Packaging device, backlight module, driving circuit and display device

Abstract

The embodiment of the utility model belongs to the display technology, and provides a packaging device, a backlight module, a driving circuit and a display device.The packaging device comprises a substrate, three light-emitting chips, a first conversion light-emitting layer and a second conversion light-emitting layer, the three light-emitting chips are arranged on the substrate side by side, and the light-emitting chips are used for emitting light of a first color. And the first conversion light-emitting layer covers one of the three light-emitting chips, and the first conversion light-emitting layer is used for receiving the light of the first color emitted by the light-emitting chips and converting the light of the first color into the light of the second color. And the second conversion light-emitting layer covers the other one of the three light-emitting chips, and the second conversion light-emitting layer is used for receiving the light of the first color emitted by the light-emitting chips and converting the light of the first color into the light of a third color. The first color, the second color and the third color are different from one another and are respectively one of red, green and blue. The problems that a backlight driving circuit and a power supply are complex in structure and high in cost can be solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of backlight technology, and in particular to a packaging device, a backlight module, a driving circuit and a display device. Background Art

[0002] Field sequential color liquid crystal display (FSC LCD) technology adopts a time mixing method and uses red, green, blue (RGB) three-color backlight source to achieve color display without the use of a panel color filter (CF).

[0003] Usually, the red, green and blue backlight sources include light emitting diodes (LEDs) containing three chips: a red chip, a blue chip and a green chip. Color display is achieved by individually driving and controlling the red chip, the blue chip and the green chip.

[0004] However, the electrical and optical properties of red, blue and green chips are very different. If they are to be driven and controlled separately, three circuits need to be set up to control the red, blue and green chips respectively, and the power supplies corresponding to the red, blue and green chips also need to be designed separately. This leads to problems such as complex structure and high cost of backlight drive circuits and power supplies. Utility Model Content

[0005] The embodiments of the present application provide a packaging device, a backlight module, a driving circuit and a display device, which can solve the problems of complex structure and high cost of the backlight driving circuit and the power supply.

[0006] A first aspect of an embodiment of the present application provides a packaging device, including: a substrate;

[0007] three light-emitting chips, the three light-emitting chips are arranged side by side on the substrate, and the light-emitting chips are used to emit light of a first color;

[0008] A first conversion light-emitting layer, the first conversion light-emitting layer covers one of the three light-emitting chips, and the first conversion light-emitting layer is used to receive the first color light emitted by the light-emitting chip and convert it into a second color;

[0009] A second conversion light-emitting layer, the second conversion light-emitting layer covers another one of the three light-emitting chips, and the second conversion light-emitting layer is used to receive the first color light emitted by the light-emitting chip and convert it into a third color; wherein,

[0010] The first color, the second color, and the third color are different from each other and are respectively one of red, green, and blue.

[0011] By setting a substrate to provide installation positions for the three light-emitting chips, the three light-emitting chips and the substrate are packaged into a packaged device. By covering one of the three light-emitting chips with a first conversion light-emitting layer and covering another of the three light-emitting chips with a second conversion light-emitting layer, only one light-emitting chip is needed in the entire packaged device to emit red, green and blue light to meet the full-color backlight requirements. In addition, by setting the three light-emitting chips to emit the same color of light, there is only one light-emitting chip in the packaged device, so it can be driven by one driving circuit, which can simplify the structure of the driving circuit and power supply of the backlight module using the packaged device, reduce the design difficulty of the driving circuit and power supply, and thus reduce the cost.

[0012] In some embodiments of the present application, the light emitting chip is a blue light chip, the first color is blue, the second color is green, and the third color is red; wherein,

[0013] The first conversion light-emitting layer is used to receive the blue light emitted by the light-emitting chip and convert it into green light;

[0014] The second conversion light-emitting layer is used to receive the blue light emitted by the light-emitting chip and convert it into red light.

[0015] Since the blue light chip is mature, has high light efficiency and good stability, the light efficiency and stability of the packaged device can be improved by setting the light emitting chip as a blue light chip, which is conducive to the miniaturization of the packaged device. In addition, since the blue light chip has high light efficiency and good stability, it is less affected by factors such as temperature, so it can reduce the difficulty of adjusting the backlight brightness of the backlight module using the packaged device, thereby reducing costs.

[0016] In some embodiments of the present application, the light-emitting chip covered with the first conversion light-emitting layer is configured as a green lamp bead; wherein,

[0017] The green lamp bead includes a light emitting side, and the light emitting side of the green lamp bead is covered with a first reflective layer, and the first reflective layer is used to reflect red light and blue light and transmit green light.

[0018] By setting a first reflective layer on the light-emitting side of the green lamp bead, the green lamp bead can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead, thereby improving the accuracy of the backlight module using the packaging device, and thereby improving the resolution of the display device using the backlight module.

[0019] In some embodiments of the present application, the first reflective layer is a distributed Bragg reflective layer.

[0020] In some embodiments of the present application, the green lamp bead includes a light-emitting side, and the light-emitting side of the green lamp bead is covered with a first filter layer, and the first filter layer is used to filter out red light and blue light and transmit green light.

[0021] By setting a first filter layer on the light-emitting side of the green lamp bead, the green lamp bead can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead, thereby improving the accuracy of the backlight module using the packaging device, and thereby improving the resolution of the display device using the backlight module.

[0022] In some embodiments of the present application, the light-emitting chip covered with the second conversion light-emitting layer is configured as a red lamp bead; wherein,

[0023] The red lamp bead comprises a light emitting side, the light emitting side of the red lamp bead is covered with a second reflecting layer, and the second reflecting layer is used for reflecting green light and blue light and transmitting red light.

[0024] By setting a second reflective layer on the light-emitting side of the red lamp bead, the red lamp bead can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead, thereby improving the accuracy of the backlight module using the packaging device, and thereby improving the resolution of the display device using the backlight module.

[0025] In some embodiments of the present application, the second reflective layer is a distributed Bragg reflective layer.

[0026] In some embodiments of the present application, the red lamp bead includes a light emitting side, and the light emitting side of the red lamp bead is covered with a second filter layer, and the second filter layer is used to filter out green light and blue light and transmit red light.

[0027] By setting a second filter layer on the light-emitting side of the red lamp bead, the red lamp bead can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead, thereby improving the accuracy of the backlight module using the packaging device, and thereby improving the resolution of the display device using the backlight module.

[0028] In some embodiments of the present application, the first conversion light-emitting layer includes green phosphor or green quantum dots.

[0029] The first conversion luminescent layer is provided to include green phosphor or green quantum dots, so that blue light passing through the first conversion luminescent layer can excite green light, and the light-emitting chip provided with the first conversion luminescent layer can emit green light.

[0030] In some embodiments of the present application, the second conversion light-emitting layer includes red phosphor or red quantum dots.

[0031] The second conversion luminescent layer is provided to include red phosphor or red quantum dots so that blue light passing through the second conversion luminescent layer can excite red light, and the light-emitting chip provided with the second conversion luminescent layer can emit red light.

[0032] In some embodiments of the present application, the three light-emitting chips are connected in series or in parallel to form an input end and an output end.

[0033] By connecting the three light-emitting chips in series or in parallel, the three light-emitting chips finally form an input end and an output end, or in other words, a positive pin and a negative pin, so as to be connected to the driving circuit of the backlight module. In addition, this can also make the packaged device with three light-emitting chips driven by one driving circuit, which can simplify the structure of the driving circuit of the backlight module using the packaged device, thereby reducing the design difficulty and cost. Moreover, it is conducive to the miniaturization of the backlight module.

[0034] A second aspect of the embodiments of the present application provides a backlight module, comprising the packaging device described in the first aspect.

[0035] The backlight module in the embodiment of the present application is provided with the packaging device of the first aspect. Since the three light-emitting chips in the packaging device are arranged to emit light of the same color, they can be driven by one driving circuit. This can simplify the structure of the driving circuit and power supply of the backlight module using the packaging device, reduce the difficulty of designing the driving circuit and power supply, and thus reduce the cost. In addition, it is conducive to the miniaturization of the backlight module.

[0036] A third aspect of an embodiment of the present application provides a driving circuit, which is applied to the backlight module described in the second aspect above; the backlight module includes at least one packaging device, the driving circuit is electrically connected to the packaging device, and the driving circuit is used to drive the packaging device.

[0037] The driving circuit provided in the embodiment of the present application can be driven by one driving circuit because the three light-emitting chips in the packaged device are set to emit light of the same color. This can simplify the structure of the driving circuit, reduce the design difficulty of the driving circuit, and further reduce the cost, and is conducive to the miniaturization of the backlight module.

[0038] A fourth aspect of an embodiment of the present application provides a display device, comprising the packaging device described in the first aspect above.

[0039] The display device provided in the embodiment of the present application has a simple structure, low cost and high resolution by disposing the packaging device of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0041] Figure 1 This is a schematic diagram of the structure of a lamp board containing three RGB LED lamp beads;

[0042] Figure 2 It is a circuit diagram of a lamp board containing three RGB LED lamp beads;

[0043] Figure 3 A schematic diagram of a driving circuit of a backlight module;

[0044] Figure 4 This is a schematic structural diagram of a packaging device according to an embodiment of the present application;

[0045] Figure 5 This is a schematic diagram of the exploded structure of a packaging device according to an embodiment of the present application;

[0046] Figure 6 A schematic diagram of the structure of a light board formed by a packaging device according to an embodiment of the present application;

[0047] Figure 7 A circuit diagram of a light board formed by a packaged device according to an embodiment of the present application;

[0048] Figure 8 A schematic diagram of a driving circuit of a backlight module according to an embodiment of the present application;

[0049] Fig. 9 Another schematic diagram of the structure of a packaging device according to an embodiment of the present application;

[0050] Fig.10 Another structural schematic diagram of a packaging device according to an embodiment of the present application.

[0051] Description of reference numerals:

[0052] 10, 20-light board;

[0053] 100-packaged devices;

[0054] 110-light emitting chip;

[0055] 111- first conversion light-emitting layer;

[0056] 112- second conversion light-emitting layer;

[0057] 120-green lamp beads;

[0058] 121- a first reflective layer;

[0059] 122-first filter layer;

[0060] 130-red lamp beads;

[0061] 131- second reflective layer;

[0062] 132- second filter layer;

[0063] 141-input terminal;

[0064] 142- output terminal;

[0065] 150-substrate;

[0066] 160-Stand;

[0067] 210-LED lamp beads;

[0068] 211-red light chip;

[0069] 212-Blue-ray chip;

[0070] 213-green light chip;

[0071] 214-connection terminal;

[0072] 220-Carrying plate. DETAILED DESCRIPTION

[0073] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0074] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0075] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0076] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0077] The terms "first" and "second" are only configured for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0078] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0079] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0080] Field sequential color LCD technology uses a time-mixing method, using red, green, and blue backlight sources, hereinafter referred to as RGB backlight sources, to achieve color display without the use of panel color filters. The color backlight system refreshes the backlights of different colors in sequence within a frame, and at the same time adjusts the thin film transistor (TFT) of each pixel, changes the deflection angle of the liquid crystal molecules, and uses the visual persistence effect of the human eye to complete the color display. Since there is no filtering effect of the panel color filter (CF) color resistance, the light transmittance of the display module can be increased to about 3 times the original, which can effectively reduce the power consumption of the liquid crystal display (LCD).

[0081] In related technologies, such as Figure 1 As shown, the light board 20 may include a carrier board 220 and a plurality of LED lamp beads 210 disposed on the carrier board 220. Generally, a light emitting diode (LED) containing three chips, a red chip 211, a blue chip 212 and a green chip 213 (hereinafter referred to as an LED with three RGB chips) is used, and the three chips are packaged in a bracket 160 in the form of a POB package to form an LED lamp bead 210, and the three chips in one LED lamp bead 210 are driven and controlled separately.

[0082] Figure 2 The following is a circuit diagram of a light board containing three RGB LED lamp beads. Figure 2 As shown, each LED lamp bead 210 includes six connection terminals 214. It should be noted that the connection terminals 214 are used to connect to a power source, etc. Each light-emitting chip 110 corresponds to two connection terminals 214, which serve as the input terminal 141 and the output terminal 142 of the current, respectively. Figure 2 As shown, the circuit of the lamp board 20 is relatively complex. Therefore, the driving system for driving the backlight module of the LED lamp bead 210 including the three chips of RGB is more complex and costly than the ordinary backlight driving system. In addition, the driving voltages of the red chip 211, the blue chip 212 and the green chip 213 are different, and the driving power supply also needs to be designed separately, which is complex and costly.

[0083] For details, please refer to Figure 3 As shown, the driving circuit includes three integrated circuits, and the voltage of each circuit needs to be controlled separately. It should be noted that the "MCU" in the figure refers to the microcontroller unit (MCU), the "IC" refers to the integrated circuit, the "PFC+LLC" represents a resonant circuit with a power factor correction function, the "LDO" refers to a low dropout regulator (LDO), the "VDD" refers to the driving voltage required by the IC, and the "DC-DC" refers to a device that converts electrical energy of one voltage value into electrical energy of another voltage value in a direct current circuit. "FB-R" refers to a red light anti-interference device, "FB-G" refers to a green light anti-interference device, "FB-L" refers to a blue light anti-interference device, and "VIN" refers to the input voltage. "Vout-1", "Vout-2" and "Vout-3" refer to the three output voltages. By Figure 3 It can be seen that the driving circuit of the LED backlight including the three chips, namely the red chip 211 , the blue chip 212 and the green chip 213 , is relatively complex.

[0084] Based on the above technical problems, the embodiment of the present application provides a packaging device 100, a backlight module, a driving circuit and a display device. The packaging device 100 is provided with three light-emitting chips 110 that emit the same color, and a first conversion light-emitting layer 111 and a second conversion light-emitting layer 112 are respectively provided on two of the light-emitting chips 110, so that the light-emitting sides of the three light-emitting chips 110 can emit red, green and blue light to meet the full-color backlight requirements. And the structure of the driving circuit and power supply of the backlight module using the packaging device 100 can be simplified, the design difficulty of the driving circuit and power supply can be reduced, and the cost can be reduced.

[0085] The display device provided in the present application is described below with reference to the accompanying drawings and in combination with specific embodiments.

[0086] Figure 4 It is a schematic structural diagram of a packaging device according to an embodiment of the present application. Figure 5 This is a schematic diagram of the exploded structure of a packaging device according to an embodiment of the present application.

[0087] like Figure 4 As shown, the embodiment of the present application provides a package device 100, which may include a substrate 150 and three light-emitting chips 110. The three light-emitting chips 110 are arranged side by side on the substrate 150, and the light-emitting chips 110 are used to emit light of a first color.

[0088] The substrate 150 is provided to provide mounting positions for the three light emitting chips 110, so that the three light emitting chips 110 and the substrate 150 are packaged into a packaged device 100. By providing three light emitting chips 110, the packaged device 100 can emit three light beams.

[0089] Exemplarily, the package device 100 may further include a bracket 160 , and the three light emitting chips 110 are located in the bracket 160 to form the package device 100 .

[0090] like Figure 5 As shown, the package device 100 may further include a first conversion light-emitting layer 111 and a second conversion light-emitting layer 112. The first conversion light-emitting layer 111 covers one of the three light-emitting chips 110, and the first conversion light-emitting layer 111 is used to receive the light of the first color emitted by the light-emitting chip 110 and convert it into a second color. The second conversion light-emitting layer 112 covers another one of the three light-emitting chips 110, and the second conversion light-emitting layer 112 is used to receive the light of the first color emitted by the light-emitting chip 110 and convert it into a third color. The first color, the second color, and the third color are different, and are respectively one of red, green, and blue.

[0091] That is to say, the package device 100 in the embodiment of the present application can emit red, green and blue lights, so that the backlight module using the package device 100 can meet the full-color backlight requirements.

[0092] By covering the first conversion light-emitting layer 111 on one of the three light-emitting chips 110 and covering the second conversion light-emitting layer 112 on another one of the three light-emitting chips 110, it is achieved that only one light-emitting chip 110 is needed in the entire packaged device 100 to emit red, green and blue lights to meet the full-color backlight requirements.

[0093] In addition, by setting the three light-emitting chips 110 to emit light of the same color, there is only one light-emitting chip 110 in the packaged device 100, so it can be driven by one driving circuit. This can simplify the structure of the driving circuit and power supply of the backlight module using the packaged device 100, reduce the design difficulty of the driving circuit and power supply, and thus reduce costs.

[0094] In some embodiments of the present application, three light emitting chips 110 are connected in series or in parallel to form an input terminal 141 and an output terminal 142 (see Figure 7 shown).

[0095] It should be noted that the backlight module generally includes a light board 10, such as Figure 6 As shown, a plurality of packaging devices 100 in the above-mentioned embodiment can be arranged on the light board 10, and the plurality of packaging devices 100 are arranged in parallel on the light board 10. Figure 7 As shown, the circuit diagram of the lamp board 10 is relative to Figure 2 The circuit of the lamp board containing LED lamp beads with three RGB chips is much simpler, which can simplify the circuit structure of the lamp board 10, and then simplify the structure of the lamp board 10, thereby reducing the cost of the lamp board 10 using the packaging device 100.

[0096] By connecting the three light emitting chips 110 in series or in parallel, the three light emitting chips 110 finally form an input terminal 141 and an output terminal 142, or in other words, a positive electrode pin and a negative electrode pin, so as to be connected to the driving circuit of the backlight module. In addition, in this way, the packaged device 100 with three light emitting chips 110 can be driven by one driving circuit, such as Figure 8 As shown, relative to Figure 3The driving circuit diagram in the embodiment of the present application shows that the driving circuit of the backlight module has a simple structure, low design difficulty, and low cost, which is conducive to the miniaturization of the backlight module. It should be noted that the "MCU" in the figure refers to a microcontroller unit (MCU), the "IC" refers to an integrated circuit, and the "DC-DC" refers to a device that converts electrical energy of one voltage value into electrical energy of another voltage value in a direct current circuit.

[0097] It should be noted that in the embodiment of the present application, there is no limit to the number of packaging devices 100 provided on a light board 10, and the number can be set according to specific circumstances.

[0098] In some embodiments of the present application, the light emitting chip 110 may be a blue light chip, the first color is blue, the second color is green, and the third color is red. The first conversion light emitting layer 111 is used to receive the blue light emitted by the light emitting chip 110 and convert it into green light. The second conversion light emitting layer 112 is used to receive the blue light emitted by the light emitting chip 110 and convert it into red light.

[0099] It should be noted that, due to the mature development of blue light chips, the blue light chip has a high light efficiency of more than 60%, and good stability, but there is a large gap between green LEDs and red LEDs in terms of light efficiency and stability. Among them, the current, voltage and brightness (IVL) curve of green LEDs is very poorly linear. Red LEDs are sensitive to temperature. For example, when the ambient temperature rises from 25°C to 85°C, the brightness will drop by more than 50%, causing red LEDs to easily have color deviation during use. In addition, changes in driving current can also easily cause color deviation.

[0100] In this way, when the backlight module includes red LEDs and green LEDs, it is very difficult to adjust the backlight brightness. At the same time, as the chip size decreases, the luminous efficiency of blue LEDs, red LEDs and green LEDs all decreases to a certain extent, but the red LED is particularly prominent. The external quantum efficiency (EQE) of red LEDs with a size of less than 50μM is only about 10%. Therefore, when the chip size is less than 100μM, the difference in luminous efficiency of the red, green and blue chips will be very large, or the difference in driving current under the same luminous efficiency will be very large.

[0101] Therefore, by setting the light emitting chip 110 as a blue light chip, the light efficiency and stability of the packaged device 100 can be improved, which is conducive to the miniaturization of the packaged device 100. In addition, since the blue light chip has a high light efficiency and good stability and is less affected by factors such as temperature, it can reduce the difficulty of adjusting the backlight brightness of the backlight module using the packaged device 100, thereby reducing costs.

[0102] Of course, in other embodiments, the light emitting chip 110 may be set as a green light chip or a red light chip. In the embodiment of the present application, the color of the light emitted by the light emitting chip 110 is not further limited.

[0103] In some embodiments of the present application, the first conversion light-emitting layer 111 may include green phosphor or green quantum dots. By providing the first conversion light-emitting layer 111 with green phosphor or green quantum dots, blue light passing through the first conversion light-emitting layer 111 may excite green light, so that the light-emitting chip 110 provided with the first conversion light-emitting layer 111 may emit green light.

[0104] In some embodiments of the present application, the second conversion light-emitting layer 112 may include red phosphor or red quantum dots. By providing the second conversion light-emitting layer 112 with red phosphor or red quantum dots, the blue light passing through the second conversion light-emitting layer 112 can excite red light, so that the light-emitting chip 110 provided with the second conversion light-emitting layer 112 can emit red light.

[0105] It should be noted that the green phosphor in the first conversion light-emitting layer 111 and the red phosphor in the second conversion light-emitting layer 112 can be fluoride phosphor, also called KSF phosphor, or nitrogen oxide phosphor, also called β-SiALON phosphor. Of course, other types of phosphors can also be used in other embodiments, and the types of phosphors are not further limited in the embodiments of the present application.

[0106] It should be noted that the green phosphor in the first conversion light-emitting layer 111 and the quantum dots in the second conversion light-emitting layer 112 can be cadmium selenide crystal (CdSe) quantum dots, indium phosphide (InP) quantum dots, perovskite quantum dots or copper indium sulfide (CuInS2) quantum dots. In the embodiment of the present application, the type of quantum dots is not further limited.

[0107] In some embodiments of the present application, Fig. 9 As shown, the light emitting chip 110 covered with the first conversion light emitting layer 111 is configured as a green lamp bead 120. The light emitting side of the green lamp bead 120 is covered with a first reflective layer 121, and the first reflective layer 121 is used to reflect red light and blue light and transmit green light.

[0108] By setting a first reflective layer 121 on the light-emitting side of the green lamp bead 120, the green lamp bead 120 can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead 120, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0109] In some embodiments of the present application, the first reflective layer 121 is a distributed Bragg reflection layer (DBR). Of course, in other embodiments, the first reflective layer 121 can also be other reflective layers. In the embodiments of the present application, the type of the first reflective layer 121 is not further limited.

[0110] In some embodiments of the present application, the light emitting chip 110 covered with the second conversion light emitting layer 112 is configured as a red lamp bead 130. The light emitting side of the red lamp bead 130 is covered with a second reflective layer 131, which is used to reflect green light and blue light and transmit red light.

[0111] It should be noted that the light-emitting side refers to the side from which the light is emitted, that is, the side of the lamp bead from which the light is emitted.

[0112] By setting a second reflective layer 131 on the light-emitting side of the red lamp bead 130, the red lamp bead 130 can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead 130, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0113] In some embodiments of the present application, the second reflective layer 131 is a distributed Bragg reflection layer (DBR). Of course, in other embodiments, the second reflective layer 131 can also be other reflective layers. In the embodiments of the present application, the type of the second reflective layer 131 is not further limited.

[0114] In some embodiments of the present application, Fig.10 As shown, the light-emitting side of the green lamp bead 120 is covered with a first filter layer 122 , and the first filter layer 122 is used to filter out red light and blue light and transmit green light.

[0115] By setting a first filter layer 122 on the light-emitting side of the green lamp bead 120, the green lamp bead 120 can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead 120, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0116] It should be noted that the first filter layer 122 may be a color filter (CF). Of course, in other embodiments, it may also be other filters. In the embodiment of the present application, the type of the first filter layer 122 is not further limited.

[0117] In some embodiments of the present application, the light-emitting side of the red lamp bead 130 is covered with a second filter layer 132 , and the second filter layer 132 is used to filter out green light and blue light and transmit red light.

[0118] By setting a second filter layer 132 on the light-emitting side of the red lamp bead 130, the red lamp bead 130 can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead 130, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0119] It should be noted that the first filter layer 122 may be a color filter (CF). Of course, in other embodiments, it may also be other filters. In the embodiment of the present application, the type of the first filter layer 122 is not further limited.

[0120] In some embodiments, the first conversion light-emitting layer 111 of the green lamp bead 120 and the second conversion light-emitting layer 112 of the red lamp bead 130 can be packaged on the light-emitting chip 110 by dispensing. Of course, it can also be packaged on the light-emitting chip 110 by other methods, such as POB packaging, CSP packaging, NCSP packaging, etc. In the embodiment of the present application, the packaging method of the green lamp bead 120 and the red lamp bead 130 is not further limited.

[0121] In one possible implementation, the three light-emitting chips 110 can be packaged on the substrate 150 by POB packaging, CSP packaging, NCSP packaging, etc. Of course, they can also be packaged on the substrate 150 by other methods. In the embodiment of the present application, the packaging method between the light-emitting chip 110 and the substrate 150 is not further limited.

[0122] The packaged device provided in the embodiment of the present application realizes full-color backlight by using a more mature blue light chip with more stable optoelectronic performance, and matching it with a luminescent conversion layer. The driving scheme is relatively mature, and when the driving current and temperature change, the current-voltage (IV) characteristics and the chip light effect do not change much, which can simplify the driving control. In addition, the driving voltages of the three chips including red, green and blue are different, and the range span is large. When only the blue light chip is driven, the voltage span is small, which can simplify the power supply design and reduce the cost.

[0123] An embodiment of the present application also provides a backlight module, comprising the packaging device in any of the above embodiments.

[0124] It should be noted that the backlight module may include Figure 6 The lamp boards 10 shown in the figure have a plurality of packaged devices 100 disposed on each lamp board 10. In the embodiment of the present application, the number of lamp boards 10 in the backlight module and the number of packaged devices 100 on each lamp board 10 are not further limited.

[0125] The backlight module in the embodiment of the present application is provided with a packaging device in any of the above embodiments. Since the three light-emitting chips in the packaging device are arranged to emit light of the same color, they can be driven by one driving circuit. This can simplify the structure of the driving circuit and power supply of the backlight module using the packaging device, reduce the difficulty of designing the driving circuit and power supply, and thus reduce the cost. In addition, it is conducive to the miniaturization of the backlight module.

[0126] The embodiment of the present application also provides a driving circuit, which is applied to the above backlight module, wherein the backlight module includes at least one packaging device in any of the above embodiments, and the driving circuit is electrically connected to the packaging device, and the driving circuit is used to drive the packaging device.

[0127] The driving circuit provided in the embodiment of the present application can be driven by one driving circuit because the three light-emitting chips in the packaged device are set to emit light of the same color. This can simplify the structure of the driving circuit, reduce the design difficulty of the driving circuit, and further reduce the cost, and is conducive to the miniaturization of the backlight module.

[0128] An embodiment of the present application also provides a display device, comprising the packaging device in any of the above embodiments.

[0129] The display device provided in the embodiment of the present application has a simple structure, low cost and high resolution by disposing the packaging device of the first aspect.

[0130] It should be noted that the display device in the embodiment of the present application includes but is not limited to display devices such as flat panel displays, televisions, computers, and mobile phone displays. The specific structure of the display device in the present application is not further limited.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0132] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A packaging device, characterized in that: include: substrate; three light-emitting chips, the three light-emitting chips are arranged side by side on the substrate, and the light-emitting chips are used to emit light of a first color; A first conversion light-emitting layer, the first conversion light-emitting layer covers one of the three light-emitting chips, and the first conversion light-emitting layer is used to receive the first color light emitted by the light-emitting chip and convert it into a second color; A second conversion light-emitting layer, the second conversion light-emitting layer covers another one of the three light-emitting chips, and the second conversion light-emitting layer is used to receive the first color light emitted by the light-emitting chip and convert it into a third color; wherein, The first color, the second color, and the third color are different from each other and are respectively one of red, green, and blue.

2. The packaged device according to claim 1, characterized in that: The light emitting chip is a blue light chip, the first color is blue, the second color is green, and the third color is red; wherein, The first conversion light-emitting layer is used to receive the blue light emitted by the light-emitting chip and convert it into green light; The second conversion light-emitting layer is used to receive the blue light emitted by the light-emitting chip and convert it into red light.

3. The packaged device according to claim 2, characterized in that: The light-emitting chip covered with the first conversion light-emitting layer is configured as a green lamp bead; wherein, The green lamp bead comprises a light emitting side, the light emitting side of the green lamp bead is covered with a first reflective layer, the first reflective layer is used to reflect red light and blue light and transmit green light; or, The green lamp bead comprises a light emitting side, and the light emitting side of the green lamp bead is covered with a first filter layer, and the first filter layer is used for filtering out red light and blue light and transmitting green light.

4. The packaged device according to claim 2, characterized in that: The light-emitting chip covered with the second conversion light-emitting layer is configured as a red lamp bead; wherein, The red lamp bead comprises a light emitting side, the light emitting side of the red lamp bead is covered with a second reflective layer, the second reflective layer is used to reflect green light and blue light and transmit red light; or, The red lamp bead comprises a light emitting side, the light emitting side of the red lamp bead is covered with a second filter layer, and the second filter layer is used for filtering out green light and blue light and transmitting red light.

5. The packaged device according to any one of claims 2 to 4, characterized in that: The first conversion light-emitting layer includes green phosphor or green quantum dots.

6. The packaged device according to any one of claims 2 to 4, characterized in that: The second conversion light-emitting layer includes red phosphor or red quantum dots.

7. The packaged device according to any one of claims 1 to 4, characterized in that: The three light-emitting chips are connected in series or in parallel to form an input end and an output end.

8. A backlight module, characterized in that: Comprising a packaging device as described in any one of claims 1-7.

9. A driving circuit, applied to the backlight module according to claim 8, characterized in that: The backlight module includes at least one packaging device; The driving circuit is electrically connected to the packaging device, and the driving circuit is used to drive the packaging device.

10. A display device, characterized in that: Comprising a packaging device as described in any one of claims 1-7.

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