A heat dissipation device

Abstract

The application discloses a heat dissipation device, which comprises a heat-conducting base provided with a flat surface for abutting against a heat-generating element and used for conducting heat of the heat-generating element, and a heat dissipation cover body distributed on a side of the heat-conducting base away from the heat-generating element along a first direction and detachably connected with the heat-conducting base, wherein the heat dissipation cover body is internally provided with a refrigerant channel, and the heat dissipation cover body is provided with a heat exchange surface in contact with the heat-conducting base, and at least part of the surface structure of the heat exchange surface is formed by an outer wall of the refrigerant channel. The application solves the problems of cost increase and complicated and time-consuming testing caused by equipping multiple sets of cold plates and frequently disassembling and assembling the cold plates.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation equipment technology, and in particular to a heat dissipation device. Background Technology

[0002] In recent years, server performance has been continuously improving. Traditional air cooling, due to its high energy consumption, noise, and low equipment density, is no longer sufficient to meet the heat dissipation requirements of high-power chips. While liquid cooling technology can significantly improve heat dissipation efficiency, existing cold plate-based liquid cooling solutions require separate design for different CPU sockets and dedicated liquid cooling pipelines. In scenarios where testing server heat dissipation and performance, researchers need to prepare multiple sets of cold plates to adapt to servers with different configurations, increasing investment costs; or frequently disassemble and install the same cold plate on servers with different configurations, which is cumbersome, time-consuming, and affects testing efficiency.

[0003] It is evident that reducing testing costs and saving testing time are problems that need to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation device that solves the problems of increased costs and cumbersome and time-consuming testing caused by equipping multiple sets of cold plates and frequently disassembling and assembling them.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a heat dissipation device, comprising:

[0006] A heat-conducting base has a flat surface that fits against the heating element for conducting heat from the heating element;

[0007] A heat dissipation cover is distributed along a first direction on the side of the heat-conducting base away from the heat-generating element and is detachably connected to the heat-conducting base. The heat dissipation cover has a refrigerant channel inside and a heat exchange surface that contacts the heat-conducting base. At least a portion of the surface structure of the heat exchange surface is formed by the outer wall of the refrigerant channel.

[0008] In some embodiments, the heat-conducting base includes a heat-conducting base plate and a plurality of first fins, the heat-conducting base plate being attached to the heating element, and the plurality of first fins being arranged at intervals along a second direction on the side of the heat-conducting base plate opposite to the heating element;

[0009] The heat dissipation cover includes a heat dissipation top plate and a plurality of second fins. The heat dissipation top plate is located above the first fins. The plurality of second fins are arranged at intervals along the second direction on the side of the heat dissipation top plate facing the heat-conducting base. The second fins are in contact with the first fins in the second direction to form the heat exchange surface.

[0010] Part of the refrigerant channel structure extends and is embedded inside the second fin.

[0011] In some embodiments, one side of the first fin is perpendicular to the heat-conducting base plate, and the other side is inclined, and the width of the first fin at one end near the heat-conducting base plate in the first direction is greater than the width at the other end.

[0012] The second fin is perpendicular to the heat dissipation top plate on one side and inclined on the other side, and the width of the second fin at the end near the heat dissipation top plate in the first direction is greater than the width at the other end; wherein, the vertical surfaces of the first fin and the second fin are in contact, or the inclined surfaces of the two are in contact.

[0013] In some embodiments, the first fin is provided with a heat exchange groove extending along the first direction, the heat exchange groove having an opening on the side facing the heat dissipation top plate, the second fin being inserted into the heat exchange groove, and the outer wall of the second fin in both the first and second directions contacting the groove wall of the heat exchange groove.

[0014] In some embodiments, the second fin is inserted between two adjacent first fins, the outer wall of the second fin in the second direction contacts two adjacent first fins respectively, and the outer wall of the second fin in the first direction contacts the heat-conducting base plate.

[0015] In some embodiments, the contact surface between the heat-conducting base and the heating element, as well as the heat exchange surface, are coated with a heat-conducting medium.

[0016] In some embodiments, the heat-conducting base plate is provided with screw holes for fixing the heat-conducting base plate to the carrier of the heating element by fasteners;

[0017] The heat-conducting base plate is provided with a positioning plate extending towards the heat dissipation top plate in the first direction. The positioning plate is located on both sides of the heat-conducting base plate and has a slot. The heat dissipation top plate is provided with a fixing plate extending towards the heat-conducting base plate in the first direction. The fixing plate and the positioning plate abut against each other in the second direction. The fixing plate is provided with a hook, which engages with the slot to prevent the heat dissipation top plate from detaching from the heat-conducting base in the first direction.

[0018] In some embodiments, the hook is connected to the fixing plate by a spring, the spring being used to provide an elastic force for the hook to move toward the slot.

[0019] In some embodiments, the fixing plate is disposed on one or both sides of the heat dissipation top plate;

[0020] When located on one side, one side of the heat dissipation top plate abuts against the positioning plate via the fixing plate, and the other side of the heat dissipation top plate abuts against the positioning plate via the second fin;

[0021] When located on both sides, the heat dissipation top plate abuts against the positioning plate on both sides through the fixing plate.

[0022] In some embodiments, the heat dissipation top plate is provided with a refrigerant inlet and a refrigerant outlet that communicate with the refrigerant channel, and the refrigerant inlet and the refrigerant outlet are externally connected to liquid cooling pipes;

[0023] And / or, it also includes a cooling fan for delivering air into the gap between adjacent first fins.

[0024] As can be seen from the above technical solution, the beneficial effect of the present invention lies in the fact that by designing the heat-conducting base and the heat dissipation cover as a modular structure with detachable connection, the versatility and testing efficiency of the heat dissipation device are significantly improved. Specifically, the heat-conducting base directly adheres to the heat-generating element to transfer its heat; the heat dissipation cover has a refrigerant channel inside, and the heat exchange surface between the heat dissipation cover and the heat-conducting base is formed by the outer wall of the refrigerant channel, which can quickly remove the heat transferred by the heat-conducting base. Different heat-generating elements can be configured with separate heat-conducting bases, and the heat dissipation cover can be adapted to different heat-conducting bases. Therefore, during the testing of multiple servers, it is not necessary to equip each heat-generating element with a separate heat dissipation cover, reducing testing costs. Furthermore, after the first heat-generating element is tested, the heat dissipation cover can be quickly disassembled and installed on the second heat-generating element. This allows for simple disassembly and assembly when switching between different testing platforms, without replacing the entire liquid cooling system or re-laying piping, greatly improving assembly efficiency and operational convenience during the testing process. Attached Figure Description

[0025] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a heat-conducting base structure for a heat dissipation device provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the heat dissipation cover structure of a heat dissipation device provided in an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the first heat dissipation device structure provided in an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a second heat dissipation device structure provided in an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of a third heat dissipation device provided in an embodiment of the present invention.

[0031] In the diagram: 1-Heat-conducting base; 2-Heating element; 3-Heat dissipation cover;

[0032] 11-Heat-conducting base plate; 12-First fin; 13-Positioning plate; 14-Screw hole; 15-Slot; 16-Heat exchange tank;

[0033] 31-Heat dissipation top plate; 32-Refrigerant channel; 33-Second fin; 34-Refrigerant inlet; 35-Refrigerant outlet; 36-Fixing plate; 37-Hook. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0035] The terms "comprising" and "having," and any variations thereof, in the specification and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may include steps or units not listed.

[0036] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] like Figure 1 and 2 As shown in the embodiment, a heat dissipation device includes a heat-conducting base 1 and a heat dissipation cover 3. The heat-conducting base 1 conducts heat from the heating element 2, and the heat dissipation cover 3 facilitates heat exchange with the refrigerant, ultimately achieving heat dissipation. Specifically, the heat-conducting base 1 is made of a metal material with high thermal conductivity, such as, but not limited to, copper, aluminum, or their alloys. The bottom surface of the heat-conducting base 1 has a flat plane that can fit in contact with the heating element 2. When the heating element 2 generates heat, the heat is rapidly transferred from the heating element 2 to the heat-conducting base 1 through thermal conduction and diffuses evenly within it. The heating element 2 is typically a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0038] The heat dissipation cover 3 is distributed along a first direction on the side of the heat-conducting base 1 away from the heat-generating element 2. This first direction is usually a vertical direction, meaning the heat dissipation cover 3 is located above the heat-conducting base 1 and is securely connected to the heat-conducting base 1 in a detachable manner. The heat dissipation cover 3 has a refrigerant channel 32 inside, which is used to introduce low-temperature liquid refrigerant to carry the heat from the heat-generating element 2 out of the device.

[0039] Furthermore, the heat dissipation cover 3 has a heat exchange surface that contacts the heat-conducting base 1. At least a portion of the surface structure of this heat exchange surface is formed by the outer wall of the refrigerant channel 32. When the heat-conducting base 1 conducts heat to the heat exchange surface, the heat will quickly pass through the channel wall constituting the heat exchange surface and be transferred to the refrigerant flowing in the refrigerant channel 32. After absorbing heat, the refrigerant's temperature rises, and it carries the heat out of the heat dissipation cover 3, thereby completing a highly efficient heat exchange process.

[0040] In summary, by designing the heat-conducting base 1 and the heat dissipation cover 3 as a modular structure with detachable connection, this application significantly improves the versatility and testing efficiency of the heat dissipation device. Specifically, the heat-conducting base 1 is directly attached to the heating element 2 to transfer heat from the heating element 2; the heat dissipation cover 3 has a refrigerant channel 32 inside, and the heat exchange surface between the heat dissipation cover 3 and the heat-conducting base 1 is formed by the outer wall of the refrigerant channel 32, which can quickly remove the heat transferred by the heat-conducting base 1.

[0041] During testing, different heat-generating elements 2 can be configured with heat-conducting bases 1, and heat dissipation covers 3 can be adapted to different heat-conducting bases 1. Thus, during testing of multiple servers, it is not necessary to equip each heat-generating element 2 with a separate heat dissipation cover 3, reducing testing costs. At the same time, after the first heat-generating element 2 is tested, the heat dissipation cover 3 can be quickly disassembled and installed on the second heat-generating element 2. This allows the heat dissipation cover 3 to be easily disassembled and installed when switching between different testing platforms without replacing the entire liquid cooling system or re-laying the piping. Each configuration switch can be completed within 10 minutes or even less, greatly improving the assembly efficiency and ease of operation during the testing process.

[0042] Furthermore, the heat-conducting base 1 includes a heat-conducting base plate 11 and a plurality of first fins 12, please refer to... Figure 1 The heat-conducting base plate 11 is a solid plate structure. One side of the plate is used to fit against the heating element 2, and multiple first fins 12 are arranged at intervals along the second direction on the other side of the heat-conducting base plate 11, that is, the side of the heat-conducting base plate 11 away from the heating element 2. The second direction is either horizontal or the length direction of the heat-conducting base plate 11, and the first direction is perpendicular to the second direction.

[0043] Accordingly, the heat sink 3 includes a heat sink top plate 31 and multiple second fins 33, please refer to... Figure 2The heat dissipation cover 3 has a plate-like structure, and multiple second fins 33 are arranged at intervals along the second direction on the side of the heat dissipation top plate 31 facing the heat conduction base 1. When the heat dissipation cover 3 is stably set on the heat conduction base 1, the first fin 12 and the second fin 33 have overlapping portions in the second direction, and the overlapping portions are in contact with each other, thereby forming the aforementioned heat exchange surface.

[0044] It should be noted that the refrigerant channels 32 inside the heat sink cover 3 are not only present inside the heat sink top plate 31; part of their channel structure extends and is embedded inside each of the second fins 33. Please refer to [reference needed]. Figures 3 to 5 This allows each second fin 33 to flow with a cooling medium. When heat is conducted to the second fin 33 through the contact surface between the first fin 12 and the second fin 33, it will be carried away immediately by the cooling medium flowing inside the second fin 33, greatly shortening the heat conduction path and thus achieving efficient heat dissipation.

[0045] In the first embodiment, please refer to Figure 3 One side of the first fin 12 is perpendicular to the heat-conducting base plate 11, and the other side is inclined, meaning that the cross-section of each first fin 12 is a right-angled triangle or a right-angled trapezoid. Furthermore, the width of the first fin 12 at the end closest to the heat-conducting base plate 11 in the first direction is greater than the width at the other end, resulting in a larger contact area between the root of the first fin 12 and the heat-conducting base plate 11. This improves the connection strength between the first fin 12 and the heat-conducting base plate 11 and ensures the heat transfer efficiency between the first fin 12 and the heat-conducting base plate 11.

[0046] Correspondingly, the second fin 33 also adopts a similar design to the first fin 12, please refer to... Figure 3 The second fin 33 is perpendicular to the heat dissipation top plate 31 on one side and inclined on the other side. The width of the second fin 33 at the end closest to the heat dissipation top plate 31 in the first direction is greater than the width at the other end. During assembly, there are two preferred contact modes: one is that the vertical surface of the first fin 12 is in contact with the vertical surface of the second fin 33; the other is that the inclined surface of the first fin 12 is in contact with the inclined surface of the second fin 33. Both modes ensure a large-area, close surface contact between the first fin 12 and the second fin 33, thereby guaranteeing efficient heat conduction.

[0047] In the second embodiment, the first fin 12 and the second fin 33 are respectively rectangular in cross-section, and the first fin 12 is provided with a heat exchange groove 16 extending along the first direction. Please refer to [reference needed]. Figure 4The heat exchange groove 16 extends downward from the top of the first fin 12, and has an opening on the side facing the heat dissipation top plate 31. When the heat dissipation cover 3 is assembled on the heat-conducting base 1, the second fin 33 is directly inserted into the heat exchange groove 16 from above along the first direction, realizing a slot-type fit between the first fin 12 and the second fin 33. This ensures that in the second direction, the two sidewalls of the second fin 33 contact the two sidewalls of the heat exchange groove 16; and in the first direction, the end face of the second fin 33 contacts the bottom wall of the heat exchange groove 16. This method increases the heat conduction area of ​​the first fin 12 and the second fin 33, and effectively prevents poor contact caused by thermal expansion and contraction or mechanical vibration, ensuring long-term heat dissipation stability.

[0048] In the third embodiment, the first fin 12 remains a solid structure but does not have an internal groove. Please refer to [reference needed]. Figure 5 The second fin 33 is relatively thin and can be precisely inserted into the narrow gap between any two adjacent first fins 12. When the heat dissipation cover 3 is assembled on the heat-conducting base 1, the two sides of the second fin 33 are tightly fitted with the inner sides of the two adjacent first fins 12, thereby forming effective thermal contact in the second direction. At the same time, in order to further enhance the heat conduction path, the bottom end of the second fin 33 extends downward until it directly contacts the upper surface of the heat-conducting base plate 11 below. This allows heat to be transferred not only through the side contact between the first fins 12 and the second fin 33, but also through the contact between the second fin 33 and the top surface of the heat-conducting base plate 11, forming a dual heat conduction path and improving the redundancy and reliability of the entire heat dissipation device.

[0049] It should be noted that, since the core area of ​​the heating element 2 generates significantly more heat than the edge area, the first fin 12 and the second fin 33 can be arranged in a non-uniform manner. Specifically, the first fin 12 and the second fin 33 can be arranged more densely in areas with high heat flux density to enhance the heat conduction and heat dissipation capacity of that area; while in areas with low heat flux density, the number of fins can be appropriately reduced, thereby optimizing material usage and reducing overall weight.

[0050] The refrigerant channels 32 inside the second fin 33 can be branch channels leading from the refrigerant channels 32 in the heat dissipation top plate 31, or they can be series channels formed sequentially. This ensures that each second fin 33 has highly fluid refrigerant in its internal refrigerant channel 32, guaranteeing the heat exchange efficiency of each second fin 33. Furthermore, based on the series channel formation, the refrigerant channels 32 inside the second fin 33 corresponding to the high-heat-generating area of ​​the heating element 2 should be as close as possible to the front end of the series channel to ensure that the low-temperature refrigerant inside has a high heat exchange capacity. Correspondingly, the refrigerant channels 32 inside the second fin 33 corresponding to the low-heat-generating area of ​​the heating element 2 can be as close as possible to the end of the series channel to make reasonable use of the refrigerant's heat exchange capacity. Here, the front end refers to the end through which the refrigerant first flows, and the rear end corresponds to the front end.

[0051] Furthermore, before installing the heat-conducting base 1 onto the heating element 2, a layer of thermally conductive medium is uniformly coated on the contact surfaces of the two. Specifically, thermally conductive silicone grease is applied to the bottom surface of the heat-conducting base 11 and the top surface of the heating element 2 to improve the contact area and heat transfer efficiency. Similarly, before assembling the heat sink cover 3 with the heat-conducting base 1, a layer of thermally conductive medium is also pre-coated on all contact areas that constitute the heat exchange surface, thereby significantly improving the thermal conductivity of the interface.

[0052] A plurality of screw holes 14 are provided on the heat-conducting base plate 11, and the entire heat-conducting base 1 is fixed to the circuit board or carrier where the heating element 2 is located by screws or other fasteners to ensure its stability. A positioning plate 13 extending along the first direction toward the heat dissipation top plate 31 is provided on the heat-conducting base plate 11. The positioning plate 13 is located on both sides of the heat-conducting base plate 11. Please refer to... Figures 3 to 5 A slot 15 is provided on the positioning plate 13. A fixing plate 36 is provided on the heat dissipation top plate 31, extending along the first direction and facing the heat conduction base plate 11. The end of the fixing plate 36 is equipped with a movable hook 37. When installing the heat dissipation cover 3, it is first placed in position so that the fixing plate 36 and the positioning plate 13 abut against each other in the horizontal direction (second direction). Then, by pressing or flicking the hook 37, it overcomes the elastic force and slides into the slot 15 on the positioning plate 13, thereby realizing the engagement of the hook 37 and the slot 15, effectively preventing the heat dissipation cover 3 from detaching from the heat conduction base 1 along the first direction.

[0053] Furthermore, the hook 37 is connected to the fixing plate 36 by a spring, which always provides the hook 37 with an elastic restoring force toward the slot 15, ensuring that the hook 37 can automatically remain in the locked position without external force intervention, thus improving the reliability of the connection.

[0054] Furthermore, the aforementioned fixing plate 36 can be located on one side of the heat dissipation top plate 31 or on both sides of the heat dissipation top plate 31. Specifically, when the fixing plate 36 is located on one side, one side of the heat dissipation top plate 31 abuts against the positioning plate 13 via the fixing plate 36 and is limited by the hook 37 and the slot 15. The other side of the heat dissipation top plate 31 is positioned and limited by abutting against the positioning plate 13 via the second fin 33. When the fixing plate 36 is located on both sides, both sides of the heat dissipation top plate 31 abut against the positioning plate 13 via the fixing plate 36 and are limited by the hook 37 and the slot 15.

[0055] To form a complete liquid cooling circulation loop, at least two through holes are provided on the heat dissipation top plate 31, which serve as the refrigerant inlet 34 and the refrigerant outlet 35, respectively. The refrigerant inlet 34 and the refrigerant outlet 35 are connected to the refrigerant channel 32 inside the heat dissipation top plate 31, and are respectively connected to two liquid cooling pipes for inlet and outlet. Low-temperature refrigerant flows in from the refrigerant inlet 34, flows through the refrigerant channel 32 inside the heat dissipation top plate 31 and the second fin 33, and after fully absorbing heat, flows out from the refrigerant outlet 35 and returns to the external condenser or heat exchanger for cooling, thereby forming a closed-loop high-efficiency liquid cooling heat dissipation system.

[0056] In addition, the heat dissipation device can be equipped with one or more cooling fans. The cooling fans are mounted on one side of the heat-conducting base 1 and can be fixedly connected to the heat-conducting base 1. Their function is to force external air to flow through the air duct formed by the first fin 12 and the second fin 33. Since the heat-conducting base 1 does not need to be disassembled during testing, there is no need to replace the cooling fans. Even without the liquid cooling system, the air cooling mode of the cooling fans can provide a certain amount of heat dissipation capacity, realizing the coordinated operation of liquid cooling and air cooling.

[0057] The above provides a detailed description of a heat dissipation device provided by an embodiment of the present invention. The various embodiments are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to the method section.

[0058] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0059] The above provides a detailed description of a heat dissipation device provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The heat-conducting base (1) has a flat surface that fits against the heating element (2) for conducting the heat of the heating element (2); The heat dissipation cover (3) is distributed along the first direction on the side of the heat-conducting base (1) away from the heat-generating element (2) and is detachably connected to the heat-conducting base (1). The heat dissipation cover (3) is provided with a refrigerant channel (32) inside. The heat dissipation cover (3) has a heat exchange surface that contacts the heat-conducting base (1). At least part of the surface structure of the heat exchange surface is formed by the outer wall of the refrigerant channel (32).

2. The heat dissipation device according to claim 1, characterized in that, The heat-conducting base (1) includes a heat-conducting base plate (11) and a plurality of first fins (12). The heat-conducting base plate (11) is attached to the heating element (2). The plurality of first fins (12) are arranged at intervals along the second direction on the side of the heat-conducting base plate (11) away from the heating element (2). The heat dissipation cover (3) includes a heat dissipation top plate (31) and a plurality of second fins (33). The heat dissipation top plate (31) is located on the upper side of the first fin (12). The plurality of second fins (33) are arranged at intervals along the second direction on the side of the heat dissipation top plate (31) facing the heat-conducting base (1). The second fins (33) are in contact with the first fins (12) in the second direction to form the heat exchange surface. Part of the refrigerant channel (32) extends and is embedded inside the second fin (33).

3. The heat dissipation device according to claim 2, characterized in that, The first fin (12) is perpendicular to the heat-conducting base plate (11) on one side and inclined on the other side, and the width of the first fin (12) near the heat-conducting base plate (11) in the first direction is greater than the width of the other end; The second fin (33) is perpendicular to the heat dissipation top plate (31) on one side and inclined on the other side. The width of the second fin (33) at one end near the heat dissipation top plate (31) in the first direction is greater than the width at the other end. The vertical surfaces of the first fin (12) and the second fin (33) are in contact, or their inclined surfaces are in contact.

4. The heat dissipation device according to claim 2, characterized in that, The first fin (12) is provided with a heat exchange groove (16) extending along the first direction. The heat exchange groove (16) has an opening on the side facing the heat dissipation top plate (31). The second fin (33) is inserted into the heat exchange groove (16), and the outer wall of the second fin (33) in both the first direction and the second direction is in contact with the groove wall of the heat exchange groove (16).

5. The heat dissipation device according to claim 2, characterized in that, The second fin (33) is inserted between two adjacent first fins (12). The outer wall of the second fin (33) in the second direction contacts the two adjacent first fins (12) respectively, and the outer wall of the second fin (33) in the first direction contacts the heat-conducting base plate (11).

6. The heat dissipation device according to claim 1, characterized in that, The contact surface between the heat-conducting base (1) and the heating element (2) and the heat exchange surface are coated with a heat-conducting medium.

7. The heat dissipation device according to claim 2, characterized in that, The heat-conducting base plate (11) is provided with screw holes (14) for fixing the heat-conducting base plate (11) on the support of the heating element (2) by fasteners; The heat-conducting base plate (11) is provided with a positioning plate (13) extending towards the heat dissipation top plate (31) in the first direction. The positioning plate (13) is located on both sides of the heat-conducting base plate (11), and a slot (15) is provided on the positioning plate (13). The heat dissipation top plate (31) is provided with a fixing plate (36) extending towards the heat-conducting base plate (11) in the first direction. The fixing plate (36) abuts against the positioning plate (13) in the second direction. The fixing plate (36) is provided with a hook (37), and the hook (37) engages with the slot (15) to restrict the heat dissipation top plate (31) from detaching from the heat-conducting base (1) in the first direction.

8. The heat dissipation device according to claim 7, characterized in that, The hook (37) is connected to the fixing plate (36) by a spring, which provides an elastic force for the hook (37) to move toward the slot (15).

9. The heat dissipation device according to claim 7, characterized in that, The fixing plate (36) is located on one or both sides of the heat dissipation top plate (31); When located on one side, one side of the heat dissipation top plate (31) abuts against the positioning plate (13) through the fixing plate (36), and the other side of the heat dissipation top plate (31) abuts against the positioning plate (13) through the second fin (33); When located on both sides, the heat dissipation top plate (31) abuts against the positioning plate (13) on both sides through the fixing plate (36).

10. The heat dissipation device according to claim 2, characterized in that, The heat dissipation top plate (31) is provided with a refrigerant inlet (34) and a refrigerant outlet (35) that are connected to the refrigerant channel (32). The refrigerant inlet (34) and the refrigerant outlet (35) are connected to liquid cooling pipes. And / or, it also includes a cooling fan for delivering air into the gap between adjacent first fins (12).

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