Wafer detection device
By designing a circumferentially rotatable material tray and a convenient detection device, the problems of inconvenient fixture operation and wafer damage during wafer detection are solved, and a safer and more convenient detection process is achieved.
Patent Information
- Application Number
- CN202420010182.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-02
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-02
AI Technical Summary
During wafer detection, carefully clamping the wafer with external fixtures is easy to be damaged and inconvenient to operate, and the prior art is difficult to effectively solve this problem.
A wafer detection device was designed, including the detector body and base, and the material tray was rotated circumferentially with the limit rod as the central axis, avoiding the need for staff to clamp the wafer with instruments, and at the same time, a groove was set up The rotating rod facilitates detection and removal of wafers, improving operational convenience and safety.
Through the design of limit rods and grooves, the risk of wafer damage is reduced, the convenience and safety of the detection process are improved, the error operation of the clamp is avoided, and the operation convenience of the staff is enhanced.
Smart Images
Figure CN222166852U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of memory chips, and in particular to a wafer detection device. Background Art
[0002] Chip, also known as microcircuit, microchip, integrated circuit, chip refers to a silicon wafer containing an integrated circuit. It is very small and is often part of a computer or other electronic device. Chip is a general term for semiconductor component products. It is the carrier of integrated circuits and is divided from wafers.
[0003] In the related technology, chips are widely used due to their complete functions, convenience and compactness, which have accelerated social progress and facilitated people's lives. However, due to the small size of chips, they are troublesome to manufacture, resulting in a large number of defective products after production. Before the wafer chip is installed on the PCB board of the U disk, the chip needs to be moved to the detection device for detection. The detection device includes a detector and a base for placing the wafer. The staff places the wafer on the base, and then uses a special clamp to carefully rotate the wafer, and uses the detector for multi-directional observation.
[0004] Regarding the above-mentioned related technologies, when the staff inspect the wafer, they use external clamps to carefully clamp the wafer and rotate it, which may accidentally damage the wafer. It is also inconvenient for the staff to operate, and there is still room for improvement. Utility Model Content
[0005] In order to reduce the risk of accidentally damaging the wafer during rotation by carefully clamping the wafer with an external clamp, and to reduce the inconvenience of operation for the staff, the present application provides a wafer inspection device.
[0006] The present application provides a wafer inspection device, which adopts the following technical solution:
[0007] A wafer detection device comprises a detector body and a base, wherein the detector body is provided with a detection probe, the base is placed on the lower side of the detection probe, the base is provided with a material tray, the material tray is provided with a through hole, a limiting groove is provided on a side of the base close to the detection probe, a limiting rod is provided on the base, the limiting rod passes through the through hole and is embedded in the limiting groove, a side of the limiting rod away from the limiting groove is fixedly connected to a limiting plate, and the limiting plate is located on a side of the material tray away from the base.
[0008] By adopting the above technical solution, the limit rod passes through the material tray, so that the material tray can rotate circumferentially with the limit rod as the central axis, so that the wafer placed on the material tray can also rotate circumferentially, thereby avoiding the situation where the staff needs to clamp the wafer with an instrument when rotating, making it convenient for the staff to inspect the wafer and reducing the occurrence of wafer damage.
[0009] Optionally, a first placement groove is opened on a side of the material tray away from the bottom plate, the first placement groove and the through hole are interconnected and coaxially arranged, and the limiting plate is embedded in the first placement groove.
[0010] By adopting the above technical solution, the setting of the first placement groove enables the limit plate to limit the movement of the material tray along the height direction of the limit column while being able to be located inside the material tray and maintain the same height as the material tray, thereby preventing the limit plate from protruding from the material tray and thereby wearing the wafer on the material tray, thereby improving the use efficiency of the material tray.
[0011] Optionally, a first thread is provided on a side of the outer circumferential side wall of the limiting rod away from the limiting plate, a second thread is provided on the circumferential side wall of the limiting groove, and one end of the limiting rod away from the limiting plate is threadedly connected to the limiting groove.
[0012] By adopting the above technical solution, the setting of the first thread allows the limit column to be connected to the base, preventing the staff from accidentally colliding with the material tray and the material tray from detaching from the base, thereby improving the stability of the material tray installation. At the same time, there is no thread at the contact part between the limit column and the material tray, avoiding wear of the material tray and increasing the service life of the material tray.
[0013] Optionally, a toggle groove is formed on a side of the limiting plate away from the limiting column.
[0014] By adopting the above technical solution and setting the toggle groove, when the staff disassembles the limit column, there is no need to insert their fingers into the first placement groove to press the limit plate for rotation. They only need to use the paddle to insert into the toggle groove to rotate the limit plate, so that the limit column can be disassembled, thereby improving the disassembly efficiency of the staff.
[0015] Optionally, a plurality of support blocks are fixedly connected to a side of the material tray away from the base.
[0016] By adopting the above technical solution, the setting of the support block can initially support and raise the wafer on the tray, and at the same time can increase the friction between the wafer and the tray, thereby improving the utilization rate of the tray.
[0017] Optionally, a groove is formed on a side of the material tray away from the base.
[0018] By adopting the above technical solution, the groove is set so that there is a gap between the wafer on the tray and the material table. When the wafer inspection is completed, it is convenient for the staff to take the inspected wafer out of the groove, thereby improving the convenience of wafer inspection.
[0019] Optionally, there are several material trays with different sizes.
[0020] By adopting the above technical solution, the sizes of several material trays are all the same, so that the material trays on the base can be removed and replaced, so that the appropriate material tray can be selected according to the size of the wafer, thereby improving the use efficiency of the material trays.
[0021] Optionally, a rotating rod is provided on the outer circumferential side wall of the tray.
[0022] By adopting the above technical solution and the setting of the rotating rod, the staff can turn the rotating rod to rotate the material tray, which is convenient for the staff to detect and improves the rotation efficiency of the material tray.
[0023] Optionally, a second placement groove is opened on the outer circumferential side wall of the material tray, and the second placement groove is arranged along the radial direction of the material tray. The rotating rod is embedded and slidably connected in the second placement groove.
[0024] By adopting the above technical solution, the second placement groove is set up so that the rotating rod can be slidably connected in the second placement groove. When the staff does not need to use the rotating rod, the rotating rod can slide into the second placement groove to avoid protruding from the outer circumferential side wall of the material tray, thereby scratching the staff in inspection.
[0025] Optionally, a first groove is formed on the outer circumferential side wall of the rotating rod, and a ball head spring plunger is fixedly connected to the rotating rod. The ball head spring plunger is located in the first groove and extends outside the circumferential side wall of the rotating rod. A second groove is formed on the side wall of the second placement groove, and the ball head of the ball head spring plunger is embedded in the second groove.
[0026] By adopting the above technical solution and the setting of the ball head spring plunger, the staff can stop pulling the rotating rod to a certain length when pulling it out of the second placement groove, thereby preventing the rotating rod from detaching from the second placement groove; at the same time, when the rotating rod needs to be retracted, the staff only needs to apply force to push the rotating rod along the length direction of the rotating rod to retract the rotating rod.
[0027] In summary, the present application includes at least one of the following beneficial technical effects:
[0028] 1. The limit rod is passed through the tray, so that the tray can rotate around the limit rod as the central axis, so that the wafer placed on the tray can also rotate around, thereby avoiding the need for workers to clamp the wafer with instruments when rotating, making it convenient for workers to inspect the wafer and reducing the occurrence of wafer damage;
[0029] 2. The setting of the groove leaves a gap between the wafer on the tray and the material table. When the wafer inspection is completed, it is convenient for the staff to take the inspected wafer out of the groove, which improves the convenience of wafer inspection;
[0030] 3. The setting of the second placement groove enables the rotating rod to be slidably connected to the second placement groove. When the staff does not need to use the rotating rod, the rotating rod can slide into the second placement groove to avoid protruding from the outer circumferential side wall of the material tray, thereby scratching the staff in the inspection. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 It is an overall structural diagram of a wafer detection device in an embodiment of the present application.
[0032] Figure 2 It is an exploded view of the material tray and the base in the embodiment of the present application.
[0033] Figure 3 It is a top view of the material tray and the base in the embodiment of the present application.
[0034] Figure 4 yes Figure 3 AA section view.
[0035] Explanation of the accompanying drawings: 1. Detector body; 11. Detection probe; 2. Base; 21. Limit rod; 211. Limit plate; 212. First thread; 213. Toggle slot; 22. Limit slot; 221. Second thread; 3. Material tray; 31. Through hole; 32. First placement slot; 33. Support block; 34. Groove; 35. Rotating rod; 351. First groove; 352. Ball head spring plunger; 36. Second placement slot; 361. Second groove. DETAILED DESCRIPTION
[0036] The following is combined with Figure 1-4 This application is described in further detail.
[0037] The present application embodiment discloses a wafer inspection device. Figure 1 A wafer detection device includes a detector body 1, a base 2 and a tray 3. The detector body 1 is located on a desktop, a detection probe 11 is fixedly connected to the detector body 1, the base 2 is placed below the detection probe 11, and the tray 3 is installed on the side of the base 2 close to the detection probe 11, so as to hold wafers for detection. In the embodiment of the present application, the number of trays 3 is several and the sizes are different, so as to accommodate wafers of different sizes.
[0038] Reference Figure 2A limiting rod 21 is installed on the base 2, a through hole 31 is provided on the material tray 3, a limiting groove 22 is provided on the side of the base 2 close to the detection probe 11, and the limiting rod 21 passes through the through hole 31 and is embedded in the limiting groove 22, so that the material tray 3 can rotate around the limiting rod 21. The side of the limiting rod 21 away from the limiting groove 22 is fixedly connected to the limiting plate 211, and the limiting plate 211 is located on the side of the material tray 3 away from the base 2, so as to prevent the material tray 3 from moving along the height direction of the limiting rod 21 on the base 2. A first placement groove 32 is provided on the side of the material tray 3 away from the chassis, and the first placement groove 32 and the through hole 31 are connected to each other, and the first placement groove 32 and the through hole 31 are coaxially arranged, and the limiting plate 211 is embedded in the first placement groove 32, so as to prevent the limiting plate 211 from protruding from the side of the material tray 3 away from the base 2.
[0039] Reference Figure 2 A first thread 212 is provided on the outer circumferential side wall of the limiting rod 21, and the first thread 212 is located on the side of the outer circumferential side wall away from the limiting plate 211. A second thread 221 is provided on the circumferential side wall of the limiting groove 22, and one end of the limiting rod 21 away from the limiting plate 211 is threadedly connected to the limiting groove 22, thereby preventing the limiting rod 21 and the material tray 3 from being separated from the base 2. A toggle groove 213 is provided on the side of the limiting plate 211 away from the limiting column, thereby facilitating the staff to rotate the limiting plate 211 and the limiting rod 21.
[0040] Reference Figure 2 , a plurality of support blocks 33 are fixedly connected to the side of the tray 3 away from the base 2, thereby increasing the friction between the tray 3 and the wafer. In the embodiment of the present application, the plurality of support blocks 33 are all arc-shaped and are evenly arranged along the circumference of the tray 3. A groove 34 is provided on the side of the tray 3 away from the base 2, thereby facilitating the staff to take away the wafers that have been tested. In the embodiment of the present application, the number of grooves 34 is two and they are symmetrically arranged about the center of the tray 3.
[0041] Reference Figure 3 and Figure 4 , a rotating rod 35 is installed on the material tray 3, and a second placement groove 36 is opened on the outer peripheral side wall of the material tray 3. The second placement groove 36 is arranged along the radial direction of the material tray 3, and the rotating rod 35 is embedded and slidably connected in the second placement groove 36. The rotating rod 35 and the material tray 3 are arranged in parallel and extend to the outer peripheral side wall of the material tray 3, so that the staff can rotate the rotating rod 35 when necessary to drive the material tray 3 to rotate. In the embodiment of the present application, the number of the rotating rods 35 is two and they are symmetrically arranged about the center of the material tray 3.
[0042] Reference Figure 3 and Figure 4A first groove 351 is provided on the outer circumferential side wall of the rotating rod 35, and a ball spring plunger 352 is fixedly connected to the rotating rod 35. The ball spring plunger 352 is located in the first groove 351 and extends outside the circumferential side wall of the rotating rod 35. A second groove 361 is provided on the side wall of the second placement groove 36, and the ball head of the ball spring plunger 352 is embedded in the second groove 361, so as to limit the stretching length of the rotating rod 35. In the embodiment of the present application, the number of ball spring plungers 352 on a rotating rod 35 is two and they are arranged opposite to each other with respect to the axis of the rotating rod 35. The second groove 361 is an annular groove, so that the ball head of the ball spring plunger 352 can be embedded in the second groove 361, so as to avoid the ball head of the ball spring plunger 352 not being accurately embedded in the second groove 361 when the rotating rod 35 rotates circumferentially in the second placement groove 36.
[0043] The implementation principle of a wafer detection device in an embodiment of the present application is as follows: the staff first places the material tray 3 on the base 2, then inserts the limit rod 21 into the through hole 31, rotates the limit plate 211, so that the limit plate 211 is embedded in the first placement groove 32, and then places the wafer on the material tray 3 for detection. During the detection process, the staff can pull the rotating rod 35 out of the second placement groove 36, thereby moving the rotating rod 35 to drive the material tray 3 to rotate for multi-directional inspection, and take the wafer out of the groove 34 after the inspection is completed; then rotate the limit plate 211 to disassemble the material tray 3, and then replace the material trays 3 of different sizes to detect wafers of different sizes.
[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A wafer inspection device, characterized in that: The invention comprises a detector body (1) and a base (2), wherein the detector body (1) is provided with a detection probe (11), the base (2) is placed on the lower side of the detection probe (11), the base (2) is provided with a material tray (3), the material tray (3) is provided with a through hole (31), a side of the base (2) close to the detection probe (11) is provided with a limiting groove (22), the base (2) is provided with a limiting rod (21), the limiting rod (21) penetrates the through hole (31) and is embedded in the limiting groove (22), a side of the limiting rod (21) away from the limiting groove (22) is fixedly connected to a limiting plate (211), and the limiting plate (211) is located on a side of the material tray (3) away from the base (2).
2. A wafer inspection device according to claim 1, characterized in that: A first placement groove (32) is provided on a side of the material tray (3) away from the bottom plate; the first placement groove (32) and the through hole (31) are interconnected and coaxially arranged; and the limiting plate (211) is embedded in the first placement groove (32).
3. A wafer inspection device according to claim 2, characterized in that: A first thread (212) is provided on a side of the outer circumferential side wall of the limiting rod (21) away from the limiting plate (211), a second thread (221) is provided on the circumferential side wall of the limiting groove (22), and one end of the limiting rod (21) away from the limiting plate (211) is threadedly connected in the limiting groove (22).
4. A wafer inspection device according to claim 3, characterized in that: A toggle groove (213) is formed on a side of the limiting plate (211) away from the limiting column.
5. The wafer inspection device according to claim 1, characterized in that: A plurality of support blocks (33) are fixedly connected to a side of the material tray (3) away from the base (2).
6. A wafer inspection device according to claim 5, characterized in that: A groove (34) is formed on a side of the material tray (3) away from the base (2).
7. The wafer inspection device according to claim 1, characterized in that: The number of the material trays (3) is several and the sizes are different.
8. The wafer inspection device according to claim 1, characterized in that: A rotating rod (35) is provided on the outer peripheral side wall of the material tray (3).
9. A wafer inspection device according to claim 8, characterized in that: The outer peripheral side wall of the material tray (3) is provided with a second placement groove (36), the second placement groove (36) is arranged along the radial direction of the material tray (3), and the rotating rod (35) is embedded in and slidably connected to the second placement groove (36).
10. A wafer inspection device according to claim 9, characterized in that: A first groove (351) is formed on the outer circumferential side wall of the rotating rod (35); a ball head spring plunger (352) is fixedly connected to the rotating rod (35); the ball head spring plunger (352) is located in the first groove (351) and extends outside the circumferential side wall of the rotating rod (35); a second groove (361) is formed on the side wall of the second placement groove (36); the ball head of the ball head spring plunger (352) is embedded in the second groove (361).