A semiconductor wafer inspection apparatus and method

Abstract

The application discloses a kind of semiconductor wafer detection equipment and detection method, it is related to semiconductor wafer detection technical field, with the advantage of realizing warped wafer rapid screening, its technical scheme main point is: including base, both sides of base are fixed with stand, two stand top are fixed with mounting plate, mounting plate has the inclined plate surface towards front side lower side, the inclined plate surface is covered with the stripe film that provides regular optical stripe, stripe film is covered with polaroid;It also includes wafer bearing assembly, wafer bearing assembly can be slidably arranged on the top of base and is located below mounting plate;Wafer bearing assembly includes multiple layers, each layer is equipped with the bearing structure for bearing wafer;Multiple layers are connected by connecting structure, so that multiple layers have the working state of sequentially unfolding in horizontal plane and folding in vertical direction.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, specifically to a semiconductor wafer inspection device and inspection method. Background Technology

[0002] In semiconductor manufacturing, wafer warpage is one of the core parameters affecting the yield of critical processes such as photolithography and bonding. Even slight warpage or deformation can lead to inaccurate pattern focusing, misalignment between layers, or insufficient bonding strength, ultimately causing device failure. Therefore, it is crucial to conduct rapid and effective warpage screening of wafers after incoming material inspection and critical process steps.

[0003] Currently, the detection of wafer warpage mainly relies on two types of equipment: one is a scanning measurement system composed of high-precision laser non-contact measuring instruments, and the other is a rapid detection method based on machine vision. Both of these detection methods require the wafer to be picked up by a robotic arm and placed on a fixed horizontal inspection platform. The flatness is judged by analyzing the image features of the entire wafer surface through a laser non-contact measuring instrument or camera above. Although the above methods provide accurate measurement data, the detection speed is slow and it is difficult to meet the needs of rapid full inspection of large batches of wafers on the production line. Summary of the Invention

[0004] In view of the above-mentioned technical deficiencies, the purpose of this invention is to provide a semiconductor wafer inspection device and inspection method, which has the advantage of realizing rapid screening of wafer warpage.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a semiconductor wafer inspection device, including a base, on both sides of the base being fixed with columns, and a mounting plate being fixed at the top of the two columns. The mounting plate has an inclined plate surface facing the lower front side, and the inclined plate surface is covered with a stripe film that provides regular optical stripes. The stripe film is covered with a polarizer. It also includes a wafer carrier assembly, which is slidably disposed above the base and below the mounting plate; The wafer carrier assembly includes multiple layers, and each layer is provided with a carrier structure for carrying the wafer; The multiple shelves are connected by a connecting structure, enabling the multiple shelves to work in a state where they unfold sequentially in the horizontal plane and retract in the vertical direction.

[0006] By adopting the above technical solution and setting an inclined plate surface covered with a striped film, rapid, in-situ screening of wafer warpage is achieved. The fixed inclined plate surface of the mounting plate, together with the striped film and polarizer covering it, constitutes a stable and interference-resistant optical inspection system. The polarizer can effectively filter out stray light and specular glare from the wafer surface, and the striped film provides clear, high-contrast regular optical stripes, making the reflected stripe distortion signal caused by wafer warpage and concavity more significant and pure, thereby improving the accuracy and reliability of rapid visual screening.

[0007] The wafer carrier assembly can slide on the base and can be deployed horizontally and retracted vertically via a connecting structure, switching between the two working states. When the carrier assembly slides under the mounting plate and deploys to a horizontal state, the wafer enters the optimal inspection posture and can be immediately optically screened. After screening, the carrier assembly can slide out and retract into a vertical cassette state, facilitating the transfer or storage of the entire batch of wafers. This eliminates the need for repeated use of robotic arms to individually pick up and place each wafer as in traditional methods, optimizing the operation process, shortening non-inspection time, and improving the overall work cycle.

[0008] Preferably, the supporting structure includes a circular hole penetrating the layer, and the edge of the circular hole is provided with at least three upwardly protruding support blocks; the support blocks are made of an elastic material, including at least one of rubber and silicone.

[0009] Preferably, the connecting structure includes an L-shaped plate fixed to the front and rear ends of the left side of the lower surface of each of the shelves. The short side of the L-shaped plate extends vertically downward and forms a first short axis. A first crossbar is fitted around a plurality of the first short axes with the same vertical cross section. The first crossbar is hinged to the connected first short axis. The connecting structure also includes a second short axis located at the front and rear ends of the right side of each of the shelves. A second crossbar is fitted around a plurality of the second short axes with the same vertical cross section. The second crossbar is hinged to the connected second short axis. A transverse connecting plate is fixed to the lower surface of the shelf located in the middle position. The two ends of the transverse connecting plate extend outward from the front and rear sides of the shelf and pass through the gap between the first crossbar and the second crossbar on the corresponding side. Support frames are fixed to the two ends of the transverse connecting plate.

[0010] Preferably, the base is provided with a moving component that drives the support frame to move along the length direction of the base.

[0011] Preferably, the movable component includes a lead screw disposed within a base, both ends of which are fixed to the groove wall of the base. A movable block adapted to the lead screw is sleeved on the lead screw. A motor for driving the lead screw to rotate is fixed on the base. The support frame is detachably fixed to the movable block. A guide rod located outside the lead screw is also fixed on the base. A sliding block slidably connected to the guide rod is sleeved on the guide rod. The sliding block is fixed to the movable block.

[0012] Preferably, the support frame is provided with a control component for controlling the rotation of the second crossbar to drive multiple shelves to change their working state.

[0013] Preferably, the control component includes a connecting pipe fixed to a support frame, one end of which has an installation port and the other end has a guide port; a connecting column rotatably connected to the installation port is fitted with the installation port, one end of the connecting column extends out of the connecting pipe through the installation port, and a swing rod is fixed to the end of the connecting column extending out of the connecting pipe, the swing rod being fixed at the middle position of the second crossbar; a guide groove is formed on the surface of the connecting column, a guide pin is slidably connected in the guide groove, the guide pin extends out of the guide groove, a short rod is fixed to the part of the guide pin extending out of the guide groove, a pressing block is fixed to the end of the short rod away from the guide pin, the front end of the pressing block extends out of the guide port into the connecting pipe, the pressing block and the connecting pipe are slidably connected by a slide rail, and the pressing block and the connecting column are connected by a spring.

[0014] Preferably, a vertical limiting rod is fixed to the portion of the pressing block extending out of the connecting tube; the column is provided with a limiting component that cooperates with the limiting rod to control the movement of the pressing block.

[0015] Preferably, the limiting component includes a mounting beam that spans and is fixedly connected between two columns; a sleeve is provided on the mounting beam corresponding to the movement path of the limiting rod, the bottom end of the sleeve has an opening, a downwardly extending push rod is slidably connected inside the sleeve, the top end of the push rod is connected to the top of the inner cavity groove of the sleeve through an elastic connection structure, the bottom end of the push rod passes through the opening at the bottom end of the sleeve, and the bottom end of the push rod is arc-shaped.

[0016] The present invention also provides a semiconductor wafer inspection method, which uses a semiconductor wafer inspection device and includes the following steps: Step 1, Wafer Carrier Assembly: The robotic arm grasps the wafer carrier assembly and places and fixes it on the moving block. At this time, the multiple layers of the wafer carrier assembly are in a vertically retracted working state. Step 2, Triggering State Transition: The wafer carrier assembly moves forward with the moving block, and the limiting rod contacts the push rod, causing the multiple layers of the wafer carrier assembly to switch to a working state in which they unfold sequentially in the horizontal plane; Step 3: Transfer to the inspection station: The wafer carrier assembly on the moving block is moved to the inspection position directly below the inclined surface of the mounting plate; Step 4: Perform optical screening: Prepare a camera and, at the inspection position, use the camera to capture the stripe image reflected from the stripe film on the tilted surface of the mounting plate. The staff will then determine whether the wafer warpage is acceptable based on whether there is distortion in the stripe image. Step 5, Removal and Reset: The robot removes the defective wafer, the wafer carrier assembly moves backward, and when the limit rod contacts the push rod again, the multiple layers of the wafer carrier assembly switch to a vertically retracted working state. Step 6, Unloading and Cycling: The entire wafer carrier assembly is removed by a robotic arm and replaced with the next wafer carrier assembly to be tested. Steps 1 to 5 are repeated.

[0017] The beneficial effects of this invention are as follows: by setting an inclined plate surface covered with a striped film, rapid and in-situ screening of wafer warpage is achieved. The fixed inclined plate surface of the mounting plate, together with the striped film and polarizer covering it, constitute a stable and interference-resistant optical detection system. The polarizer can effectively filter out stray light and specular glare from the wafer surface, and the striped film provides clear, high-contrast regular optical stripes, making the reflected stripe distortion signal caused by wafer warpage and concavity more significant and pure, thereby improving the accuracy and reliability of rapid visual screening. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this embodiment; Figure 2 This is a schematic diagram of the overall rear view of this embodiment; Figure 3 This is a schematic diagram illustrating the structure of the shelf in this embodiment; Figure 4 This embodiment Figure 1 Enlarged structural diagram at point A; Figure 5 This embodiment Figure 3 Enlarged structural diagram at point B; Figure 6 This is a structural schematic diagram illustrating the horizontal connecting plate in this embodiment; Figure 7 This is a schematic diagram illustrating the structure of the pendulum rod in this embodiment; Figure 8 This is a schematic diagram illustrating the structure of the guide groove in this embodiment.

[0020] Explanation of reference numerals in the attached figures: In the diagram: 1. Base; 2. Column; 3. Mounting plate; 4. Shelf; 5. Circular hole; 6. L-shaped plate; 7. First short shaft; 8. First crossbar; 9. Second short shaft; 10. Second crossbar; 11. Horizontal connecting plate; 12. Support frame; 13. Moving block; 14. Guide rod; 15. Connecting pipe; 16. Guide port; 17. Connecting column; 18. Swing rod; 19. Guide groove; 20. Guide pin; 21. Short rod; 22. Pressing block; 23. Spring; 24. Limiting rod; 25. Mounting beam; 26. Push rod. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] A semiconductor wafer inspection device, such as Figures 1-8 It includes a base 1, with columns 2 fixed on both sides of the base 1, and a mounting plate 3 fixed to the top of the two columns 2. The mounting plate 3 has an inclined plate surface facing the front and downward, and a stripe film that provides regular optical stripes is covered on the inclined plate surface. A polarizing film is covered on the outside of the stripe film. It also includes a wafer carrier assembly, which is slidably disposed above the base 1 and below the mounting plate 3; The wafer carrier assembly includes multiple layers 4, and each layer 4 is provided with a carrier structure for carrying the wafer; Multiple shelves 4 are connected by a connecting structure, enabling the multiple shelves 4 to unfold sequentially in the horizontal plane and retract in the vertical direction.

[0023] In the above design, by setting an inclined plate surface covered with a striped film, rapid, in-situ screening of wafer warpage is achieved. The fixed inclined plate surface of the mounting plate 3, together with the striped film and polarizer covering it, constitutes a stable and interference-resistant optical inspection system. The polarizer can effectively filter out stray light and specular glare from the wafer surface, and the striped film provides clear, high-contrast regular optical stripes, making the reflection stripe distortion signal caused by wafer warpage and concavity more significant and pure, thereby improving the accuracy and reliability of rapid visual screening.

[0024] The wafer carrier assembly can slide on the base 1 and can be unfolded in the horizontal plane and retracted in the vertical direction through the connecting structure. It can switch between the two working states. When the carrier assembly slides to the bottom of the mounting plate 3 and unfolds into a horizontal state, the wafer enters the optimal inspection posture and can be immediately optically screened. After screening, the carrier assembly can slide out and retract into a vertical cassette state, which facilitates the transfer or storage of the entire batch of wafers. It eliminates the need for repeated use of robotic arms to pick up and put in each wafer individually in the traditional method, optimizes the operation process, shortens non-inspection time, and improves the overall operation cycle.

[0025] like Figure 4 and Figure 6 The supporting structure includes a circular hole 5 penetrating the layer 4, and at least three upwardly protruding support blocks are provided on the edge of the circular hole 5. The support blocks are made of an elastic material, including at least one of rubber and silicone. By setting the support blocks made of elastic material, a buffer can be provided when supporting the wafer, absorbing minor impacts and vibrations from the layer 4 or during placement, and avoiding scratches, stress concentration or microcracks on the back of the wafer that may be caused by rigid supports.

[0026] like Figure 4 and Figure 6 The connecting structure includes an L-shaped plate 6 fixed to the front and rear ends of the left side of the lower surface of each layer plate 4. The short side of the L-shaped plate 6 extends vertically downward and forms a first short shaft 7. Multiple first short shafts 7 with the same vertical cross section are fitted with first crossbars 8. The first crossbars 8 are hinged to the connected first short shafts 7. The connecting structure also includes a second short shaft 9 located at the front and rear ends of the right side of each layer plate 4. Multiple second short shafts 9 with the same vertical cross section are fitted with second crossbars 10. The second crossbars 10 are hinged to the connected second short shafts 9. A transverse connecting plate 11 is fixed to the lower surface of the layer plate 4 located in the middle position. The two ends of the transverse connecting plate 11 extend outward from the front and rear sides of the layer plate 4 and pass through the gap between the first crossbar 8 and the second crossbar 10 on the corresponding side. Support frames 12 are fixed to the two ends of the transverse connecting plate 11.

[0027] The first short axis 7, the first crossbar 8, the second short axis 9, and the second crossbar 10 work together to form a parallel four-bar linkage. When a thrust is applied to the first crossbar 8 or the second crossbar 10, the first crossbar 8 and the second crossbar 10 can rotate around the first short axis 7 and the second short axis 9 respectively, thereby ensuring that all the shelves 4 go from a vertically folded state to a horizontally unfolded state or vice versa.

[0028] The base 1 is provided with a moving component that drives the support frame 12 to move along the length of the base 1.

[0029] like Figure 1 and Figure 2 and Figure 3The movable component includes a lead screw installed in the base 1, with both ends of the lead screw fixed to the groove wall of the base 1. A movable block 13 adapted to the lead screw is installed on the outer sleeve of the lead screw. A motor that drives the lead screw to rotate is fixed on the base 1. A support frame 12 is detachably fixed on the movable block 13. A guide rod 14 located outside the lead screw is also fixed on the base 1. A sliding block that is slidably connected to the guide rod 14 is installed on the outer sleeve of the guide rod 14. The sliding block is fixed to the movable block 13.

[0030] Power is provided by a motor, which drives a lead screw fixed coaxially with the motor output shaft to rotate. The rotation of the lead screw will drive the moving block 13, which is threadedly connected to the lead screw, to move. The guide rod 14 and the sliding block play a guiding and limiting role in the movement of the moving block 13.

[0031] The support frame 12 is equipped with a control component that controls the rotation of the second crossbar 10 to drive the multiple shelves 4 to change their working state.

[0032] The control assembly includes a connecting pipe 15 fixed to the support frame 12. One end of the connecting pipe 15 has an installation port, and the other end has a guide port 16. A connecting column 17 rotatably connected to the installation port is fitted to the installation port. One end of the connecting column 17 extends out of the connecting pipe 15 through the installation port. A rocker arm 18 is fixed to the end of the connecting column 17 extending out of the connecting pipe 15. The rocker arm 18 is fixed to the middle position of the second crossbar 10. A guide groove 19 is opened on the surface of the connecting column 17. A guide pin 20 is slidably connected in the guide groove 19. The guide pin 20 extends out of the guide groove 19. A short rod 21 is fixed to the part of the guide pin 20 extending out of the guide groove 19. A pressing block 22 is fixed to the end of the short rod 21 away from the guide pin 20. The front end of the pressing block 22 extends out of the connecting pipe 15 through the guide port 16. The pressing block 22 and the connecting pipe 15 are slidably connected by a slide rail. The pressing block 22 and the connecting column 17 are connected by a spring 23.

[0033] When the pressing block 22 moves along the guide opening under the action of external driving force, the short rod 21 and guide pin 20 fixed to the pressing block 22 move axially and overcome the elastic force of the spring 23. At the same time, the guide pin 20 moves in the guide groove 19. Through the guide groove 19, the connecting column 17 and the swing rod 18 of the integrated structure are rotated. When the pressing block 22 is released, the spring 23 rebounds and drives the pressing block 22 to move in the opposite direction.

[0034] The guide groove 19 includes a first spiral segment and a second spiral segment symmetrically arranged on the outer circumference of the connecting column 17 and extending in opposite directions, as well as an axial straight groove segment connecting the two ends of the first spiral segment and the second spiral segment respectively.

[0035] When the pressing block 22 moves axially, the guide pin 20 enters the end of the first spiral section or the second spiral section from the axial straight groove section. When the drive shaft moves in the opposite direction driven by the reset elastic element, the guide pin 20 enters the axial straight groove section and slides along the axial straight groove section.

[0036] like Figure 5 A vertical limiting rod 24 is fixed to the part of the pressing block 22 that extends out of the connecting tube 15; the column 2 is provided with a limiting component that cooperates with the limiting rod 24 to control the movement of the pressing block 22.

[0037] like Figure 5 The limiting component includes an installation beam 25 that spans and is fixedly connected between two columns 2; a sleeve is provided on the installation beam 25 corresponding to the movement path of the limiting rod 24, the bottom end of the sleeve has an opening, a downwardly extending push rod 26 is slidably connected inside the sleeve, the top end of the push rod 26 is connected to the top of the inner cavity groove of the sleeve through an elastic connection structure, the bottom end of the push rod 26 passes through the opening at the bottom end of the sleeve, and the bottom end of the push rod 26 is arc-shaped.

[0038] When the wafer carrier assembly moves forward, the limiting rod 24 contacts the bottom arc surface of the push rod 26 and continues to move. The push rod 26 remains relatively fixed in position, and its arc surface squeezes and pushes the limiting rod 24 to move in the opposite direction along the moving direction of the wafer carrier assembly. This forces the pressing block 22, guide pin 20 and swing rod 18 to move, thereby driving the second crossbar 10 to rotate and realize the change of working state of the layer 4. When the pressing block 22 moves with the wafer carrier assembly to contact the connecting post 17, the push rod 26 overcomes the elastic force of the elastic connection structure and moves upward and retracts into the sleeve, so that the limiting rod 24 passes over the push rod 26 and no longer hinders the continued movement of the limiting rod 24 and the wafer carrier assembly. When the limiting rod 24 moves with the wafer carrier assembly to disengage from the arc surface of the push rod 26, the push rod 26 remains in a downward extended preparatory state under the action of the elastic connection structure.

[0039] A semiconductor wafer inspection method, employing semiconductor wafer inspection equipment, includes the following steps: Step 1, Wafer Carrier Assembly: The robotic arm grasps the wafer carrier assembly and places and fixes it on the moving block 13. At this time, the multiple layers 4 of the wafer carrier assembly are in a vertically retracted working state. Step 2, Triggering state change: The wafer carrier assembly moves forward with the moving block 13, and the limiting rod 24 contacts the push rod 26, so that the multiple layers 4 of the wafer carrier assembly are converted into a working state in which they are sequentially unfolded in the horizontal plane. Step 3: Transfer to the inspection station: The wafer carrier assembly on the moving block 13 is moved to the inspection position directly below the inclined surface of the mounting plate 3; Step 4: Perform optical screening: Prepare a camera and, at the detection position, use the camera to capture the stripe image reflected from the stripe film on the inclined surface of the mounting plate 3. The staff will then determine whether the wafer warpage is acceptable based on whether there is distortion in the stripe image. Step 5, Removal and Reset: The robot removes the defective wafer, the wafer carrier assembly moves backward, and when the limit rod 24 contacts the push rod 26 again, the multiple layers 4 of the wafer carrier assembly are converted to a vertically retracted working state. Step 6, Unloading and Cycling: The entire wafer carrier assembly is removed by a robotic arm and replaced with the next wafer carrier assembly to be tested. Steps 1 to 5 are repeated.

[0040] When in use, the robotic arm grabs a wafer carrier assembly that has been loaded with multiple wafers from the loading area. At this time, the multiple layers 4 of the wafer carrier assembly are in a vertically retracted working state, forming a cassette structure similar to a standard wafer pod FOUP. All wafers are safely stored in their respective layer 4 slots. The movable block 13 is provided with a slot that matches the support frame 12. The robot arm places the support frame 12 of the wafer carrier assembly into the slot of the movable block 13, so that the support frame 12 and the movable block 13 are fixed by the slot, and the loading is completed. Turn on the motor, and the motor provides power to drive the lead screw, which is fixed coaxially with the motor output shaft, to rotate. The rotation of the lead screw will drive the moving block 13, which is threadedly connected to the lead screw, to move forward. When the limiting rod 24 contacts the bottom arc surface of the push rod 26, the push rod 26 remains relatively fixed in position. Its arc surface squeezes and pushes the limiting rod 24 to move in the opposite direction along the wafer carrier assembly movement direction, thereby forcing the pressing block 22 to move backward. The movement control of the pressing block 22 is related to the axial movement of the short rod 21 and guide pin 20 fixed to the pressing block 22 and overcomes the elastic force of the spring 23. The guide pin 20 moves in the guide groove 19. Through the guide groove 19, it drives the integrated structure connecting column 17 and swing rod 18 to rotate. The rotation of the swing rod 18 drives the second crossbar 10 to rotate, thereby causing the first crossbar 8 to rotate, so that the multiple layers 4 are converted into a working state in which they are unfolded sequentially in the horizontal plane, forming a stable, coplanar detection platform. The wafer carrier assembly continues to move forward to the detection position, located directly below the inclined surface of the mounting plate 3. An industrial camera is prepared to capture the regular stripe pattern reflected from the inclined mounting plate 3 above each wafer surface. The mounting plate 3 is also equipped with a monochromatic light source facing the wafer surface. Due to the polarizer and monochromatic light source on the mounting plate 3, the reflected image has high contrast and is not affected by stray light. If the wafer is flat, the stripes will appear as regular straight lines or curves. If there is warping or depression, the stripes in that area will show local distortion, breakage, or abrupt changes in spacing. The robot quickly identifies defective wafers and transfers them to the re-inspection area. Then, the motor reverses the lead screw, and the moving block 13, carrying the wafer carrier assembly, returns backward. At a specific position on the return path, the limit rod 24 contacts the push rod 26 again, causing the multiple layers 4 of the wafer carrier assembly to automatically and synchronously retract, returning to the vertical cassette state. The robot then moves the wafer carrier assembly carrying the qualified wafers to the next process. Another robot then grabs the next loaded wafer carrier assembly and places it on the now-empty moving block 13, starting a new cycle.

[0041] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A semiconductor wafer inspection device, characterized in that, Includes a base (1), on both sides of the base (1) are fixed columns (2), and the top of the two columns (2) are fixed with mounting plates (3). The mounting plates (3) have inclined surfaces facing downwards and forwards. The inclined surfaces are covered with stripe film that provides regular optical stripes, and the stripe film is covered with a polarizing film. It also includes a wafer carrier assembly, which is slidably disposed above the base (1) and below the mounting plate (3); The wafer carrier assembly includes multiple layers (4), and each layer (4) is provided with a carrier structure for carrying the wafer; Multiple layers (4) are connected by a connecting structure, so that multiple layers (4) can be in a working state of unfolding in the horizontal plane and shrinking in the vertical direction.

2. The semiconductor wafer inspection equipment as described in claim 1, characterized in that, The supporting structure includes a circular hole (5) penetrating the layer (4), and the edge of the circular hole (5) is provided with at least three upwardly protruding support blocks; The support block is made of an elastic material, including at least one of rubber and silicone.

3. The semiconductor wafer inspection equipment as described in claim 1, characterized in that, The connection structure includes an L-shaped plate (6) fixed to the front and rear ends of the left side of the lower surface of each of the layers (4). The short side of the L-shaped plate (6) extends vertically downward and forms a first short shaft (7). A first crossbar (8) is sleeved on a plurality of the first short shafts (7) with the same vertical cross section. The first crossbar (8) is hinged to the connected first short shaft (7). The connection structure also includes a second short shaft (9) located at the front and rear ends of the right side of each of the layers (4). A second crossbar (10) is provided on the multiple second short shafts (9) with the same vertical cross section. The second crossbar (10) is hinged to the connected second short shaft (9). A transverse connecting plate (11) is fixed on the lower surface of the shelf (4) located in the middle position. The two ends of the transverse connecting plate (11) extend outward from the front and rear sides of the shelf (4) and pass through the gap between the first crossbar (8) and the second crossbar (10) on the corresponding side. Support frames (12) are fixed at both ends of the transverse connecting plate (11).

4. The semiconductor wafer inspection equipment as described in claim 1, characterized in that, The base (1) is provided with a moving component that drives the support frame (12) to move along the length of the base (1).

5. The semiconductor wafer inspection equipment as described in claim 4, characterized in that, The moving component includes a lead screw disposed in the base (1), both ends of which are fixed to the groove wall of the base (1), and a moving block (13) adapted to the lead screw is provided on the outer sleeve of the lead screw. A motor for driving the lead screw to rotate is fixed on the base (1), and the support frame (12) is detachably fixed on the moving block (13). The base (1) is also fixed with a guide rod (14) located outside the lead screw. The guide rod (14) is fitted with a sliding block that is slidably connected to the guide rod (14). The sliding block is fixed to the moving block (13).

6. The semiconductor wafer inspection equipment as described in claim 3, characterized in that, The support frame (12) is equipped with a control component that controls the rotation of the second crossbar (10) to drive multiple shelves (4) to change their working state.

7. A semiconductor wafer inspection device as described in claim 6, characterized in that, The control component includes a connecting pipe (15) fixed on the support frame (12), with an installation port at one end and a guide port (16) at the other end. The mounting port is equipped with a connecting column (17) that is rotatably connected to the mounting port. One end of the connecting column (17) extends out of the mounting port through a connecting pipe (15). A swing rod (18) is fixed at one end of the connecting column (17) extending out of the connecting pipe (15). The swing rod (18) is fixed at the middle position of the second crossbar (10). The surface of the connecting post (17) is provided with a guide groove (19), and a guide pin (20) is slidably connected in the guide groove (19). The guide pin (20) extends out of the guide groove (19), and a short rod (21) is fixed to the part of the guide pin (20) that extends out of the guide groove (19). A pressing block (22) is fixed to the end of the short rod (21) away from the guide pin (20). The front end of the pressing block (22) extends out of the connecting tube (15) through the guide port (16). The pressing block (22) and the connecting tube (15) are slidably connected by a slide rail. The pressing block (22) and the connecting post (17) are connected by a spring (23).

8. A semiconductor wafer inspection device as described in claim 7, characterized in that, A vertical limiting rod (24) is fixed to the part of the pressing block (22) that extends out of the connecting tube (15). The column (2) is provided with a limiting component that works in conjunction with the limiting rod (24) to control the movement of the pressing block (22).

9. A semiconductor wafer inspection device as described in claim 8, characterized in that, The limiting component includes a mounting beam (25) that spans and is fixedly connected between the two columns (2); The mounting beam (25) is provided with a sleeve corresponding to the movement path of the limiting rod (24). The bottom end of the sleeve has an opening. A downwardly extending push rod (26) is slidably connected inside the sleeve. The top end of the push rod (26) is connected to the top of the inner cavity groove of the sleeve through an elastic connection structure. The bottom end of the push rod (26) passes through the opening at the bottom end of the sleeve and is arc-shaped.

10. A method for inspecting semiconductor wafers, characterized in that, The semiconductor wafer inspection equipment according to claims 1 to 9 includes the following steps: Step 1, Wafer carrier assembly: The robotic arm grasps the wafer carrier assembly and places and fixes it on the moving block (13). At this time, the multiple layers (4) of the wafer carrier assembly are in a vertically retracted working state. Step 2, Triggering state change: The wafer carrier assembly moves forward with the moving block (13), and the limiting rod (24) contacts the push rod (26), so that the multiple layers (4) of the wafer carrier assembly are converted into a working state in which they are unfolded sequentially in the horizontal plane; Step 3: Transfer to the testing station: The wafer carrier assembly on the moving block (13) is moved to the testing position directly below the inclined surface of the mounting plate (3); Step 4: Perform optical screening: Prepare a camera and, at the detection position, use the camera to capture the stripe image reflected from the stripe film on the inclined surface of the mounting plate (3) of the wafer. The staff will judge whether the wafer warpage is qualified based on whether there is distortion in the stripe image. Step 5, removal and reset: The robot removes the defective wafer, the wafer carrier assembly moves backward, and when the limit rod (24) contacts the push rod (26) again, the multiple layers (4) of the wafer carrier assembly are converted to a vertically retracted working state; Step 6, Unloading and Cycling: The entire wafer carrier assembly is removed by a robotic arm and replaced with the next wafer carrier assembly to be tested. Steps 1 to 5 are repeated.

Images