Liquid cooling radiator
By designing an equidistantly distributed fins and integrated molding structure in the liquid-cooled radiator, the problems of unstable welding fixation and uneven fin spacing are solved, and a more balanced and stable heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202323553674.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-25
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-25
AI Technical Summary
Existing liquid-cooled radiators are prone to false welding during welding and fixing, resulting in uneven heat conduction, and the interlaced distribution of heat dissipation fins is difficult to ensure the uniform spacing between adjacent fins, resulting in unstable heat dissipation effect.
Design a liquid-cooled radiator, including a base, a heat conductor and a heat dissipation groove. The heat dissipation member forms an annular flow channel with the inner wall of the groove, and the heat dissipation fin is distributed equidistantly to form an integrated molding structure to improve the heat conduction efficiency and pass through copper alloy Materials and processing methods ensure consistent thickness and uniform spacing.
The balance and stability of the heat dissipation effect are achieved, the heat conduction efficiency and heat dissipation efficiency are improved, the problem of welding and dummy welding is avoided, and the uniformity of the heat dissipation effect is ensured.
Smart Images
Figure CN222145479U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a liquid cooling radiator. Background Art
[0002] A radiator is a device that transfers the heat generated by machinery or other equipment in the process of operation in a timely manner to avoid affecting its normal operation. Radiators can be roughly divided into air cooling, heat pipe radiator, liquid cooling, semiconductor cooling, compressor cooling and other types according to the heat dissipation method.
[0003] In the computer industry, computer CPU heat dissipation has always been a key issue that users pay attention to, and the quality of heat dissipation is directly related to the stable state of the CPU when overclocking. For example, the Chinese utility model patent with the publication number CN219736037U discloses a liquid cooling radiator structure, in which two water nozzles are arranged on the outer side of the radiator shell, and the radiator includes a groove cavity, a heat dissipation cover plate, a water nozzle and a heat dissipation fin. The middle part of the groove cavity is provided with a liquid cooling cavity through the upper and lower parts, and the liquid cooling cavity is provided with an assembly step symmetrically on the transverse axis, and the assembly steps are provided with a heat dissipation cover plate. The liquid cooling cavity is provided with a heat dissipation fin inside, and the heat dissipation fin is connected to the heat dissipation cover plate. The water nozzle is provided on the outer side of the liquid cooling cavity, and the upper and lower sides of the groove cavity are provided with a heat dissipation cover plate. The heat dissipation cover plate is connected to the groove cavity by stir friction welding, and the heat dissipation fin gaps on the upper and lower surfaces of the heat dissipation cover plate are plugged into each other. In this way, the water nozzles on both sides of the groove cavity are respectively connected to the cold water pipe, and then the heat dissipation cover plate is fitted and installed on the chip, so that the heat of the chip is transferred to the heat dissipation fins, and then the liquid flows through the heat dissipation fins to achieve heat dissipation and cooling.
[0004] However, the existing radiator structure has the following problems: first, the heat dissipation cover is fixed on the groove cavity by welding, and the problem of cold welding is easy to occur during welding, which will affect heat conduction; second, the heat dissipation fins are arranged on two heat dissipation cover plates respectively. When the two heat dissipation cover plates are interlocked on the opposite sides of the groove cavity, the heat dissipation fins on the two heat dissipation cover plates are arranged alternately in sequence. In this way, although the heat dissipation fins on a single heat dissipation cover plate are equidistantly distributed structures, when the two heat dissipation cover plates are interlocked, the heat dissipation fins on the two heat dissipation cover plates are arranged alternately in sequence, and it is difficult to ensure that any two adjacent heat dissipation fins maintain the same spacing, which will cause the heat dissipation cover plate to have a problem of fast local heat dissipation and slow local heat dissipation, that is, the heat dissipation effect is not stable enough. Therefore, in order to solve this technical problem, a liquid cooling radiator of the present application is proposed. Utility Model Content
[0005] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a liquid cooling radiator with balanced heat dissipation effect at all locations and stable heat dissipation.
[0006] The purpose of this utility model is achieved through the following technical solutions:
[0007] A liquid cooling radiator, comprising:
[0008] A base, wherein a heat-conducting seat is arranged on one side surface of the base, and a heat-dissipating groove is opened on the other side surface of the base, and the heat-dissipating groove is aligned with the heat-conducting seat;
[0009] A heat sink, wherein the heat sink is arranged on the inner bottom wall of the heat sink groove, and a gap is arranged between the heat sink and the inner side wall of the heat sink groove so that an annular flow channel is formed between the heat sink and the inner side wall of the heat sink groove. The heat sink includes a plurality of heat sinks, each of which is arranged on the inner bottom wall of the heat sink groove, and each of the heat sinks is equidistantly distributed.
[0010] In one embodiment, the thickness of the heat sink is 0.10 mm to 0.14 mm, and the height of the heat sink is 2.8 mm to 3.4 mm.
[0011] In one embodiment, the thickness of the heat sink is 0.11 mm, and the height of the heat sink is 3 mm.
[0012] In one embodiment, the distance between any two adjacent heat sinks is equal to the thickness of the heat sink.
[0013] In one embodiment, the heat sink, the thermal base, and the base are an integrally formed structure.
[0014] In one embodiment, the substrate is a copper alloy structure.
[0015] In one embodiment, the height of the heat sink is smaller than the depth of the heat dissipation groove.
[0016] In one embodiment, a plurality of mounting holes are formed on the base around the thermal conductive seat.
[0017] In one of the embodiments, a chamfered portion is provided on one of the angles of the base.
[0018] In one embodiment, the number of the heat sinks is 176 to 180.
[0019] Compared with the prior art, the utility model has at least the following advantages:
[0020] The utility model of the liquid cooling radiator includes a base and a heat sink, a heat conducting seat is arranged on one side of the base, a heat dissipation groove is opened on the other side of the base, and the heat dissipation groove is aligned with the heat conducting seat, the heat sink is arranged on the inner bottom wall of the heat dissipation groove, and a gap is arranged between the heat sink and the inner side wall of the heat dissipation groove, so that an annular flow channel is formed between the heat sink and the inner side wall of the heat dissipation groove, and the heat sink includes a plurality of heat sinks, each heat sink is arranged on the inner bottom wall of the heat dissipation groove, and each heat sink is equidistantly distributed between two. In this way, the heat sink, the base, and the heat sink are an integrated structure, so that the heat of the heat sink can be better conducted to each heat sink, and each heat sink can be ensured to be a structure equidistant between two. Compared with the liquid cooling radiator structure of the prior art, the heat dissipation effect at each position is more balanced and stable. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 This is a schematic structural diagram of a liquid cooling radiator according to one embodiment of the present utility model;
[0023] Figure 2 for Figure 1 A top view of a liquid cooling radiator is shown;
[0024] Figure 3 for Figure 1 A schematic cross-sectional structure diagram of a liquid cooling radiator shown;
[0025] Figure 4 for Figure 3 A is a schematic diagram of a local enlarged structure. DETAILED DESCRIPTION
[0026] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings show preferred embodiments of the present invention.
[0027] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0029] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0030] like Figures 1 to 4 As shown, a liquid-cooled radiator 10 includes a base 100 and a heat sink 200, a heat-conducting seat 300 is arranged on one side surface of the base 100, a heat-dissipating groove 110 is opened on the other side surface of the base 100, and the heat-dissipating groove 110 is aligned with the heat-dissipating seat 300, the heat-dissipating element 200 is arranged on the inner bottom wall of the heat-dissipating groove 110, and a gap is arranged between the heat-dissipating element 200 and the inner side wall of the heat-dissipating groove 110 so that an annular flow channel 111 is formed between the heat-dissipating element 200 and the inner side wall of the heat-dissipating groove 110, and the heat-dissipating element 200 includes a plurality of heat-dissipating fins 210, each of the heat-dissipating fins 210 is arranged on the inner bottom wall of the heat-dissipating groove 110, and each heat-dissipating fin 210 is equidistantly distributed between each other.
[0031] It should be noted that a heat sink 300 is provided on one side of the base 100, and a heat sink groove 110 is provided on the other side of the base 100, wherein the projections of the heat sink groove 110 and the heat sink 300 on the base 100 overlap with each other, that is, the heat sink groove 110 and the heat sink 300 are aligned with each other. In one embodiment, the heat sink 300 and the base 100 are an integrally formed structure. Further, in one embodiment, the height of the heat sink 300 is 3.51 mm. In this way, the heat sink 300 is easy to fit closely with the CPU. Further, the heat sink 200 is located on the inner bottom wall of the heat sink groove 110, wherein the four sides of the heat sink 200 are all provided with a distance from the inner side wall of the heat sink groove 110, so that an annular flow channel 111 of an annular structure is formed between the heat sink 200 and the inner side wall of the heat sink groove 110. When cold water enters from one end of the annular flow channel 111, it can flow through the heat sink 200 and then flow out from the other end of the annular flow channel 111. Furthermore, the heat sink 200 includes a plurality of heat sinks 210, each of which is located on the inner bottom wall of the heat dissipation groove 110, and the distance between each two of the heat sinks 210 is equal. In one embodiment, the heat sink 210 and the inner bottom wall of the heat dissipation groove 110 of the base 100 are also an integrally formed structure. In this way, when cold water flows along the annular flow channel 111, the cold water can flow between the heat sinks 210, so that the heat on the heat sink 300 is fully exchanged, and finally the hot water flows out of each heat sink 210 along the annular flow channel 111. It should be noted that the heat sink 300, the base 100, and the heat sink 210 are an integrally formed structure, so that the heat of the heat sink 300 can be better conducted to each heat sink 210, and each heat sink 210 is set to a structure with equal distances between two. Compared with the liquid-cooled radiator structure of the prior art, the heat dissipation effect at each position is more balanced and stable. It should be noted that the liquid-cooled radiator 10 of the present application needs to be used in conjunction with a cover plate, which is used to cover the heat dissipation groove 110 so that the liquid flows in the heat dissipation groove 110 along between the heat dissipation fins 210 to take away heat.
[0032] like Figure 4 As shown, in one embodiment, the thickness D of the heat sink 210 is 0.10 mm to 0.14 mm, and the height H of the heat sink 210 is 2.8 mm to 3.4 mm.
[0033] Thus, compared to the existing heat sink fins with excessive thickness, the thickness D of the heat sink 210 of the present application is 0.1 mm to 0.14 mm. Due to the small thickness, the efficiency of heat conduction from the heat sink 210 to the liquid can be accelerated, thereby improving the heat dissipation efficiency. For example, the thickness D of the heat sink 210 can also be 0.11 mm, or 0.12 mm, or 0.13 mm. Furthermore, the height H of the heat sink 210 can be set to 2.9 mm, or 3.0 mm, or 3.1 mm, or 3.2 mm, or 3.3 mm.
[0034] like Figure 4 As shown, in one embodiment, the distance E between any two adjacent heat sinks 210 is equal to the thickness D of the heat sink 210. In this way, the thickness of the heat sink 210 and the interval between the heat sinks 210 are equidistant structures, and when the liquid flows between the heat sinks 210, it can better take away the heat of the heat sink 210.
[0035] In one embodiment, the substrate 100 is a copper alloy structure, and further, each heat sink 210 is formed by a scraping process, so that the thickness of each heat sink 210 can be kept consistent, and the distance between any two adjacent heat sinks 210 is equal to the thickness of the heat sink 210 .
[0036] In one embodiment, the height H of the heat sink 210 is smaller than the depth of the heat dissipation groove 110. In this way, when the cover plate is covered on the base 100, it can ensure that the heat dissipation groove 110 maintains sufficient sealing performance.
[0037] like Figures 1 to 3 As shown, in one embodiment, a plurality of mounting holes 120 are provided on the base 100 around the heat conducting seat 300. Thus, through each mounting hole 120, the base 100 can be easily mounted and fixed to the cover plate, for example, by screwing screws into the mounting holes 120.
[0038] like Figure 1 and Figure 2 As shown, in one embodiment, a chamfered portion 130 is provided on one of the angles of the base 100. Thus, the chamfered portion 130 facilitates the liquid cooling radiator 10 to determine the installation direction during installation.
[0039] In one embodiment, the number of the heat sinks 210 is 176 to 180. For example, the number of the heat sinks 210 may also be 177, 178, or 179. Thus, by providing a plurality of heat sinks 210, a heat dissipation channel is formed between each two adjacent heat sinks 210, so that when the liquid flows through each heat dissipation channel, the heat on the heat sink 210 can be taken away.
[0040] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A liquid cooling radiator, characterized in that: include: A base, wherein a heat-conducting seat is arranged on one side surface of the base, and a heat-dissipating groove is opened on the other side surface of the base, and the heat-dissipating groove is aligned with the heat-conducting seat; A heat sink, wherein the heat sink is arranged on the inner bottom wall of the heat sink groove, and a gap is arranged between the heat sink and the inner side wall of the heat sink groove so that an annular flow channel is formed between the heat sink and the inner side wall of the heat sink groove. The heat sink includes a plurality of heat sinks, each of which is arranged on the inner bottom wall of the heat sink groove, and each of the heat sinks is equidistantly distributed.
2. The liquid cooling radiator according to claim 1, characterized in that: The thickness of the heat sink is 0.10 mm to 0.14 mm, and the height of the heat sink is 2.8 mm to 3.4 mm.
3. The liquid cooling radiator according to claim 2, characterized in that: The thickness of the heat sink is 0.11 mm, and the height of the heat sink is 3 mm.
4. The liquid cooling radiator according to claim 3, characterized in that: The distance between any two adjacent heat sinks is equal to the thickness of the heat sink.
5. The liquid cooling radiator according to claim 1 or 4, characterized in that: The heat sink, the heat conducting seat and the base are an integrally formed structure.
6. The liquid cooling radiator according to claim 5, characterized in that: The substrate is a copper alloy structure.
7. The liquid cooling radiator according to claim 3, characterized in that: The height of the heat sink is smaller than the depth of the heat dissipation groove.
8. The liquid cooling radiator according to claim 1, characterized in that: A plurality of mounting holes are provided on the base body around the heat conducting seat.
9. The liquid cooling radiator according to claim 1, characterized in that: A chamfered portion is provided on one of the included angles of the base.
10. The liquid cooling radiator according to claim 1, characterized in that: The number of the heat sinks is 176 to 180.