Graphene heat dissipation device
The graphene heat dissipation device addresses detachment problems by integrating a flexible substrate with connecting grooves and strip portions, ensuring stable attachment and improved heat transfer efficiency for flexible electronic devices.
Patent Information
- Application Number
- CN202420771704.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-15
AI Technical Summary
Flexible electronic devices face issues with graphene films detaching during use, leading to insufficient and unstable heat dissipation due to defects generated during film transfer processes.
A graphene heat dissipation device with a flexible substrate and integrated graphene heat dissipation film, featuring connecting grooves and strip portions, which are designed to enhance contact area and reduce conduction path length, thereby stabilizing the film's attachment and improving heat transfer efficiency.
The device ensures long-term stable attachment of the graphene film, enhancing heat dissipation capacity and maintaining high efficiency by increasing contact areas and reducing conduction path lengths, thus overcoming detachment issues and improving thermal conductivity.
Smart Images

Figure CN222148108U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat dissipation, in particular to a graphene heat dissipation device. Background Art
[0002] As flexible electronic devices become more and more popular, research on their heat dissipation issues is becoming increasingly important. For flexible electronic devices, one of the important heat dissipation methods is to set additional heat-conducting materials on the outer wall of the flexible electronic device, especially graphene, which has attracted attention for its excellent thermal conductivity.
[0003] Generally speaking, flexible electronic devices and graphene films are produced separately, and the graphene film is transferred from the substrate and attached to the outer wall of the flexible electronic device using film transfer technology. During the film transfer process, additional defects are easily generated inside the graphene film, resulting in insufficient adsorption of the graphene film on the outer wall of the flexible electronic device. Desorption and peeling are prone to occur during use, and the flexible electronic device cannot obtain long-term and stable heat dissipation effect. Utility Model Content
[0004] Based on this, it is necessary to provide a graphene heat dissipation device to address the problem that the graphene film used for heat dissipation on flexible electronic devices is easily desorbed.
[0005] A graphene heat dissipation device, comprising:
[0006] The flexible substrate has a first heat-conducting surface and a second heat-conducting surface, wherein the second heat-conducting surface is provided with a connecting groove extending along a first direction; and
[0007] A graphene heat dissipation film, comprising a substrate portion, a first strip portion and a second strip portion, wherein the substrate portion has a third heat conducting surface and a fourth heat conducting surface, the first strip portion extends along a first direction and is arranged on the third heat conducting surface, and the second strip portion is arranged on the fourth heat conducting surface;
[0008] The first strip portion is located in the connecting groove and is in contact with a side wall of the connecting groove, and the second heat conducting surface is in contact with the third heat conducting surface.
[0009] The cross-section of the first strip-shaped portion of the utility model is in the shape of an arc.
[0010] The utility model has at least two second strip portions, and all the second strip portions are laid on the fourth heat conducting surface at intervals to form a cooling channel between two adjacent second strip portions.
[0011] The second strip-shaped portion of the utility model is a first drain bar and a second drain bar, the first drain bar and the second drain bar are the same in number and each has at least two drain bars, the first drain bar and the second drain bar are arranged alternately, the graphene heat dissipation film also includes a third drain bar and a fourth drain bar, the third drain bar and the fourth drain bar are both arranged on the fourth heat conductive surface and are respectively located at the two end sides of the second strip-shaped portion, one end of the first drain bar is in contact with the third drain bar, the other end of the first drain bar is spaced apart from the fourth drain bar, one end of the second drain bar is spaced apart from the third drain bar, the other end of the second drain bar is in contact with the fourth drain bar, so as to form a liquid inlet and a liquid outlet at the end of the fourth drain bar and the end of the third drain bar respectively.
[0012] In the utility model, there are at least two first strip portions which are laid on the third heat conducting surface at intervals, and the distance between two adjacent second strip portions is equal to the distance between two adjacent first strip portions.
[0013] The cross-sectional shape of the connecting groove of the utility model is a trapezoid, and the cross-sectional width of the connecting groove gradually increases from the groove opening to the groove bottom.
[0014] In the present invention, the third heat conducting surface and the fourth heat conducting surface are opposite to each other in the second direction, and the projections of the first strip portion and the second strip portion in the second direction are separated.
[0015] The second strip portion of the utility model extends along the first direction so that both ends of the second strip portion are located at the edge of the fourth heat conducting surface.
[0016] The graphene heat dissipation device of the utility model also includes an electronic device, and the first heat conducting surface is attached to the electronic device.
[0017] The side edges of both sides of the flexible substrate of the utility model are both provided with elastic clamping arms, and the elastic clamping arms clamp the electronic equipment.
[0018] The beneficial effects of the utility model are:
[0019] The graphene heat dissipation film is prepared on a flexible substrate and then installed on an electronic device through the flexible substrate, thereby avoiding the film transfer process of the graphene heat dissipation film and thus avoiding the generation of additional defects, so that the graphene heat dissipation film can be stably maintained on the electronic device for a long time.
[0020] With the cooperation of the connection groove and the first strip portion, a larger contact area is obtained between the flexible substrate and the graphene heat dissipation film, which is conducive to the flexible substrate to transfer heat to the graphene heat dissipation film faster. The first strip portion is also closer to the electronic device through the avoidance of the connection groove, shortening the length of the heat conduction path between the electronic device and the graphene heat dissipation film. The second strip portion increases the contact area between the graphene heat dissipation film and the air, further improving the heat dissipation capacity of the graphene heat dissipation film, allowing the graphene heat dissipation film to transfer heat to the air faster, thereby offsetting the adverse effect of the flexible substrate on heat dissipation.
[0021] The utility model not only enables the electronic device to maintain a relatively high heat dissipation efficiency, but also improves the connection stability of the graphene heat dissipation film on the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the main structure of the graphene heat dissipation device in Example 1 of the utility model;
[0023] Figure 2 This is a schematic diagram of the exploded structure of the graphene heat dissipation device in Example 1 of the utility model;
[0024] Figure 3 This is a schematic diagram of the front view structure of the flexible substrate in Example 1 of the utility model;
[0025] Figure 4 This is a schematic diagram of the top view of the flexible substrate in Example 1 of the utility model;
[0026] Figure 5 This is a schematic diagram of the main structure of the graphene heat dissipation film in Example 1 of the utility model;
[0027] Figure 6 This is a schematic diagram of the top view of the graphene heat dissipation film in Example 1 of the utility model;
[0028] Figure 7 This is a schematic diagram of the exploded structure of the graphene heat dissipation device in Example 2 of the utility model;
[0029] Figure 8 This is a schematic diagram of the exploded structure of the graphene heat dissipation device in Example 3 of the utility model;
[0030] Fig. 9 This is a partial front view structural diagram of the graphene heat dissipation film in Example 4 of the utility model;
[0031] Fig.10 This is a schematic diagram of the top view of the graphene heat dissipation film in Example 5 of the utility model.
[0032] Reference numerals:
[0033] 1. Flexible substrate; 11. First heat-conducting surface; 12. Second heat-conducting surface; 13. Connecting groove; 2. Graphene heat dissipation film; 21. Base plate portion; 211. Third heat-conducting surface; 212. Fourth heat-conducting surface; 22. First strip portion; 23. Second strip portion; 231. First drainage strip; 232. Second drainage strip; 24. Cooling channel; 25. Third drainage strip; 251. Liquid outlet; 26. Fourth drainage strip; 261. Liquid inlet. DETAILED DESCRIPTION
[0034] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0040] Embodiment 1:
[0041] See also Figure 1-Figure 6 This embodiment provides a graphene heat dissipation device, including a flexible substrate 1, a graphene heat dissipation film 2 and an electronic device (not shown in the figure). In this embodiment, the electronic device specifically refers to a flexible electronic device.
[0042] See also Figure 3 and Figure 4 The flexible substrate 1 is made of common flexible materials and is flat and perpendicular to the second direction when not bent. The flexible substrate 1 has a first heat-conducting surface 11 and a second heat-conducting surface 12 that are opposite to each other in the second direction. The first heat-conducting surface 11 is adapted to the shape of the outer wall of the electronic device so as to be able to fit the outer wall of the electronic device, so that the heat of the electronic device can be transferred to the flexible substrate 1. When the electronic device is bent and deformed, the flexible substrate 1 can bend and deform in coordination. The second heat-conducting surface 12 is provided with a plurality of connection grooves 13 extending along the first direction.
[0043] See also Figure 5 and Figure 6The graphene heat dissipation film 2 includes a substrate portion 21, a first strip portion 22 and a second strip portion 23. When the graphene heat dissipation film 2 is not bent and deformed, the substrate portion 21 is flat and also perpendicular to the second direction. The substrate portion 21 has a third heat conducting surface 211 and a fourth heat conducting surface 212 opposite to each other in the second direction. The first strip portion 22 extends along the first direction and is arranged on the third heat conducting surface 211, wherein the first direction is perpendicular to the second direction. The second strip portion 23 is arranged on the fourth heat conducting surface 212, and the second strip portion 23 may be parallel to the first strip portion 22 or may not be parallel to it.
[0044] See also Figure 1 and Figure 2 The positions and cross-sectional shapes of the first strip portion 22 and the connection groove 13 match each other, so that the first strip portion 22 fills the connection groove 13, thereby at least partially fitting with the side wall of the connection groove 13, and the second heat conducting surface 12 and the third heat conducting surface 211 also fit each other. The heat generated by the electronic device is conducted to the graphene heat dissipation film 2 through the flexible substrate 1, and finally conducted to the air.
[0045] The preparation method of the graphene heat dissipation film 2 of this embodiment is as follows: the graphene heat dissipation film 2 is directly coated by scraping, thereby forming a first strip portion 22 in the connection groove 13, and forming a substrate portion 21 at the second heat conducting surface 12, and after drying, screen printing is performed at the fourth heat conducting surface 212 to obtain a second strip portion 23 and then dry. This preparation method avoids the film transfer of the graphene heat dissipation film 2, thereby avoiding the generation of additional defects, and the graphene heat dissipation film 2 can be stably attached to the flexible substrate 1 for a long time. Of course, in some other embodiments, other processes can also be used to directly prepare the graphene heat dissipation film 2 on the flexible substrate 1, and this embodiment will not be repeated one by one.
[0046] In some embodiments, elastic clamping arms are provided on both side edges of the flexible substrate 1, and the elastic clamping arms clamp the electronic device, thereby installing the flexible substrate 1 on the electronic device. In other embodiments, the flexible substrate 1 can also be adhered to the electronic device.
[0047] It is easy to understand that although the graphene heat dissipation film 2 can stay on the electronic device stably for a long time through the flexible substrate 1, the thermal conductivity of the flexible substrate 1 is generally not as good as that of the graphene heat dissipation film 2. Therefore, in the absence of the first strip portion 22 and the second strip portion 23, the heat dissipation efficiency of the electronic device through the flexible substrate 1 and the graphene heat dissipation film 2 will be lower than the case where the electronic device and the graphene heat dissipation film 2 are in direct contact in the prior art.
[0048] In this embodiment, with the cooperation of the connection groove 13 and the first strip portion 22, the flexible substrate 1 and the graphene heat dissipation film 2 have a larger contact area than a simple plane contact, which is conducive to the flexible substrate 1 to transfer heat to the graphene heat dissipation film 2 faster. In addition, the first strip portion 22 is closer to the electronic device through the avoidance of the connection groove 13, shortening the length of the heat conduction path between the electronic device and the graphene heat dissipation film 2. The second strip portion 23 increases the contact area between the graphene heat dissipation film 2 and the air, thereby further improving the heat dissipation capacity of the graphene heat dissipation film 2 through the structural design features, allowing the graphene heat dissipation film 2 to transfer heat to the air faster.
[0049] In summary, the graphene heat dissipation film 2 improves the long-term stability on the electronic device through the flexible substrate 1, and the structural design of the first strip portion 22 and the second strip portion 23 can reduce the adverse effect of the flexible substrate 1 on the heat dissipation efficiency, so that the graphene heat dissipation film 2 and the flexible substrate 1 maintain a high heat dissipation level.
[0050] Preferably, there are at least two second strip portions 23 , and an increase in the number of second strip portions 23 can further increase the contact area between the graphene heat dissipation film 2 and the air.
[0051] All the second strip portions 23 are laid on the fourth heat conducting surface 212 at intervals, and the laying direction is the third direction, and the third direction can be perpendicular to the first direction, or can be parallel to the first direction, or form a certain angle. A cooling channel 24 is formed between two adjacent second strip portions 23, and a coolant can be passed through the cooling channel 24. When the electronic device is large in size and in a non-bent state, the coolant can be used to assist the electronic device in heat dissipation.
[0052] Embodiment 2:
[0053] See also Figure 7 The difference between this embodiment and the first embodiment is that the cross-sectional shape of the first strip portion 22 is an arc shape, and the side wall shape of the connecting groove 13 is adapted to the first strip portion 22 and is also an arc shape. When the total volume of the first strip portion 22 is fixed, the cross-sectional shape is designed to be an arc shape, which can obtain a larger surface area, thereby maximizing the heat conduction efficiency between the flexible substrate 1 and the graphene heat dissipation film 2.
[0054] Embodiment 3:
[0055] See also Figure 8, this embodiment is different from the embodiment 1 in that the cross-sectional shapes of the connection groove 13 and the first strip portion 22 are the same and both are trapezoidal, and the cross-sectional width of the connection groove 13 gradually increases from the groove opening to the groove bottom, and when the substrate portion 21 is scraped, the graphene slurry can flow into the connection groove 13, and the connection groove 13 is filled regardless of the cross-sectional shape of the connection groove 13. After the scraping is completed and dried, the side wall of the connection groove 13 can limit the first strip portion 22, so that the first strip portion 22 of the flexible substrate 1 can stay in the connection groove 13 more stably during the bending deformation process, effectively preventing the flexible substrate 1 and the graphene heat dissipation film 2 from separating.
[0056] Embodiment 4:
[0057] See also Fig. 9 The difference between this embodiment and the first embodiment is that the projections of the first strip portion 22 and the second strip portion 23 in the second direction are separated. The portion of the substrate portion 21 where the first strip portion 22 and the second strip portion 23 are located can obtain increased strength through the first strip portion 22 and the second strip portion 23. The projections of the first strip portion 22 and the second strip portion 23 in the second direction are staggered, so that the strength of different portions of the substrate portion 21 can be as uniform as possible.
[0058] In order to further improve the strength uniformity of the substrate portion 21 , there are at least two first strip portions 22 that are laid on the third heat conducting surface 211 at intervals, and the distance between two adjacent second strip portions 23 is equal to the distance between two adjacent first strip portions 22 .
[0059] In order to enhance the reinforcing effect of the first strip portion 22 and the second strip portion 23 on the substrate portion 21, the first strip portion 22 and the second strip portion 23 are parallel to each other, that is, the second strip portion 23 also extends along the first direction, and both ends of the first strip portion 22 and the second strip portion 23 extend to the edge of the third heat conducting surface 211 and the edge of the fourth heat conducting surface 212 respectively.
[0060] Example 5
[0061] See also Fig.10The difference between this embodiment and embodiment 1 is that the second strip portion 23 is divided into a first drain bar 231 and a second drain bar 232, and the first drain bar 231 and the second drain bar 232 are the same in number and each has at least two drain bars. The first drain bar 231 and the second drain bar 232 are staggered in a third direction, wherein the third direction is perpendicular to both the first direction and the second direction. The graphene heat dissipation film 2 also includes a third drain bar 25 and a fourth drain bar 26, and the third drain bar 25 and the fourth drain bar 26 both extend along the first direction, and the third drain bar 25 and the fourth drain bar 26 are respectively located at the two end sides of the second strip portion 23 in the first direction, and the third drain bar 25 and the fourth drain bar 26 are both arranged on the fourth heat conduction surface. One end of the first drain bar 231 contacts the third drain bar 25, the other end of the first drain bar 231 is spaced apart from the fourth drain bar 26, one end of the second drain bar 232 is spaced apart from the third drain bar 25, the other end of the second drain bar 232 contacts the fourth drain bar 26, thereby only a liquid inlet 261 is formed on the fourth heat-conducting surface at the end of the fourth drain bar 26, and only a liquid outlet 251 is formed on the end of the third drain bar 25, a serpentine cooling channel that almost covers the fourth heat-conducting surface is formed between the liquid inlet 261 and the liquid outlet 251, so that the coolant can cool the fourth heat-conducting surface through only one pipeline.
[0062] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0063] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A graphene heat dissipation device, characterized in that: include: A flexible substrate (1) comprising a first heat-conducting surface (11) and a second heat-conducting surface (12), wherein the second heat-conducting surface (12) is provided with a connecting groove (13) extending along a first direction; and A graphene heat dissipation film (2), comprising a substrate portion (21), a first strip portion (22) and a second strip portion (23), wherein the substrate portion (21) has a third heat conducting surface (211) and a fourth heat conducting surface (212), the first strip portion (22) extends along a first direction and is arranged on the third heat conducting surface (211), and the second strip portion (23) is arranged on the fourth heat conducting surface (212); The first strip portion (22) is located in the connecting groove (13) and is in contact with the side wall of the connecting groove (13); the second heat conducting surface (12) is in contact with the third heat conducting surface (211).
2. The graphene heat dissipation device according to claim 1, characterized in that: The cross-sectional shape of the first strip-shaped portion (22) is an arc shape.
3. The graphene heat dissipation device according to claim 1, characterized in that: There are at least two second strip-shaped portions (23), and all the second strip-shaped portions (23) are laid at intervals on the fourth heat-conducting surface (212) to form a cooling channel (24) between two adjacent second strip-shaped portions (23).
4. The graphene heat dissipation device according to claim 3, characterized in that: The second strip-shaped portion (23) is divided into a first drain strip (231) and a second drain strip (232); the first drain strip (231) and the second drain strip (232) are of the same number and each is at least two; the first drain strip (231) and the second drain strip (232) are arranged in an alternating manner; the graphene heat dissipation film (2) further comprises a third drain strip (25) and a fourth drain strip (26); the third drain strip (25) and the fourth drain strip (26) are both arranged on the fourth heat conducting surface (212) and are respectively located on the second strip-shaped portion; At both end sides of the first drain bar (23), one end of the first drain bar (231) is in contact with the third drain bar (25), the other end of the first drain bar (231) is spaced apart from the fourth drain bar (26), one end of the second drain bar (232) is spaced apart from the third drain bar (25), the other end of the second drain bar (232) is in contact with the fourth drain bar (26), so as to form a liquid inlet (261) and a liquid outlet (251) at the end of the fourth drain bar (26) and the end of the third drain bar (25), respectively.
5. The graphene heat dissipation device according to claim 1, characterized in that: The cross-sectional shape of the connecting groove (13) is a trapezoid, and the cross-sectional width of the connecting groove (13) gradually increases from the groove opening to the groove bottom.
6. The graphene heat dissipation device according to claim 1, characterized in that: The third heat conducting surface (211) and the fourth heat conducting surface (212) are opposite to each other in the second direction, and the projections of the first strip-shaped portion (22) and the second strip-shaped portion (23) in the second direction are separated.
7. The graphene heat dissipation device according to claim 6, characterized in that: The second strip-shaped portion (23) extends along the first direction, so that both ends of the second strip-shaped portion (23) are located at the edge of the fourth heat conducting surface (212).
8. The graphene heat dissipation device according to claim 6, characterized in that: There are at least two first strip-shaped portions (22) which are laid at intervals on the third heat-conducting surface (211), and the distance between two adjacent second strip-shaped portions (23) is equal to the distance between two adjacent first strip-shaped portions (22).
9. The graphene heat dissipation device according to any one of claims 1 to 8, characterized in that: The graphene heat dissipation device also includes an electronic device, and the first heat conducting surface (11) is bonded to the electronic device.
10. The graphene heat dissipation device according to claim 9, characterized in that: Elastic clamping arms are provided on both side edges of the flexible substrate (1), and the elastic clamping arms clamp the electronic device.
