Glue uniformizing tray suitable for irregular wafer
By designing a uniform tray suitable for irregular wafers, using telescopic structure and pressure blocking structure to perform multi-point limit and pressure blocking of irregular wafers, the existing pallets are solved for the flying and vacuum hole size when dealing with irregular wafers. The problem of discomfort improves the safety and stability of the glue uniform process.
Patent Information
- Application Number
- CN202420428640.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-03-05
AI Technical Summary
The existing glue coating trays are easily thrown and broken when dealing with irregular waves, which affects the development progress, and the size of the vacuum hole is not suitable, resulting in damage to the glue coating machine or the vacuum degree is affected.
A uniform rubber tray suitable for irregular wafers is designed, including a pallet base and a telescopic structure. One end of the telescopic structure is fixed to the side of the pallet base and the other end is connected to the pressure stop structure. It can adjust the position of the telescopic rod according to the shape of the wfer, providing multiple point limits. Position and pressure gear ensure that the waver is not thrown away when spinning at high speed.
It improves the safety and stability of irregular waffles in the glue uniform process, reduces the risk of debris, is suitable for waffles of various shapes and sizes, and enhances R&D efficiency.
Smart Images
Figure CN222145394U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a glue-spreading tray suitable for irregular wafers. Background Art
[0002] In the process of semiconductor chip manufacturing, in order to complete the photolithography process, it is usually necessary to pre-coat one or more layers of photoresist on the surface of the epitaxial wafer, expose it through a photolithography machine, and then use the developed photoresist pattern as a mask to perform etching and other processes to complete the pattern transfer from the photoresist layer to the material layer. It can be seen that the photoresist coating process is a key step related to the completion of the photolithography process.
[0003] Most of the existing glue coating machines are designed for the production of epitaxial wafers with regular shapes. Their trays are all round trays with vacuum holes. When in use, the tray of the corresponding size is selected according to the size of the wafer and replaced manually. However, during the production and R&D process, it is necessary to conduct tape-out experiments on the residual wafers. Some wafers are irregular in shape and heavy. If a tray with a large vacuum hole is used, the glue liquid is easily absorbed into the vacuum hole during the glue spreading process, causing damage to the glue coating machine and affecting the vacuum degree; if a tray with a small vacuum hole is used, it is easy to be thrown away and broken at a high speed, causing abnormal interruption of the experiment and seriously affecting the progress of R&D.
[0004] As mentioned above, when conducting irregular wafer tape-out tests, the existing glue-spreading tray is not very suitable, and a glue-spreading tray with a higher safety factor is needed to reduce the risk of fragmentation and improve R&D efficiency.
[0005] In view of the above situation, how to overcome the defects of the prior art and solve the above technical problems is a difficult problem to be solved in this technical field. Utility Model Content
[0006] Aiming at the defects or improvement needs of the prior art, the utility model provides a glue spreading tray suitable for irregular wafers, which can be suitable for wafers of various shapes and sizes, and solves the problem that the existing tray is easily thrown away and broken when used for gluing irregular wafers.
[0007] The utility model adopts the following technical solutions:
[0008] The utility model provides a glue spreading tray suitable for irregular wafers, comprising a tray base, a vacuum hole is arranged in the middle of the tray base, at least three telescopic structures are arranged on the side of the tray base, one end of the telescopic structure is fixed to the side of the tray base, and the other end of the telescopic structure is connected to a pressure-blocking structure and extends toward the middle of the tray base.
[0009] In a specific embodiment, the telescopic structure includes a fixed plate and a telescopic rod, wherein the fixed plate is fixed to the side of the pallet base and the fixed plate is higher than a portion of the pallet base, one end of the telescopic rod is fixed to a portion of the fixed plate higher than the pallet base, and the other end of the telescopic rod is connected to the pressure-blocking structure and extends toward the middle of the pallet base.
[0010] In a specific embodiment, the telescopic rod is oriented toward the center of the vacuum hole on a horizontal plane.
[0011] In a specific embodiment, the pressure-blocking structure includes a pressure plate in the horizontal direction and a blocking plate in the vertical direction. The blocking plate is fixed to the end of the telescopic structure, and the pressure plate is connected to the blocking plate in an adjustable height.
[0012] In a specific embodiment, two vertical and parallel sliding grooves are arranged on the blocking plate; two sliding blocks are arranged on the side of the pressing plate, and the positions of the sliding blocks correspond to the positions of the sliding grooves.
[0013] In a specific embodiment, slots are provided on both sides of the slider, and a limiting axis is provided in the slot; limiting holes corresponding to the limiting axis are provided at intervals on both sides of the slide slot along the vertical direction; a spring is provided at the end of the limiting axis, and the end of the spring is fixed in the slot.
[0014] In a specific embodiment, an auxiliary pressing block is arranged on the limiting shaft, the auxiliary pressing block is perpendicular to the limiting shaft and arranged transversely, and the auxiliary pressing block is located on one end of the limiting shaft close to the spring.
[0015] In a specific embodiment, a limiting piece is provided at one end of the sliding block, and the length of the limiting piece is greater than the width of the sliding groove.
[0016] In a specific embodiment, the telescopic structures are arranged at equal angles on the side of the tray base.
[0017] In a specific embodiment, the tray base is of any shape.
[0018] Compared with the prior art, the beneficial effect of the utility model is that it provides a glue-spreading tray suitable for irregular wafers. When in use, the position of the telescopic rod can be adjusted according to the shape of the wafer, so that the irregular wafer can be fixed during glue spreading. In the case that the adsorption force of the vacuum hole is insufficient, it can also ensure that the wafer is rotated at high speed without being thrown away, which greatly improves the safety of the glue spreading process. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for use in the embodiments of the present utility model. Obviously, the drawings described below are only some embodiments of the present utility model, and for ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work.
[0020] Figure 1 A schematic diagram of the structure of a glue spreading tray of an existing glue coating machine provided in an embodiment of the utility model;
[0021] Figure 2 It is a schematic diagram of the structure of a glue spreading tray suitable for irregular wafers provided by an embodiment of the utility model;
[0022] Figure 3 It is a schematic diagram of the construction of the telescopic structure provided by an embodiment of the utility model;
[0023] Figure 4 It is a schematic diagram of the structure of the pressure-blocking structure provided by an embodiment of the utility model;
[0024] Figure 5 It is a schematic diagram of the structure of a slider provided in an embodiment of the utility model;
[0025] Figure 6 It is a schematic diagram of the connection between the limit shaft and the spring provided in an embodiment of the utility model. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0027] In the description of the present invention, the indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention rather than requiring the present invention to be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0029] refer to Figure 1As shown, the existing glue spreader tray is a circular tray with a vacuum hole in the center, and there is no other design. Generally speaking, the vacuum hole of a small-sized glue spreader tray is smaller, and the vacuum hole of a large-sized glue spreader tray is larger. In specific experiments, the corresponding size of the tray will be selected according to the wafer size. However, because some wafers are irregular in shape and heavy, using a tray with a large vacuum hole will easily absorb the glue into the vacuum hole during the glue spread process, causing damage to the glue spreader and affecting the vacuum degree; using a tray with a small vacuum hole will easily be thrown away and broken at a high speed, causing abnormal interruption of the experiment, seriously affecting the progress of research and development.
[0030] Based on the above situation, the embodiment of the utility model proposes a glue spreading tray suitable for wafers of various shapes and sizes, which solves the problem that the existing tray is easily thrown away and broken when used for gluing irregular wafers.
[0031] refer to Figure 2 As shown, an embodiment of the utility model provides a glue spreading tray suitable for irregular wafers, including a tray base 1, a vacuum hole 2 is arranged in the middle of the tray base 1, at least three telescopic structures 3 are arranged on the side of the tray base 1, one end of the telescopic structure 3 is fixed to the side of the tray base 1, and the other end of the telescopic structure 3 is connected to a pressure-blocking structure 4 and extends toward the middle of the tray base 1.
[0032] refer to Figure 2 In a specific implementation of the preferred embodiment, the basic structure of the glue spreading tray used is a circular plane structure with a vacuum hole 2, that is, a tray base 1, and three combined structures including a telescopic structure 3 and a pressure-blocking structure 4 are distributed on the outside of the tray base 1, among which the pressure-blocking structure 4 can be set to be thinner and only play a certain limiting role on the irregular wafer example 5. Figure 2 The irregular wafer example 5 is a fan-shaped structure; the positions of the three telescopic structures 3 can be flexibly customized to achieve the pressure blocking of the wafer.
[0033] The glue-spreading tray manufactured and installed by the above method has the advantage that the position of the telescopic structure 3 can be adjusted according to the shape of the wafer during use, so that irregular wafers can be fixed during glue-spreading. In the case that the adsorption force of the vacuum hole is insufficient, the wafer can also be ensured to rotate at high speed without being thrown away, which greatly improves the safety of the glue-spreading process.
[0034] The embodiment of the utility model adds three telescopic structures 3 to the tray base 1, so that it can limit the irregular wafer at any three points on the same plane, and is also compatible with common round-sized wafers. It can maintain the stability of the wafer during high-speed rotation, improve safety and achieve the purpose of improving production and research and development efficiency.
[0035] The scheme of the embodiment of the utility model is applicable to materials such as polytetrafluoroethylene that are resistant to acid and alkali and various organic solvents; in addition, the tray base 1 can be of any shape, for example, in addition to the circular ring, the tray base 1 can also be other shapes such as square rhombus, as long as it meets the conditions of being able to load three telescopic structures 3 for limiting; the front of the telescopic structure 3 can be loaded with a pressing sheet, or a baffle or other structure, or both, as long as the wafer can be fixed in place. The core of the embodiment of the utility model is that the glue-leveling tray is equipped with a telescopic structure 3 with a freely adjustable position, so that it can flexibly press and block wafers of different shapes and sizes for safe and high-speed rotation. Regardless of the specific materials used and the fixing structure of the clamp, they all fall within the protection scope of the utility model.
[0036] In a specific implementation of this preferred embodiment, the telescopic structures 3 are arranged at equal angles on the side of the tray base 1. For example, when three telescopic structures 3 are arranged, the three telescopic structures 3 can be arranged at intervals of 120 degrees; for example, when four telescopic structures 3 are arranged, the four telescopic structures 3 can be arranged at intervals of 90 degrees.
[0037] refer to Figure 3 As shown, in a specific implementation of the preferred embodiment, the telescopic structure 3 includes a fixed plate 31 and a telescopic rod 32, the fixed plate 31 is fixed to the side of the pallet base 1, and the fixed plate 31 is higher than a part of the pallet base 1, one end of the telescopic rod 32 is fixed to a part of the fixed plate 31 higher than the pallet base 1, and the other end of the telescopic rod 32 is connected to the pressure-blocking structure 4 and extends toward the middle of the pallet base 1. In a specific implementation, the fixed plate 31 can be fixed to the side of the pallet base 1 by bolts. The telescopic rod 32 can also be fixed to the fixed plate 31 by bolts. The telescopic rod 32 can be a manual telescopic rod on the market or an electric telescopic rod. In specific use, the telescopic rod 32 of the telescopic structure 3 at different angles is adjusted to extend or retract to adapt to the different shapes and sizes of different irregular wafers.
[0038] In a specific implementation of this preferred embodiment, the telescopic rod 32 is oriented in a horizontal plane toward the center of the vacuum hole 2. Generally speaking, wafers are placed on the tray base 1 with the vacuum hole 2 as the center, so by oriented the telescopic rod 32 in a horizontal plane toward the center of the vacuum hole 2, the pressure-blocking structure 4 at the end of the telescopic rod 32 can provide a better limiting effect.
[0039] refer to Figure 3 , Figure 4As shown, in a specific implementation of this preferred embodiment, the pressure-blocking structure 4 includes a pressure piece 41 in the horizontal direction and a baffle 42 in the vertical direction, the baffle 42 is fixed to the end of the telescopic structure 3, and the pressure piece 41 is connected to the baffle 42 with an adjustable height. Specifically, the baffle 42 can be fixed to the end of the telescopic structure 3 by bolts; the pressure piece 41 is connected to the baffle 42 with an adjustable height, and the pressure piece 41 set in this way can adapt to irregular wafers of different heights; when changing irregular wafers of different heights for experiments, it is only necessary to adjust the height of the pressure piece 41 to limit the irregular wafers of different heights.
[0040] refer to Figure 4 As shown, in a specific implementation of this preferred embodiment, two vertical and parallel slide grooves 43 are provided on the baffle 42; two sliders 44 are provided on the side of the pressing plate 41, and the positions of the sliders 44 and the slide grooves 43 correspond. There are two sliders 44 and two slide grooves 43, and the distance between the two sliders 44 is the same as the distance between the two slide grooves 43, so that the two sliders 44 can be respectively located in the two slide grooves 43, and then the pressing plate 41 can move up and down on the baffle 42, that is, the height of the pressing plate 41 can be adjusted.
[0041] refer to Figure 5 As shown, in a specific implementation of this preferred embodiment, the slider 44 is provided with slots 46 on both sides (only one side is shown in the figure, and the other side is symmetrically provided), and a limit shaft 47 is provided in the slot 46; the slide slot 43 is provided with limit holes corresponding to the limit shaft 47 at intervals along the vertical direction on both sides; the limit shaft 47 matches the size of the limit hole, so that the limit shaft 47 can extend into the limit hole, thereby fixing the pressing sheet 41 relative to the blocking sheet 42. Figure 6 As shown, in a specific implementation of this preferred embodiment, a spring 49 is provided at the end of the limiting shaft 47, and the end of the spring 49 is fixed in the slot 46. By applying a force to the limiting shaft 47 in the direction of the spring 49, the spring 49 can be contracted and the limiting shaft 47 can be retracted into the range of the slot 46, thereby releasing the fixed state of the pressing piece 41 relative to the blocking piece 42, and the pressing piece 41 can be freely moved up and down on the blocking piece 42; when the applied force is removed, the spring 49 rebounds, and the limiting shaft 47 extends into the limiting hole, so that the pressing piece 41 can be fixed relative to the blocking piece 42 again.
[0042] refer to Figure 5As shown, in a specific implementation of this preferred embodiment, an auxiliary pressing block 48 is provided on the limiting shaft 47, the auxiliary pressing block 48 is perpendicular to the limiting shaft 47 and is arranged horizontally, and the auxiliary pressing block 48 is located on the limiting shaft 47 at one end close to the spring 49. In specific use, applying force to the auxiliary pressing block 48 can shrink the spring 49 and retract the limiting shaft 47 into the range of the slot 46; removing the force applied to the auxiliary pressing block 48 can make the spring 49 rebound and the limiting shaft 47 extend into the limiting hole.
[0043] refer to Figure 4 , Figure 5 As shown, a limit plate 45 is provided at one end of the slider 44, and the length of the limit plate 45 is greater than the width of the slide slot 43. In specific use, the limit plate 45 is located on the other side of the stopper 42 relative to the pressing plate 41, and when the spring 49 contracts and the limit shaft 47 retracts into the range of the slot 46, it can prevent the slider 44 from accidentally falling out of the slide slot 43 due to the upward and downward movement of the pressing plate 41.
[0044] In summary, the utility model provides a glue spreading tray suitable for irregular wafers. When in use, the position of the telescopic rod can be adjusted according to the shape of the wafer, so that the irregular wafer can be fixed during glue spreading. When the adsorption force of the vacuum hole is insufficient, the wafer can also be ensured to rotate at high speed without being thrown away, thereby greatly improving the safety of the glue spreading process.
[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.
Claims
1. A glue-spreading tray suitable for irregular wafers, characterized in that: The invention comprises a tray base (1), wherein a vacuum hole (2) is arranged in the middle of the tray base (1), and at least three telescopic structures (3) are arranged on the side of the tray base (1), one end of the telescopic structure (3) is fixed to the side of the tray base (1), and the other end of the telescopic structure (3) is connected to a pressure-blocking structure (4) and extends toward the middle of the tray base (1).
2. The glue dispensing tray for irregular wafers according to claim 1, characterized in that: The telescopic structure (3) comprises a fixing plate (31) and a telescopic rod (32); the fixing plate (31) is fixed to the side of the pallet base (1), and the fixing plate (31) is higher than a portion of the pallet base (1); one end of the telescopic rod (32) is fixed to a portion of the fixing plate (31) higher than the pallet base (1); the other end of the telescopic rod (32) is connected to the pressure-blocking structure (4) and extends toward the middle of the pallet base (1).
3. The adhesive dispensing tray for irregular wafers according to claim 2, characterized in that: The telescopic rod (32) is oriented toward the center of the vacuum hole (2) on a horizontal plane.
4. The glue dispensing tray for irregular wafers according to claim 1, characterized in that: The pressure-blocking structure (4) comprises a pressure plate (41) in the horizontal direction and a blocking plate (42) in the vertical direction; the blocking plate (42) is fixed to the end of the telescopic structure (3); and the pressure plate (41) is connected to the blocking plate (42) in an adjustable height.
5. The adhesive dispensing tray for irregular wafers according to claim 4, characterized in that: Two vertical and parallel sliding grooves (43) are arranged on the blocking plate (42); two sliding blocks (44) are arranged on the side of the pressing plate (41), and the positions of the sliding blocks (44) correspond to those of the sliding grooves (43).
6. The glue-spreading tray for irregular wafers according to claim 5, characterized in that: Slots (46) are provided on both sides of the slider (44), and a limiting shaft (47) is provided in the slot (46); limiting holes corresponding to the limiting shaft (47) are provided at intervals along the vertical direction on both sides of the slide groove (43); a spring (49) is provided at the end of the limiting shaft (47), and the end of the spring (49) is fixed in the slot (46).
7. The glue spreading tray applicable to irregular wafers according to claim 6, characterized in that: An auxiliary pressing block (48) is arranged on the limiting shaft (47). The auxiliary pressing block (48) is perpendicular to the limiting shaft (47) and is arranged transversely. The auxiliary pressing block (48) is located on one end of the limiting shaft (47) close to the spring (49).
8. The glue spreading tray applicable to irregular wafers according to claim 6, characterized in that: A limiting piece (45) is provided at one end of the sliding block (44), and the length of the limiting piece (45) is greater than the width of the sliding groove (43).
9. The glue spreading tray for irregular wafers according to any one of claims 1 to 7, characterized in that: The telescopic structures (3) are arranged at equal angles on the side of the tray base (1).
10. The glue spreading tray applicable to irregular wafers according to any one of claims 1 to 7, characterized in that: The tray base (1) can be of any shape.