Circulating passing type powder electroplating or electrolysis impurity removing device

Abstract

The utility model discloses a circulating through type powder electroplating or electrolysis impurity removal device, which relates to the technical field of electrochemistry and comprises a first electrode chamber, a second electrode chamber and a pump which are communicated to form a circulating liquid path, a feeding hole is formed in the top of the circulating liquid path, and an openable receiving hole is formed in the bottom; a screen plate and an electrode plate which are made of conductor materials are respectively arranged in the first electrode chamber and the second electrode chamber, and the screen plate and the electrode plate are respectively used as metal electrodes and are electrically communicated with an electrode of a power supply. According to the utility model, the mesh plate arranged in the first electrode chamber and the circulating flow of the fluid in the circulating liquid path are utilized to keep the impact of the powder material on the mesh plate and realize the repeated circulating circulation of the powder material at the mesh plate, so that the collision between the powder particles and the metal electrode is enhanced, and the contact area between the powder particles and the metal electrode is increased; the electroplating or electrolysis quality and the electroplating or electrolysis efficiency are improved; and the electrolyte or the electroplating liquid separated by the powder recovery device can be recycled, so that the control of the electrolysis or electroplating cost is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of electrochemistry, in particular to a circulating electroplating device for metal coating on the surface of powder materials or an electrolytic device for purifying crystalline silicon waste. Background Art

[0002] The lack of sufficient anti-corrosion ability makes it susceptible to oxidation and corrosion, and there are some deficiencies in stability and conductivity that limit its application in some special fields. Electroplating coating is a process of depositing a metal or alloy layer on the surface of a powder material through an electrochemical reaction. The powder is placed in an electroplating solution, and an external current is applied to deposit metal ions on the surface of the powder to form a metal layer. During the electroplating process, an oxidation reaction occurs at the anode to release metal ions. At the same time, the conductive powder acts as a cathode, and the metal ions are reduced on the surface of the powder to form a metal layer. Electroplating coating can form a uniform and dense protective layer on the surface of the powder material, effectively preventing corrosive substances from corroding the surface of the powder, improving the corrosion resistance of the material, and at the same time, it can improve the conductivity of the coated powder material, enhance mechanical properties, improve surface smoothness and gloss, etc., so that the metal-coated powder material can be adapted to a wider range of application scenarios, and the metal-coated powder material has a longer service life. In the prior art, the surface metal coating of powder materials mainly adopts methods such as chemical plating, high-energy ball milling and chemical displacement plating. Therefore, it is necessary to provide a powder electroplating device and a specific surface treatment solution to meet the requirements of different industries for powder materials.

[0003] Through prior art search, there are the following known technical solutions:

[0004] Prior art 1: A metal-coated composite powder electroplating device

[0005] Application number: 201711362736.3, application date: 2017.12.18, publication (announcement) date: 2017.12.18.

[0006] Prior art 1 relates to the field of electroplating technology, and introduces a composite powder electroplating device. The working principle of the device includes: it mainly works through a specially designed electroplating tank, which is composed of a conductive shell and is internally divided into two cavities: an inner cavity and an outer cavity. This separation is achieved by a permeable ceramic film installed in the tank. During the electroplating process, the negative pole of the power supply is connected to the conductive shell (as a cathode), and the positive pole extends into the inner cavity, which is filled with metal powder as an anode. In this way, when the current passes through, the metal powder in the inner cavity precipitates metal cations, and the shell reduces these cations to form a dense and uniform metal coating. The entire system is used in conjunction with a circulating pump and a liquid storage tank to ensure that the plating solution can circulate from the liquid storage tank through the electroplating tank, and the flow of the plating solution is controlled by the liquid inlet and the liquid outlet. The present invention ensures sufficient electroplating and a uniform and dense coating by rolling and circulating the composite powder in a rotating device.

[0007] However, in the prior art 1, the permeable ceramic membrane needs to prevent the passage of the electroplating solution while allowing a certain degree of electron exchange, and the physical stability and chemical durability of the membrane are difficult to meet the requirements. The chemical stability of the electroplating solution is difficult to ensure, and it is difficult to accurately control its chemical composition during the electroplating process.

[0008] Prior art 2: A device for electroplating nano-micron powders

[0009] Application number: 202223495614.0, application date: 2022.12.27, publication (announcement) date: 2023.05.23.

[0010] Prior art 2 discloses a device for nano-micron powder electroplating, which relates to the field of powder electroplating, including an electroplating chamber, an ultrasonic probe, a DC power supply, a liquid storage chamber, a first vacuum pump, and a second vacuum pump. A cathode current collector and an anode current collector are arranged in the electroplating chamber, and a power cathode and a power anode are arranged on the DC power supply. Both the power cathode and the power anode are connected to the electroplating chamber, and the end of the power cathode is connected to the cathode current collector. The utility model provides a device for nano-micron powder electroplating, which integrates electroplating tools (power supply, current collector), dispersion tools (ultrasonic probe) and stacking tools (vacuum pump), and replaces the operation of electroplating-ultrasound-stack-electroplating that needs to be repeated for multiple cycles in nano-micron powder electroplating. It improves the working efficiency of nano-micron powder electroplating, simplifies the operation steps, and can produce nano-micron powders with uniform and dense coating, which is very suitable for nano-micron powder electroplating.

[0011] However, in the prior art 2, the electrode adopts a fixed structure, which leads to a weak collision effect between the electrode and the powder material, a small contact area, and a low electroplating efficiency; if the ultrasonic crushing is not uniform and thorough enough, it will also cause problems such as agglomeration of the powder material.

[0012] Through the above search, it is found that the above technical solutions do not affect the novelty of the utility model.

[0013] In addition, silicon-based semiconductors are one of the key materials for manufacturing semiconductor high-tech products such as solar cells and integrated circuits, and their purity and lattice structure are crucial to device performance. In the production process of silicon-based semiconductors, the required wafers are obtained by cutting silicon-based semiconductor blocks. This process produces a large amount of cutting waste, including silicon sawdust and fragments, powder, etc. The silicon-based semiconductor cutting waste contains various organic residues, metal impurities and oxide layers, which will affect the quality and performance of silicon-based semiconductors. The current traditional methods usually include chemical dissolution, melt recrystallization, vapor deposition, rough purification and mixing. However, traditional purification methods may have problems such as high processing cost, high energy consumption, complex process and high environmental pollution. It can be seen that how to deal with silicon-based semiconductor cutting waste is not only related to product quality, but also involves environmental protection and resource utilization efficiency. Therefore, the development of efficient, environmentally friendly and economical waste purification technology is of great significance to the silicon-based semiconductor industry.

[0014] Compared with ordinary materials, powder materials have the characteristics of small particle size, large specific surface area and low density, which makes them less likely to undergo electrochemical reactions during electrolysis, easy to agglomerate, and difficult to electrolyze. This may be the reason why there is less research on powder electrolysis and the development of powder electrolysis purification equipment has been slow.

[0015] Electrolysis and electroplating are reverse processes. The technical problems faced by electroplating of powder materials and electrolytic purification of crystalline silicon powder waste (SPW) have certain similarities. The electroplating device for powder materials can be expected to be used as an electrolytic device for purifying crystalline silicon powder waste (SPW) by adjusting the electrode arrangement. This will make it possible to solve the problems of electroplating of powder materials and electrolytic purification of crystalline silicon powder waste (SPW) based on the same device. Utility Model Content

[0016] The utility model is to avoid the deficiencies of the prior art and provides a circulating powder electroplating or electrolytic impurity removal device.

[0017] The utility model adopts the following technical solution to solve the technical problem: a circulating through type powder electroplating or electrolytic impurity removal device, comprising a first electrode chamber and a second electrode chamber connected to each other, the first electrode chamber and the second electrode chamber are connected end to end to form a circulating liquid path, and a pump serving as a power source for liquid circulation is connected in the circulating liquid path;

[0018] The top of the circulating liquid circuit is provided with a feeding port, and the bottom is provided with a closable receiving port;

[0019] A mesh plate and an electrode plate made of a conductive material are respectively provided in the first electrode chamber and the second electrode chamber;

[0020] When the device is used as a powder electroplating device:

[0021] The mesh plate and the electrode plate serve as a metal cathode and a metal anode, respectively, and are electrically connected to the negative electrode and the positive electrode of the power supply;

[0022] When the device is used as an electrolytic impurity removal device:

[0023] The mesh plate and the electrode plate serve as a metal anode and a metal cathode respectively, and are electrically connected to the positive electrode and the negative electrode of the power source.

[0024] Furthermore, the mesh plate is arranged to cover the flow cross section in the first electrode chamber.

[0025] Furthermore, at least two mesh plates are disposed in the first electrode chamber, and each mesh plate is electrically connected to the electrodes of the power supply in parallel.

[0026] Furthermore, it also includes a conductive buckle;

[0027] The mesh plate or the electrode plate is provided with a mesh plate connector or an electrode plate connector that penetrates outside the first electrode chamber or the second electrode chamber. The conductive buckle is installed and fixed to the mesh plate connector or the electrode plate connector, and is connected to the electrode of the power supply through a wire, so that the mesh plate or the electrode plate is electrically connected to the electrode of the power supply.

[0028] Furthermore, a feeding valve and a receiving valve for controlling the opening and closing of the feeding port and the receiving port are respectively provided at the feeding port and the receiving port.

[0029] Furthermore, the receiving port is connected to a powder recovery device for recovering powder materials in the mixed fluid in the circulating liquid circuit.

[0030] Furthermore, the opening of the feeding port is arranged upward and is in an interface structure or a funnel-like structure with a diameter increasing from bottom to top.

[0031] Furthermore, the electrode plate is a multi-channel high surface area electrode.

[0032] The utility model provides a circulating through-type powder electroplating or electrolytic impurity removal device, which has the following beneficial effects:

[0033] 1. The electrified metal mesh plate arranged in the electroplating chamber of the utility model can strengthen the collision between the powder particles and the metal electrode, increase the contact area between the two, improve the metal coating effect on the surface of the powder material or the electrolytic purification effect of the powder waste and the uniformity of the electrolysis or electroplating, and improve the efficiency of the electrolysis or electroplating.

[0034] 2. The electrolyte or electroplating liquid of the utility model circulates directionally in the circulating liquid path under the action of the pump, and the powder material passes through the screen plate many times during the circulation process, so the electroplating or electrolysis efficiency is high.

[0035] 3. After the powder recovery device of the utility model separates the powder material from the electrolyte or electroplating solution in the mixed fluid, the electrolyte or electroplating solution can be re-added to the circulating liquid circuit for repeated use, which is beneficial to the control of electrolysis or electroplating costs.

[0036] 4. The utility model utilizes the mesh structure of the mesh plate and the circulating flow of the fluid in the circulating liquid circuit to maintain the impact of the powder material on the mesh plate, which can effectively avoid the accumulation of powder material on the mesh plate serving as a metal electrode, resulting in the problem of some powder material surfaces having no metal coating or incomplete metal coating, or the problem of impurities on the surface of some powder materials not being removed or not being completely removed, which is beneficial to electroplating or ensuring the amount of electrolyte. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a structural schematic diagram of the utility model.

[0038] In the figure:

[0039] 1. First electrode chamber; 2. Second electrode chamber; 3. Screen plate; 4. Electrode plate; 5. Power supply; 6. Feeding port, 6-1, Feeding valve; 7. Receiving port, 7-1, Receiving valve; 8. Powder recovery device; 9. Pump; 10. Conductive buckle. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be clearly and completely described below in combination with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] like Figure 1 As shown, a circulating through type powder electroplating or electrolytic impurity removal device, the structural relationship of which is: comprising a first electrode chamber 1 and a second electrode chamber 2 which are connected, the first electrode chamber 1 and the second electrode chamber 2 are connected end to end to form a circulating liquid path, and a pump 9 as a power source for liquid circulation is connected in the circulating liquid path;

[0042] A feeding port 6 is provided at the top of the circulating liquid circuit, and an openable and closable receiving port 7 is provided at the bottom;

[0043] The first electrode chamber 1 and the second electrode chamber 2 are respectively provided with a mesh plate 3 and an electrode plate 4 made of a conductive material;

[0044] When the device is used as a powder plating device:

[0045] The mesh plate 3 and the electrode plate 4 serve as a metal cathode and a metal anode, respectively, and are electrically connected to the negative electrode and the positive electrode of the power source 5;

[0046] When the device is used as an electrolytic impurity removal device:

[0047] The mesh plate 3 and the electrode plate 4 serve as a metal anode and a metal cathode, respectively, and are electrically connected to the positive electrode and the negative electrode of the power source 5 .

[0048] Preferably, the mesh plate 3 is arranged to cover the flow cross section in the first electrode chamber 1 .

[0049] Preferably, at least two mesh plates 3 are provided in the first electrode chamber 1, and each mesh plate 3 is electrically connected to the electrodes of the power source 5 in parallel.

[0050] Preferably, it also includes a conductive ring buckle 10;

[0051] The mesh plate 3 or the electrode plate 4 is provided with a mesh plate connector or an electrode plate connector that penetrates to the outside of the first electrode chamber 1 or the second electrode chamber 2. The conductive ring buckle 10 is installed and fixed to the mesh plate connector or the electrode plate connector, and is connected to the electrode of the power supply 5 through a wire, so that the mesh plate 3 or the electrode plate 4 is electrically connected to the electrode of the power supply 5.

[0052] Preferably, a feeding valve 6 - 1 and a receiving valve 7 - 1 for controlling the opening and closing of the feeding port 6 and the receiving port 7 are respectively provided at the feeding port 6 and the receiving port 7 .

[0053] Preferably, the receiving port 7 is connected to a powder recovery device 8 for recovering powder materials in the mixed fluid in the circulating liquid circuit.

[0054] Preferably, the opening of the feeding port 6 is arranged upward and is in an interface structure or a funnel-like structure with a diameter increasing from bottom to top.

[0055] Preferably, the electrode plate 4 is a multi-channel high surface area electrode.

[0056] When used specifically, the following processes are included:

[0057] In the first step, when the above device is used as a circulating powder electroplating device, each screen plate 3 and electrode plate 4 is electrically connected to the negative electrode and positive electrode of the power source 5 through the conductive buckle 10 and the wire respectively;

[0058] When the above device is used as a circulating electrolytic impurity removal device, each mesh plate 3 and electrode plate 4 is electrically connected to the positive electrode and negative electrode of the power source 5 through the conductive ring buckle 10 and the wire.

[0059] The second step is to close the receiving valve 7-1, open the feeding valve 6-1, add the powder material that has been surface treated and ion adsorbed and the electrolyte or plating solution into the circulating liquid circuit from the feeding port 6, and then close the feeding valve 6-1 or reduce the opening of the feeding valve 6-1 according to actual needs.

[0060] The third step is to start the power supply 5 and the pump 9 to start electroplating or electrolysis.

[0061] The fourth step is to turn off the power supply 5 and the pump 9 after the electroplating or electrolysis is completed, open the feeding valve 6-1 and the receiving valve 7-1, and the mixed fluid in the circulating liquid circuit flows into the powder recovery device 8 through the receiving port 7. The powder material can be recovered by using the solid-liquid separation function of the recovery device 8.

[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0063] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circulating powder electroplating or electrolytic impurity removal device, comprising a first electrode chamber (1) and a second electrode chamber (2) connected to each other, characterized in that: The first electrode chamber (1) and the second electrode chamber (2) are connected end to end to form a circulating liquid circuit, and a pump (9) serving as a power source for liquid circulation is provided in the circulating liquid circuit; The top of the circulating liquid circuit is provided with a feeding port (6), and the bottom is provided with a closable receiving port (7); A mesh plate (3) and an electrode plate (4) made of a conductive material are respectively provided in the first electrode chamber (1) and the second electrode chamber (2); When the device is used as a powder electroplating device: The mesh plate (3) and the electrode plate (4) serve as a metal cathode and a metal anode, respectively, and are electrically connected to the negative electrode and the positive electrode of a power source (5); When the device is used as an electrolytic impurity removal device: The mesh plate (3) and the electrode plate (4) serve as a metal anode and a metal cathode, respectively, and are electrically connected to the positive electrode and the negative electrode of the power source (5).

2. A circulating powder electroplating or electrolytic impurity removal device according to claim 1, characterized in that: The mesh plate (3) is arranged to cover the flow cross section in the first electrode chamber (1).

3. A circulating powder electroplating or electrolytic impurity removal device according to claim 1 or 2, characterized in that: At least two mesh plates (3) are arranged in the first electrode chamber (1), and each mesh plate (3) is electrically connected to an electrode of the power source (5) in parallel.

4. A circulating powder electroplating or electrolytic impurity removal device according to claim 1 or 2, characterized in that: Also includes a conductive buckle (10); The mesh plate (3) or the electrode plate (4) is provided with a mesh plate connector or an electrode plate connector that penetrates outside the first electrode chamber (1) or the second electrode chamber (2); the conductive buckle (10) is fixedly mounted on the mesh plate connector or the electrode plate connector and connected to the electrode of the power source (5) via a wire, so that the mesh plate (3) or the electrode plate (4) is electrically connected to the electrode of the power source (5).

5. The circulating powder electroplating or electrolytic impurity removal device according to claim 1, characterized in that: The feeding port (6) and the receiving port (7) are respectively provided with a feeding valve (6-1) and a receiving valve (7-1) for controlling the opening and closing of the feeding port (6) and the receiving port (7).

6. The circulating powder electroplating or electrolytic impurity removal device according to claim 1, characterized in that: The receiving port (7) is connected to a powder recovery device (8) for recovering powder materials in the mixed fluid in the circulating liquid path.

7. The circulating powder electroplating or electrolytic impurity removal device according to claim 1, characterized in that: The opening of the feeding port (6) is arranged upwards and is in the form of an interface structure or a funnel-like structure with a diameter increasing from bottom to top.

8. The circulating powder electroplating or electrolytic impurity removal device according to claim 1, characterized in that: The electrode plate (4) is a multi-channel high surface area electrode.

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