Mounting platform
By using a linear motor-driven sliding table structure, a combination of grating ruler and Hall sensor in the high-precision chip mounting platform, the problem of insufficient accuracy and stability of the vacuum adsorption platform is solved, and efficient mounting of high-precision chips is achieved , reduces faults in processing and improves production efficiency.
Patent Information
- Application Number
- CN202420508179.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-15
AI Technical Summary
In the existing high-precision chip mounting process, the vacuum adsorption platform lacks accuracy, repeatability and stability, resulting in the chip substrate being easily tilted, broken and thrown.
Using a lifting drive mechanism including a linear motor, the first slide platform and the second slide platform, the precise lifting control of the vacuum adsorption platform is achieved through mutual guidance and coordination, and height measurement and feedback are performed in combination with the grating ruler and Hall sensor to ensure lifting accuracy and stability. sex.
It significantly improves the accuracy and stability of the vacuum adsorption platform, and is suitable for high-precision chip mounting with a thickness of less than 50μm, reducing the inclination, chipping and material throwing during chip processing, and improving the mounting quality and efficiency.
Smart Images

Figure CN222168368U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a mounting platform for high-precision chip processing. Background Art
[0002] In the existing high-precision chip mounting process, such as IGBT power device chip mounting, the mounting substrate is generally fixed by vacuum adsorption design, and the vacuum adsorption structure is mostly lifting type. The mainstream lifting structure of the vacuum lifting platform adopts a cylinder structure. Affected by the structural properties of the lifting cylinder, the accuracy, repeatability and stability of this structure are relatively variable, which is obviously insufficient for the mounting of high-precision chips (<50μm thickness chips), and it is easy to cause the chip substrate to tilt, break and throw. Utility Model Content
[0003] The utility model aims to provide a mounting platform which can effectively improve the accuracy and stability of a vacuum lifting platform and meet the needs of high-precision chip processing.
[0004] In order to solve the above technical problems, the utility model provides a mounting platform for high-precision chip processing, the mounting platform comprising:
[0005] seat body;
[0006] A vacuum adsorption platform is movably disposed on the base body in an up-down direction; and
[0007] The lifting drive mechanism includes a linear motor, a first slide slidably arranged in the transverse direction, and a second slide slidably installed on the base body in the up-down direction. The linear motor is connected to the first slide and is used to drive the first slide to slide in the transverse direction. The vacuum adsorption platform is arranged on the upper side of the second slide. The first slide is arranged below the second slide. The upper side of the first slide is provided with a first guide part, and the lower side of the second slide is provided with a second guide part. The first guide part cooperates with the second guide part so that the second slide is pushed to slide in the up-down direction during the transverse active stroke of the first slide.
[0008] Optionally, one of the first guide portion and the second guide portion is a guide rail extending laterally upwardly and obliquely in a direction close to the first slide platform, and the other is a guide block slidably mounted on the guide rail.
[0009] Optionally, the first guide portion is a plurality of guide blocks arranged on the upper side of the first slide, the first slide has two protrusions arranged at intervals in the transverse direction, at least one guide block is arranged on the upper side of each protrusion, and a gap is formed between the two protrusions and passes through the first slide in the longitudinal direction.
[0010] Optionally, the second guide portion is two guide rails arranged on the lower side of the second slide, the two guide rails are spaced apart in the longitudinal direction, each of the protrusions is provided with two guide blocks, the two guide blocks are spaced apart in the longitudinal direction, and are slidably installed on the corresponding guide rails one by one.
[0011] Optionally, the lifting drive mechanism further includes a motor track disposed below the first slide and extending laterally, the first slide is slidably mounted on the motor track, and is driven by the linear motor to slide along the motor track.
[0012] Optionally, a grating scale extending laterally is arranged side by side next to the motor track, and a grating reading head is correspondingly arranged on the first slide. The grating reading head cooperates with the grating scale to read the lateral position of the first slide, so that the controller can obtain the height of the vacuum adsorption platform according to the lateral position of the first slide.
[0013] Optionally, a Hall sensor is further provided in the linear motor, and the Hall sensor is used to obtain the driving stroke of the linear motor, so that the controller can obtain the height of the vacuum adsorption platform according to the driving stroke of the linear motor.
[0014] Optionally, the base body has a loading station and a processing station arranged in sequence in the horizontal direction, and the mounting platform also includes a horizontal driving mechanism and a transmission track extending in the horizontal direction. The horizontal driving mechanism is used to drive the substrate to be processed to move along the transmission track to transport it from the loading station to the processing station.
[0015] Optionally, a limit detection switch is further provided on the base body, and the limit detection switch is provided at the processing station, and is used for sending a limit signal when the substrate to be processed is transported to the processing station.
[0016] Optionally, the seat body includes a vertically arranged mounting plate, the second slide has a mounting surface facing the mounting plate, a vertical track extending in an up-down direction is arranged on one of the mounting plate and the mounting surface, and a slider is arranged on the other one.
[0017] The technical solution provided by the utility model has the following advantages:
[0018] The utility model provides a mounting platform for high-precision chip processing, comprising a base body, a vacuum adsorption platform and a lifting drive mechanism, wherein the lifting drive mechanism adopts a first slide and a second slide that guide and cooperate with each other to drive the vacuum adsorption platform to move up and down, so as to realize accurate control of the lifting height of the vacuum adsorption platform. The lifting control has good repeatability and stability, is suitable for the high-precision chip mounting process with a thickness of less than 50μm, and can effectively reduce the occurrence of tilting, fragmentation and throwing during chip processing. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of a mounting platform provided by the utility model;
[0021] Figure 2 for Figure 1 Top view of the mounting platform;
[0022] Figure 3 for Figure 2 Sectional view at AA in the middle;
[0023] Figure 4 for Figure 1 A schematic diagram of the three-dimensional structure of the lifting drive mechanism;
[0024] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structural decomposition of the lifting drive mechanism.
[0025] Description of reference numerals:
[0026] 100-mounting platform; 10-base; 11-mounting plate; 12-mounting surface; 20-vacuum adsorption platform; 30-lifting drive mechanism; 31-first slide; 311-bump; 312-gap; 32-second slide; 331-first guide part; 332-second guide part; 34-motor track; 35-grating scale; 51-loading station; 52-processing station; 61-transmission track; 62-limit detection switch; 71-vertical track; 72-slider. DETAILED DESCRIPTION
[0027] The technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all of the embodiments. The utility model will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.
[0028] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0029] The utility model provides a mounting platform 100 for high-precision chip processing. In the utility model, the high-precision chip refers to a chip with a thickness of less than 50 μm, and the mounting platform 100 is used to absorb and fix the chip substrate that needs to be mounted, so that the chip substrate can be mounted.
[0030] See also Figures 1 to 5 The mounting platform 100 includes a base 10, a vacuum adsorption platform 20 and a lifting drive mechanism 30. The material structure of the base 10 is not limited. It serves as a base to support the mounting platform 100. The vacuum adsorption platform 20 is used to generate negative pressure to adsorb the substrate to be processed. The vacuum adsorption platform 20 is movably arranged on the base 10 in the up and down directions, so that it can be in a lower position before the substrate to be processed is transported to the processing station 52, and after the substrate to be processed is transported to the position, it rises to a preset height to generate negative pressure to adsorb the substrate. After the mounting process is completed, the vacuum adsorption platform 20 can be depressurized and lowered to unload the processed substrate.
[0031] In the prior art, a cylinder is generally used to drive the vacuum adsorption platform 20 up and down. First of all, the positioning accuracy of the cylinder is generally in the range of 0.2 to 0.5 mm. This accuracy index can meet most production needs, but it is far from enough for the mounting requirements of high-precision chips. Secondly, there are many factors that affect the positioning accuracy of the cylinder, such as the dead weight of the piston column, whether the air source pressure is stable, the ambient temperature and humidity, the material and size of the piston, the quality of the cylinder seal, the friction factors of the mechanical transmission device, etc., which leads to the repeatability and stability of the lifting control of the vacuum adsorption platform 20 cannot be guaranteed.
[0032] To this end, in the embodiments provided in the present utility model, please refer to Figure 4 and Figure 5The vacuum adsorption platform 20 is driven to rise and fall by a lifting drive mechanism 30. Specifically, the lifting drive mechanism 30 includes a linear motor, a first slide 31 slidably arranged in the transverse direction, and a second slide 32 slidably installed on the seat body 10 in the up-down direction. The linear motor drives the first slide 31 to drive the first slide 31 to slide in the transverse direction. The vacuum adsorption platform 20 is arranged on the upper side of the second slide 32, and the first slide 31 is arranged below the second slide 32. A first guide portion 331 is arranged on the upper side of the first slide 31, and a second guide portion 332 is arranged on the lower side of the second slide 32. The first guide portion 331 and the second guide portion 332 are guided and matched, so that the second slide 32 is pushed to slide in the up-down direction during the transverse active stroke of the first slide 31. In this embodiment, the first slide 31 and the second slide 32 which are guided and cooperated with each other are used to drive the vacuum adsorption platform 20 to move up and down, so as to realize the precise control of the lifting height of the vacuum adsorption platform 20. Compared with the driving method of the vacuum adsorption platform 20 driven by the cylinder in the prior art, the lifting control is more controllable, and the repeatability and stability of the lifting height are good. It is suitable for the high-precision chip mounting process with a thickness of less than 50μm, and can effectively reduce the tilting, fragmentation and throwing of the chip during the processing, thereby improving the mounting quality and efficiency.
[0033] Based on the previous embodiment, the specific structure of the first guide portion 331 and the second guide portion 332 is not limited, for example, they can be guide slopes that slide with each other, or they can be slide grooves and sliding members that slide with each other. Figure 4 and Figure 5 , one of the first guide part 331 and the second guide part 332 is a guide rail extending obliquely upward in the direction close to the first slide 31, and the other is a guide block slidably mounted on the guide rail. Such a structure allows the second slide 32 to be subjected to the oblique thrust of the guide rail when sliding laterally on the first slide 31, thereby sliding in the up and down directions to achieve the lifting and lowering control of the vacuum adsorption platform 20. The cooperation between the guide rail and the guide block limits the direction of relative movement of the first slide 31 and the second slide 32, and the friction between the two is smaller, thereby avoiding excessive mechanical friction to cause the generation of particles, which has an adverse effect on the chip mounting process. Compared with the structure of the first guide part 331 and the second guide part 332 used in other embodiments of the utility model, this structure is simpler, more compact and more stable, improves the response speed and sensitivity of the lifting drive mechanism 30, and further improves the accuracy and reliability of the mounting platform 100.
[0034] Furthermore, the first guide portion 331 is a plurality of guide blocks disposed on the upper side of the first slide 31, the first slide 31 has two protrusions 311 disposed at intervals in the transverse direction, at least one guide block is disposed on the upper side of each protrusion 311, and a gap 312 is formed between the two protrusions 311 and penetrates the first slide 31 in the longitudinal direction. In this embodiment, the provision of the gap 312 enables the first slide 31 to have a hollow structure, reduces the weight of the first slide 31, and facilitates driving it to move in the transverse direction. At the same time, the existence of the gap 312 also makes the guide rail easier to clean and inspect, and avoids the first slide 31 and the second slide 32 from being stuck due to the guide rail not being cleaned for a long time.
[0035] Preferably, the second guide portion 332 is two guide rails disposed on the lower side of the second slide 32, the two guide rails are spaced apart in the longitudinal direction, and each of the protrusions 311 is provided with two guide blocks, the two guide blocks are spaced apart in the longitudinal direction, and are slidably mounted on the corresponding guide rails in a one-to-one correspondence. In this way, the second slide 32 is slidably supported by the first slide 31 through two sets of guide blocks and guide rails arranged side by side, and the sliding process is more stable, and it is not easy for the second slide 32 to tilt and cause the guide rail to get stuck.
[0036] In one embodiment, see Figure 1 and Figure 2 , the lifting drive mechanism 30 also includes a motor track 34 arranged below the first slide 31 and extending in the transverse direction, the first slide 31 is slidably mounted on the motor track 34, and is driven by a linear motor to slide along the motor track 34. In this way, the sliding direction of the first slide 31 is limited. Preferably, a grating scale 35 extending in the transverse direction is arranged side by side next to the motor track 34, and a grating reading head is correspondingly arranged on the first slide 31. The grating reading head cooperates with the grating scale 35 to read the transverse position of the first slide 31, so that the controller can obtain the height of the vacuum adsorption platform 20 according to the transverse position of the first slide 31. It can be understood that the grating scale 35 can achieve a higher control accuracy. In this embodiment, the resolution of the grating scale 35 is 1um, and the repeatability is <±5um. Compared with the lifting control mechanism in the prior art, the control accuracy and repeatability of the lifting height are greatly improved, and the control requirements of the high-precision chip mounting process can be met. And according to production requirements, the lifting control accuracy of the lifting mechanism can be further improved. In a preferred embodiment, the resolution of the grating scale 35 can be 1 um, and the repeatability accuracy can be <±2 um, or even the resolution of the grating scale 35 can be 0.1 um, and the repeatability accuracy can be <±0.5 um.
[0037] The controller is a control device such as a microprocessor equipped in the mounting platform 100 or production equipment, which can realize real-time collection of height data of the vacuum adsorption platform 20, and achieve real-time process control and traceability. If a mechanical abnormality occurs on the mounting platform 100, it can be discovered in time, effectively reducing production risks and reducing costs and increasing efficiency.
[0038] Furthermore, a Hall sensor is also provided in the linear motor, and the Hall sensor is used to obtain the driving stroke of the linear motor, so that the controller can obtain the height of the vacuum adsorption platform 20 according to the driving stroke of the linear motor. In this way, the grating scale 35 can be combined to realize accurate measurement and dual feedback of the lifting height of the vacuum adsorption platform 20, and timely feedback can be provided when the grating scale 35 has detection errors or other situations, so that the height of the vacuum adsorption platform 20 can be more reliably monitored and adjusted in real time, ensuring the height consistency during the mounting process, improving the mounting accuracy and quality, and avoiding damage to the substrate or mounting failure caused by height errors.
[0039] Optionally, see Figure 1 and Figure 2 The base body 10 has a loading station 51 and a processing station 52 arranged in sequence in the horizontal direction, and the mounting platform 100 also includes a horizontal driving mechanism and a transmission track 61 extending in the horizontal direction. The horizontal driving mechanism is used to drive the substrate to be processed to move along the transmission track 61 to transport it from the loading station 51 to the processing station 52. Preferably, a limit detection switch 62 is also provided on the base body 10, and the limit detection switch 62 is provided at the processing station 52, and is used to send a limit signal when the substrate to be processed is transported to the processing station 52. Such a structure can realize automatic loading and processing of chip substrates, can realize continuous, efficient and stable mounting processing of substrates, improve mounting productivity and efficiency, and reduce manual operations.
[0040] In an optional embodiment, the base 10 includes a vertically arranged mounting plate 11, the second slide 32 has a mounting surface 12 facing the mounting plate 11, a vertical track 71 extending in the up-down direction is arranged on one of the mounting plate 11 and the mounting surface 12, and a slider 72 is arranged on the other. Such a structure can realize vertical guidance and support for the second slide 32, can enhance the rigidity and stability of the second slide 32, prevent the second slide 32 from swinging or deflecting during the lifting process, ensure the smooth and accurate lifting of the vacuum adsorption platform 20, and improve the quality and reliability of mounting.
[0041] The working principle of the mounting platform 100 in this embodiment is as follows: when the substrate of the chip needs to be mounted, the substrate to be processed is first placed in the loading station 51, and the horizontal drive mechanism drives the substrate to be processed from the loading station 51 to the processing station 52, so that it is located above the vacuum adsorption platform 20. Then the lifting drive mechanism 30 starts to work, the linear motor drives the first slide 31 to move horizontally, pushes the second slide 32 to rise, drives the vacuum adsorption platform 20 to rise to a preset height, turns on the vacuum adsorption function, and makes the substrate firmly adsorbed on the vacuum adsorption platform 20. Then, the substrate is aligned with the mounting head of the mounting device (not shown), and the mounting operation begins. After the mounting operation is completed, the vacuum adsorption platform 20 is depressurized, and the controller controls the linear motor to reversely drive the first slide 31, so that the vacuum adsorption platform 20 returns to the initial height, and a mounting process is completed.
[0042] Obviously, the above described embodiments are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, ordinary technicians in this field can make other different forms of changes or modifications without creative work, which should fall within the scope of protection of the utility model.
Claims
1. A mounting platform for high-precision chip processing, characterized in that: The mounting platform comprises: seat body; A vacuum adsorption platform is movably disposed on the base body in an up-down direction; and The lifting drive mechanism includes a linear motor, a first slide slidably arranged in the transverse direction, and a second slide slidably installed on the base body in the up-down direction. The linear motor is connected to the first slide and is used to drive the first slide to slide in the transverse direction. The vacuum adsorption platform is arranged on the upper side of the second slide. The first slide is arranged below the second slide. The upper side of the first slide is provided with a first guide part, and the lower side of the second slide is provided with a second guide part. The first guide part cooperates with the second guide part so that the second slide is pushed to slide in the up-down direction during the transverse active stroke of the first slide.
2. The mounting platform according to claim 1, characterized in that: One of the first guide portion and the second guide portion is a guide rail extending obliquely upward in a direction close to the first slide platform, and the other is a guide block slidably mounted on the guide rail.
3. The mounting platform according to claim 2, characterized in that: The first guide portion is a plurality of guide blocks arranged on the upper side of the first slide. The first slide has two protrusions arranged at intervals in the transverse direction. At least one guide block is arranged on the upper side of each protrusion. A gap is formed between the two protrusions and passes through the first slide in the longitudinal direction.
4. The mounting platform according to claim 3, characterized in that: The second guide portion is two guide rails arranged on the lower side of the second slide, the two guide rails are spaced apart in the longitudinal direction, each of the protrusions is provided with two guide blocks, the two guide blocks are spaced apart in the longitudinal direction, and are slidably installed on the corresponding guide rails one by one.
5. The mounting platform according to any one of claims 1 to 4, characterized in that: The lifting drive mechanism also includes a motor track arranged below the first slide and extending in the transverse direction. The first slide is slidably mounted on the motor track and driven by the linear motor to slide along the motor track.
6. The mounting platform according to claim 5, characterized in that: A grating scale extending laterally is arranged side by side next to the motor track, and a grating reading head is correspondingly arranged on the first slide. The grating reading head cooperates with the grating scale to read the lateral position of the first slide, so that the controller can obtain the height of the vacuum adsorption platform according to the lateral position of the first slide.
7. The mounting platform according to claim 6, characterized in that: A Hall sensor is also provided in the linear motor, and the Hall sensor is used to obtain the driving stroke of the linear motor, so that the controller can obtain the height of the vacuum adsorption platform according to the driving stroke of the linear motor.
8. The mounting platform according to any one of claims 1 to 4, characterized in that: The base body has a loading station and a processing station arranged in sequence in the horizontal direction. The mounting platform also includes a horizontal driving mechanism and a transmission track extending in the horizontal direction. The horizontal driving mechanism is used to drive the substrate to be processed to move along the transmission track to transport it from the loading station to the processing station.
9. The mounting platform according to claim 8, characterized in that: A limit detection switch is also provided on the seat body. The limit detection switch is provided at the processing station and is used to send a limit signal when the substrate to be processed is transported to the processing station.
10. The mounting platform according to any one of claims 1 to 4, characterized in that: The seat body includes a vertically arranged mounting plate, the second slide has a mounting surface facing the mounting plate, a vertical track extending in an up-down direction is arranged on one of the mounting plate and the mounting surface, and a slider is arranged on the other of the two.
