Dual-heat-dissipation type semiconductor LED (light-emitting diode) lighting module
The dual heat dissipation semiconductor LED lighting module addresses inadequate cooling by simultaneously cooling both upper and lower parts with a frame and heat dissipation component design, enhancing thermal management and ease of maintenance.
Patent Information
- Application Number
- CN202420988337.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-05-09
AI Technical Summary
Existing semiconductor LED lighting modules suffer from inadequate thermal conductivity and heat dissipation, with the upper part of the module not being effectively cooled, and the built-in cooling fan is difficult to replace and maintain.
A dual heat dissipation type semiconductor LED lighting module design featuring a frame component with upper and lower heat dissipation ports, a heat dissipation component with fins and fans, and a plug-and-play mechanism for easy fan replacement, allowing simultaneous cooling of both upper and lower parts.
The design achieves a good double heat dissipation effect and facilitates easy maintenance by allowing quick removal of the cooling fan group, ensuring a reliable lighting performance.
Smart Images
Figure CN222164713U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lighting modules, in particular to a double heat dissipation type semiconductor LED lighting module. Background Art
[0002] Semiconductor LED lighting module is a solid-state lighting technology that uses light-emitting diodes (LEDs) as light sources.
[0003] In the existing technology, the semiconductor LED lighting mold has semiconductor LED lamp beads and a cooling fan for heat dissipation. The heat dissipation part is the upper part of the lighting module, and the LED lamp bead part cannot be cooled. The thermal conductivity and heat dissipation effect is not good, and the built-in cooling fan is not convenient to replace, and maintenance and use are not convenient enough. Utility Model Content
[0004] In order to overcome the shortcomings of the prior art, one of the purposes of the utility model is to provide a dual heat dissipation type semiconductor LED lighting module. Through the set frame components and heat dissipation components, the upper and lower parts can be cooled simultaneously, and the dual heat dissipation effect is good. It also has the function of cleaning the reflective cup to ensure a good lighting effect; the set plug blocks, slots, and bosses can quickly remove the cooling fan group, which is easy to use.
[0005] One of the purposes of the utility model is achieved by the following technical solution: a dual heat dissipation type semiconductor LED lighting module, comprising a frame component, a lighting component, and a heat dissipation component, the frame component comprising a lower shell, both side walls of the lower shell are provided with an upper heat dissipation port and a lower heat dissipation port, at least two installation positions are provided inside the lower shell, a cover is provided at the upper part of the lower shell, a plug block is fixedly connected to the lower part of the cover, the cover is connected to the lower shell by screws, the lighting component comprises a lighting body located at the installation position, semiconductor lamp beads are installed inside the lighting body, a reflective cup is provided on the outer side of the semiconductor lamp beads, a mounting frame is fixedly connected to the upper part of the lighting body, the heat dissipation component comprises a disassembly shell installed on the upper part of the lighting body, a mounting shell located on the outer side of the lower shell, a plurality of heat dissipation fins are fixedly connected to the disassembly shell, a heat dissipation fan group is installed inside the mounting shell, a boss is fixedly connected to the lower part of the mounting shell, a groove is provided at the lower part of the lower shell, the boss and the groove cooperate with each other, and slots are symmetrically provided on the upper parts of the mounting shell and the lower shell. Through the set frame components and heat dissipation components, the upper and lower parts can be cooled at the same time, the double heat dissipation effect is good, and it also has the function of cleaning the reflective cup to ensure a good lighting effect; the set plug blocks, slots, and bosses can quickly remove the cooling fan group, which is easy to use.
[0006] According to the dual heat dissipation type semiconductor LED lighting module, the number of the plug-ins is four and they are axially symmetrically arranged.
[0007] According to the dual heat dissipation type semiconductor LED lighting module, the cross-sectional shape of the plug block is an I-shape.
[0008] According to the dual heat dissipation type semiconductor LED lighting module, the plug block and the slot cooperate with each other.
[0009] According to the dual heat dissipation type semiconductor LED lighting module, the upper heat dissipation opening is larger than the lower heat dissipation opening.
[0010] According to the dual heat dissipation type semiconductor LED lighting module, the heat dissipation fan group is composed of at least two heat dissipation fans.
[0011] According to the dual heat dissipation type semiconductor LED lighting module, the convex columns are arranged axially symmetrically.
[0012] According to the dual heat dissipation type semiconductor LED lighting module, the mounting frame is snap-connected with the mounting position.
[0013] Beneficial Effects
[0014] Compared with the prior art, the utility model can dissipate heat to the upper and lower parts at the same time through the set frame parts and heat dissipation parts, and has a good double heat dissipation effect. It also has the function of cleaning the reflective cup to ensure a good lighting effect; the set plug blocks, slots, and bosses can quickly remove the heat dissipation fan group, which is easy to use.
[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;
[0017] Figure 1 This is an exploded view of a double heat dissipation type semiconductor LED lighting module of the utility model;
[0018] Figure 2 This is a structural schematic diagram of a lighting component and a heat dissipation component of a double heat dissipation semiconductor LED lighting module of the utility model;
[0019] Figure 3 It is a schematic diagram of the structure of the lighting component and the heat dissipation component of a double heat dissipation semiconductor LED lighting module of the utility model from a bottom perspective;
[0020] Figure 4This is a structural schematic diagram of a cover portion of a double heat dissipation semiconductor LED lighting module of the utility model;
[0021] Figure 5 The utility model is a schematic structural diagram of a frame component of a double heat dissipation type semiconductor LED lighting module.
[0022] Legend:
[0023] 1. Frame component; 2. Lighting component; 3. Heat dissipation component; 401. Mounting shell; 402. Cooling fan assembly; 101. Cover; 1011. Insert block; 102. Lower shell; 103. Lower heat dissipation port; 104. Upper heat dissipation port; 105. Slot; 106. Mounting position; 201. Lighting lamp body; 202. Mounting frame; 203. Reflector cup; 204. Semiconductor lamp bead; 301. Disassemble shell; 302. Heat dissipation fins. DETAILED DESCRIPTION
[0024] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0025] Reference Figure 1-5The utility model embodiment is a dual heat dissipation semiconductor LED lighting module, which includes a frame component 1, a lighting component 2, and a heat dissipation component 3. The frame component 1 includes a lower shell 102. Both side walls of the lower shell 102 are provided with an upper heat dissipation port 104 and a lower heat dissipation port 103. The upper heat dissipation port 104 is larger than the lower heat dissipation port 103. At least two mounting positions 106 are provided inside the lower shell 102. A cover 101 is provided on the upper part of the lower shell 102. There are four plug-in blocks 1011, which are axially symmetrically arranged. The cross-sectional shape of the plug-in block 1011 is an I-shape. The plug-in block 1011 cooperates with the slot 105. The lower part of the cover 101 is fixedly connected with the plug-in block 1011. The cover 101 and the lower shell 102 are connected by screws. The lighting component 2 includes a lighting lamp body 201 located at the mounting position 106. The lighting lamp A semiconductor lamp bead 204 is installed inside the body 201, and a reflective cup 203 is arranged on the outside of the semiconductor lamp bead 204. The upper part of the lighting lamp body 201 is fixedly connected with a mounting frame 202, and the mounting frame 202 is snap-connected with the mounting position 106. The heat dissipation component 3 includes a disassembly shell 301 installed on the upper part of the lighting lamp body 201, and a mounting shell 401 located on the outside of the lower shell 102. A plurality of heat dissipation fins 302 are fixedly connected to the disassembly shell 301. A cooling fan group 402 is installed inside the mounting shell 401, and the cooling fan group 402 consists of at least two cooling fans. A boss is fixedly connected to the lower part of the mounting shell 401, and the boss is axially symmetrically arranged. A groove is arranged at the lower part of the lower shell 102, and the boss and the groove cooperate with each other. Slots 105 are symmetrically arranged on the upper parts of the mounting shell 401 and the lower shell 102. By setting the frame component 1 and the heat dissipation component 3, the upper and lower parts can be cooled at the same time, and the double heat dissipation effect is good. It also has the function of cleaning the reflective cup 203 to ensure a good lighting effect; the set plug block 1011, slot 105, and boss can quickly remove the cooling fan group 402, which is easy to use.
[0026] Working principle: When in use, the semiconductor lamp bead 204 is powered on to provide lighting. When dissipating heat, the cooling fan group 402 is powered on to blow the outside air through the upper heat dissipation port 104 into the heat dissipation fins 302 to take away the heat on the heat dissipation fins 302. Since the heat dissipation fins 302 are in contact with the semiconductor lamp bead 204, the heat of the semiconductor lamp bead 204 can be transferred to the heat dissipation fins 302. At the same time, the outside air enters from the lower heat dissipation port 103 to the reflective cup 203. The upper and lower parts can dissipate heat at the same time, and the double heat dissipation effect is good. At the same time, the impurities in the reflective cup 203 will fall down under the action of gravity and be blown away. When it is necessary to disassemble the mounting shell 401, first unscrew the screws on the cover 101, then remove the cover 101, and then move the plug 1011 out of the slot 105, move the mounting shell 401 horizontally, remove the boss from the frame part 1, and then partially remove the cooling fan group 402. The removal is simple and the use is flexible.
[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A dual heat dissipation semiconductor LED lighting module, comprising a frame component (1), a lighting component (2), and a heat dissipation component (3), characterized in that: The frame component (1) comprises a lower shell (102), both side walls of the lower shell (102) are provided with an upper heat dissipation outlet (104) and a lower heat dissipation outlet (103), at least two installation positions (106) are provided inside the lower shell (102), a cover (101) is provided at the upper part of the lower shell (102), an insert block (1011) is fixedly connected to the lower part of the cover (101), and the cover (101) and the lower shell (102) are connected by screws, and the lighting component (2) comprises a lighting lamp body (201) located at the installation position (106), a semiconductor lamp bead (204) is installed inside the lighting lamp body (201), and a semiconductor lamp bead (204) is provided on the outer side of the semiconductor lamp bead (204). A reflective cup (203); the upper part of the lighting lamp body (201) is fixedly connected to a mounting frame (202); the heat dissipation component (3) comprises a disassembly shell (301) mounted on the upper part of the lighting lamp body (201) and a mounting shell (401) located outside the lower shell (102); a plurality of heat dissipation fins (302) are fixedly connected to the disassembly shell (301); a heat dissipation fan group (402) is installed inside the mounting shell (401); a boss is fixedly connected to the lower part of the mounting shell (401); a groove is provided at the lower part of the lower shell (102); the boss and the groove cooperate with each other; and slots (105) are symmetrically provided at the upper parts of the mounting shell (401) and the lower shell (102).
2. A dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: There are four insert blocks (1011) in number, and they are arranged in an axisymmetric manner.
3. A dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The cross-sectional shape of the insert (1011) is an I-shape.
4. A dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The insert block (1011) and the slot (105) cooperate with each other.
5. The dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The upper heat dissipation opening (104) is larger than the lower heat dissipation opening (103).
6. A dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The heat dissipation fan group (402) consists of at least two heat dissipation fans.
7. A dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The protruding columns are arranged axially symmetrically.
8. The dual heat dissipation semiconductor LED lighting module according to claim 1, characterized in that: The installation frame (202) is snap-connected with the installation position (106).