Wire bonding process system

Abstract

The utility model provides a wire bonding processing system. The wire bonding processing system comprises a main processing device; the operation area is arranged on the first side of the main processing equipment and is configured to be operated by an operator; the loading and unloading area is arranged on the second side of the main processing equipment, and an automatic loading and unloading device is arranged in the loading and unloading area; the loading mechanism is arranged between the operation area and the loading and unloading area, the loading mechanism is configured to substantially separate the automatic loading and unloading device from operators in the operation area, the loading mechanism comprises a first area and a second area which are separated from each other, and the first area and the second area can be used for simultaneously placing material boxes for accommodating processing products; the first area is configured to enable the automatic loading and unloading device to load material boxes, and the second area is configured to enable the process products in the material boxes to be fed into the main process equipment. The wire bonding process system can be well matched with the automatic loading and unloading device, the safety is improved, the problem of operation interference is solved, the problem of insufficient space is solved, and continuous operation can be achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a wire bonding process system. Background Art

[0002] Wire bonding (wire bond, also known as wire bonding) can be divided into ball bond and wedge bond according to the process technology.

[0003] In the current process, the products before and after the process are transported to the loading port of the wedge bond equipment by manual loading and unloading. For example, the production capacity of the wedge bond equipment can reach 4k / H, and a magazine generally contains only about 320 process products (such as wafers). Therefore, when fully loaded, the frequency of personnel loading and unloading the magazine is as high as more than 20 times per hour. In addition, compared with ball welding, the wire diameter of the wire (bonding wire) used in wedge bonding products is thicker, and the number of wire bonding points (bonding points) on a single chip is fewer. Therefore, the time spent on wire bonding of a chip is relatively short, and the number of chips that complete wedge bonding within a unit time (such as one hour) is relatively large. Therefore, the loading port of the wedge bond equipment requires a larger product accommodating area to accommodate more magazines.

[0004] In order to reduce the burden of personnel who need to frequently load and unload materials, it is necessary to consider loading and unloading material boxes in an automated manner. However, the loading mechanism of the existing wedge welding equipment loads and unloads goods from the front of the equipment, and the operating area of ​​the equipment is also on the front. In this way, the automatic loading and unloading device and the operator will conflict with each other, which will cause safety risks and operational interference. In addition, the product accommodating area of ​​the existing loading mechanism has limited space, which is not enough to place multiple material boxes, and cannot be fully adapted to the automatic loading and unloading device, resulting in reduced efficiency. Therefore, the existing wedge welding equipment cannot be well matched with the automatic loading and unloading device. Utility Model Content

[0005] The purpose of this application is to provide a wire bonding process system so as to be well matched with an automatic loading and unloading device.

[0006] A wire bonding process system proposed in the present application includes: a main process equipment; an operation area, which is arranged on the first side of the main process equipment and is configured for operation by an operator; a loading and unloading area, which is arranged on the second side of the main process equipment, and is provided with an automatic loading and unloading device; a loading mechanism, which is arranged between the operation area and the loading and unloading area, and is configured to substantially separate the automatic loading and unloading device from the operator of the operation area, and the loading mechanism includes a first area and a second area which are spaced apart, and the first area and the second area can simultaneously place a material box for accommodating process products, the first area is configured to allow the automatic loading and unloading device to load the material box, and the second area is configured to allow the process products in the material box to be fed into the main process equipment.

[0007] In some optional embodiments, the loading mechanism further includes a transport device for transporting the material box from the first area to the second area.

[0008] In some optional embodiments, the transport device is a conveyor belt or a slide rail.

[0009] In some optional embodiments, the loading mechanism is arranged on the third side of the main process equipment through a plurality of supporting structures, and a first reinforcement is arranged between the supporting structure and the third side of the main process equipment, and the first reinforcement is arranged along the bottom of the loading mechanism, and the first reinforcement and the supporting structure jointly provide supporting force to the loading mechanism.

[0010] In some optional embodiments, the first reinforcement member is disposed adjacent to the loading mechanism.

[0011] In some optional embodiments, the loading mechanism further includes a second reinforcement member disposed between the support structure and a third side of the main process equipment, and the second reinforcement member, the first reinforcement member and the support structure jointly provide a supporting force for the loading mechanism.

[0012] In some optional embodiments, the thickness of the second reinforcement member is substantially equal to that of the first reinforcement member.

[0013] In some optional embodiments, the second reinforcement member is located below the first reinforcement member, and the second reinforcement member and the first reinforcement member both extend laterally.

[0014] In some optional embodiments, the wire bonding process system is a wire bonding system or a wedge bonding system.

[0015] In some optional embodiments, the wire bonding process system further includes: an unloading mechanism, which includes a third area and a fourth area separated from each other, wherein the third area and the fourth area can simultaneously place material boxes for accommodating process products, the third area is configured to allow the automatic loading and unloading device to unload the material boxes, and the fourth area is configured to allow the process products in the main process equipment to be discharged into the material boxes.

[0016] In some optional embodiments, the second side is opposite to the first side.

[0017] In some optional embodiments, the loading mechanism further comprises a lifting device, and the lifting device is configured to lift the material box from the second area.

[0018] In some optional embodiments, the lifting device is closer to the first side than to the second side, and a working surface of the lifting device faces the second side.

[0019] In some optional embodiments, the second area is adjacent to the lifting device, and the first area is adjacent to the automatic loading and unloading device.

[0020] In some optional embodiments, the loading mechanism includes an upper and lower table top, the first area and the second area are located on the lower layer, and the loading mechanism also includes a fifth area located on the upper layer, the fifth area is configured to place an empty material box, and the empty material box refers to the material box from which all process products have been taken out.

[0021] In some optional embodiments, the automatic loading and unloading device is further configured to transport the empty material box to the unloading mechanism.

[0022] In order to solve the technical problems that the existing wedge welding equipment cannot be well matched with the automatic loading and unloading device, there are safety risks, and there is insufficient space, the present application proposes a wire bonding process system, by arranging the operation area and the loading and unloading area on the first side and the second side of the main process equipment (such as wedge welding equipment) respectively, so that the operator is located on the first side, and the automatic loading and unloading device is located on the second side, and the loading mechanism is configured between the automatic loading and unloading device and the operator to substantially separate the two, thereby achieving a good match with the automatic loading and unloading device, and can solve the safety risk problem and operation interference problem caused by the conflict between the operator and the automatic loading and unloading device. In addition, by dividing the material box accommodating area on the loading mechanism into a first area and a second area, the automatic loading and unloading device can load the material box to the first area, and the main process equipment can feed the material box from the second area, thereby expanding the product accommodating space of the loading mechanism, solving the problem of insufficient space, and the two areas realize loading and feeding respectively, which is helpful to achieve continuous operation and improve operation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0024] Figure 1 is a three-dimensional structural schematic diagram of an embodiment of a wire bonding process system according to the present application;

[0025] Figure 2 is a schematic diagram of a top view of a loading mechanism according to an embodiment of the present application;

[0026] Figure 3 It is a partial side view structural schematic diagram of an embodiment of a wire bonding process system according to the present application.

[0027] Description of reference numerals / symbols:

[0028] 10-main process equipment; 11-operating area; 12-loading and unloading area; 13-loading mechanism; 1301-first area; 1302-second area; 14-unloading mechanism; 15-conveying device; 16-support structure; 17-first reinforcement; 18-second reinforcement; 19-lifting device; 20-automatic loading and unloading device; 30-material box. DETAILED DESCRIPTION

[0029] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions and creations, rather than to limit the inventions and creations. In addition, for the convenience of description, only the parts related to the relevant inventions and creations are shown in the accompanying drawings.

[0030] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.

[0031] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0032] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.

[0033] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, the thickness of a film or layer is "substantially uniform" and may refer to a standard deviation of less than or equal to ±10% of the average thickness of the film or layer, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered to be "substantially aligned" if, for example, the two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered to be "substantially perpendicular" if the angle between the two surfaces or components is, for example, 90°±10°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°. When used in conjunction with an event or situation, the terms "substantially", "substantial", "approximately", and "about" may refer to situations where the event or situation occurs exactly as well as situations where the event or situation occurs very approximately.

[0034] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.

[0035] It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.

[0036] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] refer to Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a three-dimensional structure of an embodiment of a wire bonding process system according to the present application. Figure 1 As shown, the wire bonding process system of the present application may include: a main process equipment 10 , an operation area 11 , a loading and unloading area 12 and a loading mechanism 13 .

[0038] The wire bonding process system of the present application is a wire bonding system or a wedge bonding system for implementing wire bonding. The main process equipment 10 includes but is not limited to a wedge bonding equipment.

[0039] The operation area 11 is arranged on the first side of the main process equipment 10 and is configured for operation by an operator. The operation area is configured with various operation components for operating the main process equipment, such as buttons, keys, screens, etc. The first side can be, for example, the front side of the main process equipment 10.

[0040] The loading and unloading area 12 is arranged on the second side of the main process equipment 10, and the loading and unloading area 12 is arranged with an automatic loading and unloading device 20. The automatic loading and unloading device 20 may include a robot arm for taking and placing the material box 30 to the loading mechanism 13. Optionally, the second side may be a side opposite to the first side, for example, the second side may be the rear side of the main process equipment 10.

[0041] The loading mechanism 13 is disposed between the operation area 11 and the loading and unloading area 12. The loading mechanism 13 is configured to substantially separate the automatic loading and unloading device 20 from the operator of the operation area 11 to avoid safety risks and operational interference problems caused by conflicts between the two.

[0042] In addition, the automatic loading and unloading device 20 is arranged on the second side opposite to the operation area 11 on the first side, which is convenient for automatic conveying devices such as tracks on the second side and for connecting various devices in series.

[0043] refer to Figure 2 , Figure 2 FIG. 1 is a schematic diagram of a top view of a loading mechanism 13 according to an embodiment of the present application. Figure 2 As shown, the loading mechanism 13 includes a first area 1301 and a second area 1302 that are spaced apart. Figure 1 and Figure 2 The first area 1301 and the second area 1302 can simultaneously place material boxes 30 for accommodating process products. The first area 1301 is configured to allow the automatic loading and unloading device 20 to load the material box 30, and the second area 1302 is configured to allow the process products in the material box 30 to be fed into the main process equipment 10.

[0044] It is worth noting that the English name of the loading mechanism 13 is Load port, which is a mechanism mainly used to load and unload the material box 30 in the semiconductor process. When loading, the loading mechanism 13 can open the box cover of the material box 30, use the Mapping function to locate the position of the process product (such as a wafer) in the material box 30 and whether it is offset, and send the position information to the main process equipment 10.

[0045] refer to Figure 1 and Figure 2 In some optional embodiments, the loading mechanism 13 further includes a transport device 15 for transporting the material box 30 from the first area 1301 to the second area 1302. Optionally, the transport device 15 includes but is not limited to a conveyor belt or a slide rail. After the automatic loading and unloading device 20 transports the material box 30 to the first area 1301, the transport device 15 can transport the material box 30 from the first area 1301 to the second area 1302.

[0046] In some optional embodiments, the first area 1301 can accommodate a plurality of material boxes 30 , and the plurality of material boxes 30 can be placed side by side or stacked, for example.

[0047] refer to Figure 3 , Figure 3 FIG. 1 is a partial side view of a structure diagram of a wire bonding process system according to an embodiment of the present application. Figure 3As shown, in some optional embodiments, the loading mechanism 13 can be disposed on the third side of the main process equipment 10 through a plurality of support structures 16. Here, the third side can be, for example, the right side of the main process equipment 10. Here, the support structure 16 includes but is not limited to a tripod or other forms.

[0048] refer to Figure 3 In some optional embodiments, a first reinforcement member 17 is further disposed between the support structure 16 and the third side of the main process device 10. The first reinforcement member 17 can be disposed below the loading mechanism 13. The first reinforcement member 17 and the support structure 16 jointly provide support force for the loading mechanism 13.

[0049] Optionally, in addition to providing supporting force, the first reinforcing member 17 also serves to separate the supporting structure 16 from the main process equipment 10 and to push the supporting structure 16 outward by a certain distance relative to the main process equipment 10. In this way, the supporting area of ​​the upper surface of the supporting structure 16 is expanded, and the supporting effect on the loading mechanism 13 is enhanced.

[0050] In some optional embodiments, the first reinforcement member 17 is disposed adjacent to the loading mechanism 13. Exemplarily, the first reinforcement member 17 may be a beam disposed adjacent to the loading mechanism 13 and extending transversely.

[0051] In some optional embodiments, the loading mechanism 13 further includes a second reinforcement 18 disposed between the support structure 16 and the third side of the main process equipment 10 , and the second reinforcement 18 , the first reinforcement 17 and the support structure 16 together provide support force for the loading mechanism 13 .

[0052] In some optional embodiments, the second reinforcement 18 is disposed at a position away from the loading mechanism 13 relative to the first reinforcement 17 .

[0053] In some optional embodiments, the second reinforcement member 18 is located below the first reinforcement member 17, and the second reinforcement member 18 and the first reinforcement member 17 both extend transversely. Optionally, the first reinforcement member 17 and the second reinforcement member 18 are arranged parallel to each other.

[0054] In some optional embodiments, the second reinforcement member 18 has substantially the same thickness (width), height, and length as the first reinforcement member 17. Exemplarily, the thickness (width) of the second reinforcement member 18 and the first reinforcement member 17 is approximately between 2 cm and 3 cm.

[0055] In some optional embodiments, the first reinforcement member 17 is adjacent to the upper side of the support structure 16 , and the second reinforcement member 18 is adjacent to the lower side of the support structure 16 .

[0056] In some optional embodiments, the material of the first reinforcement member 17 and the second reinforcement member 18 includes but is not limited to metal materials such as stainless steel and aluminum alloy, or non-metal materials such as plastic and wood covered with dust-free materials.

[0057] refer to Figure 1 In some optional embodiments, the loading mechanism 13 further includes a lifting device 19, which is configured to lift the material box 30 from the second area 1302. Optionally, the lifting device 19 lifts the material box 30 to a certain height so that the main process equipment 10 can take out the process product (such as a wafer) from the material box 30 and load the wafer into the main process equipment 10 for processing.

[0058] In some optional embodiments, the lifting device 19 is closer to the first side than the second side, and the working surface of the lifting device 19 faces the second side, so that the second area 1302 and the first area 1301 are located between the lifting device 19 and the automatic loading and unloading device 20, and the second area 1302 is adjacent to the lifting device 19, and the first area 1301 is adjacent to the automatic loading and unloading device 20. In this way, there can be a larger accommodation space between the lifting device 19 and the loading and unloading area 12 to accommodate the material box 30, and it is convenient for the material box 30 to be sequentially transferred from the automatic loading and unloading device 20 to the first area 1301, then transported to the second area 1302, and then lifted by the lifting device 19.

[0059] In some optional embodiments, the loading mechanism 13 includes an upper and lower table top (not shown in the figure), the first area 1301 and the second area 1302 are located on the lower layer, and the loading mechanism 13 may also include a fifth area located on the upper layer, and the fifth area is configured to place an empty material box, which refers to a material box 30 from which all process products have been taken out.

[0060] refer to Figure 1 In some optional embodiments, the wire bonding process system of the present application further includes an unloading mechanism (unload port) 14. The unloading mechanism 14 can be arranged on the fourth side of the main process equipment 10, and the fourth side can be a side opposite to the third side. The unloading mechanism 14 includes a third area and a fourth area separated from each other, and the third area and the fourth area can simultaneously place a material box 30 for accommodating process products. The third area is configured to allow the automatic loading and unloading device 20 to unload the material box 30, and the fourth area is configured to allow the process products in the main process equipment 10 to be discharged into the material box 30. That is, the unloading mechanism 14 can realize the opposite function of the mechanism 13, and the two have similar structures and opposite functions, which will not be repeated here.

[0061] In some optional embodiments, the automatic loading and unloading device 20 is further configured to transport an empty material box to the unloading mechanism 14. Taking a certain material box 30 as an example, after the automatic loading and unloading device places the material box 30 on the loading mechanism 13, the main process equipment 10 can sequentially take out multiple process products in the material box 30 and feed them into the main process equipment 10 for processing. After all the internal process products are taken out, the material box 30 becomes an empty material box, and the automatic loading and unloading device can transport the material box 30 from the fifth area to the unloading mechanism 14, so that the main process equipment 10 can sequentially place the processed process products into the material box 30 until it is full. The automatic loading and unloading device 20 can be further configured to take away the full material box 30.

[0062] It should be noted that the wire bonding process system of the present application can be improved based on the existing wedge bonding equipment. The loading mechanism and unloading structure of the existing wedge bonding equipment are both facing the same side (front) as the operation area, and the length of the loading mechanism platform and the length of the unloading mechanism platform are both relatively short.

[0063] Taking the loading mechanism 13 as an example, the improvements of the present application include:

[0064] 1. Flip the loading mechanism 13 180 degrees and set it backward, so that it can cooperate well with the automatic loading and unloading device 20 set on the second side (rear side) of the main process equipment 10; at this time, the operator operates on the first side (front side) of the main process equipment 10, and the automatic loading and unloading device 20 loads / removes materials on the second side (rear side) of the main process equipment 10, thereby solving the safety risk problems and operation interference problems caused by the conflict between the operator and the automatic loading and unloading device; in addition, it is convenient to realize the serial connection of each process site equipment through the automatic loading and unloading device 20.

[0065] 2. The length of the platform of the loading mechanism 13 is lengthened in a straight line direction, so that the first area 1301 and the second area 1302 can be sequentially arranged on the platform, and a transport device 15 (such as a conveyor belt or a pulley, etc.) can be provided, thereby expanding the product accommodating space, so that the loading mechanism 13 can accommodate more material boxes 30, and the transport device 15 can transport the material box 30 to the designated position of the platform of the loading mechanism 13, and then cooperate with the lifting device (elevator) 19 to feed the material.

[0066] 3. Add reinforcements (first reinforcement 17, second reinforcement 18). The reinforcements can be transversely extending beams, which are reinforced along the direction of the loading mechanism 13 to increase the support force of the loading mechanism 13. The first reinforcement 17 can be located at the top, close to the position where the material box 30 is placed, and the second reinforcement 18 can be located below the first reinforcement 17. The two together achieve reinforcement.

[0067] 4. Optionally, after the loading mechanism 13 is turned 180 degrees, it may move outward (away from the main process equipment 10) by a certain distance (e.g., about 3 cm), which will increase the torque, and the area range of the existing support mechanism to support the loading mechanism 13 will be reduced. The present application can reduce the torque, expand the support area provided by the upper surface of the support structure 16, and enhance the support for the loading mechanism 13 by providing a thick reinforcement member (the first reinforcement member 17 and the second reinforcement member 18).

[0068] The unloading mechanism 14 is arranged opposite to the loading mechanism 13. The improvement of the unloading mechanism 14 in the present application is similar to the improvement of the loading mechanism 13. Please refer to the above description and will not be repeated here.

[0069] Although the present application has been described and illustrated with reference to the specific embodiments of the present application, these descriptions and illustrations do not limit the present application. It is clearly understood by those skilled in the art that various changes can be made, and equivalent elements can be substituted in the embodiments without departing from the true spirit and scope of the present application as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual implementation. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive. Modifications may be made to adapt specific circumstances, materials, material compositions, methods or processes to the goals, spirits and scopes of the present application. All such modifications fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.

Claims

1. A wire bonding process system, characterized in that: include: Main process equipment; An operation area, disposed on the first side of the main process equipment, configured for an operator to operate; A loading and unloading area is arranged on the second side of the main process equipment, and an automatic loading and unloading device is arranged in the loading and unloading area; A loading mechanism is disposed between the operating area and the loading and unloading area, and is configured to substantially separate the automatic loading and unloading device from the operators in the operating area. The loading mechanism includes a first area and a second area that are spaced apart, and the first area and the second area can simultaneously hold material boxes for accommodating process products. The first area is configured to allow the automatic loading and unloading device to load the material boxes, and the second area is configured to allow the process products in the material boxes to be fed into the main process equipment.

2. The wire bonding process system according to claim 1, characterized in that: The loading mechanism further includes a transport device for transporting the material box from the first area to the second area.

3. The wire bonding process system according to claim 1, wherein: The loading mechanism is arranged on the third side of the main process equipment through multiple supporting structures, and a first reinforcement member is arranged between the supporting structure and the third side of the main process equipment. The first reinforcement member is arranged along the bottom of the loading mechanism, and the first reinforcement member and the supporting structure jointly provide supporting force for the loading mechanism.

4. The wire bonding process system according to claim 3, characterized in that: The first reinforcement member is disposed adjacent to the loading mechanism.

5. The wire bonding process system according to claim 3, wherein: The loading mechanism further includes a second reinforcement member disposed between the supporting structure and the third side of the main process equipment, and the second reinforcement member, the first reinforcement member and the supporting structure jointly provide a supporting force for the loading mechanism.

6. The wire bonding process system according to claim 5, characterized in that: The second reinforcing member has substantially the same thickness as the first reinforcing member.

7. The wire bonding process system according to claim 5, wherein: The second reinforcing member is located below the first reinforcing member, and both the second reinforcing member and the first reinforcing member extend laterally.

8. The wire bonding process system according to claim 1, wherein: Also includes: The unloading mechanism includes a third area and a fourth area separated from each other, wherein the third area and the fourth area can simultaneously place material boxes for accommodating process products, the third area is configured to allow the automatic loading and unloading device to unload the material boxes, and the fourth area is configured to allow the process products in the main process equipment to be discharged into the material boxes.

9. The wire bonding process system according to claim 1, wherein: The loading mechanism further includes a lifting device configured to lift the material box from the second area, the lifting device is closer to the first side than the second side, and a working surface of the lifting device faces the second side.

10. The wire bonding process system according to claim 1, wherein: The loading mechanism includes an upper and lower table top, the first area and the second area are located on the lower layer, and the loading mechanism also includes a fifth area located on the upper layer, the fifth area is configured to place an empty material box, and the empty material box refers to the material box from which all process products have been taken out.

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