Novel wafer carrying mechanical arm

Abstract

The utility model relates to the technical field of wafer carrying, in particular to a novel wafer carrying mechanical arm which comprises an installation column, a lifting driving mechanism is arranged in the installation column, a driving piece of the lifting driving mechanism is provided with a main rotation driving mechanism, and a driving end of the main rotation driving mechanism is provided with a mechanical arm seat. A left material taking arm and a right material taking arm are arranged at the top of the mechanical arm base, and a left material taking jig and a right material taking jig are arranged at the driving end of the left material taking arm and the driving end of the right material taking arm correspondingly. According to the novel wafer carrying mechanical arm, the left material taking arm and the right material taking arm are arranged, double material taking mechanical arms are adopted for carrying wafers, the carrying efficiency of the device is improved, material taking and placing actions at any point position within the 340-degree range are achieved through the main rotation driving mechanism, and the flexibility of the device is improved in cooperation with the lifting driving mechanism; the height can be flexibly adjusted according to the equipment size, and then automatic high-speed accurate material taking and placing in a narrow space are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transport, in particular to a novel wafer transport mechanical arm. Background Art

[0002] In the semiconductor process, the wafer transfer system plays an important role. The production and processing of wafers require multiple steps. The wafer transfer system realizes the fast, efficient and reliable transportation of wafers between different workstations. According to different applications and needs, wafer transfer robots can be divided into clean robots and vacuum robots. Clean robots are mainly used in clean atmospheric environments. In order to avoid particle pollution sources generated by moving parts affecting the cleanliness of the system and to reduce wafer surface pollution, the drive and transmission components are generally isolated outside the wafer transmission path or enclosed in an independent dust-proof space. Vacuum robots are generally used in 1×10-5Pa vacuum environments. In addition to meeting the requirements of clean environments, they are also required to adapt to vacuum environments. The structure is more complex than that of clean robots. Most wafer transfer robots realize rapid transportation of wafers in limited spaces. Therefore, there are high requirements for their motion characteristics, response sensitivity, motion accuracy, etc.

[0003] Currently, traditional wafer handling robots mostly use single-arm pick-and-place, which are relatively inefficient and have a fixed height. Different mounting columns need to be customized according to different equipment sizes. In addition, their overall size is large, and the space requirements for installing the equipment are high. They can no longer meet the increasingly advanced needs of automated wafers, so a new type of wafer handling machinery is needed that can automatically, quickly, and accurately pick and place materials in a small space. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a novel wafer handling robot arm, which solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a new type of wafer handling robot arm, including a mounting column, a lifting drive mechanism is arranged inside the mounting column, the driving part of the lifting drive mechanism is provided with a main rotation drive mechanism, the driving end of the main rotation drive mechanism is provided with a robot arm seat, the top of the robot arm seat is provided with a left material picking arm and a right material picking arm, the driving ends of the left material picking arm and the right material picking arm are respectively provided with a left material picking fixture and a right material picking fixture, and a sensor component is arranged on the left material picking arm.

[0006] Optionally, a protective cover is provided on the surface of the mounting column, a slide rail is provided on the inner side wall of the mounting column, and two sides of the main rotation drive mechanism are slidably connected to the slide rail via sliders.

[0007] Optionally, two drive motors and a reducer are provided inside the robotic arm base, and the drive ends of the two drive motors pass through the upper surface of the robotic arm base and are respectively connected to the left material picking arm and the right material picking arm through connecting shafts, and the drive ends of the two drive motors are connected to the reducer through a transmission belt.

[0008] Optionally, the left material picking fixture includes a connecting plate, a left material picking piece and a laser sensing component, the connecting plate is arranged on the rotating shaft at the driving end of the left material picking arm, the left material picking piece is arranged at one end of the connecting plate, and the laser sensing component is arranged on the connecting plate.

[0009] Optionally, the right material picking jig includes a jig connecting plate, an avoidance pad, an L-shaped material picking mounting plate and a right material picking piece. The jig connecting plate is arranged on the rotating shaft at the driving end of the right material picking arm. The top of the jig connecting plate is provided with an L-shaped material picking mounting plate through an avoidance pad, and the right material picking piece is arranged on the L-shaped material picking mounting plate.

[0010] Optionally, the driving end of the main rotation driving mechanism is also provided with a reducer for improving the main rotation accuracy.

[0011] The utility model provides a novel wafer handling robot arm, which has the following beneficial effects:

[0012] 1. The new wafer handling robot arm adopts a double-retrieving robot arm to carry out wafer handling by setting a left arm and a right arm to improve the handling efficiency of the device. At the same time, the left arm and the right arm are driven in series by synchronous belts, so that one power is used to drive one retrieving arm to retrieve materials, which further reduces the weight of the robot arm. The accuracy of picking and placing materials is effectively improved through the sensor component, and the picking and placing actions at any point within the range of 340° are realized through the main rotation drive mechanism. The flexibility of the device is improved by cooperating with the lifting drive mechanism, and the height can be flexibly adjusted according to the size of the equipment to adapt to loading equipment of different specifications, thereby meeting the automatic high-speed and precise picking and placing of materials in a small space.

[0013] 2. The new wafer handling robot arm is equipped with different specifications of fixture connecting plates and avoidance pads to effectively avoid collisions when the double arms are picking up materials. The setting of slide rails and sliders ensures the stability of the lifting when the lifting drive mechanism drives the main rotary drive machine to lift and lower, so that the robot arm can pick up materials smoothly and run horizontally. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0016] Figure 3 For this utility model Figure 2 The enlarged structural diagram at A in the middle;

[0017] Figure 4 For this utility model Figure 2 Enlarged structural diagram at B in the middle.

[0018] In the figure: 1. Mounting column; 2. Lifting drive mechanism; 3. Main rotation drive mechanism; 4. Robot arm seat; 5. Right picking fixture; 501. Fixture connecting plate; 502. Avoidance pad; 503. L-shaped picking installation plate; 504. Right picking part; 6. Left picking arm; 7. Right picking arm; 8. Left picking fixture; 801. Connecting plate; 802. Left picking part; 803. Laser sensing component; 9. Sensor component; 10. Slide rail; 11. Slider; 12. Drive motor; 13. Reducer; 14. Protective cover. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] See also Figures 1 to 4 The utility model provides a technical solution: a novel wafer handling robot arm, comprising a mounting column 1, a protective cover 14 is arranged on the surface of the mounting column 1, a slide rail 10 is arranged on the inner side wall of the mounting column 1, and both sides of the main rotation drive mechanism 3 are slidably connected to the slide rail 10 through a slider 11. Through the arrangement of the slide rail 10 and the slider 11, when the lifting drive mechanism 2 drives the main rotation drive mechanism 3 to rise and fall, it moves up and down along the slide rail 10 to ensure the lifting stability. The interior of the mounting column 1 is provided with a lifting drive mechanism 2, and the driving part of the lifting drive mechanism 2 is provided with a main rotation drive mechanism 3. The driving end of the main rotation drive mechanism 3 is also provided with a reducer for improving the main rotation accuracy. The main rotation drive mechanism 3 is used to realize the material taking and placing action at any point within the range of 340°, and the lifting drive mechanism 2 is used to improve the flexibility of the device, so that the height can be flexibly adjusted according to the size of the equipment to adapt to equipment of different specifications, thereby meeting the automatic high-speed and accurate material taking and placing in a narrow space;

[0021] A mechanical arm seat 4 is provided at the driving end of the main rotary drive mechanism 3, and two driving motors 12 and a reducer 13 are provided inside the mechanical arm seat 4. The driving ends of the two driving motors 12 pass through the upper surface of the mechanical arm seat 4 and are respectively connected to the left material picking arm 6 and the right material picking arm 7 through connecting shafts, and the driving ends of the two driving motors 12 are connected to the reducer 13 through transmission belts. A left material picking arm 6 and a right material picking arm 7 are provided on the top of the mechanical arm seat 4. Through the setting of the left material picking arm 6 and the right material picking arm 7, a double material picking mechanical arm is used to carry out wafer transportation, so as to improve the transportation efficiency of the device. At the same time, the left material picking arm 6 and the right material picking arm 7 are both driven in series by synchronous belts, so that one driving motor 12 is used to drive one material picking arm to pick up materials, thereby further reducing the weight of the mechanical arm.

[0022] The driving ends of the left material picking arm 6 and the right material picking arm 7 are respectively provided with a left material picking fixture 8 and a right material picking fixture 5. The left material picking fixture 8 includes a connecting plate 801, a left material picking piece 802 and a laser sensing component 803. The connecting plate 801 is arranged on the rotating shaft at the driving end of the left material picking arm 6. The left material picking piece 802 is arranged at one end of the connecting plate 801. The laser sensing component 803 is arranged on the connecting plate 801. The sensor component 9 is arranged on the left material picking arm 6. The accuracy of picking and placing is effectively improved by the sensor component 9.

[0023] The right material picking fixture 5 includes a fixture connecting plate 501, an avoidance pad 502, an L-shaped material picking mounting plate 503 and a right material picking piece 504. The fixture connecting plate 501 is arranged on the rotating shaft at the driving end of the right material picking arm 7. The top of the fixture connecting plate 501 is provided with an L-shaped material picking mounting plate 503 through the avoidance pad 502. The right material picking piece 504 is arranged on the L-shaped material picking mounting plate 503. By coordinating the fixture connecting plates 501 and the avoidance pad 502 of different specifications, effective avoidance can be performed when the double arms are picking up materials to prevent collision.

[0024] In the utility model, the working steps of the device are as follows:

[0025] The device is installed at the loading place through the installation column 1, and the main rotating drive mechanism 3 is driven to rise and fall by the lifting drive mechanism 2 to adjust the overall height of the device, so that the right material picking part 504 and the left material picking part 802 are adapted to the height of the incoming material, so as to accurately pick the material;

[0026] During operation, the two driving motors 12 and the reducer 13 are combined to drive the left material picking arm 6 and the right material picking arm 7 respectively, so that the right material picking component 504 and the left material picking component 802 repeatedly pick up and place wafers in sequence.

[0027] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A novel wafer handling robot arm, comprising a mounting column (1), characterized in that: A lifting drive mechanism (2) is arranged inside the mounting column (1); a driving member of the lifting drive mechanism (2) is provided with a main rotating drive mechanism (3); a driving end of the main rotating drive mechanism (3) is provided with a mechanical arm seat (4); a left material picking arm (6) and a right material picking arm (7) are arranged on the top of the mechanical arm seat (4); a left material picking fixture (8) and a right material picking fixture (5) are respectively arranged at the driving ends of the left material picking arm (6) and the right material picking arm (7); and a sensor component (9) is arranged on the left material picking arm (6).

2. According to claim 1, the novel wafer handling robot arm is characterized by: The surface of the mounting column (1) is provided with a protective cover (14), the inner side wall of the mounting column (1) is provided with a slide rail (10), and both sides of the main rotary drive mechanism (3) are slidably connected to the slide rail (10) via a slider (11).

3. The novel wafer handling robot arm according to claim 1 is characterized in that: Two drive motors (12) and a reducer (13) are arranged inside the mechanical arm base (4); the drive ends of the two drive motors (12) pass through the upper surface of the mechanical arm base (4) and are respectively connected to the left material picking arm (6) and the right material picking arm (7) via connecting shafts; and the drive ends of the two drive motors (12) are connected to the reducer (13) via a transmission belt.

4. The novel wafer handling robot arm according to claim 1 is characterized in that: The left material picking fixture (8) comprises a connecting plate (801), a left material picking piece (802) and a laser sensing component (803); the connecting plate (801) is arranged on a rotating shaft at a driving end of the left material picking arm (6); one end of the connecting plate (801) is provided with the left material picking piece (802); and the laser sensing component (803) is arranged on the connecting plate (801).

5. The novel wafer handling robot arm according to claim 1 is characterized in that: The right material picking fixture (5) comprises a fixture connecting plate (501), an avoidance pad (502), an L-shaped material picking installation plate (503) and a right material picking piece (504); the fixture connecting plate (501) is arranged on a rotating shaft at a driving end of the material picking right arm (7); the top of the fixture connecting plate (501) is provided with an L-shaped material picking installation plate (503) via the avoidance pad (502); and the right material picking piece (504) is arranged on the L-shaped material picking installation plate (503).

6. The novel wafer handling robot arm according to claim 1 is characterized in that: The driving end of the main rotation driving mechanism (3) is also provided with a reducer for improving the main rotation accuracy.

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