Injection mold for three-way joint
By introducing a fast cooling mechanism into the injection mold, the internal circulation and cooling of cooling water are achieved by using a circulation pump and a semiconductor refrigeration sheet, the problem of slow cooling speed in the prior art is solved, and the cooling efficiency and production efficiency are significantly improved.
Patent Information
- Application Number
- CN202420895462.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-28
AI Technical Summary
During the cooling process of existing injection molds, the cooling rate of the cooling water body and the outer surface of the mold is low, resulting in a slow cooling rate.
An injection mold of a tee joint is designed, including a supporting frame and a fast cooling mechanism, and the internal circulation driving and cooling of cooling water is achieved by circulating pumps and semiconductor refrigeration sheets, through hollow side plates, circular mesh plates, and industrial pipes. and components such as circulation pipes increase the contact rate between the cooling water and the mold surface, and improve heat exchange efficiency through fan-assisted heat dissipation wing design.
It significantly improves the cooling rate of the tee joint, improves production efficiency, and ensures efficient cooling effect.
Smart Images

Figure CN222156538U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of injection molds, and specifically relates to an injection mold for a three-way joint. Background Art
[0002] Injection molding, also known as injection molding, is a molding method that combines injection and molding. The advantages of the injection molding method are fast production speed, high efficiency, automated operation, a wide variety of colors, shapes from simple to complex, sizes from large to small, and precise product size. The product is easy to update and can be made into complex-shaped parts. Injection molding is suitable for mass production and complex-shaped products and other molding and processing fields. Injection molds are used in the production process of tee joints.
[0003] In order to increase the cooling rate, the existing injection mold will be immersed in water for cooling. The mold is fixed inside the water, and the contact rate between the cooling water and the outer surface of the mold is low, which will also lead to the problem of low cooling speed. Utility Model Content
[0004] The utility model aims to provide an injection mold for a three-way joint, so as to solve the problem that the efficiency of immersion water cooling in the prior art is still low.
[0005] The utility model provides the following technical solution: an injection mold of a three-way joint, comprising a supporting frame, an auxiliary cooling mechanism is arranged on the back of the supporting frame, and a rapid cooling mechanism is arranged on the inner wall of the supporting frame.
[0006] The rapid cooling mechanism includes a hollow side plate 1 and a hollow side plate 2, the hollow side plate 1 is fixedly installed on the left side of the inner wall of the support frame, the hollow side plate 2 is fixedly installed on the right side of the inner wall of the support frame, circular mesh plates are fixedly installed on the adjacent side surfaces of the hollow side plate 1 and the hollow side plate 2, a circulating pump is fixedly installed on the left side of the hollow side plate 1, a circulating pipe is fixedly connected to the right side of the hollow side plate 2, an input pipe of the circulating pump is fixedly connected to the left side of the hollow side plate 1, an I-shaped pipe is fixedly installed on the left side of the hollow side plate 1, an output pipe of the circulating pump is fixedly connected to the front of the I-shaped pipe, a semiconductor refrigeration plate is fixedly installed on the left side of the I-shaped pipe, and the cooperation of the circulating pump and the semiconductor refrigeration plate can drive the cooling water for internal circulation and cool it down, thereby improving the speed of fully cooling the three-way joint.
[0007] As a preferred embodiment of the above technical solution, a receiving pipe is fixedly connected to the back of the I-shaped pipe, and one end of the circulation pipe away from the second hollow side plate is fixedly connected to the left side of the receiving pipe.
[0008] As a preferred embodiment of the above technical solution, an extension frame is fixedly installed on the left side of the I-shaped pipeline, and a fan is fixedly installed on the inner wall of the extension frame, and the fan is used to dissipate heat and protect the hot end of the semiconductor refrigeration plate.
[0009] As a preferred embodiment of the above technical solution, the auxiliary cooling mechanism includes a fixed frame, which is fixedly installed on the back of the supporting frame, and a telescopic cylinder is fixedly installed on the top of the fixed frame. The telescopic end of the telescopic cylinder extends to the bottom of the fixed frame and is fixedly connected to a lifting frame, and the telescopic cylinder is used to drive the three-way mold to lift and lower as a whole.
[0010] As a preferred embodiment of the above technical solution, a cross sliding column is fixedly installed on the top of the lifting frame, the outer wall of the cross sliding column is slidably connected to the inner wall of the fixed frame, and the end of the inner side of the lifting frame is detachably connected with a receiving plate, and the cross sliding column is used to increase the stability of the lifting and lowering of the three-way mold.
[0011] As a preferred embodiment of the above technical solution, a three-way mold 1 is fixedly installed on the side of the receiving plate away from the lifting frame, and a three-way mold 2 is movably inserted on the top of the three-way mold 1. A sealing rubber ring is fixedly connected to the top of the three-way mold 1, and the top of the sealing rubber ring is movably connected to the bottom of the three-way mold 2. Heat dissipation fins are welded on the outer walls of the three-way mold 1 and the three-way mold 2. Through the design of the heat dissipation fins, the heat exchange rate between the three-way joints inside the three-way mold 1 and the three-way mold 2 and the water body is improved.
[0012] As a preferred embodiment of the above technical solution, a fixed block is fixedly installed on the outer wall of the three-way mold one, and a plug-in block is fixedly installed on the outer wall of the three-way mold two. The outer wall of the fixed block is movably connected to the inner wall of the plug-in block. The top of the fixed block is rotatably connected to the limiting block, and the bottom of the limiting block is movably connected to the top of the plug-in block. Through the cooperation of the plug-in block, the fixed block and the limiting block, the user can easily disassemble and assemble the three-way mold two at the top of the three-way mold one.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The utility model can absorb cooling water from the left side of the inner cavity of the support frame through the design of a circulating pump, and then transport the cooling water to the right side of the inner cavity of the support frame through the transportation of components such as a circulating pipe, thereby promoting the cooling water to circulate in the inner cavity of the support frame, thereby improving the contact rate between the water body and the outer surfaces of the three-way mold one and the three-way mold two, increasing the cooling rate of the three-way joint, and improving the production efficiency. At the same time, through the design of a semiconductor refrigeration plate, the water body can be circulated for temperature reduction treatment, thereby further improving the cooling rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional diagram of the utility model;
[0016] Figure 2 It is a structural schematic diagram of the fixing frame of the utility model;
[0017] Figure 3 It is a structural schematic diagram of the three-way mold 1 and the three-way mold 2 of the utility model;
[0018] Figure 4 This is a schematic diagram of the structure of the rapid cooling mechanism of the utility model;
[0019] Figure 5 for Figure 4 A magnified view of the structure at center.
[0020] In the figure: 1. support frame; 2. auxiliary cooling mechanism; 21. fixed frame; 22. telescopic cylinder; 23. lifting frame; 24. cross sliding column; 25. receiving plate; 26. three-way mold one; 27. three-way mold two; 28. sealing rubber ring; 29. fixed block; 291. plug-in block; 292. limit block; 293. heat sink; 3. rapid cooling mechanism; 31. hollow side plate one; 32. hollow side plate two; 33. round mesh plate; 34. circulation pump; 35. circulation pipe; 36. I-shaped pipe; 37. receiving pipe; 38. semiconductor refrigeration plate; 39. extension frame; 391. fan. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0022] like Figure 1 , Figure 4 and Figure 5As shown, the utility model provides a technical solution: an injection mold for a three-way joint, comprising a supporting frame 1, an auxiliary cooling mechanism 2 is arranged on the back of the supporting frame 1, a rapid cooling mechanism 3 is arranged on the inner wall of the supporting frame 1, the rapid cooling mechanism 3 comprises a hollow side plate 1 31 and a hollow side plate 2 32, the hollow side plate 1 31 is fixedly installed on the left side of the inner wall of the supporting frame 1, the hollow side plate 2 32 is fixedly installed on the right side of the inner wall of the supporting frame 1, a circular mesh plate 33 is fixedly installed on one side surface adjacent to the hollow side plate 1 31 and the hollow side plate 2 32, a circulating pump 34 is fixedly installed on the left side of the hollow side plate 1 31, a circulating pipe 35 is fixedly connected to the right side of the hollow side plate 2 32, and an input pipe of the circulating pump 34 is fixedly connected to the left side of the hollow side plate 1 31 Then, an I-shaped pipe 36 is fixedly installed on the left side of the hollow side plate 1 31, and the output pipe of the circulation pump 34 is fixedly connected to the front side of the I-shaped pipe 36. A semiconductor refrigeration plate 38 is fixedly installed on the left side of the I-shaped pipe 36 to control the circulation pump 34 to absorb cooling water from the left circular mesh plate 33, and output cooling water from the right circular mesh plate 33 through the I-shaped pipe 36, the receiving pipe 37 and the circulation pipe 35, so as to promote the circulation of cooling water in the inner cavity of the support frame 1, improve the contact rate between the water body and the outer surface of the three-way mold 1 26 and the three-way mold 2 27, and increase the cooling rate of the three-way joint. The cold end of the semiconductor refrigeration plate 38 is set on the right side. When the circulation pump 34 is running, the semiconductor refrigeration plate 38 is controlled to work to cool the circulating water.
[0023] As an implementation method in this embodiment, Figure 1-3 As shown, the back of the I-shaped pipe 36 is fixedly connected to a receiving pipe 37, and one end of the circulation pipe 35 away from the hollow side plate 32 is fixedly connected to the left side of the receiving pipe 37. An extension frame 39 is fixedly installed on the left side of the I-shaped pipe 36, and a fan 391 is fixedly installed on the inner wall of the extension frame 39. Through the design of the extension frame 39, the fan 391 is set up on the left side of the semiconductor refrigeration plate 38. The fan 391 is controlled to work and blow airflow to the hot end of the semiconductor refrigeration plate 38 to cool the hot end of the semiconductor refrigeration plate 38. The back of the I-shaped pipe 36 is connected to the end of the circulation pipe 35 through the receiving pipe 37 to facilitate water circulation.
[0024] As an implementation method in this embodiment, Figure 1-3As shown, the auxiliary cooling mechanism 2 includes a fixed frame 21, which is fixedly mounted on the back of the supporting frame 1, a telescopic cylinder 22 is fixedly mounted on the top of the fixed frame 21, the telescopic end of the telescopic cylinder 22 extends to the bottom of the fixed frame 21 and is fixedly connected to a lifting frame 23, a cross sliding column 24 is fixedly mounted on the top of the lifting frame 23, the outer wall of the cross sliding column 24 is slidably connected to the inner wall of the fixed frame 21, and a receiving plate 25 is detachably connected to the inner end of the lifting frame 23, and the receiving plate 25 is away from the bottom of the fixed frame 21. A three-way mold 26 is fixedly installed on one side of the lifting frame 23, and a three-way mold 27 is movably plugged into the top of the three-way mold 26. A sealing rubber ring 28 is fixedly connected to the top of the three-way mold 26, and the top of the sealing rubber ring 28 is movably connected to the bottom of the three-way mold 27. Heat dissipation fins 293 are welded on the outer walls of the three-way mold 26 and the three-way mold 27. A fixed block 29 is fixedly installed on the outer wall of the three-way mold 26, and a plug-in block 29 is fixedly installed on the outer wall of the three-way mold 27. 91, the outer wall of the fixed block 29 is movably connected to the inner wall of the plug-in block 291, the top of the fixed block 29 is rotatably connected to the limit block 292, the bottom of the limit block 292 is movably connected to the top of the plug-in block 291, and the telescopic cylinder 22 is controlled to perform telescopic work, and the height of the three-way mold 1 26 and the three-way mold 2 27 can be adjusted to facilitate the immersion cooling work. The cross sliding column 24 is used to improve the stability of the three-way mold 1 26 and the three-way mold 27. The design can further improve the heat exchange rate between the three-way joints inside the three-way mold 26 and the three-way mold 27 and the water body. The three-way mold 27 is plugged into the top of the three-way mold 26, and the plug-in block 291 is sleeved on the outer wall of the fixed block 29. The limit block 292 is then rotated to complete the fixed connection processing of the three-way mold 26 and the three-way mold 27. The design of the sealing rubber ring 28 can avoid the problem of cooling water flowing into the inner cavity of the three-way mold 26 and the three-way mold 27.
[0025] Working principle: Add cooling water to the inner cavity of the support frame 1 in advance, first insert the three-way mold 27 into the top of the three-way mold 1 26, and at the same time make the plug-in block 291 sleeved on the outer wall of the fixed block 29, and then rotate the limit block 292 forty-five degrees to complete the fixed connection processing of the three-way mold 1 26 and the three-way mold 2 27, and then perform injection molding on the inner cavity of the three-way mold 1 26 and the three-way mold 2 27. After the injection molding is completed, control the telescopic cylinder 22 to extend, so that the three-way mold 1 26 and the three-way mold 2 27 are moved into the water body in the inner cavity of the support frame 1, and control the circulation pump 34 to work, so that the water body in the support frame 1 circulates to realize the function of rapid cooling processing. After the cooling is completed, control the telescopic cylinder 22 to reset, and then reset the rotation limit block 292 to pull the three-way mold 2 27 out from the top of the three-way mold 1 26, and then the three-way joint can be demolded.
[0026] The above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it.
Claims
1. An injection mold for a three-way joint, comprising a support frame (1), characterized in that: An auxiliary cooling mechanism (2) is provided on the back of the support frame (1), and a rapid cooling mechanism (3) is provided on the inner wall of the support frame (1); The rapid cooling mechanism (3) comprises a hollow side plate 1 (31) and a hollow side plate 2 (32); the hollow side plate 1 (31) is fixedly mounted on the left side of the inner wall of the supporting frame (1); the hollow side plate 2 (32) is fixedly mounted on the right side of the inner wall of the supporting frame (1); a circular mesh plate (33) is fixedly mounted on adjacent side surfaces of the hollow side plate 1 (31) and the hollow side plate 2 (32); a circulation pump (34) is fixedly mounted on the left side of the hollow side plate 1 (31); a circulation pipe (35) is fixedly connected to the right side of the hollow side plate 2 (32); an input pipe of the circulation pump (34) is fixedly connected to the left side of the hollow side plate 1 (31); an I-type pipe (36) is fixedly mounted on the left side of the hollow side plate 1 (31); an output pipe of the circulation pump (34) is fixedly connected to the front side of the I-type pipe (36); and a semiconductor cooling plate (38) is fixedly mounted on the left side of the I-type pipe (36).
2. The injection mold of a three-way joint according to claim 1, characterized in that: The back of the I-shaped pipe (36) is fixedly connected to a receiving pipe (37), and one end of the circulation pipe (35) away from the second hollow side plate (32) is fixedly connected to the left side of the receiving pipe (37).
3. The injection mold of a three-way joint according to claim 1, characterized in that: An extension frame (39) is fixedly mounted on the left side of the I-shaped pipeline (36), and a fan (391) is fixedly mounted on the inner wall of the extension frame (39).
4. The injection mold of a three-way joint according to claim 1, characterized in that: The auxiliary cooling mechanism (2) comprises a fixing frame (21), the fixing frame (21) being fixedly mounted on the back of the supporting frame (1), a telescopic cylinder (22) being fixedly mounted on the top of the fixing frame (21), a telescopic end of the telescopic cylinder (22) extending to the bottom of the fixing frame (21) and being fixedly connected to a lifting frame (23).
5. The injection mold of a three-way joint according to claim 4, characterized in that: A cross sliding column (24) is fixedly mounted on the top of the lifting frame (23); the outer wall of the cross sliding column (24) is slidably connected to the inner wall of the fixed frame (21); and a receiving plate (25) is detachably connected to the inner end of the lifting frame (23).
6. The injection mold of a three-way joint according to claim 5, characterized in that: A three-way mold 1 (26) is fixedly installed on one side of the receiving plate (25) away from the lifting frame (23); a three-way mold 2 (27) is movably inserted at the top of the three-way mold 1 (26); a sealing rubber ring (28) is fixedly connected to the top of the three-way mold 1 (26); the top of the sealing rubber ring (28) is movably connected to the bottom of the three-way mold 2 (27); and heat dissipation fins (293) are welded on the outer walls of the three-way mold 1 (26) and the three-way mold 2 (27).
7. The injection mold of a three-way joint according to claim 6, characterized in that: A fixing block (29) is fixedly mounted on the outer wall of the three-way mold (26), and a plug-in block (291) is fixedly mounted on the outer wall of the three-way mold (27). The outer wall of the fixing block (29) is movably connected to the inner wall of the plug-in block (291). The top of the fixing block (29) is rotatably connected to a limit block (292), and the bottom of the limit block (292) is movably connected to the top of the plug-in block (291).
