Wafer temperature testing device
By using multiple identification contacts and a telescopic fixture in the wafer temperature test device, the problem of uneven temperature on the wafer surface is solved, and temperature measurement and heating uniformity are achieved at any position on the wafer surface.
Patent Information
- Application Number
- CN202420138069.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-01-19
AI Technical Summary
The existing wafer heating method results in uneven wafer surface temperature and uneven heating when the heating program fails, which affects the volatility of solvents in the photoresist. The wafer surface temperature needs to be measured to adjust.
Design a wafer temperature testing device, including at least three identification contacts and a reader, the identification contacts are installed on the fixing frame, fixed with the heating plate through the fixing frame, the identification contacts are electrically connected to the reader, and the wires are penetrated Set on the fixing frame, the temperature measurement of any position on the wafer surface is realized, and the contact position is identified through the retractable fixing frame structure.
The uniformity measurement of wafer surface temperature is achieved, the heat inequality caused by the scattering of conductors is avoided, and the accuracy of temperature measurement and heating uniformity are improved.
Smart Images
Figure CN222146139U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field related to chip production, and in particular to a wafer temperature testing device. Background Art
[0002] A wafer is a silicon chip used to make silicon semiconductor circuits. In the etching process of semiconductor manufacturing, the wafer needs to be placed on a heating plate and soft-baked to evaporate the solvent in the photoresist attached to the wafer, so that the photoresist can have a certain strength and maintain the desired shape.
[0003] The existing heating method of the wafer is usually to uniformly control the heating elements at the bottom of the heating plate by the control program to achieve heating of the wafer by the heating plate. Dirt such as photoresist is prone to remain on the top of the heating plate, resulting in uneven heating of the wafer. On the other hand, when the heating program fails, the heating plate may also heat the wafer unevenly. When there is a temperature difference between different areas on the surface of the wafer, it will affect the volatilization of the solvent in the photoresist. Therefore, in order to improve the balance of the wafer surface temperature, it is necessary to measure the temperature of the wafer surface so that timely adjustments can be made when there is a large temperature difference between the measuring points. Utility Model Content
[0004] In order to measure the surface temperature of a wafer, the present application provides a wafer temperature testing device.
[0005] The present application provides a wafer temperature testing device that adopts the following technical solution:
[0006] A wafer temperature testing device comprises an identification contact, a reader and a fixing frame, wherein the fixing frame is clamped and fixed on a heating plate, and a clamping slot for clamping and fixing the identification contact is provided on the fixing frame, the identification contact is in contact with the surface of the wafer, the number of the identification contacts is at least three, each of the identification contacts is electrically connected to the reader, and the wires of each of the identification contacts are passed through the fixing frame.
[0007] By adopting the above technical solution, at least three identification contacts are set, and the identification contacts can be set to contact and connect at any position on the surface of the wafer to identify the temperature of the wafer surface. The reader is electrically connected to the identification contacts and reads the surface temperature of the wafer at the end of the identification contacts. The wires between the identification contacts and the reader can be installed on a fixed frame, avoiding the situation where the wires are scattered on the edge of the heating plate or the surface of the wafer, resulting in uneven heating of the wafer.
[0008] Optionally, the fixing frame includes a first fixing part, a second fixing part and a connecting column, the first fixing part is clamped and fixed to the edge of the heating plate, the identification contact is installed on the second fixing part, the connecting column is vertically fixedly connected to the side of the first fixing part close to the wafer, and the second fixing part is fixedly connected to the other end of the connecting column connected to the first fixing part.
[0009] By adopting the above technical solution, the first fixing part is used to fix the frame of the fixing frame and the heating plate, the identification contact is installed on the second fixing part, and the first fixing part and the second fixing part are connected by a connecting column.
[0010] Optionally, the second fixed portion includes a connecting block and a second leg, the second leg is arranged one-to-one corresponding to the identification contact, each of the second legs is evenly circumferentially arranged on the connecting block and fixedly connected to the connecting block, and the card slot is opened on the end of each of the second legs close to the wafer side.
[0011] By adopting the above technical solution, the second legs are evenly circumferentially arranged on the connecting block, the identification contacts are installed on the ends of each second leg abutting against the wafer surface, and the second legs are provided with slots for installing the identification contacts. When the second legs are pressed against the wafer surface, the identification contacts start to detect the temperature of the wafer surface, thereby achieving the effect of measuring the wafer surface temperature.
[0012] Optionally, each of the second legs is coaxially provided with a threading cavity for threading a wire along the length direction, the threading cavity is interconnected with the card slot, and a threading hole is provided on the side of the connecting block close to the wafer, and the threading hole is interconnected with the threading cavity.
[0013] By adopting the above technical solution, a threading cavity is opened on the second leg and a threading hole is opened on the side of the connecting block close to the wafer. The threading cavity and the threading hole are interconnected, providing a placement space for the wires between the identification contacts and the reader, thereby preventing the wires from being scattered on the wafer surface and affecting the temperature measurement.
[0014] Optionally, the second leg includes a connecting portion and a telescopic portion, the connecting portion is fixedly connected to the connecting block, the telescopic portion is inserted into the connecting portion, and the identification contact is installed on the end of the telescopic portion close to one side of the wafer.
[0015] By adopting the above technical solution, the connecting part of the second leg is used to connect with the connecting block, the telescopic part is installed on the connecting part and can drive the identification contact to move, and the identification contact realizes temperature measurement at various positions on the surface of the wafer through the driving effect of the telescopic part, thereby achieving the effect of measuring the surface temperature of the wafer.
[0016] Optionally, the first fixing portion includes first legs, the number of the first legs is at least three, the first legs are evenly arranged circumferentially and fixedly connected, and the first legs are clamped and fixed on the heating plate at one end away from the interconnection.
[0017] By adopting the above technical solution, according to the stability of the triangle, the number of the first legs is set to at least three. After the three first legs are fixed to the heating plate, the three fixing points can form a relatively stable fixing and supporting effect on the heating plate.
[0018] Optionally, a hook is fixedly connected to one end of the first leg close to the heating plate.
[0019] By adopting the above technical solution, a hook is provided on the first leg, and the hook can be clamped and fixed with the edge of the heating plate, so as to fix the first fixing part and the second fixing part connected under the first fixing part on the heating plate, thereby improving the connection stability between the fixing frame and the heating plate.
[0020] Optionally, the first leg includes a first fixed tube and a first telescopic rod, the first fixed tubes are fixedly connected to each other, the first telescopic rod is passed through one end of the first fixed tube close to the heating plate and is slidably connected to the first fixed tube, and the hook is fixedly connected to the end of the first telescopic rod.
[0021] By adopting the above technical solution, the first fixed tubes are fixedly connected to each other, the first telescopic rod is passed through the first fixed tubes and is slidably connected to the first fixed tubes, and the matching arrangement between the first telescopic rod and the first fixed tube enables the first fixed part to achieve a telescopic effect, thereby reducing the volume of the fixed frame and facilitating storage.
[0022] Optionally, the connecting column includes a second fixed tube and a second telescopic rod, the second fixed tube is fixedly connected to the first fixed tube, the second telescopic rod is inserted and slidably disposed on an end of the second fixed tube away from the first fixed tube, and the second telescopic rod is fixedly connected to the second fixed portion.
[0023] By adopting the above technical solution, when the first fixing part is extended or retracted, the retractable setting of the connecting column is convenient for cooperating with the extension or retraction of the first fixing part, so that the height between the second fixing part and the wafer can be adjusted.
[0024] Optionally, a limiting block is fixedly connected between the second telescopic rod and the second fixing portion.
[0025] By adopting the above technical solution, the setting of the limit block can limit the sliding stroke between the second telescopic rod and the second fixed tube, prevent mutual interference between the connecting column and the connecting block of the second fixed part, and improve the connection stability between the first fixed part and the second fixed part.
[0026] In summary, the present application includes at least one of the following beneficial technical effects:
[0027] 1. Each identification contact is installed on a fixing frame, and the fixing frame is extended and retracted to achieve the effect of contact connection between the identification contact and any position on the wafer surface, thereby identifying the temperature at any position on the wafer surface. The wires between the identification contact and the reader can be installed on the fixing frame, which avoids the wires being scattered on the edge of the heating plate or the surface of the wafer, resulting in uneven heating of the wafer, and is conducive to improving the balance of the wafer surface temperature;
[0028] 2. The telescopic setting of the first fixed part can adjust the height between the frame of the fixed frame and the heating plate and the surface of the wafer. The identification contact is installed on the second fixed part. The telescopic setting of the second fixed part can adjust the position of the identification contact on the surface of the wafer. The first fixed part and the second fixed part are connected by a connecting column. The telescopic setting of the connecting column enables the height between the first fixed part and the second fixed part to be adjusted, thereby achieving the effect of the identification contact measuring the surface temperature of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a schematic diagram of the overall structure of a wafer temperature testing device in this embodiment.
[0030] Figure 2 Schematic diagram of the overall structure of the fixing frame in this embodiment.
[0031] Figure 3 It is a partial schematic diagram of the second fixing portion in this embodiment.
[0032] Figure 4 It is a partial schematic diagram of the first fixing portion in this embodiment.
[0033] Figure 5 yes Figure 4 Enlarged schematic diagram of the middle connecting column.
[0034] Explanation of the accompanying drawings: 1. identification contact; 2. reader; 3. fixing frame; 31. first fixing part; 311. first leg; 3111. first fixing tube; 3112. first telescopic rod; 312. hook; 32. second fixing part; 321. connecting block; 3211. threading hole; 322. second leg; 3221. connecting part; 32212. threading cavity; 3222. telescopic part; 32221. slot; 33. connecting column; 331. second fixing tube; 332. second telescopic rod; 333. limit block. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solutions and advantages of this application more clear, the following Figure 1-5 And embodiments, the present application is further described in detail.
[0036] The embodiment of the present application discloses a wafer temperature testing device. The words such as "upper" and "lower" used to express the positional relationship in the embodiment are determined with reference to the placement and installation position of the wafer temperature testing device when it is in normal use, for example, the second fixing part 32 is connected to the upper surface of the wafer, and the connecting column 33 is fixedly connected to the lower side of the first fixing part 31.
[0037] Reference Figure 1 and Figure 3 The wafer temperature testing device includes an identification contact 1, a reader 2 and a fixing frame 3. The identification contact 1 is mounted on the fixing frame 3. The reader 2 is horizontally placed outside the wafer and the heating plate and is electrically connected to the identification contact 1. A slot 32221 for mounting the identification contact 1 is provided on one end of the fixing frame 3 close to the wafer. The ends of the identification contact 1 and the fixing frame 3 are in contact with the surface of the wafer.
[0038] Reference Figure 1 and Figure 2 The fixing frame 3 includes a first fixing portion 31, a second fixing portion 32 and a connecting column 33, wherein the first fixing portion 31 is used to fix the frame of the fixing frame 3 and the heating plate, and the second fixing portion 32 is used to install the identification contact 1 and press the identification contact 1 against the surface of the wafer. The connecting column 33 is fixedly connected between the first fixing portion 31 and the second fixing portion 32 to connect the two.
[0039] Reference Figure 2 and Figure 4 The first fixed portion 31 includes a plurality of first legs 311 that are fixedly connected. According to the stability of the triangle, the effect of three fixed points is relatively stable. Therefore, in this embodiment, the number of the first legs 311 is preferably three. The three first legs 311 are evenly circumferentially arranged and the ends of each first leg 311 are fixedly connected to each other.
[0040] The first leg 311 includes a first fixed tube 3111 and a first telescopic rod 3112. The first telescopic rod 3112 is inserted into the first fixed tube 3111 and is slidably connected to the first fixed tube 3111. The ends of the first fixed tubes 3111 are fixedly connected to each other. A hook 312 is fixedly connected to one end of the first telescopic rod 3112 close to the heating plate, and the hook body of the hook 312 faces the side of the heating plate.
[0041] Reference Figure 2 and Figure 3 The second fixing portion 32 includes a plurality of second legs 322 and a connecting block 321. Each second leg 322 is fixedly connected to the connecting block 321. The number of second legs 322 corresponds to the number of identification contacts 1. In order to improve the uniformity of the wafer surface temperature, it is necessary to test the temperature at various locations on the wafer surface. In this embodiment, five different measurement points are randomly selected on the wafer surface. Therefore, the number of identification contacts 1 in this embodiment is set to five, and the number of second legs 322 is also set to five.
[0042] Reference Figure 3 The second leg 322 includes a connecting portion 3221 and a telescopic portion 3222. The connecting portion 3221 of each second leg 322 is evenly arranged on the connecting block 321 and fixedly connected to the connecting block 321. The telescopic portion 3222 is penetrated through the connecting portion 3221 and slidably connected to the telescopic portion 3222. The identification contact 1 in this embodiment is preferably a round pancake-shaped metal block. A slot 32221 is provided on the connecting portion 3221 of each second leg 322 at one end close to the wafer, and each identification contact 1 is fixedly connected in the slot 32221.
[0043] In order to prevent the wires between the identification contact 1 and the reader 2 from being scattered on the wafer or the heating plate and affecting the temperature measurement result, in this embodiment, the wires are passed through the interior of the fixing frame 3. The connecting portion 3221 and the telescopic portion 3222 of the second leg 322 are provided with a threading cavity 32212 for the wires to pass through, and the threading cavity 32212 and the card slot 32221 are connected to each other. A threading hole 3211 is provided on the side of the connection block 321 close to the wafer, and the threading hole 3211 on the connection block 321 is connected to the threading cavity 32212 on the second leg 322.
[0044] Reference Figure 4 and Figure 5The first fixing part 31 and the second fixing part 32 are connected by a connecting column 33. The second connecting column 33 includes a second fixing tube 331 and a second telescopic rod 332. The second telescopic rod 332 is passed through the second fixing tube 331 and is slidably connected to the second fixing tube 331. The second fixing tube 331 is fixedly connected to the first fixing tube 3111. The second telescopic rod 332 is fixedly connected to a limiting block 333 at one end away from the second fixing tube 331. The limiting block 333 is fixedly connected to the connecting block 321.
[0045] The implementation principle of the wafer temperature testing device of the embodiment of the present application is as follows: the first fixing part 31 adjusts the height between the frame of the fixing frame 3 and the heating plate and the wafer by sliding the first telescopic rod 3112 on the first fixing tube 3111, and the hook 312 clamps and fixes the frame of the fixing frame 3 and the heating plate. The identification contact 1 is installed on the end of the second fixing part 32, and each second leg 322 presses each identification contact 1 against the surface of the wafer. Each second leg 322 is retractable so that the identification contact 1 can reach any position on the surface of the wafer, which is conducive to improving the accuracy of temperature measurement.
[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A wafer temperature testing device, Features: The invention comprises an identification contact (1), a reader (2) and a fixing frame (3), wherein the fixing frame (3) is fixedly connected to a heating plate, and a slot (32221) is provided on the fixing frame (3) for the identification contact (1) to be fixedly connected by the slot, and the identification contact (1) is in contact with the surface of a wafer, and the number of the identification contacts (1) is at least three, and each of the identification contacts (1) is electrically connected to the reader (2), and the wires of each of the identification contacts (1) are passed through the fixing frame (3).
2. A wafer temperature testing device according to claim 1, Features: The fixing frame (3) comprises a first fixing portion (31), a second fixing portion (32) and a connecting column (33); the first fixing portion (31) is fixedly engaged with the edge of the heating plate; the identification contact (1) is mounted on the second fixing portion (32); the connecting column (33) is vertically fixedly connected to a side of the first fixing portion (31) close to the wafer; and the second fixing portion (32) is fixedly connected to the other end of the connecting column (33) connected to the first fixing portion (31).
3. A wafer temperature testing device according to claim 2, Features: The second fixing portion (32) comprises a connecting block (321) and a second leg (322); the second leg (322) is arranged in one-to-one correspondence with the identification contact (1); each of the second legs (322) is evenly circumferentially arranged on the connecting block (321) and is fixedly connected to the connecting block (321); and the slot (32221) is provided on the end of each of the second legs (322) close to one side of the wafer.
4. A wafer temperature testing device according to claim 3, Features: Each of the second legs (322) is coaxially provided with a threading cavity (32212) for threading a wire along the length direction, the threading cavity (32212) and the card slot (32221) are interconnected, and a threading hole (3211) is provided on a side of the connection block (321) close to the wafer, and the threading hole (3211) and the threading cavity (32212) are interconnected.
5. A wafer temperature testing device according to claim 4, Features: The second leg (322) comprises a connecting portion (3221) and a telescopic portion (3222), the connecting portion (3221) is fixedly connected to the connecting block (321), the telescopic portion (3222) is inserted into the connecting portion (3221), and the identification contact (1) is mounted on the end of the telescopic portion (3222) close to one side of the wafer.
6. A wafer temperature testing device according to claim 2, Features: The first fixing portion (31) comprises a first leg (311), the number of the first legs (311) is at least three, the first legs (311) are evenly arranged circumferentially and fixedly connected, and the first legs (311) are fixedly clamped on the heating plate at one end away from the interconnected ends.
7. A wafer temperature testing device according to claim 6, Features: A hook (312) is fixedly connected to one end of the first leg (311) close to the heating plate.
8. The wafer temperature testing device according to claim 7, Features: The first leg (311) comprises a first fixed tube (3111) and a first telescopic rod (3112), the first fixed tubes (3111) are fixedly connected to each other, the first telescopic rod (3112) is passed through one end of the first fixed tube (3111) close to the heating plate and is slidably connected to the first fixed tube (3111), and the hook (312) is fixedly connected to the end of the first telescopic rod (3112).
9. The wafer temperature testing device according to claim 8, Features: The connecting column (33) comprises a second fixed tube (331) and a second telescopic rod (332); the second fixed tube (331) is fixedly connected to the first fixed tube (3111); the second telescopic rod (332) is inserted and slidably disposed on an end of the second fixed tube (331) away from the first fixed tube (3111); and the second telescopic rod (332) is fixedly connected to the second fixed portion (32).
10. The wafer temperature testing device according to claim 9, Features: A limiting block (333) is fixedly connected between the second telescopic rod (332) and the second fixing portion (32).