A flexible plasma cleaning device for wafer curved edge processing

Abstract

The application discloses a flexible plasma cleaning device for wafer curved surface edge treatment and relates to the technical field of wafer curved surface cleaning.The device comprises a bottom plate, a rotating part is arranged outside a suction cup, a servo motor is installed on the lower surface of the bottom plate, the output end of the servo motor is connected with the rotating part, a positioning part is installed on the upper surface of the rotating part, a water spraying part is installed in the positioning part, a bearing part is installed on the upper surface of the bottom plate, and the bearing part is in contact with the positioning part.The utility model is characterized in that a moving structure is connected with a sliding groove, when a wafer is conveyed to the suction cup by a mechanical arm, the wafer extrudes the bearing structure and separates the bearing structure from the moving structure, then the contact structure installed on the moving structure is in contact with the wafer edge, the connecting structure installed between the two contacts can keep a tangent state with the wafer edge, the cleaning liquid discharged from the water spraying groove can keep a tangent state with the wafer edge for cleaning, and damage to the wafer curved surface is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer surface cleaning technology, specifically a flexible plasma cleaning device for edge treatment of wafer surfaces. Background Technology

[0002] In the precision processes of advanced semiconductor manufacturing, the cleanliness of the wafer surface directly determines the device performance and yield. However, traditional wet cleaning methods are prone to problems such as liquid residue and damage to fragile crystal structures in nanoscale processes. Flexible plasma cleaning of wafer surfaces is a core dry cleaning technology developed to solve this problem.

[0003] In existing technologies, wafer surface cleaning is mainly carried out by spraying cleaning fluid. However, due to the curvature of the wafer edge, ordinary cleaning fluid spraying is not easy to contact and clean the wafer edge curvature. Therefore, a flexible plasma cleaning device for wafer curved edge processing is needed. Summary of the Invention

[0004] The purpose of this invention is to provide a flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a flexible plasma cleaning device for edge treatment of curved wafer surfaces, comprising a base plate, a suction cup mounted on the upper surface of the base plate, a rotating component disposed on the outer side of the suction cup, a servo motor mounted on the lower surface of the base plate, the output end of the servo motor being connected to the rotating component, a positioning component mounted on the upper surface of the rotating component, a water spray component mounted inside the positioning component, and a supporting component mounted on the upper surface of the base plate, the supporting component contacting the positioning component.

[0006] Preferably, the rotating component includes a gear, which is mounted on the output end of the servo motor. A gear ring meshes with the annular surface of the gear. The positioning component is mounted on the upper surface of the gear ring. A first bearing is mounted on the annular surface of the gear ring, and the first bearing is mounted on the upper surface of the base plate.

[0007] Preferably, the positioning element includes a positioning block, which is mounted on the upper surface of the gear ring. Two moving grooves are formed on the upper surface of the positioning block. Moving parts are slidably connected in the moving grooves. The water spraying element is installed in the two moving parts. The supporting element is in contact with the moving parts. The side of the moving part away from the first bearing is connected to the water spraying element.

[0008] Preferably, the movable component includes a movable block slidably connected within a movable groove. A first elastic element is mounted on one side of the movable block, and the end of the first elastic element away from the movable block is mounted within the movable groove. A pressure rod is mounted on the end of the movable block away from the first elastic element, and the pressure rod contacts a supporting element. A contact element is mounted on the upper surface of the movable block, and the side of the contact element away from the first bearing is connected to a water spray element. The water spray element is installed within two contact elements.

[0009] Preferably, the contact element includes a second bearing, which is mounted on the upper surface of the movable block. A rotating rod is installed inside the second bearing, and a contact roller is mounted on the annular surface of the rotating rod. A connecting member is rotatably connected between the two rotating rods, and the water spray element is installed inside the connecting member.

[0010] Preferably, the supporting member includes a supporting cylinder, which is mounted on the upper surface of the base plate. A supporting rod is inserted into the supporting cylinder. A conical ring is installed at the end of the supporting rod away from the supporting rod. The conical ring is in contact with the pressure rod. A second elastic element is installed at one end of the supporting rod inside the supporting cylinder. The end of the second elastic element away from the supporting rod is installed inside the supporting cylinder.

[0011] Preferably, the water spray component includes a water inlet ring, which is mounted on the upper surface of the base plate. A water inlet pipe is installed on the annular surface of the water inlet ring. An annular groove is formed on the inner surface of the annular water inlet ring. An annular plate is rotatably connected in the annular groove. A drain pipe is installed on the inner surface of the annular plate. The end of the drain pipe away from the water inlet ring is installed in a connector.

[0012] Preferably, the connector includes a connecting plate, which is rotatably connected to the annular surfaces of two rotating rods. An arc-shaped cylinder is installed on the side of the connecting plate facing the suction cup. The end of the drain pipe away from the annular plate passes through the connecting plate and communicates with the arc-shaped cylinder. A water spray groove is provided on the side of the arc-shaped cylinder away from the drain pipe.

[0013] Preferably, the conical ring elastically extends and retracts to press against the pressure rod through the second elastic element. When the pressure rod is disengaged from the conical ring limit, the first elastic element can drive the moving block to slide, so that the two contact rollers on both sides adaptively conform to the edge of the wafer surface, and the arc-shaped cylinder always remains tangent to the edge of the wafer as the contact rollers are positioned. Preferably, the operation method is as follows: After the robotic arm transports the wafer to the suction cup, the suction cup is activated to adsorb the wafer. As the wafer moves toward the suction cup, it squeezes the holding rod. The holding rod moves downward, causing the conical ring to move downward and separate from the pressure rod. After the pressure rod loses its support, the first elastic element releases its rebound force, causing the moving block to move toward the suction cup. The movement of the moving block toward the suction cup causes the contact structure, which is composed of a second bearing, a rotating rod, and a contact roller, mounted on the moving block to move toward the suction cup. When the contact roller contacts the edge of the wafer, the connecting structure, which is composed of a connecting plate and an arc-shaped cylinder, mounted between the two rotating rods, can always maintain a tangent state with the edge of the wafer. At this time, the cleaning fluid discharged from the water spray tank on the side of the arc-shaped cylinder can always maintain a tangent state with the edge of the wafer for cleaning.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. By opening two moving grooves on the upper surface of the positioning block and slidingly connecting a moving structure consisting of a moving block, a first elastic element, and a pressure rod within the moving grooves, and then installing a holding structure consisting of a holding cylinder, a holding rod, a conical ring, and a second elastic element on the upper surface of the base plate, when the wafer is transported to the suction cup by the robotic arm, the wafer squeezes the holding structure, and the holding structure separates from the moving structure. This facilitates the contact structure consisting of a second bearing, a rotating rod, and a contact roller installed on the moving structure. The contact structure contacts the edge of the wafer, and the two contact structures contact the edge of the wafer for positioning. At this time, the connecting structure consisting of a connecting plate and an arc-shaped cylinder installed between the two contacts can always maintain a tangent state with the edge of the wafer. At this time, the cleaning fluid discharged from the water spray tank on the side of the arc-shaped cylinder can always maintain a tangent state with the edge of the wafer for cleaning, thereby reducing damage to the curved surface of the wafer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the assembly of the positioning block and the pressure rod with the conical ring according to the present invention; Figure 3 This is an assembly diagram of the conical ring, the supporting rod, the second elastic element, and the supporting cylinder of the present invention; Figure 4 This is an assembly diagram of the gear, gear ring, and first bearing of the present invention; Figure 5 This is a schematic diagram of the assembly of the moving block and the positioning block of the present invention.

[0016] In the diagram: 1. Base plate, 2. Inlet ring, 3. First bearing, 4. Gear ring, 5. Conical ring, 6. Suction cup, 7. Positioning block, 8. Inlet pipe, 9. Drain pipe, 10. Support rod, 11. Second elastic element, 12. Support cylinder, 13. Gear, 14. Servo motor, 15. Pressure rod, 16. Moving block, 17. Second bearing, 18. Rotating rod, 19. Connecting plate, 20. Arc cylinder, 21. First elastic element, 22. Annular plate, 23. Contact roller. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1-5 This invention provides a technical solution: a flexible plasma cleaning device for edge treatment of curved wafer surfaces, comprising a base plate 1, a suction cup 6 mounted on the upper surface of the base plate 1, a servo motor 14 mounted on the lower surface of the base plate 1, a gear 13 mounted on the output end of the servo motor 14, a gear ring 4 meshing with the annular surface of the gear 13, a first bearing 3 mounted on the annular surface of the gear ring 4, the first bearing 3 being mounted on the upper surface of the base plate 1 and the annular surface of the suction cup 6, a positioning block 7 mounted on the upper surface of the gear ring 4, two moving grooves formed on the upper surface of the positioning block 7, a moving block 16 slidably connected within the moving grooves, a first elastic element 21 mounted on one side of the moving block 16, the first elastic element 21 being a spring, the first elastic element 21 being in a compressed state, and the end of the first elastic element 21 away from the moving block 16 being mounted within the moving groove.

[0019] A support cylinder 12 is installed on the upper surface of the base plate 1. A support rod 10 is inserted into the support cylinder 12. A conical ring 5 is installed at the end of the support rod 10 away from the support rod 10. A pressure rod 15 is installed at the end of the moving block 16 away from the first elastic member 21. The conical ring 5 is in contact with the pressure rod 15. A second elastic member 11 is installed at one end of the support rod 10 inside the support cylinder 12. The second elastic member 11 is a spring. The second elastic member 11 is in a normal state. The end of the second elastic member 11 away from the support rod 10 is installed inside the support cylinder 12.

[0020] A second bearing 17 is installed on the upper surface of the moving block 16. A rotating rod 18 is installed inside the second bearing 17. A contact roller 23 is installed on the annular surface of the rotating rod 18. The wafer is placed between two contact rollers 23 on both sides of the base plate 1. A connecting plate 19 is rotatably connected between the two rotating rods 18. An arc-shaped cylinder 20 is installed on the side of the connecting plate 19 facing the suction cup 6. The arc-shaped cylinder 20 is tangent to the edge of the wafer. A water inlet ring 2 is installed on the upper surface of the base plate 1. A water inlet pipe 8 is installed on the annular surface of the water inlet ring 2. The water inlet pipe 8 is used to transport cleaning fluid. An annular groove is opened on the inner surface of the annular water inlet ring 2. An annular plate 22 is rotatably connected in the annular groove. A drain pipe 9 is installed on the inner surface of the annular plate 22. The end of the drain pipe 9 away from the annular plate 22 passes through the connecting plate 19 and communicates with the arc-shaped cylinder 20.

[0021] By opening two moving grooves on the upper surface of the positioning block 7 and slidingly connecting the moving structure consisting of the moving block 16, the first elastic element 21 and the pressure rod 15 in the moving grooves, and then installing the abutting structure consisting of the abutting cylinder 12, the abutting rod 10, the conical ring 5 and the second elastic element 11 on the upper surface of the base plate 1, when the wafer is transported to the suction cup 6 by the robotic arm, the wafer squeezes the abutting structure, and the abutting structure separates from the moving structure, which facilitates the contact structure consisting of the second bearing 17, the rotating rod 18 and the contact roller 23 installed on the moving structure. The contact structure contacts the edge of the wafer, and the two contact structures contact the edge of the wafer and perform positioning. At this time, the connecting structure consisting of the connecting plate 19 and the arc cylinder 20 installed between the two contacts can always maintain a tangent state with the edge of the wafer. At this time, the cleaning liquid discharged from the water spray groove on the side of the arc cylinder 20 can always maintain a tangent state with the edge of the wafer for cleaning, thereby reducing damage to the curved surface of the wafer.

[0022] Working principle: After the robotic arm transports the wafer to the suction cup 6, the suction cup 6 is activated to adsorb the wafer. As the wafer moves toward the suction cup 6, it presses against the holding rod 10. The holding rod 10 moves downward, causing the conical ring 5 to move downward and separate from the pressure rod 15. After the pressure rod 15 loses its support, the first elastic element 21 releases its rebound force, causing the moving block 16 to move toward one side of the suction cup 6. The movement of the moving block 16 toward the suction cup 6 causes the contact structure mounted on the moving block 16, consisting of the second bearing 17, the rotating rod 18, and the contact roller 23, to move toward one side of the suction cup 6. When the contact roller 23 contacts the edge of the wafer, the connecting structure, consisting of the connecting plate 19 and the arc-shaped cylinder 20, mounted between the two rotating rods 18, can always remain tangent to the edge of the wafer. At this time, the cleaning fluid discharged from the water spray tank on the side of the arc-shaped cylinder 20 can always remain tangent to the edge of the wafer for cleaning, thereby reducing damage to the curved surface of the wafer.

[0023] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0024] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A flexible plasma cleaning device for edge treatment of curved wafer surfaces, comprising a base plate (1), characterized in that: A suction cup (6) is installed on the upper surface of the base plate (1), and a rotating component is provided on the outside of the suction cup (6). A servo motor (14) is installed on the lower surface of the base plate (1). The output end of the servo motor (14) is connected to the rotating component. A positioning component is installed on the upper surface of the rotating component. A water spray component is installed inside the positioning component. A support component is installed on the upper surface of the base plate (1). The support component is in contact with the positioning component.

2. The flexible plasma cleaning device for wafer edge treatment according to claim 1, characterized in that: The rotating component includes a gear (13), which is installed at the output end of a servo motor (14). A gear ring (4) meshes with the annular surface of the gear (13). The positioning component is installed on the upper surface of the gear ring (4). A first bearing (3) is installed on the annular surface of the gear ring (4). The first bearing (3) is installed on the upper surface of the base plate (1).

3. The flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 2, characterized in that: The positioning component includes a positioning block (7), which is installed on the upper surface of the gear ring (4). Two moving grooves are opened on the upper surface of the positioning block (7). Moving components are slidably connected in the moving grooves. The water spray component is installed in the two moving components. The abutment component is in contact with the moving components. The side of the moving component away from the first bearing (3) is connected to the water spray component.

4. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 3, characterized in that: The movable component includes a movable block (16), which is slidably connected in a movable groove. A first elastic element (21) is installed on one side of the movable block (16). The end of the first elastic element (21) away from the movable block (16) is installed in the movable groove. A pressure rod (15) is installed on the end of the movable block (16) away from the first elastic element (21). The pressure rod (15) is in contact with a retaining element. A contact element is installed on the upper surface of the movable block (16). The side of the contact element away from the first bearing (3) is connected to a water spray element. The water spray element is installed in two contact elements.

5. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 4, characterized in that: The contact element includes a second bearing (17), which is mounted on the upper surface of the moving block (16). A rotating rod (18) is installed inside the second bearing (17). A contact roller (23) is mounted on the annular surface of the rotating rod (18). A connecting member is rotatably connected between the two rotating rods (18), and the water spraying element is installed inside the connecting member.

6. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 5, characterized in that: The supporting member includes a supporting cylinder (12), which is installed on the upper surface of the base plate (1). A supporting rod (10) is inserted into the supporting cylinder (12). A conical ring (5) is installed at the end of the supporting rod (10) away from the supporting rod (10). The conical ring (5) is in contact with the pressure rod (15). A second elastic element (11) is installed at the end of the supporting rod (10) inside the supporting cylinder (12). The end of the second elastic element (11) away from the supporting rod (10) is installed inside the supporting cylinder (12).

7. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 6, characterized in that: The water spray component includes a water inlet ring (2), which is installed on the upper surface of the base plate (1). A water inlet pipe (8) is installed on the annular surface of the water inlet ring (2). An annular groove is opened on the inner surface of the annular ring (2). An annular plate (22) is rotatably connected in the annular groove. A drain pipe (9) is installed on the inner surface of the annular plate (22). The end of the drain pipe (9) away from the water inlet ring (2) is installed in the connector.

8. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 7, characterized in that: The connector includes a connecting plate (19), which is rotatably connected to the annular surface of two rotating rods (18). An arc-shaped cylinder (20) is installed on the side of the connecting plate (19) facing the suction cup (6). The end of the drain pipe (9) away from the annular plate (22) passes through the connecting plate (19) and communicates with the arc-shaped cylinder (20). A water spray groove is provided on the side of the arc-shaped cylinder (20) away from the drain pipe (9).

9. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 8, characterized in that: The conical ring (5) elastically stretches and presses against the pressure rod (15) through the second elastic element (11). When the pressure rod (15) is released from the conical ring (5) limit, the first elastic element (21) can drive the moving block (16) to slide, so that the two side contact rollers (23) adaptively fit the edge of the wafer surface, and the arc-shaped cylinder (20) is always tangent to the edge of the wafer as the contact rollers (23) are positioned.

10. A flexible plasma cleaning apparatus for edge treatment of curved wafer surfaces according to claim 9, characterized in that: The operation method is as follows: After the robotic arm transports the wafer to the suction cup (6), the suction cup (6) is activated to adsorb the wafer. While the wafer moves towards the suction cup (6), it squeezes the holding rod (10). The holding rod (10) moves downward, causing the conical ring (5) to move downward and separate from the pressure rod (15). After the pressure rod (15) loses its support, the first elastic element (21) releases its rebound force, causing the moving block (16) to move towards the suction cup (6). The moving block (16) moves towards the suction cup (6), causing the moving block (16) to move towards the suction cup (6) to move the moving block (1 ... The contact structure on the moving block (16), consisting of the second bearing (17), the rotating rod (18) and the contact roller (23), moves toward the suction cup (6). When the contact roller (23) contacts the edge of the wafer, the connecting structure between the two rotating rods (18), consisting of the connecting plate (19) and the arc-shaped cylinder (20), can always remain tangent to the edge of the wafer. At this time, the cleaning fluid discharged from the water spray tank on the side of the arc-shaped cylinder (20) can always remain tangent to the edge of the wafer for cleaning.

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