Chip adsorption tool

Abstract

Provided is a chip suction tool (1) that ensures holding force when picking up a semiconductor chip (C) that is thin and large in thickness, and does not apply stress that causes damage to the semiconductor chip (C). Specifically, provided is a chip suction tool (1) that includes a collet (30) having a flat portion (33) that closely adheres to a semiconductor chip (C), and a holder (20) that holds the collet (30), the holder (20) having a protruding portion (20) and a side wall (23) on a surface that holds the collet (30), a through-hole (21) that communicates with the suction hole (31) being provided in the protruding portion (20), the side wall (23) closely adhering to the periphery of the collet (30), and the collet (30) being formed with a recess (32) that fits with the protruding portion (20) of the holder (20).

Description

Technical Field

[0001] This invention relates to a chip adsorption tool used when picking up semiconductor chips. Background Technology

[0002] When picking up a semiconductor chip obtained by monolithizing a wafer that is attached to a dicing tape, the semiconductor chip is lifted from the back side of the dicing tape with a needle and held by a chip adsorption tool (e.g., Patent Document 1). The chip adsorption tool used at this time is usually a metal holder with a chuck fixed on it, and the chuck is made of an elastomer with a chip adsorption surface formed thereon.

[0003] Figure 11 This illustrates a representative example of such a chip adsorption tool. Figure 11 (a) is a view taken from the chip mounting surface on the side where the semiconductor chip is held. Figure 11 (b) is Figure 11 A sectional view of the AA line portion of (a). Figure 11 The chip adsorption tool 1000 will Figure 12 The clamp 3 shown is fixed to Figure 13 The retainer 2000 is shown here. Figure 12 (a) is a view taken from the chip's adsorption side. Figure 12 (b) is Figure 12 (a) is a cross-sectional view of the portion along line AA. Additionally, Figure 13 (a) is a view taken from the side where the clamp is held. Figure 13 (b) is Figure 13 A sectional view of the AA line portion of (a). Furthermore, in Figure 13 In order to distinguish between the main body 20 of the retainer and the protrusion 22, different filling patterns are depicted for convenience, but they do not have to be made of other materials. They are generally molded from the same material in one piece.

[0004] exist Figure 11 In the chip adsorption tool 1000 shown, the protrusion 220 of the holder 2000 is embedded into the recess 32 of the chuck 3. Here, by making Figure 12 The recess 32 shown is smaller than Figure 13 The protrusion 220 shown is slightly smaller. When inserted, the elasticity of the clamp 3 makes the inner surface of the recess 32 fit tightly against the outer periphery of the protrusion 220, and the clamp 3 is fixed to the retainer 2000.

[0005] In addition, such as Figure 11 As shown, with the chuck 3 fixed to the retainer 2000, the through hole 21, which is provided in a manner that passes through the protrusion 220 and the retainer body 20, is connected to the suction hole 31 of the chuck 3.

[0006] However, in Figure 12 In the chuck 3 shown, for simplicity, only the adsorption hole 31 exists on the flat surface 33, but most often a large groove is used for adsorbing the semiconductor chip C. As an example, in Figure 14 The image shows a chuck 300 with a slot along its diagonal. Here, Figure 14 (a) is a diagram showing the chuck 300 as viewed from the chip adsorption surface side. Figure 14 (b) is Figure 14 (a) is a cross-sectional view of the portion along line AA. From now on, when describing chuck 3, chucks with slots, such as chuck 300, will also be considered.

[0007] exist Figure 11 In the chip adsorption tool 1000 shown, as described above, the adsorption hole 31 is connected to the through hole 21, and the outer periphery of the protrusion 32 is sealed by an elastomer. Therefore, by connecting the through hole 21 to a pressure reduction system, a semiconductor chip that is tightly attached to the flat portion 33 can be attracted. Therefore, it is possible to achieve the following: Figure 15 That is, the semiconductor chip C is held in place by adsorption. That is, the semiconductor chip C that has been lifted up can be received from the dicing plate.

[0008] However, as mentioned above, since the size (design size) of the recess 32 is smaller than that of the protrusion 220, it is difficult to securely embed it. Therefore, as Figure 16 As shown in (a), it sometimes becomes an incompletely embedded state. To attach the semiconductor chip C in such a state, then as... Figure 16 As shown in (b), the cross-section is boat-shaped, meaning that a depression is formed near the adsorption hole 31 in the flat portion 33. As a result, due to the stress applied to the adsorbed and held semiconductor chip C, deformation and cracking may occur even in the case of a thin semiconductor chip. In addition, sometimes even without cracking or cracking, the function of the semiconductor device may be impaired.

[0009] On the other hand, as a chip adsorption tool for adsorbing and retaining thin semiconductor chips, there are known... Figure 17 The structure shown (Patent Document 2). Figure 17 The chip adsorption tool 1001 is used to... Figure 18 The chuck 3001 shown is embedded Figure 19 The retainer 2001 shown is constructed between the side walls 23, and the design dimensions of the clamps 3001 lx and ly are slightly larger than those of the retainer 2001 Lx and ly, so that they are fixed by elastic force.

[0010] exist Figure 17 In the case of chip adsorption tool 1001, the cross-section will not be as... Figure 16 As shown in (b), it is deformed into a boat shape, which can maintain the shape without deformation even for thin semiconductor chips.

[0011] Existing technical documents

[0012] Patent documents

[0013] Patent Document 1: Japanese Patent Application Publication No. 2017-130499

[0014] Patent Document 2: Japanese Patent Application Publication No. 2006-161588 Summary of the Invention

[0015] The problem that the invention aims to solve

[0016] Recently, in the miniaturization of electronic devices, there has been a trend towards incorporating more functions into a single semiconductor chip to achieve overall miniaturization. Consequently, the size of semiconductor chips is also increasing. On the other hand, there is a trend towards thinner chips.

[0017] Therefore, chip mounting tools must be compatible with thin and large semiconductor chips. Here, Figure 11 The chip adsorption tool shown is not suitable for thin semiconductor chips. Due to leakage, the use of... Figure 17 The chip pick-up tool shown attempted to pick up thin and large semiconductor chips, but there were numerous instances where it failed to pick up and hold them, especially when picking up from diced tape. That is, it is evident that there is insufficient attraction to hold large semiconductor chips.

[0018] Therefore, by exploring the reasons, it can be seen that, for example Figure 20 As shown, a tiny gap is generated on the surface where the chuck 3001 and the chip adsorption tool 2001 are in close contact. Due to the tiny leakage (leaking LW0 and LW1 becoming flowing into OM0), it is impossible to sufficiently depressurize the adsorption hole 31, and it is impossible to ensure that the attraction of the large semiconductor chip C can be maintained.

[0019] The present invention was made in view of the above-mentioned problems, and provides a chip adsorption tool that can ensure holding force when picking up thin and large semiconductor chips without applying stress that would damage the semiconductor chips.

[0020] Methods for solving problems

[0021] To address the aforementioned issues, the invention described in technical solution 1 is a chip adsorption tool for adsorbing and holding semiconductor chips, wherein the chip adsorption tool has: A chuck having a flat portion that fits tightly against the semiconductor chip, and an adsorption hole provided within the flat portion; and A retainer that holds the chuck. The retainer has a protrusion and a sidewall on the surface that holds the chuck. The protrusion has a through hole that communicates with the adsorption hole. The sidewall fits tightly around the chuck. The chuck has a recess that fits into the protrusion of the retainer.

[0022] The invention described in technical solution 2 is a chip adsorption tool. According to the chip adsorption tool described in technical solution 1, wherein... The outer periphery of the protrusion of the retainer and the inner periphery of the recess of the clamp do not fit tightly together, resulting in a gap.

[0023] The invention described in technical solution 3 is a chip adsorption tool. According to the chip adsorption tool described in technical solution 1, wherein... A groove is formed along the inner circumference of the sidewall on the surface of the retainer that holds the chuck.

[0024] The invention described in technical solution 4 is a chip adsorption tool, wherein, according to any one of technical solutions 1 to 3, the chip adsorption tool, The sidewalls of the retainer surround the entire circumference of the clamp.

[0025] The invention described in technical solution 5 is a chip adsorption tool, wherein, according to any one of technical solutions 1 to 3, the chip adsorption tool, The sidewall of the retainer is broken at multiple locations.

[0026] The invention described in technical solution 6 is a chip adsorption tool, wherein, according to the chip adsorption tool described in technical solution 4, The component forming the retainer has higher rigidity than the chuck.

[0027] The invention described in technical solution 7 is a chip adsorption tool, wherein, according to the chip adsorption tool described in technical solution 5, The component forming the retainer has higher rigidity than the chuck.

[0028] The invention described in technical solution 8 is a chip adsorption tool, wherein, according to the chip adsorption tool described in technical solution 7, The surface of the clamp that is in close contact with the retainer is rectangular in shape. The sidewalls of the chip adsorption tool are broken at the four corners of the rectangle.

[0029] The invention described in technical solution 9 is a chip adsorption tool, wherein, according to the chip adsorption tool described in technical solution 8, The rigidity settings of the opposing sidewalls differ.

[0030] Invention Effects

[0031] According to the present invention, it is possible to pick up thin and large semiconductor chips without applying stress that would damage the semiconductor chip while ensuring holding force. Attached Figure Description

[0032] Figure 1 These are diagrams of the chip adsorption tool according to Embodiment 1 of the present invention. (a) is a view viewed from the chip adsorption surface side, and (b) is a cross-sectional view.

[0033] Figure 2 The diagram shows the chuck that constitutes the chip adsorption tool according to Embodiment 1 of the present invention. (a) is a view viewed from the chip adsorption surface side, and (b) is a cross-sectional view.

[0034] Figure 3 The figures are of the holder constituting the chip adsorption tool of Embodiment 1 of the present invention, (a) being a view from one side of the holding clamp, and (b) being a cross-sectional view.

[0035] Figure 4 These are diagrams of a chip adsorption tool according to a variation of Embodiment 1 of the present invention. (a) is a view taken from the chip adsorption surface side, and (b) is a cross-sectional view.

[0036] Figure 5 The figures are of the holder of the chip adsorption tool constituting the modified example 2 of embodiment 1 of the present invention. (a) is a view viewed from the side of the holding chuck, and (b) is a cross-sectional view.

[0037] Figure 6 These are diagrams of a chip adsorption tool according to a variation of Embodiment 1 of the present invention, (a) being a view from the chip adsorption surface side and (b) being a cross-sectional view.

[0038] Figure 7 The figures are of the holder constituting the chip adsorption tool of Embodiment 2 of the present invention. (a) is a view viewed from one side of the holding clamp, and (b) is a cross-sectional view.

[0039] Figure 8 These are diagrams of the chip adsorption tool according to Embodiment 2 of the present invention. (a) is a view viewed from the chip adsorption surface side, and (b) is a cross-sectional view.

[0040] Figure 9 The figures are of a holder for a chip adsorption tool constituting a modified example of Embodiment 2 of the present invention. (a) is a view viewed from one side of the holder clamp, and (b) is a cross-sectional view.

[0041] Figure 10 These are diagrams of a chip adsorption tool according to a modified embodiment 2 of the present invention. (a) is a view viewed from the chip adsorption surface side, and (b) is a cross-sectional view.

[0042] Figure 11This is an example of an existing chip adsorption tool. (a) is a view from the chip adsorption side, and (b) is a cross-sectional view.

[0043] Figure 12 The diagrams are of the chucks that make up the existing chip adsorption tool. (a) is a view from the chip adsorption side, and (b) is a cross-sectional view.

[0044] Figure 13 Here is an example of a holder that constitutes an existing chip adsorption tool. (a) is a view taken from one side of the holding chuck, and (b) is a cross-sectional view.

[0045] Figure 14 Here is an example of a slot provided on the chip adsorption surface of the chuck. (a) is a view viewed from the chip adsorption surface side, and (b) is a cross-sectional view.

[0046] Figure 15 This diagram illustrates an example of an existing chip-adhesion tool for maintaining the state of a semiconductor chip.

[0047] Figure 16 Here is an example of an existing chip adsorption tool. (a) is a diagram showing the state in which the holder and the chuck are not sufficiently embedded, and (b) is a diagram showing the adsorption of a semiconductor chip in this state.

[0048] Figure 17 The following are diagrams of a chuck that constitutes another example of an existing chip adsorption tool: (a) is a view from the chip adsorption side, and (b) is a cross-sectional view.

[0049] Figure 18 The following are diagrams of a holder that constitutes another example of an existing chip adsorption tool: (a) is a view taken from one side of the holding chuck, and (b) is a cross-sectional view.

[0050] Figure 19 Figures are another example of existing chip adsorption tools, (a) is a view from the side holding the chuck, and (b) is a cross-sectional view.

[0051] Figure 20 This diagram illustrates a problem arising in another example of an existing chip adsorption tool. Detailed Implementation

[0052] Embodiments of the present invention will be described using the accompanying drawings. Figure 1 This is a diagram illustrating the chip adsorption tool 1 according to Embodiment 1 of the present invention. Figure 1 (a) is a view taken from the chip mounting surface on the side where the semiconductor chip is held. Figure 1 (b) is Figure 1 A sectional view of the AA line portion of (a).

[0053] Figure 1Chip adsorption tool 1 will Figure 2 The clamp 3 shown is fixed to Figure 3 It is constructed using the retainer 2 shown. Here, Figure 2 (a) is a view of the chuck 3 from the chip adsorption surface side. Figure 2 (b) is Figure 2 A sectional view of the portion along line AA in (a). Additionally, Figure 3 (a) is a diagram showing the retainer 2 as viewed from one side of the retainer clamp. Figure 3 (b) is Figure 3 A sectional view of the AA line portion of (a). Furthermore, in Figure 3 In order to distinguish the main body 20, the protrusion 22 and the side wall 23, different filling patterns are used for convenience, but they do not have to be made of other materials. They are generally molded from the same material.

[0054] Furthermore, the material of the chuck 3 is preferably an elastic material, such as natural rubber or synthetic rubber. In addition, the retainer body 20, the protrusion 22 and the side wall 23 constituting the retainer 2 are made of a material with at least higher rigidity than the chuck 3. Considering strength and weight, metals such as aluminum, titanium and stainless steel are usually selected, but it is not limited to metals and can also be glass or ceramic.

[0055] constitute Figure 1 The chuck 3 of the chip adsorption tool 1 shown is basically with Figure 12 The same method as shown for the chuck can also be used as follows: Figure 14 As shown in the chuck 300, a groove 34 is provided on the flat portion 33.

[0056] On the other hand, the retainer 2 has: a protrusion 22 having a through hole 21 penetrating the retainer body 20; and a side wall 23 that holds the chuck 3 around its perimeter.

[0057] Therefore, chip adsorption tool 1 appears to simply be... Figure 11 The chip adsorption tool 1000 shown is Figure 17 The chip adsorption tool 1001 assembly shown has a different dimensional relationship between the protrusion 22 of the holder 2 and the recess 32 of the chuck 3. Figure 11 The chip adsorption tool shown is different from the 1000.

[0058] Specifically, in Figure 11In the chip adsorption tool 1000 shown, the recess 32 of the chuck 3 fits tightly against the protrusion 220 of the holder 2000. Conversely, in the chip adsorption tool 1, a gap exists between the outer periphery of the protrusion 22 of the holder 2 and the inner periphery of the recess 32 of the chuck 3. That is, the width D220 of the protrusion 220 of the holder 2000 is slightly larger than the designed width D32 of the recess 32 of the chuck 3 (approximately 1000 μm at most), while the width D22 of the protrusion 22 of the holder 2 constituting the chip adsorption tool 1 is smaller than the designed width D32 of the recess 32. Furthermore, in this embodiment 1, the protrusion 22 is shaped like a quadrangular prism. While it is not mandatory to use a quadrangular prism shape, a polygonal shape is preferred. Alternatively, the recess 32 may also have the same shape as the protrusion 22. Furthermore, the gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is 0 μm or more and 200 μm or less, preferably 100 μm or less. Here, a gap of 0 μm means that even if a part of the outer periphery is tightly fitted, a gap is sufficient as long as it exists in other parts.

[0059] Because of the gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22, the retainer 2 cannot use the protrusion 22 to hold the chuck 3. Therefore, Figure 2 The design dimensions of the chuck 3 shown in (a) are lx and ly. Figure 3 The retainer 2 shown in (a) has slightly larger Lx and Ly (although depending on the size of Lx and Ly, it is 20 to 500 μm), and is therefore fixed by elastic force.

[0060] like Figure 1 As shown in (b), the pressure loss of the chip adsorption tool 1 with the structure described above relative to the leaks LW0 and LW1 during the period leading to the flow into OM1 is higher than that of the other two types of leaks. Figure 17 The chip adsorption tool 1001 shown is large. Therefore, very little flows into OM1, and the pressure reduction through the adsorption hole 31 ensures that the attraction of the large semiconductor chip C can be maintained. In addition, the gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is initially set to 200 μm or less (preferably 100 μm or less) to ensure pressure loss.

[0061] Furthermore, in the chip adsorption tool 1, there is a gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22. Therefore, during the stage of inserting the chuck 3 into the holder 2, the periphery of the opening of the recess of the chuck 3 can be tightly fitted to the holder 2. Thus, when adsorbing the semiconductor chip C, it will not be as... Figure 16 The cross-section becomes boat-shaped as shown in (b). That is, it will not generate stress that would deform the semiconductor chip C and cause damage.

[0062] In addition, Figure 1In the chip adsorption tool 1 of Embodiment 1 shown, an example is shown where the surface where the chuck 3 and the holder 2 are in close contact is rectangular and has sidewalls 23 that surround the rectangle in a manner that breaks at the four corners. However, in such a configuration of sidewalls 23, a rigidity difference can also be provided between the sidewalls at opposite positions. This example is shown as follows: Figure 4 The modified example 1 of embodiment 1 shown is the chip adsorption tool 100. In the chip adsorption tool 100, the sidewall 23S is made of a material with lower rigidity than the sidewall 23H, and may also be an elastomer such as rubber.

[0063] Figure 4 The chip adsorption tool 100 shown has the following features: it is relatively easy to insert the chuck 3, and when a force is applied to the surface formed by the flat portion 33 in the vertical direction, the sidewall 23S absorbs the force applied in the transverse direction (X direction, Y direction) of the chuck 3, thereby maintaining the flatness of the flat portion 33.

[0064] Figure 5 The retainer 201 shown is configured Figure 6 The modified example 2 of embodiment 1 shown is the chip adsorption tool 101. The holder 201 is relative to... Figure 3 The retainer 2 is characterized in that a groove 24 is provided along the inner circumference of the side wall 23 of the retaining chuck 3. By providing this groove 24, in such a way... Figure 6 When the chuck 3 is inserted into the retainer 201, the outer periphery of the chuck 3 can be prevented from bulging. That is, when the retainer body 20 and the sidewall 23 are manufactured by integral molding, the influence of the corner residual R (so-called corner R) formed by the inner side of the sidewall 23 and the surface of the retainer body 20 can be eliminated.

[0065] Figure 7 The retainer 202 shown constitutes Figure 8 The illustrated embodiment 2 of the present invention is the chip adsorption tool 102.

[0066] and Figure 3 The retainer 2 is different. Figure 7 The retainer 202 has a shape that allows the sidewall 230 to surround the entire circumference of the chuck 3. Therefore, Figure 8 The chip adsorption tool 102 shown will not leak at the bottom surface of the chuck 3, but is limited to... Figure 8 The leakage LW1 is shown in (b). Therefore, it is possible to have Figure 1 The chip adsorption tool 1 has a strong attraction. However, it is difficult to reliably embed the chuck 3 into the inside of the side wall 230, and sometimes residual torsional stress remains in the chuck 3, so care is needed.

[0067] Furthermore, in the manner in which the sidewall 230 covers the entire circumference of the chuck 3, R is also prone to remain at the corner formed by the inner side of the sidewall 230 and the surface of the retainer body 20. Therefore, as Figure 9 As shown, a chip adsorption tool 103 is preferably formed in a holder 203 in which a groove 240 is formed along the inner periphery of the sidewall 230 and a chuck 3 is embedded.

[0068] As described above, the various chip picking tools shown as embodiments of the present invention can pick up thin and large semiconductor chips while ensuring holding force and without applying stress that could damage the semiconductor chip. Therefore, even thin and large semiconductor chips that are closely attached to the dicing tape can be reliably picked up.

[0069] Label Explanation

[0070] 1, 100, 101, 102, 103, 1000, 1001: Chip adsorption tools; 2, 200, 201, 202, 203, 2000, 2001: Holders; 3, 300, 3001: Chucks; 20: Holder body; 21: Through hole; 22, 220: Protrusions; 23: Side wall; 23H: Elastic sidewall; 23S: Rigid sidewall; 24: slot; 30: Elastomer; 31: Adsorption pores; 32: concave part; 33: Flat area; 34: slot; 230: (Full circumference) Sidewall; 240: (whole cycle) slot.

Claims

1. A chip adsorption tool for adsorbing and holding semiconductor chips, wherein, This chip adsorption tool has the following features: A chuck having a flat portion that fits tightly against the semiconductor chip, and an adsorption hole provided within the flat portion; and A retainer that holds the chuck. The retainer has a protrusion and a sidewall on the surface that holds the chuck. The protrusion has a through hole that communicates with the suction hole, and the sidewall fits tightly against the periphery of the chuck. The chuck has a recess that engages with the protrusion of the retainer.

2. The chip adsorption tool according to claim 1, wherein, The outer periphery of the protrusion of the retainer and the inner periphery of the recess of the clamp do not fit tightly together, resulting in a gap.

3. The chip adsorption tool according to claim 1, wherein, A groove is formed along the inner circumference of the sidewall on the surface of the retainer that holds the chuck.

4. The chip adsorption tool according to any one of claims 1 to 3, wherein, The sidewalls of the retainer surround the entire circumference of the clamp.

5. The chip adsorption tool according to any one of claims 1 to 3, wherein, The sidewall of the retainer is broken at multiple locations.

6. The chip adsorption tool according to claim 4, wherein, The component forming the retainer has higher rigidity than the chuck.

7. The chip adsorption tool according to claim 5, wherein, The component forming the retainer has higher rigidity than the chuck.

8. The chip adsorption tool according to claim 7, wherein, The surface of the clamp that fits tightly against the retainer is rectangular in shape. The sidewalls are broken at the four corners of the rectangle.

9. The chip adsorption tool according to claim 8, wherein, The rigidity settings of the opposing sidewalls differ.

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