Light emitting device, packaging method and optical module

Abstract

The invention discloses a light emitting device, a packaging method and an optical module. The light emitting device comprises a metal base, an insulating diversion layer, a pipe cap, a lens, a laser chip, a refrigerator assembly and an adapter assembly. The pipe cap is connected to the metal base in a covering mode to form a sealed cavity, and an insulating flow guide layer, a lens, a laser chip and a refrigerator assembly are arranged in the sealed cavity. The insulating diversion layer is connected between the metal base and the refrigerator assembly; a plurality of bismuth antimonide particles are sequentially connected to the upper surface of the insulating diversion layer; the cold surface substrate is connected to the upper surfaces of the bismuth antimonide particles; the upper surface of the cold face substrate is connected with a heat transfer conductive piece which is connected with the first substrate and the second substrate. The thermistor is arranged on the first substrate; the lens is arranged on the heat-transfer conductive part; the laser chip is arranged on the second substrate; the adapter assembly is connected to the outer side of the pipe cap. The heat dissipation efficiency is effectively improved, and the service life is prolonged.

Description

Technical Field

[0001] The present invention relates to the fields of data communication center, Internet of Things cloud, sensing, and mapping technology, and in particular to a light emitting device, a packaging method, and an optical module. Background Art

[0002] In the application process of light emitting devices, laser chips, as core components, will generate a certain amount of heat when working. If this heat is not effectively controlled, it will have a negative impact on the performance of the chip and even shorten its service life. Therefore, in order to ensure that the laser chip can work stably for a long time under the best conditions and extend its designed service life as much as possible, it is particularly important to effectively control the temperature of the laser chip.

[0003] As an efficient temperature control device, the working principle of semiconductor cooler is based on Peltier effect. By changing the positive and negative polarity of the current, the semiconductor cooler can absorb and release heat, thereby achieving the cooling effect. In the light emitting device, the semiconductor cooler effectively conducts the heat generated by the laser chip through the hot surface substrate, thereby regulating the temperature of the laser chip and ensuring that the chip is always in an ideal constant temperature state.

[0004] The heat dissipation efficiency of semiconductor coolers is crucial to the temperature control effect of the chip. If the heat dissipation efficiency is low, the heat generated by the laser chip cannot be effectively conducted, causing the chip temperature to rise, affecting its performance and life. Therefore, how to improve the heat dissipation efficiency of semiconductor coolers has become an indispensable focus in the design of light emitting devices. Summary of the invention

[0005] In order to effectively improve the heat dissipation effect of a light emitting device and prolong the service life of the light emitting device, the present invention provides a light emitting device, a packaging method and an optical module.

[0006] In a first aspect, an embodiment of the present invention provides a light emitting device, comprising: a metal base, an insulating guide layer, a cap, a lens, a laser chip, a refrigerator assembly, and an adapter assembly;

[0007] The tube cap is connected to the metal base to form a sealed cavity, in which the insulating guide layer, the lens, the laser chip and the refrigerator assembly are arranged;

[0008] The insulating conductive layer is connected between the metal base and the refrigerator assembly, and is used to isolate the metal base from electrical conduction with the refrigerator assembly, so that the internal circuit of the refrigerator assembly is turned on and the heat is conducted to the metal base;

[0009] The refrigerator assembly includes a cold surface substrate, a thermistor, a plurality of bismuth antimonide particles, a heat transfer and electrical conductor, a first substrate, and a second substrate;

[0010] The plurality of bismuth antimonide particles are sequentially connected to the upper surface of the insulating conductive layer;

[0011] The cold surface substrate is connected to the upper surface of the plurality of bismuth antimonide particles;

[0012] The upper surface of the cold surface substrate is connected to the heat transfer conductive member, and the heat transfer conductive member connects the first substrate and the second substrate;

[0013] The thermistor is disposed on the first substrate;

[0014] The lens is arranged on the heat transfer and electrical conductive member;

[0015] The laser chip is disposed on the second substrate and is arranged close to the thermistor;

[0016] The adapter assembly is connected to the outer side of the tube cap, and the adapter assembly, the lens and the laser chip are coaxially arranged.

[0017] Optionally, the insulating guide layer includes an insulating layer and a guide layer;

[0018] The insulating layer is connected to the metal base;

[0019] The guide layer is connected to the upper surface of the insulating layer;

[0020] The plurality of bismuth antimonide particles are sequentially connected to the upper surface of the guide layer.

[0021] Optionally, the adapter assembly includes an adjustment ring and an optical port adapter;

[0022] The adjustment ring is sleeved on the outer periphery of the optical port adapter;

[0023] The optical port adapter is connected to the outer side of the tube cap and coupled with the laser chip.

[0024] Optionally, the light emitting device further comprises a plurality of penetrating needles;

[0025] A plurality of penetration needles are inserted through the metal base and are electrically connected to the thermistor and the laser chip respectively.

[0026] Optionally, the light emitting device further includes a bonding capacitor and a backlight monitoring chip;

[0027] The bonding capacitor and the backlight monitoring chip are arranged on the first substrate.

[0028] In a second aspect, an embodiment of the present invention provides a packaging method for a light emitting device, comprising the following steps:

[0029] Spray the insulating guide layer on the center of the metal base;

[0030] Mounting a plurality of bismuth antimonide particles on the upper surface of the insulating conductive layer in sequence, and mounting a cold surface substrate on the upper surface of the plurality of bismuth antimonide particles;

[0031] Installing a heat transfer conductive member on the upper surface of the cold surface substrate, and mounting a first substrate and a second substrate on the heat transfer conductive member;

[0032] Mounting the laser chip on the second substrate;

[0033] coupling the laser chip with a lens, and connecting the lens to the heat transfer and electrical conductive member;

[0034] Mounting a thermistor on the first substrate and placing it close to the laser chip;

[0035] Connecting the tube cap to the metal base;

[0036] The laser chip is coupled to an adapter assembly, and the adapter assembly is fixed to the tube cap.

[0037] Optionally, coupling the laser chip with a lens and connecting the lens to the heat transfer and electrical conductive member comprises the following steps:

[0038] The lens is placed on the heat transfer and electrical conductive member, the laser chip is driven to emit light and form a light source, and the light source passes through the lens;

[0039] Using a beam quality analyzer to detect the spot quality of the light source passing through the lens, and fine-tuning the position of the lens until the spot quality meets the preset requirements;

[0040] The lens and the heat transfer and electrical conductive component are fixed by glue spotting.

[0041] Optionally, the light spot quality includes a light spot diameter;

[0042] The light spot quality meeting the preset requirement is set as the light spot diameter reaching a minimum value.

[0043] Optionally, the adapter assembly includes an adjustment ring and an optical port adapter;

[0044] The step of coupling the laser chip to the adapter assembly comprises the following steps:

[0045] Sleeve the adjustment ring on the optical port adapter, and connect the optical port adapter to an optical power meter;

[0046] The laser chip is driven to emit light and form a light source, the light source passes through the optical port adapter, and the optical power meter detects the power of the light source;

[0047] Adjust the position of the adjustment ring until the power detected by the optical power meter reaches a preset interval value, fix the adjustment ring to the optical port adapter, adjust the position of the optical port adapter until the power detected by the optical power meter reaches a preset value, fix the optical port adapter to the tube cap, and fix the adapter assembly to the tube cap.

[0048] Optionally, the step of sequentially installing a plurality of bismuth antimonide particles on the upper surface of the insulating conductive layer and mounting a cold surface substrate on the upper surface of the plurality of bismuth antimonide particles comprises the following steps:

[0049] The plurality of bismuth antimonide particles are sequentially mounted on the upper surface of the insulating conductive layer by a chip mounter, and solder is applied spot-on, and the metal base is placed in an oven for baking, so that the solder forms a semi-fluid state;

[0050] The cold surface substrate is mounted on the upper surface of the plurality of bismuth antimonide particles by the chip mounter, and the metal base is placed in an oven for baking until the solder is completely solidified.

[0051] In a third aspect, an embodiment of the present invention provides an optical module, comprising an optical receiving component and the optical emitting device described in the first aspect.

[0052] The beneficial effects of the above technical solution provided in the embodiments of the present invention include at least:

[0053] In the light emitting device provided in the embodiment of the present invention, the metal base replaces the traditional ceramic heat surface substrate. By arranging an insulating conductive layer between the metal base and the refrigerator assembly, the metal base and the refrigerator assembly can be effectively isolated from each other, thereby playing a role of electrical isolation and preventing electrical short circuits to ensure the safe operation of the equipment. At the same time, the insulating conductive layer enables the internal circuit of the refrigerator assembly to be conductive, and effectively conducts heat to the metal base, and dissipates heat through the metal base, which not only ensures the normal conduction of the circuit of the refrigerator assembly, but also optimizes the heat dissipation performance of the entire light emitting device, thereby extending the service life of the light emitting device.

[0054] By sequentially connecting a metal base, an insulating conductive layer, a plurality of bismuth antimonide particles, a cold surface substrate and a heat transfer conductive member, and arranging a second substrate on the heat transfer conductive member, and arranging a laser chip on the second substrate, the heat generated by the laser chip can be sequentially transferred to the metal base through the second substrate, the heat transfer conductive member, the cold surface substrate, a plurality of bismuth antimonide particles, and the insulating conductive layer, and the heat bismuth antimonide particles use the thermoelectric effect to reduce the operating temperature of the laser chip; at the same time, since the metal base has good thermal conductivity, the remaining heat after being treated with the bismuth antimonide particles continues to be conducted to the external environment through the metal base.

[0055] The metal base can play a role in heat dissipation. The entire metal base forms a large heat sink. Compared with the ceramic heat surface substrate, its heat dissipation area is significantly increased, which helps to more effectively conduct heat to the external environment, thereby improving heat dissipation efficiency; the thermal conductivity of metal materials is usually better than that of ceramic materials, so the metal base can conduct heat more quickly, reduce the operating temperature of the laser chip, and improve the stability and reliability of the entire device. Through the coordinated work of the cooler assembly and the metal base, efficient heat dissipation performance is achieved, ensuring that the laser chip operates at a stable operating temperature, thereby extending the service life of the light-emitting device and improving its reliability. Since the entire device reduces the use of ceramic heat surface substrates, it effectively reduces costs and simplifies the structure.

[0056] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0057] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0059] Figure 1 is a schematic structural diagram of a light emitting device provided by an embodiment of the present invention;

[0060] Figure 2 is a schematic structural diagram of a refrigerator assembly provided by an embodiment of the present invention;

[0061] Figure 3 is an internal packaging diagram provided by an embodiment of the present invention;

[0062] Figure 4 is a flow chart of a packaging method for a light emitting device provided by an embodiment of the present invention;

[0063] Description of reference numerals:

[0064] 1. Metal base; 2. Insulating guide layer; 3. Tube cap; 4. Lens; 5. Laser chip; 6. Refrigerator assembly; 61. Cold surface substrate; 62. Thermistor; 63. Bismuth antimonide particles; 64. Heat transfer and conductive parts; 65. First substrate; 66. Second substrate; 7. Adapter assembly; 8. Through needle; 9. Bonding capacitor; 10. Backlight monitoring chip. DETAILED DESCRIPTION

[0065] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0066] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "far", "near", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0067] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0068] Embodiment 1

[0069] See also Figure 1-Figure 3, this embodiment provides a light emitting device, which includes: a metal base 1, an insulating guide layer 2, a cap 3, a lens 4, a laser chip 5, a refrigerator assembly 6 and an adapter assembly 7. The cap 3 is connected to the metal base 1 to form a sealed cavity, and the insulating guide layer 2, the lens 4, the laser chip 5 and the refrigerator assembly 6 are arranged in the sealed cavity to protect these components from the external environment (such as dust, moisture, temperature changes, etc.), which can ensure that the light emitting device can operate stably under various environmental conditions, which not only improves the reliability and durability of the light emitting device, but also provides a guarantee for the efficient use of the light emitting device in various application scenarios.

[0070] The insulating conductive layer 2 is connected between the metal base 1 and the refrigerator assembly 6, and is used to isolate the metal base 1 from electrical conduction with the refrigerator assembly 6, thereby playing the role of electrical isolation and preventing electrical short circuits to ensure the safe operation of the equipment; the insulating conductive layer 2 enables the internal circuit of the refrigerator assembly 6 to be conductive, and effectively conducts heat to the metal base 1, and dissipates heat through the metal base 1, which not only ensures the normal conduction of the circuit of the refrigerator assembly 6, but also optimizes the heat dissipation performance of the entire light emitting device, thereby extending the service life of the light emitting device.

[0071] The refrigerator assembly 6 includes a cold surface substrate 61, a thermistor 62, a plurality of bismuth antimonide particles 63, a heat transfer conductive member 64, a first substrate 65 and a second substrate 66. The plurality of bismuth antimonide particles 63 are sequentially connected to the upper surface of the insulating conductive layer 2, and the refrigeration function is realized by using the thermoelectric effect; the cold surface substrate 61 is connected to the upper surface of the plurality of bismuth antimonide particles 63, and the cold surface substrate 61 absorbs and takes away the heat generated by the laser chip 5; the upper surface of the cold surface substrate 61 is connected to the heat transfer conductive member 64, and the heat transfer conductive member 64 is connected to the first substrate 65 and the second substrate 66. On the one hand, the heat transfer conductive member 64 serves as a support carrier for the thermistor 62, the laser chip 5 and other components, and on the other hand, ensures that the heat generated by the laser chip 5 is effectively transferred to the cold surface substrate 61. The thermistor 62 is disposed on the first substrate 65. The thermistor 62 is used to monitor the operating temperature of the laser chip 5. When the operating temperature exceeds a preset value, the cold surface substrate 61 and the bismuth antimonide particles 63 can be triggered to dissipate heat for the laser chip 5, thereby preventing the laser chip 5 from being overheated and damaged, ensuring that the performance of the laser chip 5 reaches the optimal level, thereby extending the service life of the laser chip 5 and improving its reliability.

[0072] The lens 4 is arranged on the heat transfer and conductive member 64, and the lens 4 is coupled with the laser chip 5 to focus and shape the light emitted by the laser chip 5, thereby optimizing the output quality and directionality of the light. The laser chip 5 is arranged on the second substrate 66, and is arranged close to the thermistor 62, so that the thermistor 62 can monitor the working temperature of the laser chip 5 in real time and make adjustments. The adapter assembly 7 is connected to the outside of the cap 3 for connection with an external device or circuit, and the adapter assembly 7, the lens 4 and the laser chip 5 are coaxially arranged to ensure accurate transmission of the light, that is, after the light is emitted from the laser chip, it can be focused and shaped by the lens and transmitted to the adapter assembly along a predetermined path, and then connected to the external device or circuit; at the same time, the coaxial arrangement also helps to maintain the compactness of the light emitting device, reducing the volume and weight of the entire light emitting device.

[0073] When the laser chip 5 is working, heat is generated. The thermistor 62 monitors the working temperature of the laser chip 5 in real time and feeds back the signal to the control system to adjust the working state of the cold surface substrate 61 and the plurality of bismuth antimonide particles 63. The heat generated by the laser chip 5 is transferred to the metal base 1 through the second substrate 66, the heat transfer conductive member 64, the cold surface substrate 61, the plurality of bismuth antimonide particles 63, and the insulating conductive layer 2. The heat bismuth antimonide particles 63 use the thermoelectric effect to reduce the working temperature of the laser chip 5; at the same time, since the metal base 1 has good thermal conductivity, the remaining heat after being processed by the bismuth antimonide particles 63 continues to be conducted to the external environment through the metal base 1. In this embodiment, through the coordinated work of the refrigerator assembly 6 and the metal base 1, efficient heat dissipation performance is achieved, ensuring that the laser chip 5 operates at a stable working temperature, thereby extending the service life of the light emitting device and improving its reliability.

[0074] In the prior art, the ceramic heat surface substrate and the metal base 1 are bonded, and the difference in thermal conductivity between ceramic and metal leads to poor heat conversion efficiency; and the heat dissipation area of ​​the ceramic heat surface substrate is relatively small, which limits the effective conduction of heat to the external environment. In this embodiment, the metal base 1 replaces the traditional ceramic heat surface substrate to play a role in heat dissipation. The entire metal base 1 forms a large heat sink, and its heat dissipation area is significantly increased compared to the ceramic heat surface substrate, which helps to more effectively conduct heat to the external environment, thereby improving the heat dissipation efficiency. The thermal conductivity of metal materials is generally better than that of ceramic materials, so the metal base 1 can conduct heat more quickly, reduce the operating temperature of the laser chip 5, and improve the stability and reliability of the entire device. Since the entire device reduces the use of ceramic heat surface substrates, the cost is effectively reduced and the structure is simplified.

[0075] In this embodiment, the heat transfer conductive member 64 connects the first substrate 65 and the second substrate 66, the thermistor 62 is arranged on the first substrate 65, and the laser chip 5 is arranged on the second substrate 66. The laser chip 5 and the thermistor 62 are respectively placed on different substrates. This can reduce the thermal interference of the laser chip 5 on the thermistor 62 when the thermistor 62 is monitoring the temperature, ensure that the thermistor 62 can accurately reflect the operating temperature of the laser chip 5, and make the temperature monitoring data of the thermistor 62 more accurate, which helps to maintain the stable operating temperature of the laser chip 5, improve the reliability, and help optimize the performance of the laser chip 5.

[0076] In one specific implementation, see Figure 2 , the insulating conductive layer 2 includes an insulating layer (not shown in the figure) and a conductive layer (not shown in the figure). The insulating layer is connected to the metal base 1, the conductive layer is connected to the upper surface of the insulating layer, and a plurality of bismuth antimonide particles 63 are sequentially connected to the upper surface of the conductive layer. Since the metal base 1 and the bismuth antimonide particles 63 are both made of metal, by providing an insulating layer, direct electrical contact between the metal base 1 and the bismuth antimonide particles 63 is avoided to prevent current short circuit. The insulating layer is usually made of a material with high resistivity, good thermal stability and mechanical strength, such as ceramics, polymers or glass. The conductive layer is located on the upper surface of the insulating layer, and the conductive layer is in contact with the plurality of bismuth antimonide particles 63, ensuring that the circuits of the plurality of bismuth antimonide particles 63 and the cold surface substrate 61 are normally connected, while maintaining good thermal contact with the insulating layer to effectively transfer heat. The guide layer has good electrical conductivity and thermal conductivity and can be made of metal or alloy materials. In order to avoid the problem of reduced thermal conductivity due to material differences, the guide layer can be made of the same material as the metal base 1, which can not only reduce thermal resistance and effectively ensure heat dissipation efficiency, but also improve the stability and reliability of the overall structure.

[0077] In one specific implementation, see Figure 1 The adapter assembly 7 includes an adjustment ring and an optical port adapter. The adjustment ring is sleeved on the outer periphery of the optical port adapter. The optical port adapter is connected to the outer side of the tube cap 3. The optical port adapter is responsible for leading the light from the laser chip 5 to the external optical fiber or other optical components. The optical port adapter is coupled with the laser chip 5 to ensure that the light loss is minimized and can be transmitted efficiently.

[0078] In one specific implementation, see Figure 1-Figure 3The light emitting device also includes a plurality of penetration needles 8, which are used to electrically connect to the electrical components in the light emitting device. The plurality of penetration needles 8 are arranged on the metal base 1, and are electrically connected to the thermistor 62 and the laser chip 5 respectively. Specifically, one end of the penetration needle 8 is inserted into the sealed cavity and is electrically connected to the electrical components such as the thermistor 62 and the laser chip 5. The other end of the penetration needle 8 is arranged outside the sealed cavity to facilitate connection with the external circuit. The penetration needle 8 can be made of a metal with good conductive properties, such as copper, silver or alloy, to ensure that the current can pass smoothly. The penetration needle 8 provides a stable electrical connection and reduces the risk of failure due to poor contact or looseness.

[0079] In one specific implementation, see Figure 3 , the light emitting device further includes a wire bonding capacitor 9 and a backlight monitoring chip 10, and the wire bonding capacitor 9 and the backlight monitoring chip 10 are arranged on the first substrate 65. The wire bonding capacitor 9 is a miniaturized capacitor, which is usually installed on the first substrate 65 by wire bonding technology (i.e., using thin metal wires for connection), and plays the role of filtering, decoupling and energy storage, etc., which helps to stabilize the power supply voltage and reduce noise interference, and can play a role in optimizing the power management performance of the light emitting device, thereby improving the luminous efficiency and stability of the laser chip 5. The backlight monitoring chip 10 can monitor the backlight intensity generated by the laser chip 5 in real time, and feed this information back to the external circuit, and the external circuit adjusts the driving parameters (such as driving current or voltage) of the laser chip 5 according to this feedback signal to ensure that the output light intensity and light quality of the laser chip 5 remain within a stable range, so as to achieve the purpose of optimizing the performance of the laser chip 5. Through the synergistic effect of the wire bonding capacitor 9 and the backlight monitoring chip 10, the working performance of the laser chip 5 is ensured, thereby improving the luminous efficiency and stability of the laser chip 5.

[0080] Embodiment 2

[0081] Based on the same inventive concept, refer to Figure 4 This embodiment provides a packaging method for a light emitting device, comprising the following steps:

[0082] Step S1, spraying an insulating guide layer at the center of the metal base.

[0083] In step S1, the insulating guide layer includes an insulating layer and a guide layer. The insulating layer is first printed at the center of the metal tube seat, and then the guide layer is sprayed on the insulating layer to form the insulating guide layer.

[0084] Step S2: sequentially install a plurality of bismuth antimonide particles on the upper surface of the insulating conductive layer, and mount a cold surface substrate on the upper surface of the plurality of bismuth antimonide particles.

[0085] In step S2, a plurality of bismuth antimonide particles are sequentially mounted on the upper surface of the insulating guide layer by a chip mounter, and solder is spot-coated, and the metal base is placed in an oven for baking, so that the solder forms a semi-fluid state; a cold surface substrate is mounted on the upper surface of the plurality of bismuth antimonide particles by a chip mounter, and the metal base is placed in an oven for baking until the solder is completely solidified.

[0086] Step S3: installing a heat transfer conductive member on the upper surface of the cold surface substrate, and mounting the first substrate and the second substrate on the heat transfer conductive member.

[0087] Step S4: mounting the laser chip on the second substrate.

[0088] Step S5: coupling the laser chip to the lens, and connecting the lens to the heat transfer and electrical conductive member.

[0089] In step S5, the specific process may include:

[0090] Step S51: placing a lens on the heat transfer and conductive member, driving the laser chip to emit light and form a light source, and the light source passes through the lens.

[0091] Step S52: Use a beam quality analyzer to detect the light spot quality of the light source passing through the lens, and fine-tune the position of the lens until the light spot quality meets the preset requirements.

[0092] In step S52, the light spot quality includes the light spot diameter, and the light spot quality reaching the preset requirement is set as the light spot diameter reaching the minimum value.

[0093] Step S53, fixing the lens and the heat transfer and conductive component by glue.

[0094] Step S6: Mount the thermistor on the first substrate and place it close to the laser chip.

[0095] In step S6, the following steps are also included: using a wire bonding machine to connect the laser chip and thermistor through gold wire bonding to complete the overall circuit bridge packaging.

[0096] Step S7: Cover and connect the tube cap to the metal base.

[0097] In step S7, the metal base and the pipe cap are welded with solder, and then the pipe cap can be seam-welded with a metal pipe body. The metal pipe body can improve the connection strength of the pipe cap and provide welding points for subsequent adapter components.

[0098] Step S8, coupling the laser chip with the adapter assembly, and fixing the adapter assembly to the tube cap.

[0099] In step S8, the adapter assembly includes an adjustment ring and an optical port adapter; coupling the laser chip to the adapter assembly may include the following steps:

[0100] Step S81, sleeve the adjustment ring on the optical port adapter, and connect the optical port adapter to the optical power meter.

[0101] Step S82: The laser chip is driven to emit light and form a light source. The light source passes through the optical port adapter, and the optical power meter detects the power of the light source.

[0102] Step S83, adjust the position of the adjustment ring until the power detected by the optical power meter reaches a preset interval value, and fix the adjustment ring to the optical port adapter; adjust the position of the optical port adapter until the power detected by the optical power meter reaches a preset value, and fix the optical port adapter to the tube cap to fix the adapter assembly to the tube cap.

[0103] In step S83, the preset value is the product of the light emitting power of the laser chip and the coupling efficiency of the lens, the preset interval is set to [preset value-5, preset value+5], and the preset interval value is all values ​​falling within the preset interval.

[0104] Embodiment 3

[0105] Based on the same inventive concept, this embodiment provides an optical module, including a light receiving component and the light emitting device described in the first aspect.

[0106] Obviously, various changes and modifications may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention. The present disclosure is not limited to the precise structure described above and shown in the accompanying drawings, and various changes and modifications may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if these changes and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these changes and modifications.

Claims

1. A light emitting device, characterized in that: include: Metal base, insulating guide layer, cap, lens, laser chip, cooler assembly and adapter assembly; The tube cap is connected to the metal base to form a sealed cavity, in which the insulating guide layer, the lens, the laser chip and the refrigerator assembly are arranged; The insulating conductive layer is connected between the metal base and the refrigerator assembly, and is used to isolate the metal base from electrical conduction with the refrigerator assembly, so that the internal circuit of the refrigerator assembly is turned on and the heat is conducted to the metal base; The refrigerator assembly includes a cold surface substrate, a thermistor, a plurality of bismuth antimonide particles, a heat transfer and electrical conductor, a first substrate, and a second substrate; The plurality of bismuth antimonide particles are sequentially connected to the upper surface of the insulating conductive layer; The cold surface substrate is connected to the upper surface of the plurality of bismuth antimonide particles; The upper surface of the cold surface substrate is connected to the heat transfer conductive member, and the heat transfer conductive member connects the first substrate and the second substrate; The thermistor is disposed on the first substrate; The lens is arranged on the heat transfer and electrical conductive member; The laser chip is disposed on the second substrate and is arranged close to the thermistor; The adapter assembly is connected to the outer side of the tube cap, and the adapter assembly, the lens and the laser chip are coaxially arranged.

2. The light emitting device according to claim 1, wherein The insulating conductive layer comprises an insulating layer and a conductive layer; The insulating layer is connected to the metal base; The guide layer is connected to the upper surface of the insulating layer; The plurality of bismuth antimonide particles are sequentially connected to the upper surface of the guide layer.

3. The light emitting device according to claim 2, characterized in that The adapter assembly includes an adjustment ring and an optical port adapter; The adjustment ring is sleeved on the outer periphery of the optical port adapter; The optical port adapter is connected to the outer side of the tube cap and coupled with the laser chip.

4. The light emitting device according to claim 3, characterized in that Also included are a plurality of penetration needles; A plurality of penetration needles are inserted through the metal base and are electrically connected to the thermistor and the laser chip respectively.

5. The light emitting device according to any one of claims 1 to 4, characterized in that: It also includes bonding capacitors and backlight monitoring chips; The bonding capacitor and the backlight monitoring chip are arranged on the first substrate.

6. A packaging method for a light emitting device, characterized in that: The following steps are involved: Spray the insulating guide layer on the center of the metal base; Mounting a plurality of bismuth antimonide particles on the upper surface of the insulating conductive layer in sequence, and mounting a cold surface substrate on the upper surface of the plurality of bismuth antimonide particles; Installing a heat transfer conductive member on the upper surface of the cold surface substrate, and mounting a first substrate and a second substrate on the heat transfer conductive member; Mounting the laser chip on the second substrate; coupling the laser chip with a lens, and connecting the lens to the heat transfer and electrical conductive member; Mounting a thermistor on the first substrate and placing it close to the laser chip; Connecting the tube cap to the metal base; The laser chip is coupled to an adapter assembly, and the adapter assembly is fixed to the tube cap.

7. The packaging method of a light emitting device according to claim 6, characterized in that: The step of coupling the laser chip to the lens and connecting the lens to the heat transfer and electrical conductive member comprises the following steps: The lens is placed on the heat transfer and electrical conductive member, the laser chip is driven to emit light and form a light source, and the light source passes through the lens; Using a beam quality analyzer to detect the spot quality of the light source passing through the lens, and fine-tuning the position of the lens until the spot quality meets the preset requirements; The lens and the heat transfer and electrical conductive component are fixed by glue spotting.

8. The packaging method of a light emitting device according to claim 6, characterized in that: The adapter assembly includes an adjustment ring and an optical port adapter; The coupling of the laser chip to the adapter assembly comprises the following steps: Sleeve the adjustment ring on the optical port adapter, and connect the optical port adapter to an optical power meter; The laser chip is driven to emit light and form a light source, the light source passes through the optical port adapter, and the optical power meter detects the power of the light source; Adjust the position of the adjustment ring until the power detected by the optical power meter reaches a preset interval value, fix the adjustment ring to the optical port adapter, adjust the position of the optical port adapter until the power detected by the optical power meter reaches a preset value, fix the optical port adapter to the tube cap, and fix the adapter assembly to the tube cap.

9. The packaging method of a light emitting device according to claim 6, characterized in that: The method of sequentially mounting a plurality of bismuth antimonide particles on the upper surface of the insulating conductive layer and mounting a cold surface substrate on the upper surface of the plurality of bismuth antimonide particles comprises the following steps: The plurality of bismuth antimonide particles are sequentially mounted on the upper surface of the insulating conductive layer by a chip mounter, and solder is applied spot-on, and the metal base is placed in an oven for baking, so that the solder forms a semi-fluid state; The cold surface substrate is mounted on the upper surface of the plurality of bismuth antimonide particles by the chip mounter, and the metal base is placed in an oven for baking until the solder is completely solidified.

10. An optical module, characterized in that: It comprises a light receiving component and the light emitting device according to any one of claims 1 to 5.

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