Through-wall optical detection unit and gluing and developing equipment

Abstract

The utility model provides a through-wall type optical detection unit and gluing and developing equipment, the unit is applied to the gluing and developing equipment, and the unit comprises a through-wall carrier plate, a light source, a reflecting mirror, a detector, a fixing piece and a driving piece, the fixing piece, the light source, the reflecting mirror and the detector are fixedly connected with the through-wall carrier plate; the driving part is movably connected with the fixing part, and the driving part is used for driving a wafer to move from a first module to a second module of the gluing and developing equipment; the light source is used for projecting light rays to a detection area, and when the driving piece drives the wafer to pass through the detection area, the light rays enter the detector after sequentially passing through the surface of the wafer and the reflecting mirror; the detector is used for generating image data according to the reflected light. The detection unit is used for improving the productivity of the optical detection process of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a through-the-wall optical detection unit and a glue coating and developing device. Background Art

[0002] In order to address the yield reduction problem caused by defects in the coating developer process, an optical inspection unit becomes a necessary part, which needs to be able to effectively identify common process defects such as dust on the wafer surface, process residues, grinding defects, crystal defects, scratch defects, etc. The overall system has friendly interactivity and flexible scalability, which can realize fast and accurate defect detection, analysis and storage in the integrated circuit production process, thereby improving product yield.

[0003] The optical inspection unit in the prior art is set in a single module, and the wafer needs to be transported back and forth to connect with the rest of the coating and development process. In mass production, the time for transporting the wafer back and forth plus the time for optical inspection is long, which is not conducive to improving production capacity. Therefore, a new type of through-the-wall optical inspection unit and coating and development equipment is urgently needed to improve the above problems. Utility Model Content

[0004] The utility model aims to provide a through-the-wall optical inspection unit and a glue coating and developing device, wherein the inspection unit is used to improve the production capacity of an optical inspection process for wafers.

[0005] In the first aspect, the utility model provides a through-wall optical detection unit, which is applied to a glue coating and developing device, comprising: a through-wall carrier, a light source, a reflector, a detector, a fixing part and a driving part; the fixing part, the light source, the reflector and the detector are all fixedly connected to the through-wall carrier; the driving part is movably connected to the fixing part, and the driving part is used to drive a wafer to move from a first module to a second module of the glue coating and developing device; the light source is used to project light to a detection area, and when the driving part drives the wafer to pass through the detection area, the light is reflected by the wafer surface and the reflector in turn and enters the detector; the detector is used to generate image data based on the reflected light.

[0006] The beneficial effects of the method of the utility model are as follows: the application drives the wafer to move from the first module to the second module of the glue coating and developing equipment through the driving member, thereby realizing the transmission of the wafer between different modules; at the same time, a light source is provided to project light to the detection area. When the driving member drives the wafer to pass through the detection area, the light is reflected by the wafer surface and the reflector in turn and enters the detector, thereby realizing optical detection of the wafer while transmitting the wafer, which can save time and is conducive to improving production capacity.

[0007] Optionally, it also includes a straight-axis rotating assembly; the driving member and the straight-axis rotating assembly are fixedly connected; the straight-axis rotating assembly is used to load the wafer and drive the wafer to rotate so that the notch of the wafer is rotated to a preset angle; the driving member is used to drive the straight-axis rotating assembly loaded with the wafer to move from the first module of the glue coating and developing equipment to the second module.

[0008] Optionally, a positioning sensor is also included, which is located on the top side of the straight-axis rotating assembly and is used to detect the angle of the notch of the wafer.

[0009] Optionally, the straight-axis rotation assembly includes a motor and a vacuum suction component; the main shaft of the motor is in a vertical direction; the vacuum suction component is connected to the main shaft of the motor; the top surface of the vacuum suction component is horizontally arranged to drive the wafer to rotate on a horizontal plane.

[0010] Optionally, the reflection angle α of the light on the wafer and the reflection angle β on the reflector satisfy:

[0011] 2β-α=90°

[0012] So that the light emitted from the reflector to the detector is parallel to the wafer surface.

[0013] Optionally, the through-wall carrier plate includes a bottom wall and a side wall; the fixing member and the side wall are both fixedly connected to the bottom wall; and the light source and the reflector are both connected to the side wall.

[0014] Optionally, the side wall is provided with a strip groove, the length of the strip groove is greater than the outer diameter of the wafer; the width of the strip groove is greater than the thickness of the wafer; the strip groove is used to accommodate the wafer and the robot, so that the robot carries the wafer through the side wall.

[0015] Optionally, the through-wall carrier plate further includes a top wall; the top wall and the bottom wall are both connected to at least two side walls, for enclosing the light source, the reflector, the detector, the fixing member, the driving member and the straight-axis rotating assembly.

[0016] Optionally, the fixing member is provided with a first end and a second end; the driving member is used to drive the direct-axis rotating assembly and the wafer to move from the first end to the second end; the driving member is also used to drive the direct-axis rotating assembly to move from the second end to the first end; when the wafer is located at the first end or the second end, the wafer is located outside the detection area; and the wafer passes through the detection area when it moves from the first end to the second end.

[0017] In the second aspect, the utility model provides a glue coating and developing device, comprising a first robot, a second robot and a detection unit described in any one of the first aspects; the first robot is located in the first module of the glue coating and developing device, and is used to place the wafer in the first module onto the straight-axis rotating assembly; the second robot is located in the second module of the glue coating and developing device, and is used to take the wafer on the straight-axis rotating assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a through-the-wall optical detection unit provided by the utility model;

[0019] Figure 2 A schematic diagram of the side structure of a through-wall optical detection unit provided by the utility model.

[0020] Numbers in the figure:

[0021] 1. Through-wall carrier; 2. Light source; 3. Reflector; 4. Fixing part; 5. Driving part; 6. Detector; 7. Positioning sensor; 10. Straight-axis rotating assembly; 101. Vacuum adsorption part; 102. Motor; 11. First manipulator; 12. Second manipulator; 13. Strip groove; 14. Side wall; 15. Bottom wall. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0023] In view of the problems existing in the existing technology, such as Figure 1As shown, the utility model provides a through-wall optical detection unit, which is applied to glue coating and developing equipment, including: a through-wall carrier 1, a light source 2, a reflector 3, a fixing member 4, a driving member 5, a detector 6 and a straight-axis rotating assembly 10; the straight-axis rotating assembly 10 is used to load a wafer and drive the wafer to rotate so that the notch of the wafer is rotated to a preset angle; the light source 2, the reflector 3 and the detector 6 are all fixedly connected to the through-wall carrier 1; the driving member 5 is movably connected to the fixing member 4, and the driving member 5 is fixedly connected to the straight-axis rotating assembly 10; the straight-axis rotating assembly 10 is used to load a wafer and drive the wafer to rotate so that the notch of the wafer is rotated to a preset angle; the driving member 5 is used to drive the straight-axis rotating assembly 10 and the wafer to move from the first module of the glue coating and developing equipment to the second module; the light source 2 is used to project light to the detection area, and when the driving member 5 drives the straight-axis rotating assembly 10 and the wafer to pass through the detection area, the light is reflected from the wafer surface and the reflector 3 in turn into the detector 6; the detector 6 is used to generate image data according to the reflected light.

[0024] Specifically, the through-wall carrier plate 1 includes a bottom wall 15 and a side wall 14; the fixing member 4 and the side wall 14 are fixedly connected to the bottom wall 15; the light source 2 and the reflector 3 are connected to the side wall 14. The light source 2, the reflector 3 and the detector 6 are all arranged on the first direction side of the side wall 14; the detector 6 is located on the second direction side of the light source 2 and the reflector 3; the light source 2 and the reflector 3 are located on the top side of the driving member 5, and the direct-axis rotating assembly 10 is located on the bottom side of the driving member 5.

[0025] It is worth noting that in this embodiment, the driving member 5 drives the direct-axis rotating assembly 10 and the wafer to move from the first module of the coating and developing equipment to the second module, thereby realizing the transmission of the wafer between different modules; at the same time, a light source 2 is provided for projecting light to the detection area. When the driving member 5 drives the direct-axis rotating assembly 10 and the wafer to pass through the detection area, the light is reflected by the wafer surface and the reflector 3 in turn and enters the detector 6, thereby realizing optical detection of the wafer while transmitting the wafer, which can save time and is conducive to improving production capacity.

[0026] Specifically, the fixing member 4 is provided with a first end and a second end; the driving member 5 is used to drive the direct-axis rotating assembly 10 and the wafer to move from the first end to the second end; the driving member 5 is also used to drive the direct-axis rotating assembly 10 to move from the second end to the first end; when the wafer is located at the first end or the second end, the wafer is located outside the detection area; and the wafer passes through the detection area when it moves from the first end to the second end.

[0027] In some embodiments, the side wall is provided with a strip groove 13, the length of the strip groove 13 is greater than the outer diameter of the wafer; the width of the strip groove 13 is greater than the thickness of the wafer; the strip groove 13 is used to accommodate the wafer and the robot, so that the robot carries the wafer through the side wall.

[0028] Specifically, the number of the strip grooves is 2, and the two strip grooves are provided corresponding to the first module and the second module. The strip groove located on the third direction side is used to accommodate the first manipulator of the first module; the strip groove located on the second direction side is used to accommodate the second manipulator of the second module.

[0029] In some embodiments, the through-wall carrier plate also includes a top wall; the top wall and the bottom wall 15 are both connected to at least two side walls 14, which are used to surround the light source 2, the reflector 3, the detector 6, the fixing member 4, the driving member 5 and the direct-axis rotating assembly 10.

[0030] Specifically, the side walls 14 are provided in four numbers, and the top wall and the bottom wall 15 are connected to the four side walls 14, and surround the light source 2, the reflector 3, the detector 6, the fixing member 4, the driving member 5 and the straight-axis rotating assembly 10 from six directions. This embodiment can prevent the wafer from contacting the outside air, which is conducive to ensuring the cleanliness of the wafer surface.

[0031] In some embodiments, a positioning sensor 7 is further included. The positioning sensor 7 is located on the top side of the straight-axis rotating assembly 10 and is used to detect the angle of the notch of the wafer.

[0032] Specifically, the straight-axis rotating assembly 10 includes a motor 102 and a vacuum suction component 101; the main shaft of the motor 102 is in the vertical direction; the vacuum suction component 101 is connected to the main shaft of the motor 102; the top surface of the vacuum suction component 101 is horizontally arranged to drive the wafer to rotate on the horizontal plane.

[0033] More specifically, the vacuum suction member 101 is a vacuum suction cup, which is connected to a vacuum machine, and the vacuum machine is used to provide negative pressure for the vacuum suction cup so that the wafer is adsorbed on the top of the vacuum suction cup.

[0034] Please refer to Figure 2 In some embodiments, the reflection angle α of the light on the wafer and the reflection angle β on the reflector 3 satisfy:

[0035] 2β-α=90°

[0036] So that the light emitted from the reflector 3 to the detector 6 is parallel to the wafer surface. The reflector 3 is a plane mirror, and the light can be infrared, ultraviolet or visible light. In this embodiment, the reflector 3 is arranged to facilitate the detector 6 to obtain the light passing through the wafer surface, which is convenient for analyzing the defects on the wafer surface. By making the light emitted from the reflector 3 to the detector 6 parallel to the wafer surface, it is helpful to reduce the deformation and distortion of the image obtained by the detector 6. At the same time, this embodiment is applicable to a glue coating and developing device in which multiple second modules are stacked, which is helpful to reduce the height required for the second module.

[0037] Specifically, the detector 6 is configured as an image sensor, the light source 2 is a line light source, and when the line light source emits light to the surface of the wafer, a line light spot is formed on the surface of the wafer, and the line light spot is parallel to the first direction; when the driving member 5 drives the direct axis rotating assembly 10 and the wafer to move along the second direction, the line light spot sweeps across the surface of the wafer, so that the image sensor receives a line light spot image that changes with time. The detection area is configured as the area where the line light spot is formed, and is fixed relative to the image sensor and the reflector 3.

[0038] It is worth noting that the driving member 5 is configured as a linear motor and the fixing member 4 is configured as a guide rail. The linear motor and the linear light source together constitute an interlocking circuit, so that the linear motor moves along the guide rail in the second direction and the linear light source emits light to the wafer surface, which are triggered by the same pulse signal. This embodiment is conducive to keeping the wafer conveying and wafer detection synchronous.

[0039] In some other embodiments, the number of the reflectors 3 may be M, where M is any positive integer. Exemplarily, the number of the reflectors 3 is 2, wherein the first reflector 3 is used to reflect the light emitted from the wafer surface; the second reflector 3 is used to reflect the light emitted from the first reflector 3. The light emitted from the second reflector 3 to the detector 6 is parallel to the wafer surface.

[0040] The utility model provides a glue coating and developing device, comprising a detection unit as described in any one of the above embodiments. Figure 1-Figure 2 The coating and developing device includes the first module and the second module. The detection unit is arranged between the first module and the second module. Specifically, the first module is set as an intra-layer process module for processing the wafer, and the second module is set as an inter-layer module for transferring the wafer to a wafer transfer box.

[0041] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A through-the-wall optical detection unit, characterized in that: Applied to glue coating and developing equipment, including: through-wall carrier, light source, reflector, detector, fixing parts and driving parts; The fixing member, the light source, the reflector and the detector are all fixedly connected to the through-wall carrier; the driving member is movably connected to the fixing member, and the driving member is used to drive the wafer to move from the first module to the second module of the glue coating and developing equipment; The light source is used to project light to the detection area. When the driver drives the wafer to pass through the detection area, the light is reflected by the wafer surface and the reflector in turn and enters the detector; the detector is used to generate image data based on the reflected light.

2. The detection unit according to claim 1, characterized in that: Also included is a direct-axis rotation assembly; The driving member is fixedly connected to the straight-axis rotating assembly; the straight-axis rotating assembly is used to load the wafer and drive the wafer to rotate so that the notch of the wafer is rotated to a preset angle; the driving member is used to drive the straight-axis rotating assembly loaded with the wafer to move from the first module of the glue coating and developing equipment to the second module.

3. The detection unit according to claim 2, characterized in that: It also includes a positioning sensor, which is located on the top side of the straight-axis rotating assembly and is used to detect the angle of the notch of the wafer.

4. The detection unit according to claim 2, characterized in that: The straight-axis rotating assembly comprises a motor and a vacuum adsorption member; the main shaft of the motor is in the vertical direction; The vacuum adsorption member is connected to the main shaft of the motor; the top end surface of the vacuum adsorption member is arranged horizontally to drive the wafer to rotate on the horizontal plane.

5. The detection unit according to claim 1 or 2, characterized in that: The reflection angle α of the light on the wafer and the reflection angle β on the reflector satisfy: 2β-α＝90° So that the light emitted from the reflector to the detector is parallel to the wafer surface.

6. The detection unit according to claim 1 or 2, characterized in that: The through-wall carrier plate comprises a bottom wall and a side wall; The fixing member and the side wall are both fixedly connected to the bottom wall; the light source and the reflector are both connected to the side wall.

7. The detection unit according to claim 6, characterized in that: The side wall is provided with a strip groove, the length of the strip groove is greater than the outer diameter of the wafer; the width of the strip groove is greater than the thickness of the wafer; The strip-shaped groove is used to accommodate wafers and a robot arm, so that the robot arm carries the wafer through the side wall.

8. The detection unit according to claim 6, characterized in that: The through-wall carrier plate also includes a top wall; the top wall and the bottom wall are both connected to at least two side walls, and are used to surround the light source, the reflector, the detector, the fixing member, the driving member and the straight-axis rotating assembly.

9. The detection unit according to claim 2, characterized in that: The fixing member is provided with a first end and a second end; The driving member is used to drive the direct-axis rotating assembly and the wafer to move from the first end to the second end; the driving member is also used to drive the direct-axis rotating assembly to move from the second end to the first end; When the wafer is located at the first end or the second end, the wafer is located outside the detection area; The wafer passes through the inspection area while moving from the first end to the second end.

10. A coating and developing device, characterized in that: A detection unit comprising a first manipulator, a second manipulator and any one of claims 1 to 9; The first robot is located in the first module of the glue coating and developing equipment, and is used to place the wafer in the first module onto the straight-axis rotating assembly; The second robot is located in the second module of the coating and developing equipment and is used to pick up the wafer on the straight-axis rotating assembly.

Images