Base station cooling fin supporting frame

Abstract

The utility model discloses a base station radiating fin supporting frame which comprises a supporting assembly and a radiating assembly, the supporting assembly is composed of a supporting frame body, a conduction groove is formed in the supporting frame body, a plurality of conduction protruding blocks are arranged in the conduction groove at equal intervals so that concave-convex alternating conduction contact faces can be formed, the radiating assembly comprises a mounting plate, radiating plates are arranged on the mounting plate at equal intervals, and the radiating plates are arranged on the mounting plate at equal intervals. Meanwhile, a fixing end is arranged on the mounting plate, conducting strip-shaped grooves are formed in the fixing end at equal intervals, so that concave-convex alternating conducting contact surfaces are formed, the conducting grooves are clamped with the fixing end, the conducting convex blocks are clamped with the conducting strip-shaped grooves, and the two concave-convex alternating conducting contact surfaces are clamped. According to the utility model, the problems that the heat conduction efficiency is reduced and the installation between the radiating fin and the bracket is inconvenient because the contact surfaces of most of the existing radiating fin brackets and the radiating fin are usually flat are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a base station heat sink support frame. Background Art

[0002] The base station heat sink support frame is specially used to install the base station heat sink. It is not only a part of the base station heat sink, but also an important part of the heat sink. The function of the heat sink is to exchange the heat generated by the electronic components and power amplifiers in the base station equipment to the outside, and the function of the heat sink support frame is to conduct the heat to the heat sink. Therefore, the heat sink support frame plays a key role in the efficiency of the base station heat sink.

[0003] However, the contact surface between the current heat sink and the support frame is usually flat. It is well known that under equal size, the size of the contact surface determines the efficiency of heat conduction. Under the same size, the heat conduction efficiency of the plane contact is the lowest. In addition, the flat surface does not have limiting holes / grooves, which is not convenient for the installation between the heat sink and the support frame. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and utility model name of this application to avoid blurring the purpose of this section, specification abstract and utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In order to solve the problem that the contact surface between the heat sink bracket and the heat sink is usually flat, resulting in reduced heat conduction efficiency and inconvenient installation between the heat sink and the bracket, the utility model provides the following technical solutions:

[0006] A base station heat sink support frame includes a support assembly, which is composed of a support frame, wherein a conductive groove is provided on the support frame, and a plurality of conductive protrusions are provided in the conductive groove at equal intervals, thereby forming a conductive contact surface with alternating concave and convex shapes;

[0007] The heat dissipation assembly comprises a mounting plate, on which heat dissipation plates are arranged at equal intervals, and a fixing end is arranged on the mounting plate, on which conductive strip-shaped grooves are arranged at equal intervals, thereby forming a conductive contact surface with alternating concave and convex shapes;

[0008] The conductive groove is engaged with the fixed end, the conductive protrusion is engaged with the conductive strip groove, and the two conductive contact surfaces with alternating concave and convex portions are engaged with each other.

[0009] On the basis of the above technical solution, the present invention can also be improved as follows.

[0010] As a preferred solution of the base station heat sink support frame of the utility model, wherein: an adapter slot is opened on the upper surface of the support frame, and mounting holes are opened at equal intervals at the edge of the adapter slot.

[0011] As a preferred solution of the base station heat sink support frame of the utility model, wherein: the adapter slot on the support frame is matched and snapped with the mounting plate, and mounting adapter holes are opened at equal intervals on the edge of the mounting plate.

[0012] As a preferred solution of the base station heat sink support frame of the utility model, wherein: the mounting hole of the adapter slot on the support frame is matched with the mounting adapter hole of the mounting plate through a fastener.

[0013] As a preferred solution of the base station heat sink support frame of the utility model, the heat sinks on the mounting plate are arranged in an array with equal spacing, and there are multiple heat sinks, and the spacing between adjacent heat sinks is between 5mm-10mm.

[0014] As a preferred solution of the base station heat sink support frame of the utility model, a rack groove is provided on the conductive protrusion of the support frame.

[0015] As a preferred solution of the base station heat sink support frame of the utility model, heat dissipation micro holes are opened on the side of the conductive protrusion of the support frame.

[0016] As a preferred solution of the base station heat sink support frame of the utility model, a circular groove is provided in the conduction groove of the support frame, the circular groove is engaged with a circular protrusion, and the circular protrusion is arranged at the bottom of the fixed end.

[0017] The beneficial effect of the utility model is that by opening a circular groove in the conduction groove and a rack groove on the surface of the conduction protrusion, and arranging a fixed end and a conduction strip groove at the bottom of the mounting plate of the heat dissipation component, more conduction surface area can be increased and the heat conduction efficiency can be improved.

[0018] The conductive strip groove and the rack groove can be engaged with each other to ensure a stable connection between the heat dissipation component and the support component and increase the contact area between them. The circular groove and the circular protrusion can also be engaged with each other to improve the stability of the connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0020] Figure 1 It is a stereogram of the whole embodiment.

[0021] Figure 2 It is a three-dimensional diagram of the support assembly of this embodiment.

[0022] Figure 3 It is a plan view of the support assembly of this embodiment.

[0023] Figure 4 4 is a three-dimensional diagram of the heat dissipation assembly of this embodiment.

[0024] Figure 5 It is a cross-sectional view of the support assembly and the heat dissipation assembly of this embodiment.

[0025] Figure 6 It is a cross-sectional view of the support assembly and the heat dissipation assembly of this embodiment.

[0026] In the figure; support assembly 100, support frame 101, adapter slot 101a, mounting hole 101a-1, conduction slot 102, round-shaped groove 102a, conduction bump 103, rack groove 103a, heat dissipation microhole 103b;

[0027] Heat dissipation assembly 200, mounting plate 201, mounting adapter hole 201a, heat dissipation plate 201b, fixing end 202, round-shaped protrusion 202a, conductive strip groove 202b. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments. Example

[0031] Reference Figures 1 to 6 , is an embodiment of the utility model, which provides a base station heat sink support frame, such as Figure 1As shown, the support assembly 100 is installed in the area where the electronic components and power amplifiers in the base station equipment generate more heat, or near these areas. Usually, the support assembly 100 is fixedly installed on the base station equipment so that they become a whole. In order to dissipate the heat, the heat dissipation assembly 200 is installed on the support assembly 100 by screws or other fasteners. The function of the heat dissipation assembly 200 is to dissipate the heat of the electronic components and power amplifiers in the base station equipment. At the same time, the support assembly 100 itself must also have good thermal conductivity to quickly transfer heat;

[0032] In order to ensure that the support component 100 can effectively dissipate heat, a fixed installation method is generally adopted to make it a large whole with the base station equipment. In this way, the heat transfer between the support component 100 and the equipment is closer, which is conducive to the rapid transfer and dissipation of heat. In order to further improve the heat dissipation effect, the heat dissipation component 200 is designed to be installed on the support component 100 by screws or other fasteners. The heat dissipation component 200 can transfer heat to the surrounding environment through its special design and materials. In this way, the heat dissipation component 200 can effectively absorb and dissipate heat to maintain the normal operating temperature of the base station equipment. At the same time, in order to ensure that the heat can be transferred quickly, the support component 100 itself must also have good thermal conductivity. In this way, the heat can be quickly transferred from the electronic components and the power amplifier to the support component 100, and then finally dissipated through the heat dissipation component 200;

[0033] like Figure 2-Figure 3 As shown, in order to increase the heat conduction efficiency of the support assembly 100 and improve the installation efficiency and stability of the heat dissipation assembly 200, the support assembly 100 may be improved;

[0034] The support assembly 100 includes a support frame 101, a conduction slot 102 is provided in the middle of the support frame 101, and conduction bumps 103 are arranged in equal intervals in the conduction slot 102 and arranged alternately in sequence. This design increases the contact area between the support assembly 100 and the heat dissipation assembly 200, so that heat can be conducted and dissipated more effectively;

[0035] Through the design of the conductive groove 102 and the conductive bump 103, the support assembly 100 can be better and tightly combined with the heat dissipation assembly 200, and the installation efficiency of the heat dissipation assembly 200 is also improved, because the presence of the conductive bump 103 enables the heat dissipation assembly 200 to be more firmly fixed on the support frame 101;

[0036] Specifically, Figure 2 , Figure 4 , Figure 5 , Figure 6As shown, by providing a circular groove 102a in the conduction slot 102 and a rack groove 103a on the surface of the conduction protrusion 103, and providing a fixed end 202 and a conduction strip groove 202b at the bottom of the mounting plate 201 of the heat dissipation assembly 200, more conduction surface area can be added, and the heat conduction efficiency can be further improved;

[0037] The conductive strip groove 202b and the rack groove 103a can be engaged with each other to ensure a stable connection between the heat dissipation component 200 and the support component 100 and increase the contact area between them. The round-shaped groove 102a and the round-shaped protrusion 202a can also be engaged with each other to further improve the stability of the connection.

[0038] The heat conducted from the support frame 101 to the heat sink 201b on the mounting plate 201 can be dissipated more quickly, increasing the conduction surface area, so that the heat generated by the electronic components and power amplifiers in the base station equipment can be more effectively conducted to the heat sink 200 through the support assembly 100 and quickly dissipated to the external environment;

[0039] After the improvement, the heat dissipation effect is further improved, ensuring that the electronic components and power amplifiers in the base station equipment can operate within a stable temperature range. At the same time, due to the staggered arrangement of the fixed end 202 and the conductive strip groove 202b, the installation of the heat dissipation component 200 is also more convenient and quick;

[0040] In summary, through the above improvements, more conductive surface area can be added, the heat conduction efficiency can be improved, and it can be ensured that the heat in the base station equipment can be dissipated quickly and effectively to maintain the stable operation of the equipment;

[0041] Further, such as Figure 2 , Figure 4 As shown, a shallow adapter slot 101a is provided at the edge of the support frame 101, and the shape and size of the slot match the mounting plate 201. Therefore, when installing the mounting plate 201, the installation can be completed by simply aligning the edge of the mounting plate with the adapter slot on the support frame. Through the mounting hole 101a-1 on the support frame and the mounting adapter hole 201a on the mounting plate, the two can be mounted together using fasteners such as screws.

[0042] The connection between the mounting plate and the support frame is firm and not easy to loosen. At the same time, due to the existence of the adapter slot, the position of the mounting plate can be accurately aligned and fixed on the support frame. In this way, when replacing the heat sink, you only need to remove the screws, remove the mounting plate, and then replace the heat sink. The whole process is simple and efficient.

[0043] Furthermore, the conductive protrusion 103 on the support frame 101 is provided with heat dissipation micropores 103b. This design further improves the efficiency of conductive heat dissipation. The heat dissipation micropores can increase the heat transfer surface area, accelerate the heat dissipation, and thus improve the heat dissipation effect.

[0044] At the same time, the heat dissipation micropores can also prevent thermal expansion and contraction. When the support frame 101 and the mounting plate 201 expand and contract due to temperature changes, the heat dissipation micropores can buffer the pressure of thermal expansion and contraction, avoiding the problem that the support frame and the mounting plate cannot be sealed and engaged. This helps to ensure a stable connection between the mounting plate and the support frame, avoid loosening or sliding, and thus increase the service life of the heat sink and the support frame.

[0045] By adding the design of heat dissipation microholes, the heat dissipation efficiency can be further improved, and the sealing and stability of the mounting plate and the support frame can be ensured.

[0046] Importantly, it should be noted that the construction and arrangement of the present application shown in a number of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete element may be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0047] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment may not be described (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention).

[0048] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A base station heat sink support frame, characterized in that: include, The support assembly (100) is composed of a support frame (101), wherein the support frame (101) is provided with a conduction groove (102), and a plurality of conduction bumps (103) are arranged at equal intervals in the conduction groove (102), thereby forming a conduction contact surface with alternating concave and convex shapes; A heat dissipation component (200) comprises a mounting plate (201), heat dissipation plates (201b) being arranged at equal intervals on the mounting plate (201), and a fixed end (202) being arranged on the mounting plate (201), and conductive strip-shaped grooves (202b) being arranged at equal intervals on the fixed end (202), thereby forming a conductive contact surface with alternating concave and convex shapes; The conductive groove (102) is engaged with the fixed end (202), the conductive protrusion (103) is engaged with the conductive strip groove (202b), and the two alternating concave and convex conductive contact surfaces are engaged with each other.

2. The base station heat sink support frame according to claim 1, characterized in that: An adapter slot (101a) is provided on the upper surface of the support frame (101), and mounting holes (101a-1) are provided at equal intervals on the edge of the adapter slot (101a).

3. The base station heat sink support frame according to claim 2, characterized in that: The adapter slot (101a) on the support frame (101) is matched and snap-connected with the mounting plate (201), and mounting adapter holes (201a) are provided at equal intervals on the edge of the mounting plate (201).

4. The base station heat sink support frame according to any one of claims 2 and 3, characterized in that: The mounting hole (101a-1) of the adapter slot (101a) on the support frame (101) is matched with the mounting adapter hole (201a) of the mounting plate (201) via a fastener.

5. The base station heat sink support frame according to any one of claims 1 and 3, characterized in that: The heat dissipation plates (201b) on the mounting plate (201) are arranged in an array at equal intervals, and there are a plurality of heat dissipation plates (201b), with the spacing between adjacent heat dissipation plates (201b) being between 5 mm and 10 mm.

6. The base station heat sink support frame according to claim 3, characterized in that: A rack groove (103a) is provided on the conductive protrusion (103) of the support frame (101).

7. The base station heat sink support frame according to claim 3, characterized in that: Heat dissipation microholes (103b) are provided on the side surfaces of the conductive protrusions (103) of the support frame (101).

8. The base station heat sink support frame according to claim 3, characterized in that: A circular groove (102a) is provided in the conducting groove (102) of the support frame (101), and the circular groove (102a) is engaged with a circular protrusion (202a), and the circular protrusion (202a) is arranged at the bottom of the fixed end (202).

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