Packaging adhesive film jig

Abstract

A packaging adhesive film jig comprises a jig base, a substrate groove is further formed in the upper surface of the jig base, the plane of the substrate groove is parallel to the lower surface of the jig base, boss structures are arranged on the two sides of the plane of the substrate groove, and the upper surfaces of the boss structures are parallel to the plane of the substrate groove. A boss structure is arranged in the substrate groove, the height of the boss structure is consistent with the thickness of the substrate, a component containing groove set is further arranged in the middle of the substrate groove, and a clamping plate structure is installed on the boss structure and used for clamping the substrate in the substrate groove. The glue film packaging device is simple in structure, can guarantee good sealing performance and durability after glue films are packaged, is convenient to operate, and is convenient for removing the glue films.

Description

Technical Field

[0001] The utility model belongs to the technical field of packaging tools, and in particular relates to a packaging film fixture. Background Art

[0002] After the display screen is manufactured, it needs to be encapsulated with film to protect the screen and extend its service life. However, if the jig or fixture used to encapsulate the film cannot remain flat and stable during the entire encapsulation process, the encapsulated film is prone to quality problems, and its sealing and durability will be greatly reduced, even affecting the user experience. The same is true for the encapsulation of photovoltaic panels.

[0003] In the prior art, a patent document with publication number CN 112331091 A discloses an LED module packaging method and an LED module; wherein the method comprises the steps of: stacking a circuit board equipped with LED lamp beads, a solid light-transmitting adhesive layer, and a light-transmitting film in sequence, wherein the side of the circuit board equipped with the LED lamp beads faces the light-transmitting adhesive layer; applying pressure to the stacked circuit board, the light-transmitting adhesive layer, and the light-transmitting film under a preset temperature environment to obtain an LED module; after the light-transmitting adhesive layer re-solidifies, trimming the LED module according to product requirements; wherein the melting point of the light-transmitting film is higher than the melting point of the light-transmitting adhesive layer; the preset temperature is above the melting point of the light-transmitting adhesive layer and lower than the melting point of the light-transmitting film; the LED module comprises a circuit board, a light-transmitting adhesive layer, and a light-transmitting film, and the melting point of the light-transmitting adhesive layer is lower than the melting point of the light-transmitting film. The above scheme utilizes the different melting points of the transparent adhesive layer and the transparent film, and melts and solidifies them in sequence and then trims them to make the thickness of the adhesive layer uniform everywhere. However, the operation is too complicated, and the melted adhesive layer and the film are not easy to remove after they are adhered. If the service life is expected to be the same as the equipment life, the adhesive film cannot be resealed. Utility Model Content

[0004] 1. Technical Problems Solved

[0005] In view of the deficiencies in the prior art, the utility model provides a packaging film fixture which has a simple structure, can ensure good sealing and durability after packaging the film, and is easy to operate and convenient for removing the film.

[0006] 2. Specific technical solutions

[0007] A packaging film jig includes a jig base, wherein a substrate groove is provided on the upper surface of the jig base, wherein the plane of the substrate groove is parallel to the lower surface of the jig base, and boss structures are provided on both sides of the plane of the substrate groove, wherein the upper surface of the boss structure is parallel to the plane of the substrate groove, and the height of the boss structure is consistent with the thickness of the substrate, and a component accommodating groove group is provided in the middle of the substrate groove, and a clamping plate structure is installed on the boss structure for clamping the substrate in the substrate groove.

[0008] Preferably, the surface roughness of the groove plane of the substrate is not higher than Ra 6.3.

[0009] Preferably, the clamping plate structure is composed of four right-angle clamping plates, and the four right-angle clamping plates are respectively clamped at four right-angle portions of the substrate in the substrate clamping groove.

[0010] Preferably, a positioning notch is provided in the middle of the boss structure, and a positioning block is provided at the bottom of the clamping plate structure, and the positioning block cooperates with the positioning notch.

[0011] Preferably, folding calipers are provided at both ends of the boss structure, and the folding calipers are clamped on the side of the clamping plate structure.

[0012] The utility model has the following beneficial effects: the structure is simple, good sealing and durability can be ensured after the encapsulation film is encapsulated, and the operation is convenient for removing the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall top view of the utility model.

[0014] Figure 2 It is a cross-sectional schematic diagram of the utility model as a whole from the side.

[0015] In the figure: a fixture base 1; a substrate groove 2; a boss structure 3; a component accommodating groove group 4; a clamping plate structure 5; a positioning notch 6; a positioning block 7; and a folding caliper 8. DETAILED DESCRIPTION

[0016] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0017] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0018] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a direct connection, it can be connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] Example:

[0020] like Figure 1 and Figure 2 As shown: a packaging film jig is provided with a jig base 1, and a substrate groove 2 is also provided on the upper surface of the jig base 1. The plane of the substrate groove 2 is parallel to the lower surface of the jig base 1, and there are boss structures 3 on both sides of the plane of the substrate groove 2. The upper surface of the boss structure 3 is parallel to the plane of the substrate groove 2, and the height of the boss structure 3 is consistent with the thickness of the substrate. A component accommodating groove group 4 is also provided in the middle of the substrate groove 2, and a clamping plate structure 5 is installed on the boss structure 3 for clamping the substrate in the substrate groove 2.

[0021] Furthermore, the surface roughness of the substrate groove 2 plane is not higher than Ra 6.3, and the parallelism between the substrate groove 2 plane and the lower surface of the fixture base 1 is not higher than 0.5 mm, and the parallelism between the upper surface of the boss structure 3 and the substrate groove 2 plane is not higher than 0.2 mm.

[0022] Furthermore, the clamping plate structure 5 is composed of four right-angle clamping plates, and the four right-angle clamping plates are respectively clamped at four right-angled parts of the substrate in the substrate clamping groove 2 .

[0023] Furthermore, a positioning slot 6 is provided in the middle of the boss structure 3, and a positioning block 7 is provided at the bottom of the card plate structure 5, which cooperates with the positioning slot 6. Positioning pins are also provided at two opposite right-angled parts of the plane of the substrate groove 2, and corresponding positioning pin holes are provided on the substrate to cooperate with the positioning pins, otherwise there is no need to set them up.

[0024] Furthermore, folding calipers 8 are provided at both ends of the boss structure 3 , and the folding calipers 8 are clamped on the side of the clamping plate structure 5 .

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention shall be defined by the appended claims.

Claims

1. A packaging film jig, characterized in that: The jig base (1) comprises a jig base (1), the upper surface of the jig base (1) is also provided with a substrate groove (2), the plane of the substrate groove (2) is parallel to the lower surface of the jig base (1), both sides of the plane of the substrate groove (2) are provided with a boss structure (3), the upper surface of the boss structure (3) is parallel to the plane of the substrate groove (2), and the height of the boss structure (3) is consistent with the thickness of the substrate, a component accommodating groove group (4) is also provided in the middle of the substrate groove (2), and a clamping plate structure (5) is installed on the boss structure (3) for clamping the substrate in the substrate groove (2).

2. The encapsulation film jig according to claim 1, characterized in that: The surface roughness of the plane of the substrate groove (2) is not higher than Ra 6.

3.

3. The encapsulation film jig according to claim 1, characterized in that: The clamping plate structure (5) is composed of four right-angle clamping plates, and the four right-angle clamping plates are respectively clamped on four right-angled parts of the substrate in the substrate clamping groove (2).

4. The encapsulation film jig according to any one of claims 1 to 3, characterized in that: A positioning notch (6) is provided in the middle of the boss structure (3), and a positioning block (7) is provided at the bottom of the clamping plate structure (5), and the positioning block (7) cooperates with the positioning notch (6).

5. The encapsulation film jig according to any one of claims 1 to 3, characterized in that: Folding calipers (8) are provided at both ends of the boss structure (3), and the folding calipers (8) are clamped on the side of the clamping plate structure (5).

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