Electric heating soaking plate based on temperature control of semiconductor chilling plate and feeding system

Abstract

The utility model relates to the technical field of lithium battery coating and feeding, in particular to an electric heating soaking plate based on temperature control of a semiconductor chilling plate and a feeding system, and the electric heating soaking plate based on temperature control of the semiconductor chilling plate comprises a soaking plate main body, the semiconductor chilling plate, a temperature monitoring assembly, a controller and a heat exchange assembly, a flow channel is arranged in the soaking plate main body; the semiconductor chilling plate is provided with a working face and a heat exchange face, the working face adjusts the temperature of fluid in the flow channel, a heat exchange assembly is arranged on the heat exchange face, and the heat exchange face exchanges heat with the outside through the heat exchange assembly so as to reduce the temperature difference between the working face and the heat exchange face. The temperature monitoring assembly monitors temperature information of fluid in the flow channel; the controller and the temperature monitoring assembly are matched to control the operation state of the working face so as to achieve temperature closed-loop control. When the coating is used for lithium battery coating, the fluidity of high-solid-content slurry can be improved, the density consistency of a coating surface can be improved, and the thickness of a coating on a current collector can be reduced, so that the baking time is shortened, the size of a drying oven is shortened and the power of the drying oven is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lithium battery coating and feeding, and in particular to an electrically heated soaking pan and a feeding system based on temperature control of a semiconductor refrigeration sheet. Background Art

[0002] Lithium battery coating is the process of applying slurry onto the electrode current collector, which is one of the core processes in lithium battery manufacturing.

[0003] During the coating process, while ensuring a certain coating thickness, increasing the solid content of the slurry can shorten the time required to enter the oven, shorten the length of the oven, and reduce energy consumption.

[0004] However, slurries with high solid content have poor fluidity at room temperature and will reduce the consistency of coating surface density, resulting in uneven internal capacity of the battery. Lithium deposition is likely to occur during the cycle charging process, affecting the safety and life of the battery. Utility Model Content

[0005] In view of this, the main purpose of the utility model is to propose an electrically heated soaking pan based on semiconductor refrigeration chip temperature control to solve the problem of poor fluidity and reduced coating surface density consistency when the slurry has a high solid content. The utility model also provides a feeding system including the electrically heated soaking pan based on semiconductor refrigeration chip temperature control.

[0006] In order to achieve the above-mentioned purpose, the present invention provides an electrically heated soaking pan based on semiconductor cooling sheet temperature control, comprising: a soaking pan body, a semiconductor cooling sheet, a temperature monitoring component, a controller and a heat exchange component;

[0007] A flow channel is provided in the main body of the heat spreader;

[0008] The semiconductor cooling sheet has a working surface and a heat exchange surface. The working surface is arranged toward the main body of the heat spreader and adjusts the temperature of the fluid in the flow channel. The heat exchange component is arranged on the heat exchange surface, and the heat exchange surface exchanges heat with the outside through the heat exchange component.

[0009] The temperature monitoring component is used to monitor the temperature information of the fluid in the flow channel; the controller is electrically connected to the temperature monitoring component and the semiconductor refrigeration sheet, and the controller controls the operating state of the working surface according to the monitoring information of the temperature monitoring component.

[0010] Further, the temperature monitoring component includes a first temperature sensor and a second temperature sensor;

[0011] The main body of the heat equalizing pan is provided with a feed inlet and a discharge outlet, and the two ends of the flow channel are respectively connected to the feed inlet and the discharge outlet;

[0012] The first temperature sensor is disposed at the feed port and monitors the temperature information of the fluid at the feed port; the second temperature sensor is disposed at the discharge port and monitors the temperature information of the fluid at the discharge port.

[0013] Further, it also includes a shield;

[0014] The protective cover is arranged on the main body of the heat spreader, a protective cavity is formed between the protective cover and the main body of the heat spreader, and the semiconductor cooling plate is arranged in the protective cavity.

[0015] Further, it also includes an exhaust component;

[0016] The protective cover is provided with an exhaust port which is in communication with the protective cavity, and the exhaust component is arranged at the exhaust port.

[0017] Furthermore, the heat exchange component is provided with a first through hole;

[0018] The heat spreader body is provided with a connecting hole corresponding to the first through hole, and the connecting hole is connected to the corresponding first through hole through a connecting piece;

[0019] The semiconductor refrigeration sheet is arranged between the heat exchange component and the heat spreader body, and the working surface is in contact with the heat spreader body.

[0020] Furthermore, when the working surface is the cold surface of the semiconductor refrigeration plate, the heat exchange surface is the hot surface of the semiconductor refrigeration plate, and the heat exchange component is a radiator.

[0021] Furthermore, when the working surface is the hot surface of the semiconductor refrigeration plate, the heat exchange surface is the cold surface of the semiconductor refrigeration plate, and the heat exchange component is a cooling block.

[0022] Furthermore, the flow channel extends in an S shape.

[0023] Furthermore, the heat spreader body includes an upper plate, a lower plate and a sealing structure;

[0024] The upper plate is butt-jointed with the lower plate, an upper flow groove is provided on one side of the upper plate facing the lower plate, and the discharge port is provided on the bottom wall of the upper flow groove; a lower flow groove corresponding to the upper flow groove is provided on one side of the lower plate facing the upper plate, and the feed port is provided on the bottom wall of the lower flow groove, and the upper flow groove and the lower flow groove form the flow channel; the sealing structure is provided between the upper plate and the lower plate.

[0025] Another embodiment of the present invention provides a feeding system, including the electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet as described in any of the above embodiments.

[0026] Beneficial effects of the utility model:

[0027] The utility model provides an electric heating soaking pan based on semiconductor refrigeration plate temperature control, comprising: a soaking pan body, a semiconductor refrigeration plate, a temperature monitoring component, a controller and a heat exchange component; a flow channel is arranged in the soaking pan body; the semiconductor refrigeration plate has a working surface and a heat exchange surface, the working surface is arranged toward the soaking pan body and adjusts the temperature of the fluid in the flow channel, the heat exchange component is arranged on the heat exchange surface, and the heat exchange surface exchanges heat with the outside through the heat exchange component; the temperature monitoring component is used to monitor the temperature information of the fluid in the flow channel; the controller is electrically connected to the temperature monitoring component and the semiconductor refrigeration plate, and the controller controls the operating state of the working surface according to the monitoring information of the temperature monitoring component.

[0028] The working surface of the semiconductor refrigeration plate can adjust the temperature of the fluid in the flow channel. The heat exchange component dissipates the cold or heat generated by the heat exchange surface to the outside world by heat exchange with the outside world, so as to reduce the temperature difference between the working surface and the heat exchange surface and improve the working efficiency of the semiconductor refrigeration plate. By cooperating with the temperature monitoring component, the closed-loop control of the slurry temperature can be achieved to improve the control accuracy. When the above-mentioned electric heating soaking plate based on semiconductor refrigeration plate temperature control is used for lithium battery coating, compared with the prior art, the temperature rise of the slurry in the flow channel can be adjusted by heating the working surface, thereby improving the fluidity of the high-solid content slurry and improving the density consistency of the coating surface. And the coating thickness on the current collector can be reduced, thereby reducing the baking time, shortening the size of the oven, reducing the oven power, and reducing a lot of energy consumption for the lithium battery coating production system. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A three-dimensional diagram of an electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet provided in an embodiment of the utility model;

[0031] Figure 2 A schematic diagram of the internal structure of an electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet provided in an embodiment of the utility model;

[0032] Figure 3 This is a schematic diagram of the installation structure of the semiconductor cooling sheet, heat conducting block and radiator;

[0033] Figure 4 is a structural schematic diagram of the lower plate;

[0034] Figure 5 A schematic diagram of the structure of an electric control module for an electric heating soaking pan based on temperature control of a semiconductor refrigeration sheet provided in an embodiment of the utility model.

[0035] Icons: 1-heating plate body; 11-upper plate; 111-discharge port; 12-lower plate; 121-lower flow channel; 122-feed port; 13-flow channel; 14-connector; 15-sealing structure;

[0036] 2- Controller;

[0037] 3-heat exchange component; 31-radiator; 32-cooling block;

[0038] 4- Semiconductor refrigeration chip;

[0039] 51-first temperature sensor; 52-second temperature sensor;

[0040] 6-shield; 61-shield plate; 62-frame; 621-exhaust port; 622-exhaust assembly; 623-wire duct; 63-protective cavity. DETAILED DESCRIPTION

[0041] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] like Figures 1 to 5 As shown, on one hand, an embodiment of the utility model provides an electric heating equalizing plate based on temperature control of a semiconductor refrigeration plate, comprising: an equalizing plate body 1, a semiconductor refrigeration plate 4, a temperature monitoring component, a controller 2 and a heat exchange component 3; a flow channel 13 is provided in the equalizing plate body 1; the semiconductor refrigeration plate 4 has a working surface and a heat exchange surface, the working surface is arranged toward the equalizing plate body 1, and adjusts the temperature of the fluid in the flow channel 13, a heat exchange component 3 is provided on the heat exchange surface, and the heat exchange surface exchanges heat with the outside through the heat exchange component 3; the temperature monitoring component is used to monitor the temperature information of the fluid in the flow channel 13; the controller 2 is electrically connected to the temperature monitoring component and the semiconductor refrigeration plate 4, and the controller 2 controls the operating state of the working surface according to the monitoring information of the temperature monitoring component.

[0043] The electric heating equalizing plate based on semiconductor refrigeration plate temperature control provided in this embodiment is used to adjust the temperature of the fluid in the flow channel 13 when the fluid flows through the flow channel 13 of the equalizing plate body 1. Specifically, the flow channel 13 is formed inside the equalizing plate body 1, and the fluid will flow through the flow channel 13 during the transportation process. The semiconductor refrigeration plate 4 is a sheet structure, which has a relative working surface and a heat exchange surface. During assembly, the working surface is set toward the equalizing plate body 1, and the working surface adjusts the temperature of the fluid flowing through the flow channel 13 by heating or cooling. The heat exchange component 3 is arranged at the heat exchange surface, and the heat exchange surface realizes heat exchange with the outside world through the heat exchange component 3, thereby improving the working efficiency of the semiconductor refrigeration plate 4 and realizing rapid regulation of the temperature of the fluid in the flow channel 13. The temperature monitoring component is used to monitor the temperature information of the fluid in the flow channel 13 in real time. The controller 2 is electrically connected to the temperature monitoring component. The controller 2 is a PCB (Printed Circuit Board) board or a CPU (Central Processing Unit) board. The temperature monitoring component feeds back the temperature information of the fluid in the monitored flow channel 13 to the controller 2. The controller 2 is also electrically connected to the semiconductor refrigeration chip 4. The controller 2 controls the operating state of the semiconductor refrigeration chip 4 according to the temperature information of the fluid in the flow channel 13 fed back by the temperature monitoring component, so as to realize closed-loop temperature regulation of the fluid in the flow channel 13.

[0044] Specifically, in this embodiment, the semiconductor cooling sheet 4 is used as an example to adjust the temperature rise of the fluid in the flow channel 13. At this time, the working surface is heated, the heat exchange surface is cooled, and the heat exchange surface realizes heat exchange with the external environment through the heat exchange component 3, thereby dissipating the generated cold energy to avoid excessive temperature difference between the working surface and the heat exchange surface. A fluid temperature threshold is preset in the controller 2, and the temperature monitoring component monitors the temperature information of the fluid in the flow channel 13. When the temperature information of the fluid in the flow channel 13 fed back to the controller 2 by the temperature monitoring component is less than the fluid temperature threshold preset in the controller 2, the controller 2 controls the current flowing through the semiconductor cooling sheet 4 to increase, so as to increase the heat generation of the working surface of the semiconductor cooling sheet 4, thereby increasing the temperature of the fluid in the flow channel 13. When the temperature information of the fluid in the flow channel 13 fed back to the controller 2 by the temperature monitoring component is greater than the fluid temperature threshold preset in the controller 2, the controller 2 controls the current flowing through the semiconductor cooling sheet 4 to decrease or change the direction of the current flowing through the semiconductor cooling sheet 4, so as to reduce the heat generation of the semiconductor cooling sheet 4 or change the working surface of the semiconductor cooling sheet 4 from heating to cooling, thereby reducing the temperature of the fluid in the flow channel 13.

[0045] Optionally, in this embodiment, the electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet can be used to heat up the fluid. At this time, the working surface is the hot surface of the semiconductor refrigeration sheet 4, and the heat exchange surface is the cold surface of the semiconductor refrigeration sheet 4. The heat exchange surface realizes heat exchange with the external environment through the heat exchange component 3, thereby dissipating the generated cold; or, the electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet can also be used to cool down the fluid. At this time, the working surface is the cold surface of the semiconductor refrigeration sheet 4, and the heat exchange surface is the hot surface of the semiconductor refrigeration sheet 4. The heat exchange surface realizes heat exchange with the external environment through the heat exchange component 3, thereby dissipating the generated heat; or, the electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet can be used to heat up the fluid or to cool down the fluid. At this time, the working surface can also be the hot surface of the semiconductor refrigeration sheet 4 or the cold surface of the semiconductor refrigeration sheet 4, and there is no specific limitation. When multiple semiconductor refrigeration sheets 4 are provided, it is only necessary to ensure that the setting methods of all semiconductor refrigeration sheets 4 are consistent. When in use, the direction of the current flowing through the semiconductor refrigeration plate 4 can be controlled by the controller 2 to switch the working surface between the cooling and heating modes, and the heat exchange component 3 dissipates the cold generated by the heat exchange surface or dissipates the heat generated by the heat exchange surface.

[0046] When the above-mentioned electrically heated soaking pan based on temperature control of semiconductor refrigeration film is used for lithium battery coating, the electrically heated soaking pan based on temperature control of semiconductor refrigeration film is used to heat the slurry, thereby improving the fluidity of the high-solid content slurry and improving the coating surface density consistency.

[0047] Specifically, in the present embodiment, the working surface of the semiconductor refrigeration plate 4 is the hot surface of the semiconductor refrigeration plate 4, and correspondingly, the heat exchange surface is the cold surface of the semiconductor refrigeration plate 4. The heat exchange component 3 dissipates the cold generated by the heat exchange surface to the outside world by heat exchange with the outside world, so as to reduce the temperature difference between the working surface and the heat exchange surface and improve the working efficiency of the semiconductor refrigeration plate 4. The slurry will flow through the flow channel 13 of the heat spreader body 1 during the feeding process. The working surface of the semiconductor refrigeration plate 4 is arranged toward the heat spreader body 1. The temperature rise of the slurry in the flow channel 13 can be adjusted by heating the working surface, thereby improving the fluidity of the high solid content slurry and improving the consistency of the coating surface density. By cooperating with the controller 2 and the temperature monitoring component, the closed-loop control of the slurry temperature can be achieved, and the control accuracy can be improved. Compared with the prior art, when applying high solid content slurry, the coating thickness on the current collector can be reduced, thereby reducing the baking time, shortening the oven size, reducing the oven power, and reducing a large amount of energy consumption for the lithium battery coating production system.

[0048] Optionally, in this embodiment, one or more semiconductor cooling sheets 4 may be provided. In this embodiment, preferably, multiple semiconductor cooling sheets 4 are provided to achieve precise temperature control of the heat spreader body 1 in different regions.

[0049] Specifically, in the present embodiment, the heat spreader body 1 has relative upper and lower surfaces, and a plurality of semiconductor cooling plates 4 are evenly distributed on the upper and lower surfaces of the heat spreader body 1. All semiconductor cooling plates 4 are electrically connected to the controller 2. The controller 2 can individually control the operating state of each semiconductor cooling plate 4 to achieve precise temperature control in different areas, thereby improving the fluidity of the slurry and improving the density consistency of the coating surface without changing the solid content.

[0050] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 1 and Figure 2 As shown, the temperature monitoring component includes a first temperature sensor 51 and a second temperature sensor 52; a feed port 122 and a discharge port 111 are provided on the heat equalizing plate main body 1, and both ends of the flow channel 13 are respectively connected to the feed port 122 and the discharge port 111; the first temperature sensor 51 is provided at the feed port 122, and monitors the temperature information of the fluid at the feed port 122; the second temperature sensor 52 is provided at the discharge port 111, and monitors the temperature information of the fluid at the discharge port 111.

[0051] In this embodiment, the heat spreader body 1 is provided with a feed port 122 and a discharge port 111, and the two ends of the flow channel 13 are respectively connected with the feed port 122 and the discharge port 111, and the external fluid enters the flow channel 13 through the feed port 122, and then exits the flow channel 13 through the discharge port 111. The temperature of the fluid will change due to the action of the semiconductor cooling sheet 4 during the flow in the flow channel 13. Optionally, the feed port 122 and the discharge port 111 are both through holes opened on the heat spreader body 1, which are connected with the external system through a number of pipe fittings such as elbows.

[0052] Furthermore, in this embodiment, the temperature monitoring component includes two temperature sensors, namely a first temperature sensor 51 and a second temperature sensor 52. The first temperature sensor 51 is arranged at the feed port 122 for monitoring the feed temperature, and the second temperature sensor 52 is arranged at the discharge port 111 for monitoring the discharge temperature. When in use, the controller 2 controls the start and stop of the semiconductor refrigeration plate 4 and parameters such as the working current according to the temperature of the fluid at the feed port 122 and the discharge port 111, thereby realizing closed-loop control of temperature regulation.

[0053] Specifically, in this embodiment, the first temperature sensor 51 is disposed on the pipe at the feed port 122 , and the second temperature sensor 52 is disposed on the pipe at the discharge port 111 , so as to facilitate inspection and maintenance of the first temperature sensor 51 and the second temperature sensor 52 .

[0054] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 1 and Figure 2As shown, it also includes a protective cover 6 ; the protective cover 6 is arranged on the heat spreader body 1 , a protective cavity 63 is formed between the protective cover 6 and the heat spreader body 1 , and the semiconductor cooling plate 4 is arranged in the protective cavity 63 .

[0055] In this embodiment, the shield 6 is disposed on the surface of the heat spreader body 1. When the shield 6 is connected to the heat spreader body 1, a protective cavity 63 is formed between the shield 6 and the heat spreader body 1. During assembly, the semiconductor cooling sheet 4 is assembled into the protective cavity 63, which can include the semiconductor cooling sheet 4, so as to avoid damage to the semiconductor cooling sheet 4 due to liquid splashing onto the semiconductor cooling sheet 4.

[0056] As mentioned above, the semiconductor cooling sheet 4 is preferably provided in plurality and distributed on the upper and lower surfaces of the heat spreader body 1, and two shields 6 can be provided, and the two shields 6 respectively cover the entire area of ​​the upper and lower surfaces of the heat spreader body 1 to protect the semiconductor cooling sheet 4 provided on the upper and lower surfaces of the heat spreader body 1, and the production cost is lower. Optionally, each semiconductor cooling sheet 4 can be provided with a shield 6 to protect the semiconductor cooling sheet 4 from splashing liquid.

[0057] Specifically, in this embodiment, the shield 6 includes a shield plate 61 and a frame 62, the shield plate 61 covers one end of the frame 62, and the shield plate 61 and the frame 62 can be fixed by conventional connection methods such as screws, rivets or welding, and the other end of the frame 62 is connected to the surface of the heat spreader body 1 by a structure such as screws, rivets or slots.

[0058] Furthermore, in this embodiment, a wire duct 623 is provided on the frame 62, and external wires for powering electronic components such as the semiconductor cooling plate 4 and transmitting data can extend into the protective cavity 63 through the wire duct 623 and be connected to the corresponding electronic components.

[0059] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 1 and Figure 2 As shown, an exhaust component 622 is also included; an exhaust port 621 communicating with the protective cavity 63 is opened on the protective cover 6, and the exhaust component 622 is arranged at the exhaust port 621.

[0060] Since the heat exchange surface of the semiconductor cooling plate 4 is provided with a heat exchange component 3, when the semiconductor cooling plate 4 is provided in the protective cavity 63, the heat exchange component 3 is also located in the protective cavity 63 accordingly, and in order to improve the heat exchange effect of the heat exchange component 3, an exhaust port 621 is provided on the shield 6. When the shield 6 is connected to the heat spreader body 1, the two ends of the exhaust port 621 are respectively connected to the outside and the protective cavity 63, so that the air in the protective cavity 63 can flow, thereby improving the heat exchange effect of the heat exchange component 3. In addition, an exhaust component 622 is provided at the exhaust port 621, and the exhaust component 622 is used to enhance the air flow in the protective cavity 63, so that the heat exchange effect of the heat exchange component 3 can be further improved, and the temperature difference between the working surface and the heat exchange surface of the semiconductor cooling plate 4 can be reduced.

[0061] Optionally, in this embodiment, the exhaust component 622 can be a fan, which has a simple structure, is installed with a square plate, and has a low cost. When in use, by driving the fan blades to rotate, the air flow in the protective cavity 63 can be enhanced. Alternatively, the exhaust component 622 can also be a fan or a hood, which can achieve the purpose of enhancing the air flow in the protective cavity 63.

[0062] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 3 As shown, a first through hole is provided on the heat exchange component 3; a connecting hole corresponding to the first through hole is provided on the heat spreader body 1, and the connecting hole is connected to the corresponding first through hole through a connecting piece 14; a semiconductor refrigeration sheet 4 is provided between the heat exchange component 3 and the heat spreader body 1, and the working surface is in contact with the heat spreader body 1.

[0063] In this embodiment, the connecting member 14 is a screw or a bolt, and correspondingly, the connecting hole is an internal threaded hole. A first through hole is respectively provided on the opposite sides of the heat exchange component 3, and a plurality of connecting holes are provided on the heat spreader body 1, and the connecting holes correspond to the first through holes in pairs. During assembly, the corresponding first through holes are connected to the connecting holes by screws, so that the heat exchange component 3 can be fixed on the heat spreader body 1. Furthermore, the working surface of the semiconductor refrigeration plate 4 is coated with silicone grease, the working surface of the semiconductor refrigeration plate 4 is in contact with the heat spreader body 1, and the heat dissipation surface is in contact with the heat dissipation component. Under the action of the heat dissipation component, the semiconductor refrigeration plate 4 is fixed on the heat spreader body 1.

[0064] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 3 As shown, when the working surface is the cold surface of the semiconductor cooling plate 4 , the heat exchange surface is the hot surface of the semiconductor cooling plate 4 , and the heat exchange component 3 is the radiator 31 .

[0065] Optionally, in this embodiment, when the electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet is only used to adjust the temperature of the fluid, at this time, the cold surface of the semiconductor refrigeration sheet 4 is used as the working surface, which is highly targeted, and the controller 2 only needs to control the current value flowing through the semiconductor refrigeration sheet 4. Correspondingly, the hot surface of the semiconductor refrigeration sheet 4 is used as the heat exchange surface. When the hot surface of the semiconductor refrigeration sheet 4 is the heat exchange surface, the heat dissipation component is a radiator 31, which is used to dissipate the heat generated by the heat exchange surface to the outside to reduce the temperature difference between the working surface and the heat exchange surface.

[0066] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 3 As shown, when the working surface is the hot surface of the semiconductor refrigeration plate 4 , the heat exchange surface is the cold surface of the semiconductor refrigeration plate 4 , and the heat exchange component 3 is the cooling block 32 .

[0067] Optionally, in this embodiment, when the electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet is only used to adjust the temperature rise of the fluid, at this time, the hot surface of the semiconductor refrigeration sheet 4 is used as the working surface, which is highly targeted, and the controller 2 only needs to control the current value flowing through the semiconductor refrigeration sheet 4. Correspondingly, the cold surface of the semiconductor refrigeration sheet 4 is used as the heat exchange surface. When the cold surface of the semiconductor refrigeration sheet 4 is the heat exchange surface, the heat dissipation component is a cold conduction block 32, which is used to dissipate the cold generated by the heat exchange surface to the outside to reduce the temperature difference between the working surface and the heat exchange surface.

[0068] The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet provided in this embodiment can adjust the installation method of the semiconductor refrigeration sheet 4 and the implementation method of the heat exchange component 3 according to actual usage conditions when in use.

[0069] Optionally, in this embodiment, the heat exchange component 3 can also be a coil. When the cold surface is the heat exchange surface, a heat medium can be introduced into the coil to reduce the temperature difference between the working surface and the heat exchange surface; when the hot surface is the heat exchange surface, a refrigerant can be introduced into the coil to reduce the temperature difference between the working surface and the heat exchange surface. Moreover, when the electric heating soaking pan based on the temperature control of the semiconductor refrigeration plate can be used for heating or cooling the fluid, the coil is also applicable, and it is only necessary to control the medium introduced into the coil according to the usage.

[0070] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 2 and Figure 4 As shown, the flow channel 13 extends in an S shape so that the temperature of the fluid in the flow channel 13 can be more fully regulated.

[0071] Optionally, in the present embodiment, the flow channel 13 may also be in a spiral shape, a U-shaped shape, etc., which can achieve the purpose of more fully regulating the temperature of the fluid in the flow channel 13.

[0072] The electric heating soaking pan based on the temperature control of the semiconductor refrigeration sheet provided in the embodiment of the utility model is as follows: Figure 1 , Figure 2 and Figure 4 As shown, the heat equalizing plate body 1 includes an upper plate 11, a lower plate 12 and a sealing structure 15; the upper plate 11 is connected to the lower plate 12, and an upper flow groove is provided on the side of the upper plate 11 facing the lower plate 12, and a discharge port 111 is provided on the bottom wall of the upper flow groove; a lower flow groove 121 corresponding to the upper flow groove is provided on the side of the lower plate 12 facing the upper plate 11, and a feed port 122 is provided on the bottom wall of the lower flow groove 121, and the upper flow groove and the lower flow groove 121 form a flow channel 13; the sealing structure 15 is arranged between the upper plate 11 and the lower plate 12.

[0073] In this embodiment, the upper plate 11 and the lower plate 12 of the heat equalizing pan body 1 are arranged opposite to each other and are connected and fixed by screws or bolts. An upper chute is provided on the side of the upper plate 11 facing the lower plate 12, and the side away from the lower plate 12 is the above-mentioned upper surface. A through hole is provided on the bottom wall of the upper chute to form the above-mentioned discharge port 111. A lower chute 121 is provided on the side of the lower plate 12 facing the upper plate 11, and the side away from the upper plate 11 is the above-mentioned lower surface. A through hole is provided on the bottom wall of the lower chute 121 to form the above-mentioned feed port 122. From the above description, it can be seen that the structures of the upper plate 11 and the lower plate 12 are almost the same. When the upper plate 11 and the lower plate 12 are connected together, the above-mentioned heat equalizing pan body 1 is formed, and the upper chute and the lower chute 121 cooperate to form the above-mentioned flow channel 13. The sealing structure 15 is used to seal between the upper plate 11 and the lower plate 12, so as to prevent leakage of the fluid in the flow channel 13. The sealing structure 15 is preferably a gasket disposed between the upper plate 11 and the lower plate 12, such as a Teflon gasket or a paper gasket, etc. The sealing structure 15 can also be a sealant coated between the upper plate 11 and the lower plate 12, etc.

[0074] Optionally, in this embodiment, the flow channel may be opened only on one of the upper plate 11 or the lower plate 12, and the other may be a flat plate, which can also achieve the purpose of forming the flow channel 13 between the upper plate 11 and the lower plate 12 after they are docked.

[0075] Optionally, in this embodiment, a pressure sensor may be further provided at the feed port 122 , and the pressure sensor is used to monitor the feed pressure, thereby preventing the pressure in the heat equalizing pan body 1 from being too high.

[0076] Another aspect of the utility model is to provide a feeding system, including the electrically heated soaking pan based on the temperature control of the semiconductor cooling sheet 4 described in the above embodiment. The feeding system includes all the advantages of the electrically heated soaking pan based on the temperature control of the semiconductor cooling sheet 4 described above, which will not be repeated here. Optionally, the feeding system can be part of the lithium battery coating system, used to transport the slurry to the coating die head to coat the current collector.

[0077] In the description of the present invention, it should be noted that the terms "upper" and "lower" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0078] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the insides of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0079] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet, characterized in that: include: A heat spreader body (1), a semiconductor cooling sheet (4), a temperature monitoring component, a controller (2) and a heat exchange component (3); The heat equalizing plate body (1) is provided with a flow channel (13); The semiconductor cooling plate (4) has a working surface and a heat exchange surface, the working surface is arranged toward the heat spreader body (1) and adjusts the temperature of the fluid in the flow channel (13), the heat exchange component (3) is arranged on the heat exchange surface, and the heat exchange surface exchanges heat with the outside through the heat exchange component (3); The temperature monitoring component is used to monitor the temperature information of the fluid in the flow channel (13); the controller (2) is electrically connected to the temperature monitoring component and the semiconductor refrigeration plate (4), and the controller (2) controls the operating state of the working surface according to the monitoring information of the temperature monitoring component.

2. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to claim 1, characterized in that: The temperature monitoring component comprises a first temperature sensor (51) and a second temperature sensor (52); The heat equalizing pan body (1) is provided with a feed inlet (122) and a discharge outlet (111), and two ends of the flow channel (13) are respectively connected to the feed inlet (122) and the discharge outlet (111); The first temperature sensor (51) is disposed at the feed port (122) and monitors the temperature information of the fluid at the feed port (122); the second temperature sensor (52) is disposed at the discharge port (111) and monitors the temperature information of the fluid at the discharge port (111).

3. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to claim 1, characterized in that: Also includes a protective cover (6); The protective cover (6) is arranged on the heat equalizing pan body (1), a protective cavity (63) is formed between the protective cover (6) and the heat equalizing pan body (1), and the semiconductor cooling plate (4) is arranged in the protective cavity (63).

4. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to claim 3, characterized in that: Also included is an exhaust assembly (622); The protective cover (6) is provided with an exhaust port (621) which is in communication with the protective cavity (63), and the exhaust assembly (622) is arranged at the exhaust port (621).

5. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to claim 1, characterized in that: The heat exchange component (3) is provided with a first through hole; The heat spreader body (1) is provided with a connecting hole corresponding to the first through hole, and the connecting hole is connected to the corresponding first through hole via a connecting piece (14); The semiconductor refrigeration sheet (4) is arranged between the heat exchange component (3) and the heat spreader body (1), and the working surface is in contact with the heat spreader body (1).

6. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to any one of claims 1 to 5, characterized in that: When the working surface is the cold surface of the semiconductor cooling plate (4), the heat exchange surface is the hot surface of the semiconductor cooling plate (4), and the heat exchange component (3) is a radiator (31).

7. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to any one of claims 1 to 5, characterized in that: When the working surface is the hot surface of the semiconductor refrigeration plate (4), the heat exchange surface is the cold surface of the semiconductor refrigeration plate (4), and the heat exchange component (3) is a cooling block (32).

8. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to any one of claims 1 to 5, characterized in that: The flow channel (13) extends in an S shape.

9. The electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet according to claim 2, characterized in that: The heat spreader body (1) comprises an upper plate (11), a lower plate (12) and a sealing structure (15); The upper plate (11) is butt-jointed with the lower plate (12); an upper flow groove is provided on one side of the upper plate (11) facing the lower plate (12); a discharge port (111) is provided on the bottom wall of the upper flow groove; a lower flow groove (121) corresponding to the upper flow groove is provided on one side of the lower plate (12) facing the upper plate (11); a feed port (122) is provided on the bottom wall of the lower flow groove (121); the upper flow groove and the lower flow groove (121) enclose the flow channel (13); and the sealing structure (15) is provided between the upper plate (11) and the lower plate (12).

10. A feeding system, characterized in that: It comprises an electrically heated soaking pan based on temperature control of a semiconductor refrigeration sheet as described in any one of claims 1 to 9.

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