Semi-automatic wafer transfer device

Abstract

The utility model discloses a semi-automatic wafer transfer device, which comprises a bearing base and a vacuum pump, and is characterized in that a wafer tray, a gold-plated support plate tray and a vacuum transfer mechanism are arranged on the bearing base; the vacuum transfer mechanism comprises a rotating base and a lifting support. The wafer tray and the gold-plated support plate tray are positioned on two sides of the vacuum transfer mechanism, and the central positions are the same distance away from the rotary base; and the vacuum pump is connected with the bottom of the wafer tray through a first vacuum pipeline arranged in the bearing base, is connected with the bottom of the gold-plated carrier plate tray through a second vacuum pipeline arranged in the bearing base, and is also connected with the bracket sucking disc through a third vacuum pipeline arranged in the lifting bracket. According to the utility model, when wafers are transferred, a special tray is not needed to repeatedly reverse the wafers, so that time is saved, and efficiency is improved; and meanwhile, after the wafer is transferred by the device, the wafer and the gold-plated carrier plate are ensured to be concentric, so that the subsequent processes of testing, inspection and the like are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a device for semi-automatically transferring wafers. Background Art

[0002] With the development of semiconductor process technology and the increase in market demand for consumer electronic products (such as computers, mobile phones, etc.), people's requirements for electronic products are smaller and thinner. After the wafer is thinned, the wafer will be warped as a whole, which puts higher requirements on its transmission, cleaning, transfer and shipment.

[0003] At present, the industry uses gold-plated carriers for single-wafer shipment: that is, the wafer is fixed on the gold-plated carrier by UV film, and loaded into a wafer box for single-wafer shipment. Before this, the wafer connected to the substrate needs to be transferred to a gold-plated carrier. At present, the wafer is transferred from the substrate to the gold-plated carrier manually, and a special tray needs to be used in the middle. The wafer needs to be repeatedly turned over, which is prone to fragmentation and the problem that the wafer and the carrier are not in the concentric circle position.

[0004] Therefore, in view of the above problems, providing a device for automatically replacing a photomask is a technical problem that needs to be solved urgently in the art. Utility Model Content

[0005] The utility model aims to overcome the deficiencies of the prior art and provide a device for semi-automatically transferring wafers.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] In a first aspect of the utility model, a semi-automatic wafer transfer device is provided, comprising a load-bearing base and a vacuum pump, wherein a wafer tray, a gold-plated carrier tray and a vacuum transfer mechanism are arranged on the load-bearing base;

[0008] The vacuum transfer mechanism comprises a rotating base and a lifting bracket, one end of the lifting bracket is connected to the rotating base, and the other end of the lifting bracket is provided with a bracket suction cup facing downwards;

[0009] The wafer tray and the gold-plated carrier tray are located on both sides of the vacuum transfer mechanism, and the center positions are at the same distance from the rotating base;

[0010] The vacuum pump is connected to the bottom of the wafer tray through a first vacuum pipe arranged in the load-bearing base, the vacuum pump is connected to the bottom of the gold-plated carrier tray through a second vacuum pipe arranged in the load-bearing base, and the vacuum pump is also connected to the bracket suction cup through a third vacuum pipe arranged in the lifting bracket; the wafer tray, gold-plated carrier tray and bracket suction cup are all provided with penetrating adsorption micropores.

[0011] Furthermore, the interior of the bracket suction cup is concave, and a plurality of penetrating adsorption micropores are arranged on the edge of the outer ring.

[0012] Furthermore, the wafer tray has the same size as the wafer to be transferred, and the gold-plated carrier tray has the same size as the gold-plated carrier, and is larger than the size of the wafer tray;

[0013] Furthermore, the wafer to be transferred includes a substrate and a wafer body, and the gold-plated carrier is provided with densely penetrating microholes.

[0014] Furthermore, a control knob is provided on the vacuum pump.

[0015] The beneficial effects of the utility model are:

[0016] In the utility model, the problem that a special tray is needed to repeatedly flip the wafer when manually transferring the wafer is solved, and since the wafer thickness is 100 microns and is extremely thin, there is a risk of fragmentation, which further saves costs; and there is no need to repeatedly flip the wafer with a special tray when transferring the wafer, which saves time and improves efficiency; at the same time, after the device transfers the wafer, it ensures that the wafer and the gold-plated carrier are in a concentric circle, which is convenient for subsequent testing, inspection and other processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic structural diagram of a device for semi-automatically transferring wafers provided by an exemplary embodiment of the utility model;

[0018] Figure 2 A first structural schematic diagram of a bracket suction cup provided for an exemplary embodiment of the utility model;

[0019] Figure 3 A second structural schematic diagram of a bracket suction cup provided for an exemplary embodiment of the utility model;

[0020] In the figure, 1-wafer tray, 2-gold-plated carrier tray, 3-bracket suction cup, 4-load-bearing base, 5-rotating base, 6-third vacuum pipe, 7-vacuum pump, 8-first vacuum pipe, 9-lifting bracket, 10-first control knob, 11-second control knob, 12-third control knob, 13-second vacuum pipe. DETAILED DESCRIPTION

[0021] The technical solution of the utility model is described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be noted that the directions or positional relationships indicated by "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are directions or positional relationships based on the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0025] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determination". In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0027] See also Figure 1 , Figure 1 The schematic diagram of the structure of a semi-automatic wafer transfer device provided by an exemplary embodiment of the utility model is shown, comprising a load-bearing base 4 and a vacuum pump 7, wherein a wafer tray 1, a gold-plated carrier tray 2 and a vacuum transfer mechanism are arranged on the load-bearing base 4;

[0028] The vacuum transfer mechanism comprises a rotating base 5 and a lifting bracket 9, one end of the lifting bracket 9 is connected to the rotating base 5, and the other end of the lifting bracket 9 is provided with a bracket suction cup 3 facing downwards;

[0029] The wafer tray 1 and the gold-plated carrier tray 2 are located on both sides of the vacuum transfer mechanism, and the center positions are at the same distance from the rotating base 5;

[0030] The vacuum pump 7 is connected to the bottom of the wafer tray 1 through a first vacuum pipe 8 arranged in the load-bearing base 4, and the vacuum pump 7 is connected to the bottom of the gold-plated carrier tray 2 through a second vacuum pipe 13 arranged in the load-bearing base 4. The vacuum pump 7 is also connected to the bracket suction cup 3 through a third vacuum pipe 6 arranged in the lifting bracket 9; the wafer tray 1, the gold-plated carrier tray 2, and the bracket suction cup 3 are all provided with penetrating adsorption micropores.

[0031] Specifically, in this exemplary embodiment, the device is used to perform the transfer step in the single wafer shipment by means of a gold-plated carrier, and can be further used in the shipment step, wherein the transfer step is specifically used to transfer the wafer body of the wafer to be transferred to the gold-plated carrier, while the substrate portion is retained:

[0032] First, place the wafer to be transferred on the wafer tray 1, and place the gold-plated carrier on the gold-plated carrier tray 2. At this time, control the vacuum pump 7 to use the first vacuum pipe 8 set in the load-bearing base 4 to vacuum adsorb the entire wafer to be transferred (mainly used for adsorbing the substrate).

[0033] Thereafter, the rotating base 5 is rotated so that the support suction cup 3 and the wafer tray 1 are in a facing position, and then the height of the support suction cup 3 is lowered by the lifting bracket 9. At this time, the vacuum pump 7 is controlled to use the third vacuum pipe 6 arranged in the lifting bracket 9 to make the support suction cup 3 adsorb the wafer body of the wafer to be transferred, and raise the support suction cup 3 to a certain height.

[0034] Thereafter, the rotating base 5 is rotated so that the support suction cup 3 and the gold-plated carrier tray 2 are in a concentric circle position, and then the height of the support suction cup 3 is lowered by the lifting bracket 9 so that the wafer body contacts the gold-plated carrier on the gold-plated carrier tray 2. At this time, the vacuum pump 7 is controlled to use the second vacuum pipe 13 arranged in the load-bearing base 4 to make the wafer body adsorbed on the gold-plated carrier, and then the vacuum adsorption of the support suction cup 3 is turned off, and the support suction cup 3 is raised, thereby completing the transfer of the wafer body of the wafer to be transferred.

[0035] As for the shipping step, it can be carried out directly after completing the transfer step, including: sticking UV film on the four edges of the wafer body on the gold-plated carrier of the gold-plated carrier tray 2, fixing the wafer body, and then vacuum adsorbing the gold-plated carrier tray 2, and finally removing the gold-plated carrier and the wafer body to complete the shipment.

[0036] In addition, it should be noted that the structure can also be used to transfer the wafer body with the UV film removed from the gold-plated carrier to the substrate. The arrangement of the penetrating adsorption microholes is used to achieve vacuum adsorption.

[0037] Therefore, it can be known that the semi-automatic wafer transfer device provided by this exemplary embodiment realizes the transfer of wafers by raising and lowering the lifting bracket 9, using the support suction cup 3 to vacuum absorb the wafer, and then rotating the base 5 to make the wafer tray 1 and the gold-plated carrier tray 2 respectively located in concentric circles. This solves the problem that when manually transferring wafers, a special tray is needed to repeatedly flip the wafer, which is easy to cause the risk of fragmentation due to the extremely thin thickness of 100 microns, further saving costs; and when transferring wafers, there is no need to repeatedly flip the wafer with a special tray, saving time and improving efficiency; at the same time, after the device transfers the wafer, it ensures that the wafer and the gold-plated carrier are in a concentric circle, which is convenient for subsequent testing, inspection and other processes.

[0038] More preferably, in an exemplary embodiment, Figure 2 and Figure 3 As shown, the interior of the bracket suction cup 3 is concave, and a plurality of penetrating adsorption micropores are arranged on the outer edge.

[0039] Specifically, in this exemplary embodiment, the outer ring edge of the support suction cup 3 can absorb the edge invalid area of ​​the wafer body without damaging the effective area of ​​the wafer body.

[0040] More preferably, in an exemplary embodiment, the wafer tray 1 has the same size as the wafer to be transferred, and the gold-plated carrier tray 2 has the same size as the gold-plated carrier and is larger than the wafer tray 1. This method facilitates rapid positioning of the wafer to be transferred and the gold-plated carrier.

[0041] More preferably, in an exemplary embodiment, the wafer to be transferred includes a substrate and a wafer body, and the gold-plated carrier is provided with densely penetrating micro-holes.

[0042] Specifically, in this exemplary embodiment, the adsorption of the wafer body is accomplished by penetrating dense microholes on the gold-plated carrier.

[0043] More preferably, in an exemplary embodiment, the vacuum pump 7 is provided with a control knob. Figure 1 The three control knobs shown are respectively a first control knob 11 for controlling vacuum adsorption of the first vacuum pipe 8, a second control knob 11 for controlling vacuum adsorption of the second vacuum pipe 13, and a third control knob 12 for controlling vacuum adsorption of the third vacuum pipe 6. When vacuum adsorption is required or not, just rotate the corresponding control knob.

[0044] In addition, it should be noted that, for the rotating base 5 and the lifting bracket 9:

[0045] (1) The rotating base 5 can rotate by itself, thereby driving the lifting bracket 9 and the bracket suction cup 3 to rotate (in this case, the lifting bracket 9 and the rotating base 5 are preferably threadedly fixedly connected), or the lifting bracket 9 can rotate by itself, and the rotating base 5 limits the rotation of the lifting bracket 9 (in this case, the bottom of the lifting bracket 9 is rotationally connected to the rotating base 5), as long as the structure can be realized. In addition, the rotation method can be motor control (for example, a motor control method using gear meshing, etc.) or manual operation.

[0046] (2) The lifting of the lifting bracket 9 can be performed manually or by motor control (for example, by motor control with gear meshing).

[0047] If the above method requires motor control, a corresponding PLC controller can be connected externally, and the PLC controller can also be connected to the vacuum pump 7, thereby eliminating the physical control knob of the vacuum pump 7.

[0048] The above contents are all conventional technical means in this field and will not be elaborated here.

[0049] Obviously, the above embodiments are only examples for clear explanation, and are not limitations on the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the protection scope of the invention of the utility model.

Claims

1. A device for semi-automatic wafer transfer, characterized in that: It includes a load-bearing base and a vacuum pump, wherein the load-bearing base is provided with a wafer tray, a gold-plated carrier tray and a vacuum transfer mechanism; The vacuum transfer mechanism comprises a rotating base and a lifting bracket, one end of the lifting bracket is connected to the rotating base, and the other end of the lifting bracket is provided with a bracket suction cup facing downwards; The wafer tray and the gold-plated carrier tray are located on both sides of the vacuum transfer mechanism, and the center positions are at the same distance from the rotating base; The vacuum pump is connected to the bottom of the wafer tray through a first vacuum pipe arranged in the load-bearing base, the vacuum pump is connected to the bottom of the gold-plated carrier tray through a second vacuum pipe arranged in the load-bearing base, and the vacuum pump is also connected to the bracket suction cup through a third vacuum pipe arranged in the lifting bracket; the wafer tray, gold-plated carrier tray and bracket suction cup are all provided with penetrating adsorption micropores.

2. The semi-automatic wafer transfer device according to claim 1, characterized in that: The interior of the bracket suction cup is concave, and a plurality of penetrating adsorption micropores are arranged on the edge of the outer ring.

3. The semi-automatic wafer transfer device according to claim 1, characterized in that: The wafer tray has the same size as the wafer to be transferred, and the gold-plated carrier tray has the same size as the gold-plated carrier and is larger than the size of the wafer tray.

4. The semi-automatic wafer transfer device according to claim 1, characterized in that: The wafer to be transferred comprises a substrate and a wafer body, and the gold-plated carrier is provided with penetrating dense micro-holes.

5. The semi-automatic wafer transfer device according to claim 1, characterized in that: The vacuum pump is provided with a control knob.

Images