cavity of the labyrinth-type sealing groove 331, forming a positive pressure that can effectively drive away conductive ions and high-temperature gases in the groove. The high-pressure gas released by the gas-generating arc-extinguishing layer 35 has a cooling and blowing effect, which can cool, dilute and extinguish the electric arc or ionized gas that enters the labyrinth-type sealing groove 331, suppress the continuous combustion and spread of the electric arc in the sealing gap, and prevent the electric arc from penetrating the sealing structure and causing a breakdown accident to the outside or adjacent modules.

[0031] Furthermore, such as Figure 3As shown, the insulating module 31 includes an insulating body 311, which serves as the substrate carrier for the entire multilayer composite coating, providing an adhesion base for the functional coatings on the inner and outer surfaces. Its material is typically a high-performance insulating material such as epoxy resin, ensuring the module's basic electrical and mechanical reliability. The insulating body 311 is coated with a nonlinear field strength homogenization layer 312 on the side closest to the charged body. This layer uses a material with nonlinear resistance characteristics, such as a polymer doped with fillers like silicon carbide and zinc oxide. Its resistivity decreases nonlinearly with increasing applied electric field strength. In areas with normal electric field strength, this layer exhibits high resistance, providing insulation. In areas with abnormally concentrated electric field strength, such as near sharp points or burrs, the resistivity of this layer automatically decreases, forming a local conductive channel, allowing the accumulated charge to redistribute and dissipate, thereby eliminating local field strength distortion and suppressing corona discharge. Furthermore, this layer works synergistically with the semiconductor voltage equalizer 332. The semiconductor voltage equalizer 332 structurally facilitates leakage current, while this layer achieves active field strength homogenization at the material level, providing a dual effect. To prevent localized breakdown, the insulating body 311 is coated with a hydrophobic microporous breathable layer 313 on the side away from the charged body. This layer has a highly hydrophobic surface, effectively repelling condensation droplets, preventing the formation of a water film on the insulating surface, and blocking liquid conductive channels for surface creep. Furthermore, this layer has a microporous structure, allowing one-way air permeability, permitting water vapor molecules to pass through while preventing liquid water penetration, automatically balancing internal and external humidity and solving the condensation problem. The nonlinear field strength homogenization layer 312 is coated with a highly thermally conductive insulating layer 314 on the side close to the charged body. When the charged body is in operation, it generates a large amount of Joule heat. If this heat cannot be dissipated in time, it will accelerate the thermal aging of the insulating material, shorten its service life, or even cause thermal breakdown. This layer is composed of highly thermally conductive and electrically insulating materials, such as insulating resin doped with highly thermally conductive fillers like boron nitride, alumina, and silicon nitride. It has the function of efficiently conducting heat and ensuring electrical isolation, maintaining excellent electrical insulation performance while conducting heat. The addition of thermally conductive fillers does not reduce the breakdown voltage or increase the leakage current, ensuring reliable insulation isolation of the charged body. Furthermore, such as Figure 5As shown, a pressure relief chamber 315 is provided on the upper side of the inner part of the insulating body 311, serving as a temporary buffer and containment space for high-pressure gas. When an arc fault occurs inside the switchgear, the instantaneously generated high-temperature and high-pressure gas can be introduced into the pressure relief chamber 315 for temporary storage and buffering, preventing the high-pressure gas from randomly impacting the insulation structure and causing module rupture or breakdown along weak points. At the same time, this chamber also provides cooling and expansion space for the gas, allowing the incoming high-temperature gas to be initially cooled and slowed down within the chamber, reducing its thermal and pressure impact on downstream channels. Pressure relief channels 316 are provided at both the upper and lower ends of the pressure relief chamber 315, serving as directional flow channels to guide the flow of the gas through the labyrinth. The high-pressure gas in the labyrinth seal groove 331 is guided into the pressure relief chamber 315 in an orderly manner, and then discharged from the pressure relief port 319 through the pressure relief channel 316. The pressure relief chamber 315 is provided with a pressure relief port 319 at the front end, which safely discharges the fault gas after buffering and cooling to the outside of the insulation module 31, avoiding the continuous accumulation of high-pressure gas inside the module and causing it to burst. It is connected to the external pressure relief interface 41 through a standardized interface to achieve directional discharge, guiding the high-temperature gas to a safe area outside the switch cabinet, preventing damage to other equipment or operators inside the cabinet. The end of the pressure relief channel 316 away from the pressure relief chamber 315 is connected to the labyrinth seal groove 331.

[0032] Furthermore, an encapsulation cavity 317 is provided on the lower inner side of the insulating body 311, providing installation space for the passive wireless sensing unit 318. The passive wireless sensing unit 318, which is an LC resonant sensor, is installed inside the encapsulation cavity 317 to realize real-time sensing of insulation status and wireless data reporting. On the one hand, it realizes passive power supply, which can be self-powered through electromagnetic induction, electric field energy harvesting, etc. On the other hand, it realizes wireless communication, which transmits data to an external receiving terminal through wireless methods such as radio frequency, Bluetooth, ZigBee, etc., without the need to drill holes and run wires in the insulating structure, and does not damage the sealing integrity. On the other hand, it realizes parameter sensing, which can monitor key insulation parameters such as temperature, humidity, electric field strength, and leakage current characteristics in real time, providing data support for the insulation status for operation and maintenance personnel, realizing the transformation from periodic maintenance to condition-based maintenance.

[0033] Furthermore, such as Figure 2As shown, the surface of the insulation module 31 away from the live part is provided with an indicator window 36, which provides the most intuitive basis for the operation and maintenance personnel to judge the insulation status. It is made of transparent or semi-transparent material, which can protect the internal light-emitting element 37 while allowing light to pass through. The indicator window 36 is provided with a light-emitting element 37, which is electrically connected to the semiconductor voltage equalizer 332. The potential or leakage current of the semiconductor voltage equalizer 332 is conducted to the light-emitting element 37 through the electrical connection, driving it to emit light. The light intensity, color or flashing frequency changes in real time with the state of the voltage equalizer, forming an intuitive mapping relationship of light warning. When an abnormal electric field or leakage current increases inside the leakage protection insulation structure 3, the brightness, color or flashing mode of the light-emitting element 37 will change accordingly, reminding the inspection personnel to intervene in time. The light-emitting element 37 is directly driven by the induced potential or leakage current of the semiconductor voltage equalizer 332, without the need for independent power supply, realizing passive alarm and further simplifying the system configuration.

[0034] Furthermore, the conductive shield 4 and the insulating body 311 are connected through a standardized interface to achieve modular rapid assembly and interchangeability. The outer surface of the conductive shield 4 is provided with an insulating layer, which provides dual insulation protection by isolating external electrical components and preventing surface discharge. The outer surface of the conductive shield 4 is also fitted with a pressure relief external interface 41, which is adapted to connect with the pressure relief port 319 to form a complete pressure relief path from the pressure relief chamber 31, pressure relief channel 316, labyrinth seal groove 331, pressure relief port 319, pressure relief external interface 41 to the external safe area. This prevents gas from accumulating inside the shield and causing structural damage. The interface is provided with a sealing structure to ensure that there is no air leakage or water ingress under normal circumstances. It is only opened as a discharge port when a fault high voltage is triggered.

[0035] Furthermore, such as Figure 2 As shown, the upper end of the support base plate 2 is symmetrically provided with sliding grooves 21, which provide a precise straight guide path for the installation and disassembly of the leakage protection insulation structure 3. The sliding groove 21 is adapted to be equipped with a slider 22, which is located at the bottom of the leakage protection insulation structure 3. The slider 22 acts as a sliding support component and cooperates with the sliding groove 21 to realize push-pull installation, realizing push-in and pull-out operation like a drawer, which greatly facilitates the installation, maintenance and replacement of the equipment.

[0036] Example 2 Furthermore, such as Figure 4As shown, the side of the tenon of the insulating module 31 is provided with a countersunk hole 38. A shape memory alloy wedge-shaped locking block 381 is connected to the countersunk hole 38 by a compression spring. The protruding end of the shape memory alloy wedge-shaped locking block 381 is provided with a guide slope. The inner wall of the mortise corresponding to the countersunk hole 38 is provided with a matching locking blind hole 382. A piezoelectric thin film sensor 383 is attached to the bottom of the locking blind hole 382. The signal output terminal of the piezoelectric thin film sensor 383 is electrically connected to the passive wireless sensing unit 318. During installation, when the tenon is inserted into the mortise, the shape memory alloy wedge-shaped locking block 381 is squeezed back into the countersunk hole 38 by the mortise wall; when the tenon is fully inserted into the mortise... After positioning, the shape memory alloy wedge-shaped locking block 381 automatically pops out and locks into the locking blind hole 382 under the action of the compression spring, realizing mechanical anti-loosening locking and effectively preventing the tenon and mortise joint from loosening due to long-term operation vibration of the switch cabinet; at the same time, the piezoelectric film sensor 383 at the bottom of the locking blind hole 382 senses the positive pressure applied by the shape memory alloy wedge-shaped locking block 381 in real time and transmits the pressure signal to the outside through the passive wireless sensing unit 318; when the pressure value continues to drop and exceeds the set threshold, it is determined that the connection is loose, realizing remote online monitoring of the tenon and mortise joint status. This design upgrades the traditional pure mechanical tenon and mortise connection to a self-locking and self-sensing intelligent connection node.

[0037] Furthermore, a floating capacitor shielding ring 5 is added inside the insulating body 311. Its closed ring structure forms a stable coupling capacitor with the charged body, which can actively smooth the high-frequency distorted electric field around the charged body. The range of action covers the entire circumferential area, and it has a wider voltage equalization coverage area than the strip-shaped voltage equalization component 332. When the system encounters transient overvoltage impacts such as lightning strikes or operational overvoltages, the overvoltage energy coupled by the floating capacitor shielding ring 5 causes the gas discharge tube 6 to break down and conduct rapidly, forming an auxiliary discharge channel. The transient energy is quickly introduced to the ground through the semiconductor voltage equalization component 332 and the grounding wire 333. Together with the semiconductor voltage equalization component 332, it forms a dual field equalization mechanism of physical shielding voltage equalization and material nonlinear voltage equalization, as well as a dual discharge channel of main channel and auxiliary channel, which significantly improves the tolerance to transient overvoltages.

[0038] Example 3 It is worth mentioning that, such as Figure 5As shown, a multi-stage baffle cooling arc-extinguishing core is added inside the pressure relief chamber 315. When the high-temperature and high-pressure gas generated by the fault arc enters the pressure relief chamber 315 through the pressure relief channel 316, the gas is guided by 3-5 layers of staggered porous ceramic baffles 321 to turn and revert multiple times along a serpentine path, and the flow velocity decreases step by step. At the same time, the porous ceramic material has a very large specific surface area, which can quickly absorb the heat of the gas to achieve forced cooling, so that the temperature of the discharged gas drops from the initial thousands of degrees Celsius to below 150°C. In addition, the metal vapor and... Free carbon particles are physically intercepted and adsorbed as they flow through the porous ceramic micropores, preventing secondary surface discharge caused by the ejection of conductive particles. The unidirectional metal rupture disc 320 remains completely sealed under normal operating pressure, ensuring that the pressure relief chamber 315 does not become a channel for moisture intrusion. It ruptures directionally only when the pressure inside the chamber exceeds the 0.4MPa threshold, solving the technical problem of sealing failure caused by the constant opening of the existing pressure relief groove. In this embodiment, the pressure relief chamber is upgraded from a single containment space to a multi-stage arc-extinguishing and pressure relief device that integrates flow deceleration, forced cooling, particle filtration, and overpressure sealing.

[0039] Working process: Under normal circumstances, the leakage-proof insulation structure 3, which is formed by the tenon and mortise connection of six insulating modules 31, forms a three-dimensional closed protection for the charged body. The high thermal conductivity insulation layer 314 on the inner surface conducts heat away, the nonlinear field strength homogenization layer 312 homogenizes the distorted electric field, and the hydrophobic microporous breathing layer 313 on the outer surface prevents liquid water from entering and allows water vapor to escape in one direction. At the same time, the labyrinth-type sealing structure 33 blocks moisture, and the semiconductor equalizing element 332 at the bottom of the tank senses and smooths the electric field in real time, and guides the leakage current to the ground through the grounding wire 333. The floating capacitor shielding ring 5 continuously smooths the high-frequency distorted electric field in the entire space, forming a dual equalizing field mechanism with the equalizing element. At the same time, the memory alloy locking block 381 and the piezoelectric film sensor 383 enable the tenon and mortise joint to have self-locking and loosening detection functions. The passive wireless sensing unit 318 continuously collects insulation parameters and transmits them wirelessly. The light-emitting element 37 is driven by the induced potential of the equalizing element to indicate the current insulation status. Furthermore, when an arc fault occurs, high-temperature and high-pressure gas enters the pressure relief chamber 315 through the pressure relief channel 316. The multi-stage porous ceramic baffle 321 in the chamber causes the gas to decelerate, absorb heat and cool, and filter metal vapor and carbon particles. After cooling, the gas enters the labyrinth-type sealing groove 331 in the opposite direction. The sealing structure switches from blocking moisture to releasing gas. The high-temperature excited gas-generating arc-extinguishing layer 35 releases gas to extinguish the arc. At the same time, the gas discharge tube 6 breaks down and conducts under transient overvoltage, forming a main and auxiliary dual-channel discharge with the main channel of the grounding conductor. After the semiconductor equalizing component 332 senses the abnormality, it drives the light-emitting element 37 to switch to fault warning. Furthermore, when the gas pressure exceeds the threshold, the one-way rupture disc 320 ruptures, and the residual gas is safely discharged to the outside of the cabinet through the pressure relief port 319 and the pressure relief external interface 41. The entire insulation structure 3 can be pushed and pulled along the slide groove 21 by the bottom slider 22, and modular quick disassembly and maintenance can be achieved with the standardized interface.

[0040] In the description of this invention, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0041] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0042] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A modular high and low voltage switchgear leakage protection insulation structure, characterized in that: The switch cabinet (1) is provided with a support base plate (2) on the rear inner wall of the switch cabinet (1). The upper end of the support base plate (2) is provided with a leakage protection insulation structure (3). The outer periphery of the leakage protection insulation structure (3) is provided with a conductive shield (4). The interior of the leakage protection insulation structure (3) is provided with a live body. The leakage protection insulation structure (3) consists of six interconnected insulation modules (31). The upper and lower ends of the insulation modules (31) are provided with a labyrinth-type sealing structure (33). The labyrinth-type sealing structure (33) includes a labyrinth-type sealing groove (331). The bottom of the labyrinth-type sealing groove (331) is adapted to be provided with a semiconductor voltage equalizing component (332). The outer surface of the semiconductor voltage equalizing component (332) is coated with a hydrophobic coating. One end of the semiconductor voltage equalizing component (332) extends to a position close to the live body, and the other end is connected to a grounding wire (333). The lower end of the grounding wire (333) is connected to a grounding terminal (334).

2. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 1, characterized in that, The lower end of the insulating module (31) located in the upper and lower positions is fitted with a maze-type protrusion at the tenon-and-mortise connection position, and a gas-generating arc-extinguishing layer (35) is provided between the maze-type protrusion and the maze-type sealing groove (331).

3. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 1, characterized in that, The insulating module (31) includes an insulating body (311). The side of the insulating body (311) closest to the charged body is coated with a nonlinear field strength homogenization layer (312), and the side of the insulating body (311) away from the charged body is coated with a hydrophobic microporous breathing layer (313). The side of the nonlinear field strength homogenization layer (312) closest to the charged body is coated with a high thermal conductivity insulating layer (314). A floating capacitor shielding ring (5) is provided between the nonlinear field strength homogenization layer (312) and the high thermal conductivity insulating layer (314), and is arranged circumferentially around the charged body. A gas discharge tube (6) is connected in series with the floating capacitor shielding ring (5) through a wire. The other end of the gas discharge tube (6) is electrically connected to the semiconductor equalizing element (332).

4. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 3, characterized in that, The insulating body (311) has a pressure relief cavity (315) located on the upper side inside. The pressure relief cavity (315) has pressure relief channels (316) at both the upper and lower ends. The pressure relief cavity (315) has a pressure relief port (319) at the front end. The end of the pressure relief channel (316) away from the pressure relief cavity (315) is connected to the labyrinth seal groove (331).

5. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 3, characterized in that, The insulating body (311) has an encapsulation cavity (317) located on its lower inner side, and a passive wireless sensing unit (318) is provided inside the encapsulation cavity (317).

6. The modular high and low voltage switchgear leakage protection insulation structure according to claim 1, characterized in that, The insulating module (31) has an indicator window (36) on its surface away from the charged body. The indicator window (36) has a light-emitting element (37) inside it. The light-emitting element (37) is electrically connected to a semiconductor equalizing element (332).

7. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 1, characterized in that, The conductive shield (4) is connected to the insulating body (311) through a standardized interface, and the outer surface of the conductive shield (4) is provided with an insulating layer, and the outer surface of the conductive shield (4) is adapted to be provided with a pressure relief external interface (41), which is adapted to be connected to the pressure relief port (319).

8. The modular high and low voltage switchgear leakage protection insulation structure according to claim 1, characterized in that, The upper end of the support base plate (2) is provided with symmetrical sliding grooves (21), and the sliding grooves (21) are adapted to be provided with sliders (22), which are located at the bottom of the leakage-proof insulation structure (3).

9. The modular high and low voltage switchgear leakage protection and insulation structure according to claim 1, characterized in that, The insulating module (31) has a countersunk hole (38) on the side of the tenon. A memory alloy wedge-shaped locking block (381) is connected to the countersunk hole (38) by a compression spring. The protruding end of the memory alloy wedge-shaped locking block (381) has a guide slope. The inner wall of the mortise corresponding to the countersunk hole (38) has a matching locking blind hole (382). A piezoelectric thin film sensor (383) is attached to the bottom of the locking blind hole (382). The signal output end of the piezoelectric thin film sensor (383) is electrically connected to the passive wireless sensing unit (318).

10. A modular high and low voltage switchgear leakage protection and insulation structure according to claim 1, characterized in that, The bottom of the pressure relief chamber (315) is provided with a one-way metal rupture disc (320). The interior of the pressure relief chamber (315) is staggered with porous ceramic baffles (321) along the gas flow direction. The air pore channels of two adjacent layers of porous ceramic baffles (321) are staggered. The surface of the porous ceramic baffles (321) is coated with a high-temperature resistant insulating coating. The burst pressure threshold of the one-way metal rupture disc (320) is 0.35-0.45 MPa.

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