A full-via PCB and circuit board assembly
By adopting full-hole PCBs and utilizing SMT reflow soldering, the high cost and low efficiency problems caused by half-hole PCBs in smart door lock circuit boards have been solved, achieving a more efficient and higher-quality soldering process.
Patent Information
- Application Number
- CN202611541665.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-10-02
- Publication Date
- 2026-11-06
AI Technical Summary
Existing smart door lock circuit boards use half-hole PCBs and are manually soldered, resulting in high PCB material costs, low production efficiency, and a high probability of poor soldering.
A full-hole PCB is used, and the second PCB is soldered to the first PCB by SMT reflow soldering, eliminating the half-hole process. Electrical connection is achieved by using the conductive layer of the full-hole, and assembly errors are prevented by irregular edge limiting.
It reduced PCB material costs, improved production efficiency and quality, and reduced the probability of poor soldering.
Smart Images
Figure CN123056284A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCB circuit board technology, and more particularly to a full-hole PCB and a circuit board assembly using the full-hole PCB. Background Technology
[0002] In smart door lock circuit boards with touch passwords, two PCBAs are typically soldered together. For example... Figure 1 As shown, the two PCBAs are separated into a first PCB 101 and a second PCB 102. The first PCB 101 has multiple pads 103, and the second PCB 102 has multiple half-holes 104, with each pad 103 corresponding to a half-hole 104. During production, workers manually place the second PCB 102 onto the surface of the first PCB 101 and then manually solder the pads 103 and half-holes 104 together.
[0003] The above method has two problems: First, the half-hole process for PCBs is very expensive, resulting in high PCB material costs; second, manual soldering is inefficient and has a high probability of poor soldering, which directly affects product quality. Summary of the Invention
[0004] Technical problems to be solved The technical problem to be solved by this invention is that the existing smart door lock circuit board uses a half-hole PCB and is manually soldered, which results in high PCB material cost, low production efficiency and high probability of poor soldering. Technical solution
[0005] This invention eliminates the half-hole process and directly uses a full-hole PCB. For example... Figure 2 As shown, all edge half holes of the second PCB 202 are removed and replaced with full holes 204. After the second PCB 202 is replaced with full holes, it can be soldered to the first PCB 201 by SMT reflow soldering.
[0006] Specifically, a full-hole PCB includes a PCB body, wherein no half-holes are provided on the edge of the PCB body, and multiple full holes are provided on the PCB body; the full holes penetrate the upper and lower surfaces of the PCB body, and a conductive layer is provided on the inner wall of the full holes; the full holes are configured to correspond one-to-one with pads on another PCB, and are electrically connected to the pads by SMT reflow soldering.
[0007] Furthermore, the PCB body is provided with multiple touch PADs, such as... Figure 2 In section 205 and 206, inductance is used to trigger the password.
[0008] Furthermore, the aperture of the full-hole is configured to guide solder paste to diffuse toward the inner wall of the full-hole during SMT reflow soldering, preventing the solder paste from spreading outwards on the plane of the other PCB.
[0009] Furthermore, the edges of the PCB body are irregularly shaped to provide positioning and error prevention during assembly.
[0010] The present invention also provides a circuit board assembly, including a first PCB and a second PCB; the first PCB is provided with a plurality of pads; the second PCB is the above-mentioned full-hole PCB; the second PCB is stacked on the first PCB, and the pads of the first PCB correspond one-to-one with the full holes of the second PCB and are electrically connected by SMT reflow soldering.
[0011] The present invention also provides a smart door lock circuit board, including the circuit board assembly described above.
[0012] Beneficial effects: This invention reduces PCB material costs by eliminating the half-hole process and using full-hole PCBs, and improves production efficiency and quality through SMT reflow soldering. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of a circuit board structure using a half-hole PCB in the prior art.
[0014] Figure 2 This is a schematic diagram of the structure of the full-hole PCB in this invention.
[0015] Figure 3 This is a schematic diagram of the structure of the full-hole PCB and another PCB after being stacked and soldered in this invention. Detailed Implementation
[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0017] like Figure 1 As shown, in the prior art, the first PCB 101 is provided with multiple pads 103, and the second PCB 102 is provided with multiple half holes 104. The pads 103 and the half holes 104 correspond one-to-one. The worker manually places the second PCB 102 onto the surface of the first PCB 101, and then manually solders the pads 103 and the half holes 104 together.
[0018] like Figure 2 As shown, in this invention, all edge half-holes in the second PCB 202 are eliminated and replaced entirely with full holes 204. The full holes 204 penetrate the upper and lower surfaces of the second PCB 202, and a conductive layer is provided on the inner wall of the full holes 204. Each full hole 204 corresponds one-to-one with a pad 203 on the first PCB 201.
[0019] like Figure 3 As shown, during assembly, solder paste can be applied to all pads 203. The second PCB 202 is placed on top of the first PCB 201, ensuring that all pads 203 correspond one-to-one with all through holes 204. Then, the stacked first PCB 201 and second PCB 202 are placed in a reflow oven for heating. After the solder paste melts, the second PCB 202 is soldered to the first PCB 201.
[0020] After the solder paste melts, the second PCB 202 will adhere tightly to the first PCB 201, and the solder paste will spread outwards. Therefore, the diameter of the through hole 204 needs to be large enough to guide the solder paste to spread towards the inner wall of the through hole 204, and prevent the solder paste from spreading outwards on the plane of the first PCB 201.
[0021] The second PCB 202 can be made into an irregular shape, the purpose of which is to limit the second PCB 202 during assembly and prevent the second PCB 202 from being placed in the wrong direction.
[0022] It should be noted that the board limiting fixtures, hole limiting fixtures, and manual or fixture placement methods used in the above assembly process are only used to assist in the assembly of the full-hole PCB with another PCB. This application focuses on protecting the full-hole PCB and the circuit board assembly formed with another PCB. Fixtures and production methods are not the focus of protection in this application.
[0023] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A fully-hole PCB, characterized in that, The device includes a PCB body with multiple through holes and multiple touch pads. The through holes penetrate the upper and lower surfaces of the PCB body, and the inner walls of the through holes are provided with conductive layers. The through holes are configured to correspond one-to-one with pads on another PCB and are electrically connected to the pads after thermal soldering.
2. The full-hole PCB according to claim 1, characterized in that, The aperture of the full-hole is configured to guide solder paste to diffuse toward the inner wall of the full-hole during hot soldering.
3. The full-hole PCB according to claim 1, characterized in that, The hole is a round hole.
4. The full-hole PCB according to claim 1, characterized in that, The edges of the PCB body are irregularly shaped to limit positioning and prevent errors during assembly.
5. The full-hole PCB according to claim 1, characterized in that, The conductive layer on the inner wall of the full-hole is a metallized hole wall.
6. A circuit board assembly, characterized in that, It includes a first PCB and a second PCB; the first PCB has a plurality of pads; the second PCB is a full-hole PCB as described in any one of claims 1 to 5; the second PCB is stacked on the first PCB, and the pads of the first PCB correspond one-to-one with the full-holes of the second PCB and are electrically connected by thermal soldering.
7. The circuit board assembly according to claim 6, characterized in that, The pads of the first PCB are coated with solder paste, which fills the inner wall of the full-hole and connects to the pads after thermal soldering.
8. A smart door lock circuit board, characterized in that, Includes the circuit board assembly as described in claim 6 or 7.
9. The smart door lock circuit board according to claim 8, characterized in that, The first PCB and the second PCB are touch password circuit boards for smart door locks.