High-surface-quality monocrystalline silicon wafer grinding and thinning grinding wheel

Abstract

The utility model discloses a monocrystalline silicon wafer grinding and thinning grinding wheel with high surface quality, which relates to the technical field of grinding equipment and comprises a grinding wheel main body, a slot is arranged on the back of the grinding wheel main body, a first mounting seat is connected inside the slot, a bolt penetrates through the top of the first mounting seat, and a chute is arranged on the outer ring of the grinding wheel main body. A second mounting base is connected into the sliding groove, and a first relay plate is connected to one side of the second mounting base. Through the arrangement of the first mounting seat, the second mounting seats, the first relay plate, the slots and the sliding chutes, the first mounting seat is connected with the second mounting seats through the first relay plate, and the second mounting seat at the tail end is mounted in the slots and slides along the sliding chutes during mounting; when the sand blocks are mounted to the last, the first mounting seats are inserted into the slots, and the bolts are tightened, so that the mounting of the plurality of sand blocks can be completed; the dismounting operation is simple and convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding equipment, in particular to a grinding wheel for grinding and thinning single crystal silicon slices with high surface quality. Background Art

[0002] Single crystal silicon wafers are drawn from high-purity polycrystalline silicon in a single crystal furnace. They have the physical properties of a quasi-metal and weak electrical conductivity. Their electrical conductivity increases with increasing temperature and they have significant semi-conductivity. Single crystal silicon wafers are mainly used to manufacture semiconductor devices, integrated circuits, solar cells and other products. They have the advantages of high purity, high density, high mechanical strength and high stability, so they are widely used in electronics, photovoltaics, solar energy and other fields. Therefore, in the manufacturing process, the preparation of single crystal silicon wafers requires strict control of the impurity content and requires high surface quality and quality, so they need to be ground with a grinding wheel.

[0003] A combined grinding wheel with application number 202321585264.9 comprises a connecting plate and a plurality of grinding wheel blocks, wherein the grinding wheel blocks are fixedly connected to the connecting plate, the connecting plate is a regular polygon, a circular mounting hole is provided in the middle of the surface of the connecting plate, a positioning sleeve is provided in the mounting hole, the positioning sleeve and the mounting hole are embeddedly connected, the positioning sleeve is fixedly connected to the connecting plate by screws, and a plurality of through holes are also provided on the surface of the connecting plate; adopting the scheme of the utility model, the grinding wheel disclosed in the utility model is a combined grinding wheel, which is detachably fixedly connected by bolts, and the grinding wheel is composed of unit parts, and there is no stress problem and deformation problem after high-temperature heating, so that the accuracy of the processing process is guaranteed; the grinding wheel disclosed in the utility model is made of diamond as a matrix, has low requirements on equipment power and rigidity, and a plurality of through holes are provided on the surface of the connecting plate to achieve the effect of weight reduction;

[0004] This technical solution uses bolts to disassemble and assemble the sand blocks. However, when multiple sand blocks are rotating to grind the silicon wafer, unless the sand blocks are destructively damaged, the wear amount between the multiple sand blocks is similar. When replacing, all the sand blocks generally need to be disassembled and assembled together. However, this technical solution uses a bolt to limit a sand block, which makes the disassembly and assembly process more cumbersome and labor-intensive. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide a single crystal silicon wafer grinding and thinning grinding wheel with high surface quality to solve the technical problem of time-consuming and labor-intensive disassembly operation.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-surface-quality single-crystal silicon wafer grinding and thinning grinding wheel, comprising a grinding wheel body, a slot is provided on the back of the grinding wheel body, and a first mounting seat is connected inside the slot, a bolt passes through the top of the first mounting seat, a slide groove is provided on the outer ring of the grinding wheel body, and a second mounting seat is connected inside the slide groove, and a first relay plate is connected to one side of the second mounting seat.

[0007] By adopting the above technical solution, the first mounting seat and multiple second mounting seats are connected through the first relay plate. During installation, the second mounting seat at the tail end is installed into the slot and the second mounting seat is slid along the slide groove, so that the multiple second mounting seats pass through the slot and enter the slide groove. When it is installed to the end, the first mounting seat is inserted into the slot and the bolts are tightened to complete the installation of multiple sand blocks. During disassembly, the bolts are removed first, and then the first mounting seat is pulled out and the first mounting seat is continuously pulled, so that the multiple second mounting seats pass through the slide groove and are pulled out of the slot.

[0008] Furthermore, the slot is communicated with the slide groove, and the second mounting seat is detachably connected to the slot.

[0009] By adopting the above technical solution, the staff first inserts the second mounting seat at the tail end into the slot, and then slides the second mounting seat to make the remaining multiple second mounting seats pass through the slot and enter the inside of the slide groove in sequence.

[0010] Furthermore, the first relay board is rotatably connected to the first mounting seat and the second mounting seat respectively.

[0011] By adopting the above technical solution, the staff pulls multiple second mounting seats through the first mounting seat. Since the first mounting seat and the multiple second mounting seats are connected through the first relay board, the multiple second mounting seats pass through the slide groove in turn and are pulled out of the slot, thereby completing the disassembly work.

[0012] Furthermore, the first mounting seat is detachably connected to the slot via bolts, and the second mounting seat is slidably connected to the slide groove.

[0013] By adopting the above technical solution, the staff can complete the installation of multiple sand blocks by inserting the first mounting seat into the slot and tightening the bolts.

[0014] Furthermore, the back of the first mounting seat and the outer surface of the second mounting seat are both connected with sand blocks.

[0015] By adopting the above technical solution, after the grinding wheel body is installed on the grinding machine, a plurality of sand blocks revolve around the center of the grinding wheel body, thereby grinding a single silicon wafer.

[0016] Furthermore, the sand block, the second mounting seat and the first relay plate are provided in plurality, and the plurality of sand blocks, the second mounting seat and the first relay plate are distributed in a ring array.

[0017] By adopting the above technical solution, during installation, the second mounting seat at the tail end is installed into the slot and the second mounting seat is slid along the slide groove, so that multiple second mounting seats pass through the slot and enter the slide groove. During disassembly, the bolts are first removed, and then the first mounting seat is pulled out and the first mounting seat is continuously pulled, so that multiple second mounting seats pass through the slide groove and are pulled out of the slot.

[0018] Furthermore, a second relay board is connected to the other side of the second mounting seat, and a buckle strip is connected to one side inside the second relay board, and a buckle groove is provided on one side of the outer surface of the first mounting seat.

[0019] By adopting the above technical solution, when the first mounting seat is inserted into the slot, the buckle groove holds the buckle bar, so that the second relay board is connected to the first mounting seat, thereby completing the connection between the second mounting seat at the tail end and the first mounting seat, and increasing the stability of the structure.

[0020] Furthermore, the buckle strip is detachably connected to the buckle groove, and the second relay plate is rotatably connected to the second mounting seat.

[0021] By adopting the above technical solution, the staff pulls the first mounting seat out of the slot, and at the same time the buckle slot is separated from the buckle strip, thereby terminating the connection between the first mounting seat and the second relay board.

[0022] In summary, the utility model mainly has the following beneficial effects:

[0023] The utility model is provided with a first mounting seat, a second mounting seat, a first relay plate, a slot and a slide groove. The first mounting seat and multiple second mounting seats are connected through the first relay plate. During installation, the second mounting seat at the tail end is installed into the slot and the second mounting seat is slid along the slide groove, so that the multiple second mounting seats all pass through the slot and enter the slide groove. When it is installed to the end, the first mounting seat is inserted into the slot and the bolts are tightened to complete the installation of multiple sand blocks. During disassembly, the bolts are first removed, and then the first mounting seat is pulled out and the first mounting seat is continuously pulled, so that the multiple second mounting seats pass through the slide groove and are pulled out of the slot; the disassembly and assembly operation is simple and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 It is a schematic diagram of the top-sectional structure of the utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the first mounting base of the utility model;

[0027] Figure 4 It is a schematic diagram of the back structure of the grinding wheel body of the utility model.

[0028] In the figure: 1. grinding wheel body; 2. sand block; 3. bolt; 4. first mounting seat; 5. second mounting seat; 6. first relay plate; 7. second relay plate; 8. slot; 9. slide groove; 10. buckle groove; 11. buckle strip. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0030] The following describes an embodiment of the utility model based on its overall structure.

[0031] Embodiment 1:

[0032] A high surface quality single crystal silicon wafer grinding and thinning grinding wheel, such as Figure 1-Figure 4 As shown, it includes a grinding wheel body 1, a slot 8 is opened on the back of the grinding wheel body 1, a first mounting seat 4 is connected inside the slot 8, a bolt 3 is passed through the top of the first mounting seat 4, the first mounting seat 4 is detachably connected to the slot 8 by the bolt 3, the bolt 3 is removed, and then the staff pulls the first mounting seat 4 out of the slot 8; a slide groove 9 is opened on the outer ring of the grinding wheel body 1, the slot 8 is connected to the slide groove 9, a second mounting seat 5 is connected inside the slide groove 9, the second mounting seat 5 is detachably connected to the slot 8, the second mounting seat 5 is slidably connected to the slide groove 9, and a first relay plate 6 is connected to one side of the second mounting seat 5, the first relay plate 6 is rotatably connected to the first mounting seat 4 and the second mounting seat 5 respectively, the staff pulls multiple second mounting seats 5 through the first mounting seat 4, because the first mounting seat 4 and multiple second mounting seats 5 are connected through the first relay plate 6, so that the multiple second mounting seats 5 are sequentially pulled out of the slot 8 through the slide groove 9, thereby completing the disassembly work.

[0033] See also Figure 1-Figure 3 In the above embodiment, the back of the first mounting seat 4 and the outer surface of the second mounting seat 5 are connected with a sand block 2, and a plurality of sand blocks 2, the second mounting seat 5 and the first relay plate 6 are provided. The plurality of sand blocks 2, the second mounting seat 5 and the first relay plate 6 are distributed in a circular array, and the plurality of sand blocks 2 revolve along the center of the grinding wheel body 1 to facilitate grinding of the single silicon wafer.

[0034] Embodiment 2:

[0035] On the basis of the above-mentioned embodiment one, although the disassembly and assembly operations can be made simple and convenient by setting the first mounting seat 4, the second mounting seat 5, the first relay board 6, the slot 8 and the slide groove 9; the second mounting seat 5 located at the tail end is not connected to the first mounting seat 4, which causes the stability deviation of the structural connection; now, by setting the second relay board 7, the buckle groove 10 and the buckle strip 11, the stability of the structure can be increased.

[0036] See also Figure 2 and Figure 3 In the above embodiment, the second relay board 7 is connected to the other side of the second mounting seat 5, and the second relay board 7 is rotatably connected to the second mounting seat 5. A buckle strip 11 is connected to one side of the inside of the second relay board 7. A buckle groove 10 is provided on one side of the outer surface of the first mounting seat 4. The buckle strip 11 is detachably connected to the buckle groove 10. When the first mounting seat 4 is inserted into the slot 8, the buckle groove 10 holds the buckle strip 11, so that the second relay board 7 is connected to the first mounting seat 4, thereby completing the connection between the second mounting seat 5 at the tail end and the first mounting seat 4, thereby increasing the stability of the structure.

[0037] The implementation principle of the utility model is as follows: first, when the multiple sand blocks 2 are seriously worn, the staff removes the bolts 3, and then the staff pulls out the first mounting seat 4 from the slot 8, and at the same time the buckle slot 10 is separated from the buckle strip 11, thereby ending the connection between the first mounting seat 4 and the second relay plate 7, and then the staff pulls the multiple second mounting seats 5 through the first mounting seat 4, and since the first mounting seat 4 and the multiple second mounting seats 5 are connected through the first relay plate 6, the multiple second mounting seats 5 are sequentially pulled out of the slot 8 through the slide groove 9, thereby completing the disassembly work;

[0038] During installation, the staff first inserts the second mounting seat 5 at the tail end into the slot 8, and then slides the second mounting seat 5 so that the remaining multiple second mounting seats 5 pass through the slot 8 and enter the slide groove 9 in turn. When installing to the end, the staff inserts the first mounting seat 4 into the slot 8 and tightens the bolt 3 to complete the installation of multiple sand blocks 2. While the first mounting seat 4 is inserted into the slot 8, the buckle groove 10 holds the buckle strip 11 to connect the second relay plate 7 to the first mounting seat 4, thereby completing the connection between the second mounting seat 5 at the tail end and the first mounting seat 4, increasing the stability of the structure.

[0039] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. A high-surface-quality single-crystal silicon wafer grinding and thinning grinding wheel, comprising a grinding wheel body (1), characterized in that: The grinding wheel body (1) has a slot (8) on its back, and a first mounting seat (4) is connected to the inside of the slot (8), a bolt (3) passes through the top of the first mounting seat (4), a slide groove (9) is provided on the outer ring of the grinding wheel body (1), and a second mounting seat (5) is connected to the inside of the slide groove (9), and a first relay plate (6) is connected to one side of the second mounting seat (5).

2. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 1, characterized in that: The slot (8) is communicated with the slide groove (9), and the second mounting seat (5) is detachably connected to the slot (8).

3. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 2, characterized in that: The first relay plate (6) is rotatably connected to the first mounting seat (4) and the second mounting seat (5) respectively.

4. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 2, characterized in that: The first mounting seat (4) is detachably connected to the slot (8) via bolts (3), and the second mounting seat (5) is slidably connected to the slide groove (9).

5. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 1, characterized in that: The back of the first mounting seat (4) and the outer surface of the second mounting seat (5) are both connected to a sand block (2).

6. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 5, characterized in that: The sand blocks (2), the second mounting seats (5) and the first relay plates (6) are each provided in plurality, and the plurality of sand blocks (2), the second mounting seats (5) and the first relay plates (6) are distributed in a ring array.

7. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 1, characterized in that: The second mounting seat (5) is connected to a second relay board (7) on the other side, and a buckle strip (11) is connected to the inner side of the second relay board (7), and a buckle groove (10) is provided on one side of the outer surface of the first mounting seat (4).

8. The high surface quality single crystal silicon wafer grinding and thinning grinding wheel according to claim 7, characterized in that: The buckle strip (11) is detachably connected to the buckle groove (10), and the second relay plate (7) is rotatably connected to the second mounting seat (5).

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