Novel mixed heat dissipation liquid cooling system

Abstract

The invention discloses a novel mixed heat dissipation liquid cooling system, and belongs to the technical field of mixed heat dissipation of electronic equipment. According to the novel mixed heat dissipation liquid cooling system, uniform heat dissipation of electronic equipment devices with different power consumptions in the cooling cabinet can be ensured, normal operation and service life prolonging of electronic equipment with different heat values can be finally realized, the energy utilization efficiency is improved, the cooling effect is improved, and the service life of the electronic equipment is prolonged. By providing better heat dissipation performance and system stability, the high-density and high-load heat dissipation requirements of modern data centers and servers are met, the application range is wide, the cost is low, and operation is convenient.

Description

Technical Field

[0001] The present invention belongs to the technical field of hybrid heat dissipation of electronic equipment, and specifically relates to a new type of hybrid heat dissipation liquid cooling system. Background Art

[0002] Fast, stable and energy-efficient heat dissipation is a key concern in the design of high-density heat-generating scenarios such as supercomputing / intelligent computing data centers, 6G base stations, battery thermal management and new energy. Electronic equipment is composed of electronic devices with different power consumption, and the heat dissipation requirements of each device are different. If the environment in which the electronic equipment operates is allowed to heat up or become unstable over time, the reliability and service life of the electronic equipment will be reduced. Maintaining a proper thermal environment is essential for the normal operation and service life of these electronic devices in the above scenarios, which requires more effective and precise heat dissipation solutions for electronic equipment components, especially when cooling these high-density and complex electronic equipment.

[0003] The traditional technology of combining immersion liquid cooling and cold plate liquid cooling uses different types of cooling liquids. There is a risk of cold plate cooling liquid leaking into the immersion cooling liquid, and two sets of refrigeration circulation loops consisting of different heat exchangers and adaptive variable frequency pumps are required. The system is complex, costly, and difficult to operate and maintain. Summary of the invention

[0004] The purpose of the present invention is to provide a new type of hybrid heat dissipation liquid cooling system to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: a novel hybrid heat dissipation liquid cooling system, comprising an immersion type electronic equipment cooling cabinet, a heat exchanger, an adaptive variable frequency pump, a flow sensor, a temperature sensor, a pressure sensor, an adaptive regulating valve, an outdoor heat dissipation unit and a system master control unit. The technical solution of the hybrid heat dissipation liquid cooling system is as follows:

[0006] S1. Composition of electronic equipment cooling cabinet and heat dissipation control of high power consumption electronic devices;

[0007] S2, refrigeration cycle;

[0008] As a further preferred embodiment of the present technical solution: S1 is to set two liquid inlet spoiler devices on both sides of the bottom of each electronic equipment cooling cabinet, the liquid outlet flow channel angle is determined according to the distance between the electronic equipment and the bottom of the cooling cabinet, a turbine pump is set in the middle of the cabinet and the high-power electronic device deployment area, a cold plate liquid cooling distributor is set at the bottom of the immersion electronic equipment cooling cabinet, and the high-power electronic device is covered with a cold plate cold head. At the same time, a temperature detection sensor is set on the cold plate side, and the control unit can adjust the speed of the turbine pump according to the temperature to ensure the heat dissipation requirements of the high-power electronic device;

[0009] As a further preferred embodiment of the technical solution: the immersion liquid cooling technology and the cold plate liquid cooling technology in the S2 process use the same cooling liquid, the selection of the heat exchanger and the pipe diameter is determined according to the overall heat dissipation requirements of the electronic equipment, the adaptive variable frequency pump increases the head on the basis of the immersion liquid cooling technology, the inlet and outlet pipes of the cold plate liquid cooling manifold are connected to the main circulation line of the system, and the inlet and outlet pipes of the cold plate cold head of the high power consumption electronic device are led out from the manifold;

[0010] As a further preferred embodiment of the present technical solution: the immersion electronic equipment cooling cabinet comprises a liquid cooling manifold, a cold plate, a turbo pump, a temperature sensor and a turbulent flow device, the temperature sensor monitors the temperature of the electronic equipment and components in real time and transmits the information to the controller, and the coolant in the cold plate absorbs heat and flows back to the cooling system through the liquid circulation pipeline for cooling treatment;

[0011] As a further preferred embodiment of the present technical solution: the turbine pump ensures that the coolant circulates between the liquid cooling plate and the radiator by providing power for the coolant to flow, and the turbulent flow device is used to optimize the cooling effect and improve the safety and stability of the equipment.

[0012] Compared with the prior art, the beneficial effects of the present invention are: through the new hybrid heat dissipation liquid cooling system of the present invention, uniform heat dissipation of electronic equipment devices with different power consumption in the cooling cabinet can be ensured, and finally the normal operation and service life of electronic equipment with different heat generation can be achieved, and the energy utilization efficiency and cooling effect can be improved. The present invention meets the high-density and high-load heat dissipation requirements of modern data centers and servers by providing better heat dissipation performance and system stability, and has a wide range of applications, low cost and easy operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram of a novel hybrid heat dissipation liquid cooling system of the present invention;

[0014] Figure 2 It is a front view of a novel hybrid heat dissipation liquid cooling system of the present invention;

[0015] Figure 3 A top view of a novel hybrid heat dissipation liquid cooling system of the present invention. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] Example

[0018] See also Figure 1-Figure 3 As shown, the present invention provides a technical solution: a new type of hybrid heat dissipation liquid cooling system, including an immersion type electronic equipment cooling cabinet, a heat exchanger, an adaptive variable frequency pump, a flow sensor, a temperature sensor, a pressure sensor, an adaptive regulating valve, an outdoor heat dissipation unit and a system master control unit, characterized in that: the technical solution of the hybrid heat dissipation liquid cooling system is as follows:

[0019] S1. Composition of electronic equipment cooling cabinet and heat dissipation control of high power consumption electronic devices;

[0020] S2, refrigeration cycle;

[0021] In this embodiment, specifically: S1 is to set two liquid inlet spoiler devices on both sides of the bottom of each electronic equipment cooling cabinet, the liquid outlet flow channel angle is determined according to the distance between the electronic equipment and the bottom of the cooling cabinet, a turbine pump is set in the middle of the cabinet and the high-power electronic device deployment area, and a cold plate liquid cooling distributor is set at the bottom of the immersion electronic equipment cooling cabinet. The high-power electronic device is covered with a cold plate cold head. At the same time, a temperature detection sensor is set on the cold plate side. The control unit can adjust the speed of the turbine pump according to the temperature to ensure the heat dissipation requirements of the high-power electronic device;

[0022] In this embodiment, specifically: in the S2 process, the immersion liquid cooling technology and the cold plate liquid cooling technology use the same cooling liquid, the selection of the heat exchanger and the pipe diameter is determined according to the overall heat dissipation requirements of the electronic equipment, the adaptive variable frequency pump increases the head on the basis of the immersion liquid cooling technology, the inlet and outlet pipes of the cold plate liquid cooling manifold are connected to the system circulation main line, and the inlet and outlet pipes of the cold plate cold head of the high power consumption electronic device are led out from the manifold;

[0023] In this embodiment, specifically: the immersion electronic equipment cooling cabinet includes a liquid cooling manifold, a cold plate, a turbo pump, a temperature sensor and a turbulent flow device. The temperature sensor monitors the temperature of the electronic equipment and components in real time and transmits the information to the controller. After the coolant in the cold plate absorbs heat, it flows back to the cooling system through the liquid circulation pipeline for cooling treatment;

[0024] In this embodiment, specifically: the turbine pump ensures that the coolant circulates between the liquid cooling plate and the radiator by providing power for the coolant to flow, and the turbulent flow device is used to optimize the cooling effect and improve the safety and stability of the equipment.

[0025] Working principle: Due to the traditional immersion liquid cooling and cold plate liquid cooling combination technology, different liquids are used. There is a risk that the cold plate cooling liquid will leak into the immersion liquid. Leakage of the cold plate cooling liquid will cause the immersion cooling liquid to fail, and in severe cases, it will cause irreversible damage to the electronic equipment. At the same time, there is a lack of an accurate detection system for the temperature of the liquid flowing through high-power electronic components and a turbulence device for the immersion liquid when it flows through the place, and accurate control cannot be achieved. The heat dissipation system requires two sets of refrigeration circulation loops composed of different heat exchangers and adaptive frequency conversion pumps. The system is complex, costly, and difficult to operate and maintain. Therefore, the present invention combines the immersion liquid cooling technology with the cold plate liquid cooling technology in a new way under the premise of fully considering the reasonable deployment of electronic equipment devices with different heat dissipation requirements. The system uses the same cooling liquid and a common set of heat exchangers and adaptive frequency conversion pumps to form a new refrigeration circulation loop. A liquid temperature detection device is arranged in the cold plate area of ​​high-power electronic devices, and a turbine pump and a turbulence device are arranged in the cooling cabinet area of ​​high-power electronic devices. This technology can ensure uniform heat dissipation of electronic equipment devices in the cooling cabinet, and ultimately achieve the normal operation and extended service life of electronic equipment with different heat output, while improving energy utilization efficiency.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new type of hybrid heat dissipation liquid cooling system, including an immersion electronic equipment cooling cabinet, a heat exchanger, an adaptive variable frequency pump, a flow sensor, a temperature sensor, a pressure sensor, an adaptive regulating valve, an outdoor heat dissipation unit and a system master control unit, characterized in that: The technical solution of the hybrid heat dissipation liquid cooling system is as follows: S1. Composition of electronic equipment cooling cabinet and heat dissipation control of high power consumption electronic devices; S2, refrigeration cycle circuit.

2. A novel hybrid heat dissipation liquid cooling system according to claim 1, characterized in that: The S1 is achieved by setting two liquid inlet spoiler devices on both sides of the bottom of each electronic equipment cooling cabinet, the liquid outlet flow channel angle is determined according to the distance between the electronic equipment and the bottom of the cooling cabinet, a turbine pump is set in the middle of the cabinet and the high-power electronic device deployment area, a cold plate liquid cooling distributor is set at the bottom of the immersion electronic equipment cooling cabinet, and the high-power electronic device is covered with a cold plate cold head. At the same time, a temperature detection sensor is set on the cold plate side. The control unit can adjust the speed of the turbine pump according to the temperature to ensure the heat dissipation requirements of the high-power electronic device.

3. According to the novel hybrid heat dissipation liquid cooling system of claim 1, it is characterized by: In the S2 process, the immersion liquid cooling technology and the cold plate liquid cooling technology use the same cooling liquid. The selection of the heat exchanger and the pipe diameter is determined according to the overall heat dissipation requirements of the electronic equipment. The adaptive variable frequency pump increases the head based on the immersion liquid cooling technology. The inlet and outlet pipes of the cold plate liquid cooling manifold are connected to the system circulation main line, and the inlet and outlet pipes of the cold plate cold head of the high-power electronic device are led out from the manifold.

4. According to claim 2, a novel hybrid heat dissipation liquid cooling system is characterized in that: The immersion electronic equipment cooling cabinet includes a liquid cooling manifold, a cold plate, a turbine pump, a temperature sensor and a turbulent flow device. The temperature sensor monitors the temperature of the electronic equipment and components in real time and transmits the information to the controller. After the coolant in the cold plate absorbs heat, it flows back to the cooling system through the liquid circulation pipeline for cooling treatment.

5. A novel hybrid heat dissipation liquid cooling system according to claim 4, characterized in that: The turbo pump ensures that the coolant circulates between the liquid cooling plate and the radiator by providing power for the coolant to flow, and the turbulent flow device is used to optimize the cooling effect and improve the safety and stability of the equipment.

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