Workpiece machining table cooling device

Abstract

The utility model relates to the technical field of workpiece cooling, in particular to a workpiece machining table cooling device which is applied to a machining table body and comprises a first cavity, a supporting groove, a heat conduction plate, a heat conduction silica gel pad, a heat conduction rod, a water cooling mechanism and an air cooling mechanism. The heat conducting plate is fixedly arranged in the supporting groove, the heat conducting silica gel pad is fixedly arranged between the heat conducting plate and the bottom of the supporting groove, the multiple heat conducting rods penetrate through the heat conducting silica gel pad and stretch into the first cavity, the water cooling mechanism is arranged in the machining table body and used for conducting water cooling on the heat conducting rods, and the air cooling mechanism is arranged on the machining table body and used for cooling the heat conducting rods. By means of the technical scheme, the problem that in the prior art, the substrate machining efficiency is affected due to the fact that the cooling efficiency of a substrate is low is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of workpiece cooling, in particular to a workpiece processing table cooling device. Background Art

[0002] The ion beam sputtering coating machine uses an ion source to emit ions, which are extracted, accelerated, and focused to form a beam. The ion beam is used to bombard a target placed in a high vacuum, and the sputtered atoms are coated. Ion beam sputtering coating optical components can help demanding laser optical applications achieve the highest possible performance. The films on these optical components have dense, non-porous and uniform coating layers, so they have drift-free and temperature-insensitive properties.

[0003] Ion beam etching will bring heat to the substrate (etched substrate). In order to facilitate subsequent processing of the substrate, it is generally required to cool the substrate after processing. In the prior art, the cooling method for the substrate is mostly to apply thermal grease between the workpiece table and the substrate for heat conduction. In this case, the thermal grease will inevitably adhere to the surface of the substrate, thereby increasing the subsequent cleaning problem of the substrate. At the same time, after the heat is conducted to the work surface through the thermal grease, it takes a certain amount of time for the heat to dissipate from the work surface to the external environment, which is not convenient for rapid heat dissipation of the substrate, thereby affecting the processing efficiency of the substrate. Utility Model Content

[0004] The utility model provides a workpiece processing table cooling device, which solves the problem in the prior art that the cooling efficiency of a substrate is low and thus affects the processing efficiency of the substrate.

[0005] The technical solution of the utility model is as follows: A workpiece processing table cooling device is applied to a processing table body, comprising a first cavity, a support groove, a heat conducting plate, a heat conducting silicone pad, a heat conducting rod, a water cooling mechanism and an air cooling mechanism;

[0006] The first cavity is provided in the processing platform body;

[0007] The support groove is provided on the processing table body;

[0008] The heat conducting plate is fixedly disposed in the supporting groove;

[0009] The thermally conductive silicone pad is fixedly arranged between the thermally conductive plate and the bottom of the supporting groove;

[0010] The heat conducting rods are provided in plurality, and the plurality of heat conducting rods penetrate the heat conducting silicone pad and extend into the first cavity;

[0011] The water cooling mechanism is arranged in the processing table body and is used for water cooling the heat conducting rod;

[0012] The air cooling mechanism is arranged on the processing table body and is used for air cooling the workpiece.

[0013] Preferably, the water cooling mechanism comprises:

[0014] A helical tooth, wherein the helical tooth is fixedly disposed on the heat conducting rod corresponding to the first cavity;

[0015] A temperature-cooling ring, the temperature-cooling ring being fixedly arranged in the first cavity corresponding to the heat-conducting rod;

[0016] A heat exchange mechanism is arranged in the processing table body and is used for exchanging heat for the heat conducting rod.

[0017] Furthermore, the heat exchange mechanism comprises:

[0018] a second cavity, the second cavity being opened at one side of the first cavity and filled with a coolant;

[0019] a third cavity and a fourth cavity, wherein the third cavity and the fourth cavity are opened on two sides of the first cavity;

[0020] A communication port, the communication port corresponding to the cooling ring is opened on the side wall of the third cavity and the fourth cavity;

[0021] a reflux pipe, the reflux pipe being arranged between the fourth cavity and the second cavity in communication, and a check valve being arranged in the reflux pipe;

[0022] A water pump is fixedly arranged on the processing table body, the water pump input end is connected with the second cavity, and the water pump output end is connected with the third cavity.

[0023] Furthermore, it also includes a semiconductor refrigeration plate, which is fixedly arranged in the second cavity, and a heat exchange component of the semiconductor refrigeration plate is fixedly arranged on the outer wall of the processing table body.

[0024] Furthermore, the air cooling mechanism comprises:

[0025] A blowing shell, wherein the blowing shell is provided in plurality, and the plurality of blowing shells are fixedly arranged on the processing table body corresponding to the cooling ring;

[0026] Blowing ports, each of the blowing shell side walls is provided with a plurality of the blowing ports;

[0027] A jacket, wherein the jacket is disposed in the cooling ring;

[0028] A blowing pipe, wherein the blowing pipe is arranged in the blowing housing;

[0029] A heat exchange pipe, wherein one end of the heat exchange pipe away from the blowing shell extends into the jacket, and the heat exchange pipe is connected to the blowing pipe;

[0030] A fan is installed on the processing table body, the fan input end is connected to the external environment, and the fan output end is connected to the heat exchange tube.

[0031] Based on the above solution, the heat exchange tube is fixedly arranged on the inner wall of the jacket in a spiral shape.

[0032] The working principle and beneficial effects of the utility model are:

[0033] 1. In the utility model, through the setting of the water cooling mechanism, the water pump can pump the cooling liquid in the second cavity into the third cavity, and then pass through the cooling ring and the fourth cavity through the circulation port and return to the second cavity under the action of the reflux pipe. In the process of the cooling liquid circulating in the cooling ring, the heat exchange with the substrate can be realized through the heat conducting rod, the heat conducting silicone pad and the heat conducting plate, so as to realize the cooling treatment of the substrate. At the same time, the cooling liquid can be continuously cooled by the semiconductor refrigeration sheet, so as to avoid the problem of the cooling efficiency being affected by the increase of the cooling liquid temperature;

[0034] 2. In the utility model, through the setting of the air cooling mechanism, the operation of the fan can drive the air in the external environment to extend into the blowing housing through the heat exchange tube and the blowing tube, and then blow to the substrate through the blowing port to achieve air cooling and cooling of the substrate. At the same time, the airflow can achieve heat exchange with the coolant through the heat exchange tube and the cooling ring during the circulation in the heat exchange tube, thereby reducing the temperature of the airflow, thereby further improving the cooling effect;

[0035] 3. In the utility model, by arranging the first cavity, the supporting groove, the heat conducting plate, the heat conducting silicone pad, the heat conducting rod, the water cooling mechanism and the air cooling mechanism, it is convenient to exchange heat with the substrate through the coolant while cooling the substrate by blowing air on the surface of the substrate, thereby solving the problem in the prior art that the cooling efficiency of the substrate is low and affects the substrate processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] Figure 1 It is a schematic diagram of the structure of the utility model;

[0038] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;

[0039] Figure 3 This is a schematic diagram of the cross-sectional structure of the heat conducting rod of the utility model;

[0040] Figure 4 This is a schematic diagram of the cross-sectional structure of the heat exchange tube of the utility model;

[0041] In the figure: 1. first cavity; 2. heat conduction plate; 3. thermally conductive silicone pad; 4. thermally conductive rod; 5. spiral teeth; 6. cooling ring; 7. second cavity; 8. third cavity; 9. fourth cavity; 10. return pipe; 11. water pump; 12. semiconductor refrigeration plate; 13. blowing shell; 14. jacket; 15. blowing pipe; 16. heat exchange pipe; 17. fan. DETAILED DESCRIPTION

[0042] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] like Figure 1 to Figure 4 As shown, this embodiment proposes a workpiece processing table cooling device, which is applied to a processing table body, including a first cavity 1, a supporting groove, a heat conducting plate 2, a thermally conductive silicone pad 3, a thermally conductive rod 4, a water cooling mechanism and an air cooling mechanism. The first cavity 1 is opened in the processing table body, the supporting groove is opened on the processing table body, the heat conducting plate 2 is fixedly arranged in the supporting groove, the thermally conductive silicone pad 3 is fixedly arranged between the heat conducting plate 2 and the bottom of the supporting groove, the thermally conductive rod 4 is arranged in plurality, and the plurality of thermally conductive rods 4 penetrate the thermally conductive silicone pad 3 and extend into the first cavity 1. The water cooling mechanism is arranged in the processing table body for water-cooling the thermally conductive rod 4, and the air cooling mechanism is arranged on the processing table body for air-cooling the workpiece.

[0044] The water cooling mechanism includes a spiral tooth 5, a cooling ring 6 and a heat exchange mechanism. The spiral tooth 5 is fixedly arranged on the heat conducting rod 4 corresponding to the first cavity 1. The cooling ring 6 is fixedly arranged in the first cavity 1 corresponding to the heat conducting rod 4. The heat exchange mechanism is arranged in the processing table body for exchanging heat with the heat conducting rod 4. The heat exchange mechanism includes a second cavity 7, a third cavity 8, a fourth cavity 9, a connecting port, a reflux pipe 10 and a water pump 11. The second cavity 7 is opened on one side of the first cavity 1. The second cavity 7 is filled with coolant. The third cavity 8 and the fourth cavity 9 are opened at On both sides of the first cavity 1, connecting ports are opened on the side walls of the third cavity 8 and the fourth cavity 9 corresponding to the cooling ring 6. The return pipe 10 is connected between the fourth cavity 9 and the second cavity 7. A check valve is arranged in the return pipe 10. A water pump 11 is fixedly arranged on the processing table body. The input end of the water pump 11 is connected to the second cavity 7, and the output end of the water pump 11 is connected to the third cavity 8. A semiconductor refrigeration plate 12 is also included. The semiconductor refrigeration plate 12 is fixedly arranged in the second cavity 7, and the heat exchange component of the semiconductor refrigeration plate 12 is fixedly arranged on the outer wall of the processing table body.

[0045] Specifically, the water pump 11 can pump the coolant in the second cavity 7 into the third cavity 8, and then pass through the cooling ring 6 and the fourth cavity 9 through the circulation port and return to the second cavity 7 under the action of the reflux pipe 10. In the process of the coolant circulating in the cooling ring 6, heat exchange with the substrate can be achieved through the heat conducting rod 4, the heat conducting silicone pad 3 and the heat conducting plate 2, thereby realizing the cooling treatment of the substrate. At the same time, the coolant can be continuously cooled by the semiconductor refrigeration plate 12, thereby avoiding the problem of the coolant temperature rising and affecting the cooling efficiency.

[0046] Among them, the air cooling mechanism includes a blowing shell 13, a blowing port, a jacket 14, a blowing pipe 15, a heat exchange pipe 16 and a fan 17. The blowing shell 13 is provided in plurality, and the plurality of blowing shells 13 are fixedly arranged on the processing table body corresponding to the cooling ring 6. A plurality of blowing ports are provided on the side wall of each blowing shell 13. The jacket 14 is provided in the cooling ring 6. The blowing pipe 15 is arranged in the blowing shell 13. The heat exchange pipe 16 extends into the jacket 14 at one end away from the blowing shell 13. The heat exchange pipe 16 is connected with the blowing pipe 15. The fan 17 is installed on the processing table body. The input end of the fan 17 is connected with the external environment, and the output end of the fan 17 is connected with the heat exchange pipe 16. The heat exchange pipe 16 is spirally fixed on the inner wall of the jacket 14.

[0047] Specifically, the operation of the fan 17 can drive the air in the external environment to extend into the blowing shell 13 through the heat exchange tube 16 and the blowing tube 15, and then blow toward the substrate through the blowing port to achieve air cooling of the substrate. At the same time, during the flow of the airflow in the heat exchange tube 16, it can achieve heat exchange with the coolant through the heat exchange tube 16 and the cooling ring 6, thereby reducing the temperature of the airflow, thereby further improving the cooling effect.

[0048] In this embodiment, when in use, the operator places the substrate on the heat conducting plate 2 for processing. During the processing, the water pump 11 can be controlled to work. The water pump 11 can pump the coolant in the second cavity 7 into the third cavity 8, and then pass through the cooling ring 6 and the fourth cavity 9 through the circulation port and return to the second cavity 7 under the action of the reflux pipe 10. During the circulation of the coolant in the cooling ring 6, heat exchange with the substrate can be achieved through the heat conducting rod 4, the heat conducting silicone pad 3 and the heat conducting plate 2, thereby realizing cooling treatment of the substrate. At the same time, the semiconductor refrigeration sheet 12 can continuously cool the coolant, thereby avoiding the problem of the coolant temperature rising and affecting the cooling efficiency. After the processing is completed, the operator controls the fan 17 to work. The operation of the fan 17 can drive the air in the external environment to pass through the heat exchange tube 16 and the blowing tube 15 into the blowing shell 13, and then blow to the substrate through the blowing port to achieve air cooling of the substrate. At the same time, the air flow can achieve heat exchange with the coolant through the heat exchange tube 16 and the cooling ring 6 during the circulation of the heat exchange tube 16, thereby reducing the temperature of the air flow, thereby further improving the cooling effect.

[0049] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A workpiece processing table cooling device, characterized in that: Applied to the processing table body, including: A first cavity (1), wherein the first cavity (1) is disposed in the processing platform body; A support groove, wherein the support groove is provided on the processing table body; A heat conducting plate (2), the heat conducting plate (2) being fixedly arranged in the supporting groove; A heat-conducting silicone pad (3), wherein the heat-conducting silicone pad (3) is fixedly arranged between the heat-conducting plate (2) and the bottom of the supporting groove; A heat conducting rod (4), wherein the heat conducting rod (4) is arranged in plurality, and the plurality of heat conducting rods (4) penetrate the heat conducting silicone pad (3) and extend into the first cavity (1); A water cooling mechanism, the water cooling mechanism being arranged in the processing table body and being used for water cooling the heat conducting rod (4); An air cooling mechanism is arranged on the processing table body and is used for air cooling the workpiece.

2. A workpiece processing table cooling device according to claim 1, characterized in that: The water cooling mechanism comprises: A helical tooth (5), the helical tooth (5) being fixedly arranged on the heat conducting rod (4) corresponding to the first cavity (1); a temperature-cooling ring (6), the temperature-cooling ring (6) being fixedly arranged in the first cavity (1) corresponding to the heat-conducting rod (4); A heat exchange mechanism is arranged in the processing platform body and is used for exchanging heat for the heat conducting rod (4).

3. A workpiece processing table cooling device according to claim 2, characterized in that: The heat exchange mechanism comprises: A second cavity (7), the second cavity (7) being opened on one side of the first cavity (1), and the second cavity (7) being filled with a cooling liquid; A third cavity (8) and a fourth cavity (9), wherein the third cavity (8) and the fourth cavity (9) are opened on both sides of the first cavity (1); A communication port, the communication port corresponding to the cooling ring (6) is opened on the side wall of the third cavity (8) and the fourth cavity (9); a return pipe (10), the return pipe (10) being arranged in communication between the fourth cavity (9) and the second cavity (7), and a check valve being arranged in the return pipe (10); A water pump (11), wherein the water pump (11) is fixedly arranged on the processing table body, the input end of the water pump (11) is connected to the second cavity (7), and the output end of the water pump (11) is connected to the third cavity (8).

4. A workpiece processing table cooling device according to claim 3, characterized in that: It also includes a semiconductor refrigeration sheet (12), which is fixedly arranged in the second cavity (7), and a heat exchange component of the semiconductor refrigeration sheet (12) is fixedly arranged on the outer wall of the processing platform body.

5. A workpiece processing table cooling device according to claim 4, characterized in that: The air cooling mechanism comprises: A blowing shell (13), wherein the blowing shell (13) is provided in plurality, and the plurality of blowing shells (13) are fixedly arranged on the processing table body corresponding to the temperature reduction ring (6); Blowing ports, a plurality of blowing ports being provided on the side wall of each of the blowing shells (13); A jacket (14), wherein the jacket (14) is disposed in the cooling ring (6); A blowing pipe (15), wherein the blowing pipe (15) is arranged in the blowing housing (13); a heat exchange pipe (16), wherein one end of the heat exchange pipe (16) away from the blowing shell (13) extends into the jacket (14), and the heat exchange pipe (16) is connected to the blowing pipe (15); A fan (17), wherein the fan (17) is installed on the processing table body, the input end of the fan (17) is connected to the external environment, and the output end of the fan (17) is connected to the heat exchange pipe (16).

6. A workpiece processing table cooling device according to claim 5, characterized in that: The heat exchange tube (16) is spirally fixed on the inner wall of the jacket (14).

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