Transparent antenna pad thickening method and transparent antenna

Abstract

The application provides a transparent antenna pad thickening method and a transparent antenna. The method is used for thickening a plurality of pads to be thickened on the transparent antenna, and comprises the following steps: manufacturing a copper pad assembly comprising a plurality of copper pads and a conductive adhesive layer arranged on one side of the copper pads, wherein the plurality of copper pads are arranged according to the distribution positions of the pads to be thickened; manufacturing a pressing head assembly comprising a pressing head body, a plurality of pressing parts protruding from the surface of the pressing head body and a heating element arranged in the pressing parts; manufacturing a positioning jig; arranging the transparent antenna and the copper pad assembly on the positioning jig, so that each copper pad is opposite to the corresponding pad to be thickened, and the conductive adhesive layer is arranged between the copper pad and the pad to be thickened; arranging the pressing head assembly opposite to the copper pad assembly, so that each pressing part is opposite to the corresponding copper pad; and performing hot pressing on the copper pad assembly by using the pressing head assembly, so that each pressing part applies a preset hot pressing pressure and temperature to the corresponding copper pad, and the copper pad transmits the hot pressing pressure and temperature to the conductive adhesive layer, so that the conductive adhesive layer is combined with the copper pad and the pad to be thickened respectively, and the copper pad is fixedly and electrically connected with the pad to be thickened.

Description

Technical Field

[0001] This invention relates to the field of transparent antenna technology, and in particular to a method for thickening the pads of a transparent antenna and a transparent antenna. Background Technology

[0002] With the development of augmented reality devices (e.g., AR glasses), wearable electronic devices, and other products, transparent antennas, while maintaining good light transmittance (also known as light transmittance), also need to meet requirements for signal transmission (also known as transmission rate), conductivity, and electrical characteristics. Existing transparent antennas typically form conductive lines and bonding pads connected to these lines on a transparent dielectric material using a sputtering process. Due to limitations in sputtering process conditions and overall manufacturing capabilities, the sputtered thickness is relatively thin, typically ranging from 1µm to 3µm, which cannot meet the transmission rate requirements of high-power transparent antennas. When some bonding pads on the transparent antenna need to carry larger currents, meet higher conductivity requirements, or have higher connection requirements (these are the bonding pads that need to be thickened), it is difficult to achieve sufficient thickness using only the sputtering process.

[0003] To improve the conductivity and connectivity of the pads to be thickened, it is usually necessary to further thicken the pads on the transparent antenna. However, the pads to be thickened and the conductive lines connected to them on the transparent antenna are relatively small. In actual manufacturing, if the method of thickening each pad individually is adopted, the alignment and bonding of the thickening material (e.g., copper pad or copper sheet) with the corresponding pad must be completed one by one. This is not only inefficient, but also difficult to stably control the relative position between each thickening material and its corresponding pad when there are multiple pads to be thickened on the transparent antenna. This can easily lead to positional deviations between the thickening material and the corresponding pad. The conductive line size of the transparent antenna is 10μm±2μm, which makes the traditional single-pad thickening operation even more difficult.

[0004] Furthermore, since the conductive lines formed on transparent antennas through sputtering are typically thin, the bonding between the thickening material and the pad to be thickened usually requires applying certain pressure and temperature when thickening the pad. If traditional full-area pressurization or full-area hot-pressing methods are used, other conductive lines on the transparent antenna, besides the pad to be thickened, may also be subjected to pressure and temperature simultaneously. Because the thickness of non-target conductive lines is small, they are prone to damage under significant pressure or temperature, thus affecting the electrical performance of the transparent antenna.

[0005] Simultaneously, when thickening multiple pads, the thickening material must accurately correspond to the distribution position of the corresponding pads and maintain their relative position during the thickening process. Without a stable positioning structure, relative movement may occur during pressing, affecting the accuracy of the thickening position of the multiple pads. Furthermore, the thickening material not only needs to be stably fixed to the original pads but also needs to form a reliable electrical connection with them. Therefore, high requirements are placed on the connection method between the thickening material and the pads, as well as the hot-pressing conditions.

[0006] Therefore, existing methods for thickening transparent antenna pads have at least the following problems: it is difficult to efficiently thicken multiple pads in batches; the positioning accuracy between multiple thickening materials and the corresponding pads to be thickened, as well as the positional stability during the processing, need to be improved; traditional whole-surface hot pressing can easily cause non-target conductive lines to be damaged by pressure and temperature at the same time; while achieving pad thickening, it is also necessary to take into account the fixed connection and electrical connection between the thickening material and the original pads to be thickened. Summary of the Invention

[0007] The transparent antenna pad thickening method and transparent antenna provided by this invention aim to solve at least some of the defects of existing transparent antenna pad thickening methods.

[0008] In a first aspect, the present invention provides a method for thickening transparent antenna pads. The method for thickening transparent antenna pads is used to thicken multiple pads on a transparent antenna, including: A copper pad assembly is fabricated, comprising a plurality of copper pads and a conductive adhesive layer disposed on one side surface of the copper pads, wherein the plurality of copper pads are arranged according to the distribution positions of a plurality of pads to be thickened on the transparent antenna. A pressure head assembly is manufactured, the pressure head assembly including a pressure head body, a plurality of pressing portions protruding from the surface of the pressure head body, and a heating element disposed within the pressing portions; Make positioning fixtures; The transparent antenna and the copper pad assembly are placed on the positioning fixture so that each copper pad is positioned opposite to the corresponding pad to be thickened. At this time, the conductive adhesive layer is located between the copper pad and the pad to be thickened. The pressure head assembly and the copper pad assembly are arranged opposite to each other, so that the position of each pressing part corresponds to the corresponding copper pad. The copper pad assembly is hot-pressed by the pressure head assembly so that each pressing part applies a preset hot-pressing pressure and hot-pressing temperature to the corresponding copper pad. The hot-pressing pressure and the hot-pressing temperature are transmitted to the conductive adhesive layer via the copper pad, so that the conductive adhesive layer bonds with the copper pad and the pad to be thickened, thereby forming a fixed connection and electrical connection between the copper pad and the pad to be thickened on the transparent antenna.

[0009] In some embodiments, the distribution range of the plurality of pads to be thickened on the transparent antenna determines the target processing area, and the fabrication of the copper pad assembly includes: Provide a copper material layer capable of covering the target processing area; Based on the distribution of the plurality of pads to be thickened on the transparent antenna, the copper material layer is patterned to form a plurality of copper pads, such that the setting position of each copper pad corresponds to the corresponding pad to be thickened.

[0010] In some embodiments, the fabrication of the pressure head assembly includes: According to the distribution positions of the multiple copper pads, multiple protruding pressing portions are formed on the surface of the pressure head body, so that the setting position of each pressing portion corresponds to the corresponding copper pad; The heating element is provided in each of the pressing sections so that each pressing section can simultaneously apply the hot pressing pressure and the hot pressing temperature to the corresponding copper pad.

[0011] In some embodiments, the pressure head assembly applies the hot pressing pressure and the hot pressing temperature to the corresponding copper pad only through each of the pressing portions.

[0012] In some embodiments, the copper pad assembly is provided with a plurality of first positioning structures, and the positioning fixture is provided with a plurality of second positioning structures that correspond to and are adapted to the plurality of first positioning structures respectively. Each of the first positioning structures cooperates with a corresponding second positioning structure to define the position of the copper pad assembly relative to the positioning fixture.

[0013] In some embodiments, during the hot pressing of the copper pad assembly by the pressure head assembly, a plurality of first positioning structures are respectively maintained in cooperation with corresponding second positioning structures to maintain the relative positioning between the transparent antenna and the copper pad assembly by the positioning fixture.

[0014] In some embodiments, the hot pressing pressure applied by the pressing portion to the corresponding copper pad is 2 MPa.

[0015] In some embodiments, the heating element is used to heat the corresponding pressing portion so that the hot pressing temperature of the pressing portion is 200°C.

[0016] In some embodiments, the hot pressing time of the pressure head assembly on the copper pad assembly is 10 s.

[0017] Secondly, the present invention provides a transparent antenna. The transparent antenna includes: The antenna body, conductive lines, and multiple pads to be thickened are formed on the antenna body by a sputtering process, and the multiple pads to be thickened are distributed in local positions of the conductive lines. Multiple pads to be thickened are thickened using the above-described transparent antenna pad thickening method.

[0018] The transparent antenna pad thickening method and at least one beneficial effect of the transparent antenna provided in this invention are as follows: The transparent antenna pad thickening method arranges multiple copper pads according to the distribution positions of multiple pads to be thickened on the transparent antenna to form a copper pad assembly. A positioning fixture is used to align each copper pad with its corresponding pad to be thickened, thereby enabling unified positioning and thickening of multiple pads to be thickened. This avoids individually positioning and bonding smaller pads, thus improving the efficiency of the thickening process and the alignment accuracy between the copper pads and the pads. The pressure head assembly in this transparent antenna pad thickening method has multiple protruding pressing parts on its main surface, with each pressing part corresponding to a corresponding copper pad. During the hot pressing process, only each pressing part applies hot pressing pressure and temperature to its corresponding copper pad, thereby concentrating the main hot pressing action on the pad to be thickened. Compared to the traditional method of using a planar pressure head to hot-press the entire transparent antenna surface, this localized hot-pressing method helps reduce unnecessary pressure and temperature on non-target conductive lines, thereby lowering the risk of pressure and heat damage to thin conductive lines on the transparent antenna during the hot-pressing process. Simultaneously, the copper pad assembly in this transparent antenna pad thickening method includes a conductive adhesive layer disposed between the copper pad and the pad to be thickened. The hot-pressing pressure and temperature are transferred to the conductive adhesive layer via the copper pad, allowing the conductive adhesive layer to bond with both the copper pad and the pad to be thickened. This ensures the copper pad is stably fixed to the corresponding pad to be thickened, forming a fixed connection and electrical connection between them. Therefore, while increasing the thickness of the pad to be thickened, the conductivity between the copper pad and the pad to be thickened is maintained, thus improving the conductivity of the pad to be thickened. In addition, since multiple pressing parts are respectively set to correspond to multiple copper pads, the pressing head assembly can perform local hot pressing on multiple copper pads, which is conducive to completing the thickening process of multiple pads to be thickened in one process, reducing the operation process required to press each pad to be thickened individually, thereby improving the overall processing efficiency. Attached Figure Description

[0019] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0020] Figure 1 This is an overall schematic diagram of the copper pad assembly being pressed onto a transparent antenna according to an embodiment of the present invention; Figure 2 A schematic diagram of a transparent antenna provided in an embodiment of the present invention; Figure 3 A schematic diagram of a copper pad assembly provided in an embodiment of the present invention; Figure 4 A schematic diagram of the pressure head assembly provided in an embodiment of the present invention; Figure 5 A schematic diagram of the positioning fixture provided in an embodiment of the present invention; Figure 6 This is a flowchart of a method for thickening transparent antenna pads provided in an embodiment of the present invention; Figure 7 The transparent antenna pad thickening method provided in the embodiment of the present invention is illustrated in the flowchart of step S1. Figure 8 The transparent antenna pad thickening method provided in the embodiment of the present invention is illustrated in the flowchart of step S2.

[0021] Figure label: 10. Transparent antenna; 101. Conductive circuit; 102. Antenna body; 103. Pad to be thickened; 20. Copper pad assembly; 21. Copper pad; 22. Conductive adhesive layer; 201. First positioning structure; 30. Press head assembly; 31. Press head body; 32. Pressing part; 40. Positioning fixture; 401. Second positioning structure. Detailed Implementation

[0022] The present invention will now be described in detail with reference to specific embodiments. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope and application of the present invention.

[0023] It should be noted that, unless otherwise explicitly specified and limited, the terms "upper," "lower," "protruding from," "convex," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. The terms "installation," "fitting," "connection," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixing" can be bolted, clipped, or glued. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality" or "several" means two or more. In addition, "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] In this embodiment, the specific implementation of the "transparent antenna pad thickening method and transparent antenna" is not limited. Those skilled in the art can selectively use any suitable implementation method according to actual needs.

[0026] A "transparent antenna" refers to an antenna structure that is transparent or has light-transmitting properties, which includes an antenna body made of a transparent dielectric material, conductive lines disposed on the antenna body for transmitting and / or receiving signals, and pads disposed at local locations on the conductive lines.

[0027] The conductive lines and pads of a transparent antenna can be formed on the antenna body using a sputtering process. "Transparent" does not require all components of the antenna structure to be completely optically transparent, but rather indicates that the antenna structure is suitable for products with light transmission requirements (e.g., AR glasses and other wearable electronic products).

[0028] "Pad" is a local conductive area on a transparent antenna used to achieve electrical connection or grounding function; while pad to be thickened refers to a pad that has already been formed on a transparent antenna but needs to be further thickened, and the pad to be thickened is a conductive area formed simultaneously or separately from the conductive lines through sputtering process.

[0029] In the design process of transparent antennas, it is not required to thicken all the pads on the transparent antenna. Instead, the pads that need to be thickened or whose conductivity needs to be improved are identified from the multiple pads on the transparent antenna, and the pads to be thickened are thickened.

[0030] "Copper pad" refers to a copper sheet structure placed at the location of the solder pad to be thickened, used to increase the thickness of the solder pad. It can also be called a copper sheet.

[0031] The outline, size, and location of the copper pads produced in the transparent antenna pad thickening method provided in this application embodiment can be determined based on the shape, size, and distribution location of the corresponding pad to be thickened.

[0032] The copper pads produced in the transparent antenna pad thickening method provided in this application are not manufactured piece by piece and then installed piece by piece. Instead, multiple copper pads are pre-arranged according to the distribution positions of multiple pads to be thickened on the transparent antenna, and positioned and processed as a whole copper pad assembly.

[0033] "Copper pad assembly" refers to an assembly to be bonded, which includes multiple copper pads and a conductive adhesive layer disposed on one side of the copper pads.

[0034] In the transparent antenna pad thickening method provided in this application embodiment, the multiple copper pads on the copper pad assembly are arranged according to the actual spatial positions of the multiple pads to be thickened on the transparent antenna, so that after the copper pad assembly and the transparent antenna are positioned, each copper pad is respectively set opposite to the corresponding pad to be thickened.

[0035] The copper pad assembly in this embodiment is a processing component manufactured and attached to the transparent antenna during the process of thickening the pads to be thickened, and is not a structure that comes with the transparent antenna when the conductive lines are formed by the sputtering process.

[0036] The "conductive adhesive layer" is an adhesive layer placed between the copper pad and the pad to be thickened, which can form a fixed connection and electrical connection between the copper pad and the pad to be thickened under predetermined pressure and temperature conditions.

[0037] It should be noted that the conductive adhesive layer can be made of ACF (Anisotropic Conductive Film).

[0038] It is understandable that the ACF is placed on the side of the copper pad facing the pad to be thickened. When the copper pad is subjected to pressure and heat, the ACF completes the connection under thermo-pressurization conditions, fixing the copper pad to the pad to be thickened and forming a fixed connection and electrical connection with the pad to be thickened.

[0039] The “target processing area” is the processing area determined based on the overall distribution range of multiple pads to be thickened on the transparent antenna.

[0040] In this embodiment of the application, the copper material layer used to fabricate the copper pad assembly can cover the target processing area so that multiple copper pads can be formed on the same copper material layer according to the distribution positions of multiple pads to be thickened.

[0041] The "pressure head assembly" is a hot-pressing assembly that applies localized heating and pressure to the copper pad assembly.

[0042] In the embodiments of this application, the multiple pressing parts on the pressing head assembly do not form a traditional complete and flat pressing surface, but are respectively set at the positions where the copper pad needs to be hot-pressed.

[0043] In other words, after the pressure head assembly and the copper pad assembly are aligned, each pressing part corresponds to a corresponding copper pad.

[0044] The "pressing section" is a local structure that protrudes from the working surface of the pressure head body toward the copper pad assembly.

[0045] In this embodiment, the function of the pressing part is that when the pressing head assembly moves toward the copper pad assembly, the pressing part first forms contact with the corresponding copper pad and concentrates the pressure and heat onto the copper pad.

[0046] In this embodiment, the pressing part is a protruding structure that protrudes from the surface of the pressing head body, rather than a groove structure that is recessed into the surface of the pressing head body.

[0047] It is understandable that the shape of the pressing part can be designed according to the shape of the actual copper pad or the area to be pressed; for example, the pressing part can be formed into a rectangle, a strip extending in different directions, or other local protrusions that are adapted to the corresponding copper pad.

[0048] A "heating element" is a heating structure that provides heat to the pressing section. In this embodiment of the application, a corresponding heating element can be provided in each pressing section, so that each pressing section can simultaneously provide heat and pressure to the corresponding copper pad.

[0049] It should be noted that the heating element can be a heating wire. This pressure head assembly, through the heating element, can bring the pressing section to the hot-pressing temperature required for the conductive adhesive layer to be thermally bonded.

[0050] A "positioning fixture" is a fixture used to define the relative position of the transparent antenna and the copper pad assembly before and during hot pressing.

[0051] The positioning fixture can support a transparent antenna, a copper pad assembly, or a head assembly formed by both, and enable multiple copper pads to maintain a predetermined relative position with multiple pads to be thickened.

[0052] The “first positioning structure” is located on the copper pad assembly, and the “second positioning structure” is located on the positioning fixture.

[0053] Multiple first positioning structures correspond to and are adapted to multiple second positioning structures respectively, and can cooperate with each other to define the position of the copper pad assembly relative to the positioning fixture; "corresponding" here mainly means that there is a corresponding positional relationship between the first positioning structure and the second positioning structure; "adapting" here means that the two can match each other structurally; "cooperating" here means that the two are in a cooperative state that can achieve the positioning function during the actual positioning process.

[0054] It is understandable that if one of the first positioning structure and the second positioning structure is a positioning hole, then the other is a positioning post that matches the positioning hole; for example, a positioning hole is set on the copper pad assembly or the sheet supporting the copper pad assembly, and a positioning post corresponding to the positioning hole is set on the positioning fixture, and the positioning hole is fitted onto the corresponding positioning post to complete the positioning of the copper pad assembly.

[0055] The positioning fixture, copper pad assembly, and transparent antenna in this application embodiment each have four positioning positions set at their periphery or corners.

[0056] It should be noted that the first positioning structure and the second positioning structure are not limited to the positioning holes and positioning posts mentioned above, as long as they can achieve the positioning of the copper pad assembly relative to the positioning fixture.

[0057] "Hot pressing pressure" refers to the pressure applied by the pressing part to the corresponding copper pad, which is used to bond the conductive adhesive layer under the copper pad.

[0058] "Hot pressing temperature" refers to the operating temperature at which the pressing part acts on the copper pad and transfers heat to the conductive adhesive layer during the hot pressing process.

[0059] "Hot pressing time" refers to the duration for which the pressure head assembly applies effective hot pressing to the copper pad assembly.

[0060] Please see Figures 1-5 The transparent antenna pad thickening method is used to thicken multiple pads 103 on the transparent antenna 10.

[0061] The transparent antenna pad thickening method provided in this application embodiment is applicable to forming conductive lines and pads on an antenna body 102 made of transparent dielectric material using sputtering process. Some pads need to be thickened due to requirements such as thickness, conductivity, or connection performance.

[0062] Generally, the thickness of conductive lines and multiple pads connected to the conductive lines formed on the antenna body 102 by sputtering is usually within a small range of 1μm to 3μm due to limitations in sputtering process conditions and overall process capability. When transparent antennas are used in applications with high requirements for transmission rate, conductivity, or power, it is difficult to effectively increase the thickness of the pads 103 to be thickened by simply continuing sputtering deposition.

[0063] In transparent antennas, the characteristic size of conductive lines formed by sputtering is 10μm±2μm. For such small conductive lines, if the traditional method of thickening each individual pad is used, not only is the positioning and operation difficult, but the thickening process is also prone to scratching, contamination, pressure or heat damage to adjacent thin conductive lines. Therefore, the transparent antenna pad thickening method provided in this application pre-forms multiple copper pads and uses a positioning fixture and a pressure head assembly with multiple pressing parts to position and heat press multiple pads 103 to be thickened, thereby achieving the thickening of multiple pads 103 to be thickened.

[0064] like Figures 1-6 As shown, the method for thickening the transparent antenna pads includes: S1. Fabricate copper pad components.

[0065] In this embodiment, the copper pad assembly 20 includes a plurality of copper pads 21 and a conductive adhesive layer 22 disposed on one side surface of the copper pads 21. The plurality of copper pads 21 are arranged according to the distribution positions of the plurality of pads 103 to be thickened on the transparent antenna 10.

[0066] S2. Make the pressure head assembly.

[0067] In this embodiment of the application, the pressure head assembly 30 includes a pressure head body 31, a plurality of pressing portions 32 protruding from the surface of the pressure head body 31, and a heating element disposed within the pressing portions 32.

[0068] S3. Make positioning fixture.

[0069] S4. Place the transparent antenna and copper pad assembly on the positioning fixture so that each copper pad is positioned opposite to the corresponding pad to be thickened. At this time, the conductive adhesive layer is located between the copper pad and the pad to be thickened.

[0070] S5. Set the pressure head assembly and the copper pad assembly opposite each other so that the setting position of each pressing part corresponds to the corresponding copper pad.

[0071] S6. The copper pad assembly is hot-pressed by the pressure head assembly so that each pressing part applies a preset hot-pressing pressure and hot-pressing temperature to the corresponding copper pad.

[0072] S7. The hot pressing pressure and temperature are transferred to the conductive adhesive layer through the copper pad, so that the conductive adhesive layer is bonded to the copper pad and the pad to be thickened respectively, thereby forming a fixed connection and electrical connection between the copper pad and the pad to be thickened on the transparent antenna.

[0073] In some embodiments, such as Figures 1 to 7 As shown, the distribution range of multiple pads 103 to be thickened on the transparent antenna 10 determines the target processing area. Step S1 includes: S11. Provide a copper material layer that can cover the target processing area.

[0074] S12. Based on the distribution of multiple pads to be thickened on the transparent antenna, the copper material layer is patterned to form multiple copper pads, so that the setting position of each copper pad corresponds to the corresponding pad to be thickened.

[0075] like Figures 1-7 The manufacturing process of the copper pad assembly 20 is described in detail below: First, the target processing area is determined based on the overall distribution of multiple pads 103 to be thickened on the transparent antenna 10; then, a copper material layer capable of covering the target processing area is provided; subsequently, the copper material layer is laid or composited with the ACF to form a large-area copper material layer and ACF combined material; next, the copper material layer is patterned according to the actual positions of the multiple pads 103 to be thickened and the corresponding copper pad outlines (this patterning can be laser processing; the laser is applied to the copper material according to the predetermined copper pad pattern 21). The outline of multiple copper pads 21 is formed on the composite material of the layer and ACF; the purpose of laser processing is to distinguish the copper pad area that needs to be retained from the surrounding non-target material area that does not need to be retained); then, the non-target area material around the multiple copper pads 21 is removed or removed, leaving only the multiple copper pads 21 corresponding to the multiple pads 103 to be thickened, thereby forming multiple copper pads 21 arranged according to the actual spatial position of the multiple pads 103 to be thickened on the transparent antenna 10. At this time, the corresponding ACF conductive adhesive layer is retained on one side of each copper pad 21, and the multiple copper pads 21 and the multiple corresponding conductive adhesive layers 22 form the copper pad assembly 20.

[0076] In some embodiments, such as Figures 1 to 8 As shown, step S2 includes: S21. Based on the distribution of multiple copper pads, multiple protruding pressing parts are formed on the surface of the pressure head body so that the setting position of each pressing part corresponds to the corresponding copper pad.

[0077] S22. A heating element is provided in each pressing part so that each pressing part can simultaneously apply hot pressing pressure and hot pressing temperature to the corresponding copper pad.

[0078] like Figures 1-8 As shown, the manufacturing process of the pressure head assembly 30 is described in detail: According to the distribution of multiple copper pads 21 on the copper pad assembly 20, multiple pressing parts 32 are formed on the working surface of the pressure head body. At this time, the setting position of each pressing part 32 corresponds to the position of a corresponding copper pad 21.

[0079] It is understandable that after the pressure head assembly 30 and the copper pad assembly 20 are aligned, when viewed from the hot pressing direction, the pressing part 32, the copper pad 21, the conductive adhesive layer 22 and the pad to be thickened 103 form a corresponding spatial positional relationship.

[0080] In this embodiment, apart from the pressing part 32, the other working surface areas of the pressing head body 31 do not form a full-surface pressing structure with the same pressing height as the pressing part 32; thus, when the pressing head assembly 30 moves toward the copper pad assembly 20, the multiple pressing parts 32 first contact the corresponding copper pads 21 respectively.

[0081] In some embodiments, such as Figures 1 to 5 As shown, the pressure head assembly 30 can only apply hot-pressing pressure and hot-pressing temperature to the corresponding copper pad 21 through each pressing part 32, while the non-target area on the pressure head body 31 located between adjacent pressing parts 32 cannot apply pressure and heat to the conductive lines 101 on the transparent antenna 10.

[0082] Traditional planar pressure heads can press all pads and adjacent conductive lines simultaneously when pressing down as a whole. However, the pressure head assembly 30 in this embodiment concentrates the effective hot-pressing area at the location of the copper pad 21 through multiple locally protruding pressing parts 32.

[0083] In some embodiments, such as Figures 1 to 5 As shown, in order to ensure that the copper pad assembly 20 can accurately correspond to the multiple pads 103 to be thickened on the transparent antenna 10, multiple first positioning structures 201 need to be set on the copper pad assembly 20; at the same time, according to the position of the first positioning structure 201, multiple second positioning structures 401 are set on the positioning fixture 40 so that the multiple second positioning structures 401 correspond to and are adapted to the multiple first positioning structures 201 respectively.

[0084] Multiple first positioning structures 201 cooperate with corresponding second positioning structures 401 to define the position of the copper pad assembly 20 relative to the positioning fixture 40.

[0085] When the first positioning structure 201 engages with the corresponding second positioning structure 401, the position of the copper pad assembly 20 relative to the positioning fixture 40 is restricted, thereby enabling the copper pad assembly 20 to be in a predetermined position.

[0086] After the copper pad assembly 20 is installed onto the positioning fixture 40, the transparent antenna 10 is installed on the positioning fixture 40 at a predetermined position, so that each copper pad 21 is respectively positioned opposite to the corresponding pad 103 to be thickened on the transparent antenna 10.

[0087] In some embodiments, such as Figures 1 to 5As shown, during the process of hot pressing the copper pad assembly 20 by the pressure head assembly 30, multiple first positioning structures 201 respectively cooperate with the corresponding second positioning structures 401 to maintain the relative positioning between the transparent antenna 10 and the copper pad assembly 20 through the positioning fixture 40.

[0088] It should be noted that the positioning fixture 40 is not only used for initial alignment before hot pressing, but also continues to be used to maintain the relative positioning between the transparent antenna 10 and the copper pad assembly 20 during the subsequent hot pressing process. That is to say, during the hot pressing of the copper pad assembly 20 by the pressure head assembly 30, the multiple first positioning structures 201 still maintain their respective cooperation with the corresponding second positioning structures 401, so that the positioning relationship established between the transparent antenna 10 and the copper pad assembly 20 is not changed by the pressure applied by the pressure head assembly 30.

[0089] like Figures 1-8 The following describes in detail the assembly process of the transparent antenna 10 and the copper pad assembly 20: First, the copper pad assembly 20, the pressure head assembly 30, and the positioning fixture 40 are fabricated; then, the transparent antenna 10 is installed in the predetermined position of the positioning fixture 40; next, the copper pad assembly 20 is placed above the transparent antenna 10 or at the corresponding bonding position; then, the copper pad assembly 20 is positioned by the corresponding cooperation of the first positioning structure 201 and the second positioning structure 401; after positioning, each copper pad 21 is respectively bonded to the corresponding pad to be thickened. With the conductive adhesive layer 22 disposed on the side of the copper pad 21 facing the pad 103 to be thickened, the conductive adhesive layer 22 is located between the copper pad 21 and the pad 103 to be thickened (that is, a layered relationship of copper pad 21, conductive adhesive layer 22 and pad 103 to be thickened is formed before hot pressing). Then, the pressure head assembly 30 is positioned opposite the copper pad assembly 20. Finally, by adjusting the position of the pressure head assembly 30, multiple pressing parts 32 are respectively positioned opposite to the corresponding copper pads 21, thereby forming a complete multi-point hot pressing correspondence.

[0090] like Figures 1-8 As shown, the hot pressing process is described in detail: First, the pressing part 32 is brought to a predetermined hot pressing temperature using a heating element; then, the pressing head assembly 30 is moved toward the copper pad assembly 20 (when the pressing head assembly 30 moves toward the copper pad assembly 20, since the pressing part 32 protrudes outward relative to the surface of the pressing head body 31, each pressing part 32 first forms contact with the corresponding copper pad 21); subsequently, each pressing part 32 applies a preset hot pressing pressure and hot pressing temperature to the corresponding copper pad 21 (the hot pressing pressure and hot pressing temperature first act on the copper pad 21, and are transmitted through the copper pad 21 to the conductive adhesive layer 22 located between the copper pad 21 and the pad to be thickened 103); finally, the conductive adhesive layer bonds with the copper pad 21 and the pad to be thickened 103 under predetermined hot pressing conditions.

[0091] When the conductive adhesive layer 22 is made of ACF, the ACF is bonded and a conductive connection is established under the action of hot pressing pressure and hot pressing temperature; thus, the copper pad 21 is fixed to the corresponding pad to be thickened 103 through the conductive adhesive layer 22, and an electrical connection is formed between the copper pad 21 and the pad to be thickened 103.

[0092] It can be seen that, compared with the pad 103 to be thickened formed by sputtering process, the copper pad 21 increases the actual thickness at the position of the pad 103 to be thickened, thereby achieving the thickening of the pad 103.

[0093] In some embodiments, such as Figures 1 to 5 As shown, the hot pressing pressure applied by the pressing part 32 to the corresponding copper pad 21 is 2 MPa.

[0094] In some embodiments, such as Figures 1 to 5 As shown, the heating element (not shown in the figure) is used to heat the corresponding pressing part 32 so that the hot pressing temperature of the pressing part 32 is 200°C.

[0095] In some embodiments, such as Figures 1 to 5 As shown, the hot pressing time of the pressure head assembly 30 on the copper pad assembly 20 is 10 s.

[0096] Once the hot-pressing time is reached, the pressure head assembly 30 can be released, eliminating the need to maintain pressure on the combination of the transparent antenna 10 and the copper pad assembly 20.

[0097] Specifically, the hot pressing pressure, hot pressing temperature, and hot pressing time can be adapted to the material of the conductive adhesive layer 22, the size of the copper pad 21, the size of the solder pad 103 to be thickened, and the actual product's process conditions.

[0098] In summary, such as Figures 1 to 8 As shown, the transparent antenna pad thickening method provided in this application embodiment can be implemented according to the following process: (1) Determine the pads to be thickened.

[0099] Based on the electrical performance, connectivity performance, and subsequent assembly requirements of the transparent antenna 10, a number of pads 103 that need to be thickened are determined from the various pads on the transparent antenna 10.

[0100] (2) Determine the outline and position of the copper pad.

[0101] The copper pads 21 are designed according to the shape, size and position of each pad 103 to be thickened, and the copper pads 21 are arranged according to the spatial distribution relationship of the pads 103 to be thickened.

[0102] (3) Prepare copper materials and conductive adhesive materials.

[0103] Provide a copper material layer that can cover the target processing area defined by multiple pads 103 to be thickened, and then lay or composite the copper material layer with the entire surface of ACF.

[0104] (4) Perform graphic processing.

[0105] According to the copper pad patterns corresponding to the multiple pads 103 to be thickened, the copper material layer and the ACF composite material are patterned, and the outline of each copper pad 21 is formed by laser processing.

[0106] (5) Remove non-target materials.

[0107] Remove the non-target area material except for the copper pads 21, leaving only the multiple copper pads 21 and the corresponding conductive adhesive layer 22, thereby forming the copper pad assembly 20.

[0108] (6) Set the first positioning structure.

[0109] Multiple first positioning structures 201 are provided on the copper pad assembly 20 or the sheet used to support the copper pad assembly 20. Each first positioning structure 201 may have four positioning holes.

[0110] (7) Make positioning fixtures.

[0111] A positioning fixture with a corresponding second positioning structure 401 is made according to the first positioning structure 201 on the copper pad assembly 20; when the positioning hole is used as the first positioning structure 201, the second positioning structure 401 can be a positioning post that is adapted to the positioning hole.

[0112] (8) Make the pressure head assembly.

[0113] Based on the positions of the multiple copper pads 21, multiple protruding pressing portions 32 are formed on the working surface of the pressure head body 31; wherein each pressing portion 32 corresponds to a corresponding copper pad 21.

[0114] (9) Configure heating elements.

[0115] A heating element is provided in each pressing part 32 so that each pressing part 32 can obtain the heat required to hot press the conductive adhesive layer.

[0116] (10) Install a transparent antenna.

[0117] The transparent antenna is installed at a predetermined position on the positioning fixture.

[0118] (11) Install and position the copper pad assembly.

[0119] The copper pad assembly 20 is placed on the positioning fixture 40, so that the multiple first positioning structures 201 respectively cooperate with the corresponding second positioning structures 401; after positioning, each copper pad 21 is opposite to the corresponding pad to be thickened 103 on the transparent antenna 10.

[0120] (12) Form the hot-pressed assembly.

[0121] The conductive adhesive layer 22 is positioned between the copper pad 21 and the corresponding pad 103 to be thickened, while maintaining the relative positioning between the transparent antenna 10 and the copper pad assembly 20.

[0122] (13) Alignment of the pressure head assembly.

[0123] The pressure head assembly 30 is positioned opposite the copper pad assembly 20, and each pressing part 32 is positioned opposite the corresponding copper pad 21.

[0124] (14) Heating and pressing.

[0125] The heating element heats the pressing part 32, and the pressing head assembly 30 moves toward the copper pad assembly 20; the pressing part 32 can be heated to the required hot pressing temperature before pressing.

[0126] (15) Perform local hot pressing.

[0127] Each pressing part 32 acts on the corresponding copper pad 21, so that the hot pressing pressure and hot pressing temperature are transmitted to the conductive adhesive layer 22 through the copper pad 21.

[0128] (16) Complete the thickening.

[0129] After maintaining the hot-pressing pressure for about 10 seconds, release it; the conductive adhesive layer 22 forms a bond with the copper pad 21 and the pad to be thickened 103, thereby forming a fixed connection and electrical connection between the copper pad 21 and the corresponding pad to be thickened 103, thereby achieving the thickening of multiple pads 103.

[0130] Please see Figures 1-5 The transparent antenna 10 includes: an antenna body 102, conductive lines 101, and multiple pads to be thickened 103.

[0131] It should be noted that the conductive line 101 and the multiple pads to be thickened 103 are formed on the antenna body by sputtering process, and the multiple pads to be thickened 103 are distributed in local positions of the conductive line 101.

[0132] It is understandable that multiple pads 103 to be thickened are thickened using the aforementioned method for thickening pads of the transparent antenna 10.

[0133] Specifically, by adding a copper pad 21 at the location of the pad 103 to be thickened, the actual thickness of the original sputtered conductive area can be increased, thereby improving the conductivity of the pad 103 to be thickened.

[0134] Specifically, by forming a fixed connection and electrical connection between the copper pad 21 and the pad to be thickened 103 through the conductive adhesive layer 22, reliable conductivity can be maintained while increasing the thickness.

[0135] To further explain, multiple copper pads 21 are pre-arranged according to the positions of multiple pads 103 to be thickened to form a copper pad assembly 20, which can avoid the need for manual positioning and bonding of each small copper pad 21, thereby improving the efficiency of batch processing.

[0136] In addition, the positioning accuracy between the copper pad assembly 20 and the transparent antenna 10 can be improved by the cooperation of the first positioning structure 201 and the second positioning structure 401.

[0137] In addition, the positioning fixture 40 continues to maintain the relative positioning between the transparent antenna 10 and the copper pad assembly 20 during the hot pressing process, which can reduce the possibility of positional shift during the hot pressing process.

[0138] It should be noted that by using the multiple locally protruding pressing parts 32 on the main body of the pressing head 31, the hot pressing pressure and hot pressing temperature can be concentrated on the copper pad 21 that needs to be thickened, while minimizing the pressure and heat on the conductive line 101.

[0139] Since multiple pressing sections 32 can each correspond to multiple copper pads 21, multiple pads 103 to be thickened can be processed simultaneously using the same pressing head assembly 30 to improve production efficiency.

[0140] The pressure head assembly 30 has both heating and pressurizing functions, which can meet the process conditions required for the hot-pressing connection of the conductive adhesive layer 22.

[0141] It is understandable that, compared with traditional individual pad thickening operations, the transparent antenna pad thickening method provided in this application embodiment is beneficial to reduce scratches and contamination on the conductive lines on the transparent antenna 10 during operation, stabilize product resistance, improve work efficiency and product yield, and reduce the possibility of scrapping in subsequent processing steps such as cutting.

[0142] Generally speaking, since the transparent antenna 10 is covered with a protective film, before the pads 103 to be thickened are thickened, corresponding openings need to be made on the protective film to expose these pads 103 to be thickened, so that the subsequent conductive adhesive layer 22 and copper pad 21 can directly connect with the pads 103 to be thickened.

[0143] In the embodiments of this application, the transparent dielectric material used to fabricate the antenna body 102 can be an optical-grade transparent material such as PET or COP.

[0144] ACF (Anisotropic Conductive Adhesive) contains conductive particles and is a special type of adhesive that conducts electricity in the vertical direction but not in the horizontal direction.

[0145] To further explain, ACF can achieve electrical connection and physical fixation, simplify the manufacturing process, improve connection quality, and even adapt to the trend of finer pitch.

[0146] Specifically, ACF enables electrical connections between electronic components; in the vertical direction, the conductive particles in ACF can form conductive paths, allowing current to flow in the vertical direction; this characteristic of ACF makes it particularly suitable for applications requiring high-precision electrical connections.

[0147] In addition to its conductivity, ACF also has the function of bonding and fixing; ACF can achieve a firm, stable and reliable connection between electronic components; this fixing effect helps to prevent electronic components from loosening or falling off under vibration or impact conditions.

[0148] Understandably, using ACF can simplify the manufacturing process; compared to traditional soldering methods, ACF does not require high-temperature treatment, thereby reducing the risk of thermal stress and stress cracking. This makes ACF particularly suitable for interconnecting heat-sensitive components, helping to reduce production costs and improve production efficiency.

[0149] It should be noted that ACF has high connection quality and can provide stable electrical and mechanical connections; ACF can ensure stable and reliable signal transmission between electronic components, while providing sufficient mechanical strength.

[0150] In summary, the transparent antenna pad thickening method and transparent antenna provided by this invention involve arranging multiple copper pads according to the distribution positions of multiple pads to be thickened on the transparent antenna to form a copper pad assembly. A positioning fixture is used to align each copper pad with its corresponding pad, enabling unified positioning and thickening of multiple pads. This avoids individually positioning and bonding smaller pads, thus improving the efficiency of the thickening process and the alignment accuracy between the copper pads and the pads. The pressure head assembly in this method has multiple protruding pressing parts on its main surface, each corresponding to a copper pad. During hot pressing, only each pressing part applies hot pressing pressure and temperature to its corresponding copper pad, concentrating the main hot pressing effect on the pad to be thickened. Compared to the traditional method of using a planar pressure head to hot-press the entire transparent antenna surface, this localized hot-pressing method helps reduce unnecessary pressure and temperature on non-target conductive lines, thereby lowering the risk of pressure and heat damage to thin conductive lines on the transparent antenna during the hot-pressing process. Simultaneously, the copper pad assembly in this transparent antenna pad thickening method includes a conductive adhesive layer disposed between the copper pad and the pad to be thickened. The hot-pressing pressure and temperature are transferred to the conductive adhesive layer via the copper pad, allowing the conductive adhesive layer to bond with both the copper pad and the pad to be thickened. This ensures the copper pad is stably fixed to the corresponding pad to be thickened, forming a fixed connection and electrical connection between them. Therefore, while increasing the thickness of the pad to be thickened, the conductivity between the copper pad and the pad to be thickened is maintained, thus improving the conductivity of the pad to be thickened. In addition, since multiple pressing parts are respectively set to correspond to multiple copper pads, the pressing head assembly can perform local hot pressing on multiple copper pads, which is conducive to completing the thickening process of multiple pads to be thickened in one process, reducing the operation process required to press each pad to be thickened individually, thereby improving the overall processing efficiency.

[0151] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention, but it should not be construed as limiting the specific implementation of the invention to these descriptions. Those skilled in the art will recognize that various modifications and improvements can be made without departing from the inventive concept of the present invention, and all such modifications and improvements fall within the scope of protection of the present invention.

Claims

1. A method for thickening transparent antenna pads, used to thicken multiple pads on a transparent antenna to be thickened, characterized in that, include: A copper pad assembly is fabricated, comprising a plurality of copper pads and a conductive adhesive layer disposed on one side surface of the copper pads, wherein the plurality of copper pads are arranged according to the distribution positions of a plurality of pads to be thickened on the transparent antenna. A pressure head assembly is manufactured, the pressure head assembly including a pressure head body, a plurality of pressing portions protruding from the surface of the pressure head body, and a heating element disposed within the pressing portions; Make positioning fixtures; The transparent antenna and the copper pad assembly are placed on the positioning fixture so that each copper pad is positioned opposite to the corresponding pad to be thickened. At this time, the conductive adhesive layer is located between the copper pad and the pad to be thickened. The pressure head assembly and the copper pad assembly are arranged opposite to each other, so that the position of each pressing part corresponds to the corresponding copper pad. The copper pad assembly is hot-pressed by the pressure head assembly so that each pressing part applies a preset hot-pressing pressure and hot-pressing temperature to the corresponding copper pad. The hot-pressing pressure and the hot-pressing temperature are transmitted to the conductive adhesive layer via the copper pad, so that the conductive adhesive layer bonds with the copper pad and the pad to be thickened, thereby forming a fixed connection and electrical connection between the copper pad and the pad to be thickened on the transparent antenna.

2. The method for thickening transparent antenna pads according to claim 1, characterized in that, The distribution range of the multiple pads to be thickened on the transparent antenna determines the target processing area, and the fabrication of the copper pad assembly includes: Provide a copper material layer capable of covering the target processing area; Based on the distribution of the plurality of pads to be thickened on the transparent antenna, the copper material layer is patterned to form a plurality of copper pads, such that the setting position of each copper pad corresponds to the corresponding pad to be thickened.

3. The method for thickening transparent antenna pads according to claim 1, characterized in that, The manufacturing of the pressure head assembly includes: Based on the distribution of the multiple copper pads, multiple protruding pressing portions are formed on the surface of the pressure head body, so that the setting position of each pressing portion corresponds to the corresponding copper pad. The heating element is provided in each of the pressing sections so that each pressing section can simultaneously apply the hot pressing pressure and the hot pressing temperature to the corresponding copper pad.

4. The method for thickening transparent antenna pads according to claim 1, characterized in that, The pressure head assembly applies the hot-pressing pressure and the hot-pressing temperature to the corresponding copper pad only through each of the pressing parts.

5. The method for thickening transparent antenna pads according to claim 1, characterized in that, The copper pad assembly is provided with a plurality of first positioning structures, and the positioning fixture is provided with a plurality of second positioning structures that correspond to and are adapted to the plurality of first positioning structures respectively. Each of the first positioning structures cooperates with a corresponding second positioning structure to define the position of the copper pad assembly relative to the positioning fixture.

6. The method for thickening transparent antenna pads according to claim 5, characterized in that, During the hot pressing of the copper pad assembly by the pressure head assembly, multiple first positioning structures respectively cooperate with the corresponding second positioning structures to maintain the relative positioning between the transparent antenna and the copper pad assembly by the positioning fixture.

7. The method for thickening transparent antenna pads according to claim 1, characterized in that, The hot pressing pressure applied by the pressing part to the corresponding copper pad is 2 MPa.

8. The method for thickening transparent antenna pads according to claim 1, characterized in that, The heating element is used to heat the corresponding pressing part so that the hot pressing temperature of the pressing part is 200°C.

9. The method for thickening transparent antenna pads according to claim 1, characterized in that, The hot pressing time of the pressure head assembly on the copper pad assembly is 10 seconds.

10. A transparent antenna, characterized in that, include: The antenna body, conductive lines, and multiple pads to be thickened are formed on the antenna body by a sputtering process, and the multiple pads to be thickened are distributed in local positions of the conductive lines. The plurality of pads to be thickened are thickened by the transparent antenna pad thickening method according to any one of claims 1 to 9.

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