Wafer bearing device
By designing a wafer bearing device made of aluminum material and setting grooves and limit columns, the problem of wafer damage caused by existing devices is solved, achieving a safer and wear-resistant wafer bearing effect.
Patent Information
- Application Number
- CN202323427660.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-15
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-15
AI Technical Summary
The existing wafer bearing devices are prone to wafer damage during the wafer loading process, affecting product quality, and the buffer material has no movement and insufficient angle adjustment capabilities.
A wafer bearing device consisting of a device body made of aluminum material is designed, with grooves and wafer limit mounting columns inside, with groove spacing of 10mm to ensure that the wafer does not contact and prevent slide when loading. .
This device improves the handling and transfer safety of wafers, has the advantages of wear resistance and lightness, and improves the quality of wafer products.
Smart Images
Figure CN222137376U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a wafer carrying device. Background Art
[0002] With the advancement of technology, manufacturers of various products (such as electronic parts, food, etc.) have found that the factors that affect the yield of finished products, in addition to the relevant process design and control, the environmental conditions of semi-finished products and finished products during transportation or production also have a direct or indirect correlation with the final yield of finished products. Therefore, for manufacturers of various products, how to control the environmental conditions of semi-finished products and finished products during transportation or production has become an important issue.
[0003] A wafer carrier is a structure used to carry wafers in the semiconductor process, such as the grinding head cleaning and loading and unloading structure in a chemical mechanical grinding machine. The structure and performance of the wafer carrier directly affect the structure of the wafer itself and the quality of the semiconductor process. The current wafer carrier may cause damage to the wafer in the process of carrying the wafer, thereby affecting the quality of the final wafer product. Summary of the invention
[0004] In order to solve the problem that the buffer material cannot be moved or adjusted in angle due to the presence or absence of a mechanism and is easily damaged, the utility model proposes: a wafer carrying device, comprising a device body and a wafer, wherein a groove is provided inside the device body and the wafer is mounted at the groove.
[0005] Furthermore, the grooves are arranged and distributed in layers inside the device body.
[0006] Furthermore, the spacing between the grooves is 10 mm.
[0007] Furthermore, the device body is made of aluminum material.
[0008] Furthermore, the device body is composed of splicing plates.
[0009] Furthermore, a wafer limiting mounting column is provided in the device body to prevent the wafer from sliding off.
[0010] The beneficial effects of the utility model are as follows: the handling and transportation of wafers require a carrying device to carry them. According to the needs of the currently developed wafer inspection equipment, a wafer carrying device is designed and developed. The utility model solves the wafer carrying problem. The carrying device has the advantages of wear resistance and light weight. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 The wafer carrying device structure of the utility model Figure 1 ;
[0012] Figure 2 The wafer carrying device structure of the utility model Figure 2 ;
[0013] Figure 3 The wafer carrying device structure of the utility model Figure 3 ;
[0014] Figure 4 The wafer carrying device structure of the utility model Figure 4 ;
[0015] Among them, the figures are marked as: 1. device body, 11. cutting groove, 12. splicing plate, 2. wafer limiting safety column, 3. wafer. DETAILED DESCRIPTION
[0016] A wafer carrier device, such as Figure 1-Figure 4 As shown, the device comprises a main body 1 and a wafer 3 . A groove 11 is provided inside the main body 1 , and the wafer 3 is mounted in the groove 11 .
[0017] The grooves 11 are arranged in layers inside the device body 1 .
[0018] Wherein, the spacing between the grooves 11 is 10 mm.
[0019] Wherein, the device body 1 is made of aluminum material.
[0020] The device body 1 is composed of splicing plates 12.
[0021] Wherein, a wafer limiting mounting column 2 is provided in the device body 1 to prevent the wafer 3 from sliding off.
[0022] There are grooves inside the device body 1, and the wafers 3 are installed in the grooves 11. There are spacings between the grooves 11 to ensure that the wafers 3 are spaced apart and do not touch each other. The device body 1 is made of aluminum material, and the various parts are assembled; after the assembly is completed, the device body 1 is subjected to surface oxidation treatment.
[0023] The function of the wafer limiting mounting column 2 is to prevent the wafer 3 from slipping when personnel transfer the wafer carrying device.
[0024] The wafers 3 are placed layer by layer according to the structure of the device body 1 .
[0025] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and concept of the utility model within the technical scope disclosed by the utility model, which should be covered by the protection scope of the utility model.
Claims
1. A wafer carrying device, characterized in that: The invention comprises a device body (1) and a wafer (3); a groove (11) is provided inside the device body (1); the wafer (3) is mounted at the groove (11); the device body (1) is made of aluminum material; the device body (1) is composed of splicing plates (12); and a wafer limiting mounting column (2) is provided in the device body (1) to prevent the wafer (3) from sliding off.
2. The wafer carrier device according to claim 1, characterized in that: The grooves (11) are arranged in layers inside the device body (1).
3. The wafer carrier device according to claim 2, characterized in that: The spacing between the grooves (11) is 10 mm.