Micro light-emitting packaging chip and micro display device
By interlacing sub-pixels in the micro-luminescent package chip, some sub-pixels are shared by multiple pixels, the problems of many pads and complex wiring in the prior art are solved, and the number of pads and wiring complexity is reduced, and the cost is reduced. and the effect of craft difficulty.
Patent Information
- Application Number
- CN202420366691.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-27
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-02-27
AI Technical Summary
The RGB three-in-one design in existing micro-luminous packaging chips leads to a large number of pads and complex wiring, which increases process difficulty and cost.
In the sub-pixel array of micro-luminescent packaging chip, multiple red, green, and blue sub-pixels are interleaved to make some sub-pixels share by two or more pixels, thereby reducing the number of pads and wiring complexity. Ensure that the number of pixels remains unchanged.
It effectively reduces the number of pads, wiring complexity and area of micro-luminous packaging chips, reduces cost and process difficulty, and improves production efficiency.
Smart Images
Figure CN222168399U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of display technology, in particular to a micro-luminescent package chip and a micro-display device. Background Art
[0002] MIP (Micro LED In Package) is a new packaging technology. Its process flow is: transfer the Micro LED chip to the carrier through mass transfer technology, package it, cut it into small packages, and then split and mix the small packages, and then carry out the patch process. At the same time, it can support the surface coating of the screen and complete the production of the display screen.
[0003] MIP has many advantages, such as light mixing, high uniformity, no Mura effect, no need for high-cost repair, direct testing and sorting, and reduced difficulty of point testing and sorting. At the same time, MIP has unique advantages in terms of compatibility with large-scale mass production of large-size Micro LEDs and acceptance by terminal display manufacturers. In terminal display application scenarios with smaller pitch and larger size, MIP can avoid core bottlenecks in yield, ink color consistency, uniformity, inspection and repair, cost, etc., and become an ideal choice for Micro LED display production.
[0004] However, in current MIP applications, RGB three-in-one MIP chips are the most commonly used. Each MIP chip includes multiple pixels, and each pixel is composed of three independent sub-pixels of the three primary colors of RGB, which results in a large number of corresponding sub-pixels, a large number of chip pads that require electrical lead-out, and complex wiring. The number of pads on the corresponding circuit board and the complexity of wiring increase accordingly, which will increase the process difficulty and cost of the MIP chip (hereinafter referred to as the micro-luminescent packaging chip) and subsequent display devices.
[0005] Therefore, there is an urgent need for a micro-luminescent packaging chip technology solution that can reduce the number of chip pads and wiring difficulty. Utility Model Content
[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a technical solution for a micro-luminescent packaging chip, which is based on the staggered layout of multiple red sub-pixels, green sub-pixels and blue sub-pixels in a sub-pixel array, so that as many sub-pixels as possible are shared by adjacent pixels, so as to reduce the number of required sub-pixels while ensuring that the number of effective pixels remains unchanged, thereby reducing the number of pads and wiring complexity of the micro-luminescent packaging chip, and reducing the area of the micro-luminescent packaging chip.
[0007] The utility model provides a micro-luminescent package chip, comprising:
[0008] A substrate having a front side and a back side arranged opposite to each other;
[0009] a sub-pixel array, arranged on the front side of the substrate, comprising a plurality of sub-pixels arranged in an array, the sub-pixels comprising red sub-pixels, green sub-pixels and blue sub-pixels, the plurality of the red sub-pixels, the green sub-pixels and the blue sub-pixels being arranged alternately, one adjacent red sub-pixel, one adjacent green sub-pixel and one adjacent blue sub-pixel constituting one pixel, and at least some of the red sub-pixels, some of the green sub-pixels and some of the blue sub-pixels being shared by two or more of the pixels;
[0010] The pad array is arranged on the back side of the substrate and includes a plurality of pads arranged in an array and used for electrically leading out the first electrode and the common second electrode of each sub-pixel.
[0011] In the above-mentioned micro-luminescent packaging chip, multiple red sub-pixels, green sub-pixels and blue sub-pixels are alternately arranged, and some red sub-pixels, some green sub-pixels and some blue sub-pixels are shared by two or more pixels, which enables multiple pixels to share sub-pixels as much as possible. Compared with the traditional micro-luminescent packaging chip design, the number of required sub-pixels is reduced while ensuring that the number of effective pixels remains unchanged, thereby reducing the number of pads and wiring complexity of the micro-luminescent packaging chip, and reducing the area of the micro-luminescent packaging chip.
[0012] Optionally, the sub-pixel array includes 3 red sub-pixels, 2 green sub-pixels and 1 blue sub-pixel, and the 3 red sub-pixels, 2 green sub-pixels and 1 blue sub-pixel are arranged in a 2×3 array to constitute 4 pixels.
[0013] Optionally, the first pixel and the third pixel share the first green sub-pixel, the third pixel and the fourth pixel share the third red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, and all four pixels share the blue sub-pixel.
[0014] Optionally, the area of the blue sub-pixel is larger than the area of the red sub-pixel, and the area of the blue sub-pixel is larger than the area of the green sub-pixel.
[0015] Optionally, the sub-pixel array includes 3 red sub-pixels, 2 green sub-pixels and 2 blue sub-pixels, and the 3 red sub-pixels, 2 green sub-pixels and 2 blue sub-pixels are arranged in an irregular array to constitute 4 pixels.
[0016] Optionally, the first pixel and the third pixel share the first green sub-pixel, the first pixel and the third pixel share the first blue sub-pixel, the third pixel and the fourth pixel share the third red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, and the second pixel and the fourth pixel share the second blue sub-pixel.
[0017] Optionally, the sub-pixel array includes 4 red sub-pixels, 4 green sub-pixels and 1 blue sub-pixel, and the 4 red sub-pixels, 4 green sub-pixels and 1 blue sub-pixel are arranged in a 3×3 array to constitute 8 pixels.
[0018] Optionally, the first pixel and the third pixel share the first green sub-pixel, the first pixel and the second pixel share the first red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, the third pixel and the fifth pixel share the second red sub-pixel, the fourth pixel and the sixth pixel share the third red sub-pixel, the fifth pixel and the seventh pixel share the third green sub-pixel, the seventh pixel and the eighth pixel share the fourth red sub-pixel, the sixth pixel and the eighth pixel share the fourth green sub-pixel, and the eighth pixel share the blue sub-pixel.
[0019] Optionally, the area of the blue sub-pixel is larger than the area of the red sub-pixel, and the area of the blue sub-pixel is larger than the area of the green sub-pixel.
[0020] Based on the same inventive concept, the utility model also provides a micro display device, comprising the micro light-emitting package chip according to any one of the above.
[0021] In the above-mentioned micro display device, based on the sharing of sub-pixels in each micro-luminescent package chip, the number of required sub-pixels is reduced while ensuring that the number of effective pixels remains unchanged, the number of pads and wiring complexity of a single micro-luminescent package chip are reduced, and the area of a single micro-luminescent package chip is reduced. When it is applied to a micro display device, the number of pads on the subsequent circuit board is reduced, the wiring complexity of the circuit board is reduced, and the number of corresponding driver chips is reduced, which not only reduces the cost, but also reduces the process difficulty and is easier to implement. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1-Figure 3 It is a schematic diagram of the structure of a RGB three-in-one micro-luminescent package chip in the prior art;
[0023] Figure 4 It is a structural schematic diagram of a circuit board for a RGB three-in-one micro-luminescent package chip in the prior art;
[0024] Figure 5-Figure 6 This is a schematic diagram of the structure of a micro-luminescent package chip in one embodiment of the utility model;
[0025] Figure 7 This is a schematic diagram of the structure of a micro-luminescent package chip in another embodiment of the present invention;
[0026] Figure 8-Figure 9 This is a schematic diagram of the structure of a micro-luminescent package chip in one embodiment of the utility model;
[0027] Figure 10-11 This is a schematic structural diagram of a micro-luminescent package chip in another embodiment of the present utility model;
[0028] Figure 12-13 This is a schematic diagram of the structure of a RGB three-in-one micro-luminescent package chip.
[0029] Description of reference numerals:
[0030] 1-substrate; 2-subpixel array; 2a-red subpixel; 2b-green subpixel; 2c-blue subpixel; 3-pad array; 3a-first pad; 3b-second pad; 4-package shell; P1, P2, P3, P4, P5, P6, P7, P8-pixels. DETAILED DESCRIPTION
[0031] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0033] As described in the background technology above, the inventors have found that the most commonly used micro-luminescent packaging chips are RGB three-in-one micro-luminescent packaging chips. Each micro-luminescent packaging chip includes multiple pixels, and each pixel is composed of an independent red sub-pixel, a green sub-pixel and a blue sub-pixel, which results in a large number of corresponding sub-pixels, a large number of chip pads that need to be electrically connected, and complex wiring. The number of pads on the corresponding circuit board and the complexity of wiring increase accordingly, which will increase the process difficulty and cost of the micro-luminescent packaging chip and subsequent display device.
[0034] In detail, Figure 1-Figure 3 The figure shows a micro-luminescent package chip in the prior art, which includes a substrate 1, a sub-pixel array 2, a pad array 3 and a package shell 4. The sub-pixel array 2 is arranged on the front side of the substrate 1, including 12 sub-pixels arranged in an array, forming 4 pixels distributed in a 2×2 array, namely pixels P1 to P4, and each pixel contains separate RGB (red, green and blue primary colors) three monochrome light-emitting elements, that is, the sub-pixel array 2 includes 4 red sub-pixels 2a, 4 green sub-pixels 2b and 4 blue sub-pixels 2c, a total of 12 sub-pixels.
[0035] In more detail, Figure 3 As shown, the pad array 3 is arranged on the back side of the substrate 1, including a plurality of pads arranged in an array, namely a first pad 3a and a second pad 3b, which are used to electrically lead out the first electrode and the common second electrode of each sub-pixel. Among them, the first electrode is one of the cathode and the anode, and the common second electrode is the other common electrode of the cathode and the anode, such as the common second electrode can be a common cathode or a common anode. According to the common cathode or common anode design, the pads of the micro-luminescent package chip require at least 13 (3N+1, N is the number of pixels). At the same time, the packaging shell 4 is also arranged on the front side of the substrate 1, and cooperates with the substrate 1 to seal and protect the sub-pixel array 2. For details, please refer to the prior art, which will not be repeated here.
[0036] However, if Figure 1-Figure 3 The micro-luminescent package chip shown has at least the following defects:
[0037] 1. It is difficult to wire the pads of micro-luminescent package chips during the manufacturing process. Source wires and common cathode and common anode wires need to be wired on a substrate 1 with a limited area. The space is limited. Secondly, a single-layer wiring is generally the best for the substrate 1. In order to solve the wiring difficulties, two or more layers are required, which increases both the process time and the cost.
[0038] 2. Similarly, the more pads a micro-luminescent package chip has, the more pads a corresponding circuit board will have when the micro-display device is subsequently integrated and manufactured. This will make the wiring of the circuit board more difficult, and the number of layers of the circuit board will certainly increase. Figure 4The circuit board shown is actually designed for the RGB three-in-one micro-light package chip project. For the micro-light package chip that only packages a single pixel, there are three source pads plus one common cathode pad, a total of four pads ( Figure 4 The four small boxes in the middle), and the wiring space on the top layer is only Figure 4 The area of the middle frame is such that each Source line needs to be punched to the bottom layer device. If the number of pads increases, there will not be enough space.
[0039] Based on this, the utility model provides a technical solution for a micro-luminescent package chip: on the basis of designing the micro-luminescent package chip in combination with a substrate, a sub-pixel array and a pad array, multiple red sub-pixels, green sub-pixels and blue sub-pixels in the sub-pixel array are arranged in an alternating manner, and some red sub-pixels, some green sub-pixels and some blue sub-pixels are shared by two or more pixels, so that multiple adjacent pixels can share sub-pixels as much as possible, while ensuring that the number of effective pixels remains unchanged. The number of required sub-pixels is reduced, the number of pads of the micro-luminescent package chip is reduced, the complexity of wiring is reduced, and the area of the micro-luminescent package chip is reduced. When it is applied in a micro display device, the number of pads on the subsequent circuit board can be reduced, the complexity of wiring of the circuit board can be reduced, and the number of corresponding driving chips can be reduced, thereby reducing the cost and process difficulty.
[0040] like Figure 5-Figure 13 As shown, the utility model provides a micro-luminescent package chip, which includes:
[0041] A substrate 1 having a front side and a back side arranged opposite to each other;
[0042] A sub-pixel array 2 is arranged on the front side of the substrate 1, and includes a plurality of sub-pixels arranged in an array, wherein the sub-pixels include a red sub-pixel 2a, a green sub-pixel 2b, and a blue sub-pixel 2c, wherein the plurality of red sub-pixels 2a, green sub-pixels 2b, and blue sub-pixels 2c are arranged alternately, wherein one adjacent red sub-pixel 2a, one adjacent green sub-pixel 2b, and one adjacent blue sub-pixel 2c constitute one pixel, and at least part of the red sub-pixels 2a, part of the green sub-pixels 2b, and part of the blue sub-pixels 2c are shared by two or more pixels;
[0043] The pad array 3 is arranged on the back side of the substrate 1 and includes a plurality of pads arranged in an array and used for electrically leading out the first electrode and the common second electrode of each sub-pixel.
[0044] In detail, Figure 5-Figure 6 As shown, in an optional embodiment of the present invention, the sub-pixel array 2 includes 3 red sub-pixels 2a, 2 green sub-pixels 2b and 1 blue sub-pixel 2c. The 3 red sub-pixels 2a, 2 green sub-pixels 2b and 1 blue sub-pixel 2c are arranged in a 2×3 array to constitute 4 pixels.
[0045] In more detail, Figure 5 As shown, in the sub-pixel array 2, three red sub-pixels 2a, two green sub-pixels 2b and one blue sub-pixel 2c are arranged in an array in an interlaced manner. Among them, the three sub-pixels spanned by the thick dashed line segment in the upper left corner constitute the first pixel P1, that is, the first red sub-pixel 2a and blue sub-pixel 2c in the first row (counting from left to right) and the first green sub-pixel 2b in the second row (counting from left to right) constitute the first pixel P1; the three sub-pixels spanned by the thick dashed line segment in the upper right corner constitute the second pixel P2, that is, the second red sub-pixel 2a and blue sub-pixel 2c in the first row (counting from left to right) and the second green sub-pixel 2c in the second row (counting from left to right) 2b constitute the second pixel P2; the three sub-pixels spanned by the thick dotted line segment in the lower left corner constitute the third pixel P3, that is, the first green sub-pixel 2b in the second row (counting from left to right), the red sub-pixel 2a in the second row, and the blue sub-pixel 2c constitute the third pixel P3; the three sub-pixels spanned by the thick dotted line segment in the lower right corner constitute the fourth pixel P4, that is, the blue sub-pixel 2c, the red sub-pixel 2a in the second row, and the second green sub-pixel 2b in the second row (counting from left to right) constitute the fourth pixel P4.
[0046] That is to say, the first pixel P1 and the third pixel P3 share the first green sub-pixel 2b, the third pixel P3 and the fourth pixel P4 share the third red sub-pixel 2a (i.e., the red sub-pixel 2a in the second row), the second pixel P2 and the fourth pixel P4 share the second green sub-pixel 2b, and the four pixels P1 to P4 share the blue sub-pixel 2c.
[0047] In this way, on the basis that one red sub-pixel 2a is shared by two pixels, two green sub-pixels 2b are shared by two pixels respectively, and a blue sub-pixel 2c is shared by four pixels, the staggered distribution of six sub-pixels, namely three red sub-pixels 2a, two green sub-pixels 2b and one blue sub-pixel 2c, is equivalent to forming four pixels P1 to P4. Figure 1 The prior art shown in the figure needs 12 sub-pixels to form 4 pixels. Figure 1 The prior art shown greatly reduces the number of required sub-pixels while ensuring that the number of effective pixels (all 2×2) remains unchanged, thereby reducing the number of pads and wiring complexity of the micro-luminescent packaging chip and reducing the area of the micro-luminescent packaging chip.
[0048] Correspondingly, Figure 6As shown, on the basis of a common cathode, only 6+1=7 pads are needed, and the pad array 3 on the back side of the substrate 1 includes 6 first pads 3a and 1 second pad 3b, the 6 first pads 3a are used to electrically lead out the anodes of the 6 sub-pixels in a one-to-one correspondence, and the second pad 3b is used to electrically lead out the common cathode of the 6 sub-pixels.
[0049] It should be noted that, in theory, the color of the shared sub-pixel can be freely selected, but considering the differences in the luminous efficiency of the RGB three primary color elements, the luminous efficiency of the blue sub-pixel 2c is greater than the luminous efficiency of the green sub-pixel 2b, and the luminous efficiency of the green sub-pixel 2b is greater than the luminous efficiency of the red sub-pixel 2a. From the perspective of improving quality and efficiency, the utility model gives priority to the sharing of blue sub-pixels 2c and green sub-pixels 2b, and shares blue sub-pixels 2c and green sub-pixels 2b as much as possible, such as Figure 5 The blue sub-pixel 2c is shared four times, and the two green sub-pixels 2b are shared twice respectively.
[0050] Furthermore, considering that a single sub-pixel is shared by two or more pixels, the luminous contribution of the shared sub-pixel to the single pixel is shared. If the areas of the sub-pixels are still equal, the equivalent luminous areas of the three sub-pixels of the three primary colors in each pixel are unbalanced, which will affect the luminous quality and display effect of the single pixel.
[0051] Based on this, in the present invention, the area optimization is performed in combination with the times each sub-pixel is shared and the luminous efficiency. For example, the area of a sub-pixel with more times of sharing is larger, and the area of a sub-pixel with lower luminous efficiency is larger.
[0052] In the present invention, considering that the blue LED has the highest luminous efficiency in LED display, the blue sub-pixel is designed as the sub-pixel with the most shared pixels, such as Figure 5 shown.
[0053] In detail, Figure 5 In the 2×2 micro-luminescent package chip design shown in FIG. 1 , the blue sub-pixel 2c is shared by four pixels. To improve the display quality, the area of the blue sub-pixel 2c can be increased so that when a single pixel emits light or four pixels emit light at the same time, the driving condition (power) of the blue sub-pixel 2c remains unchanged, and the brightness value is compensated by the larger light-emitting area of the blue sub-pixel 2c, as shown in FIG. Figure 7 The sub-pixel array 2 shown in FIG. 1 is shown in FIG. 1 , while the number and layout of the pads remain unchanged. Figure 6 shown.
[0054] That is to say, Figure 7 As shown, the area of the blue sub-pixel 2c is larger than the area of the red sub-pixel 2a, and the area of the blue sub-pixel 2c is larger than the area of the green sub-pixel 2b.
[0055] Furthermore, on the basis of increasing the area of a single sub-pixel, in order to make the display more refined, the sub-pixels with a larger area can be divided into two or more. The consequence is that some pads need to be added, but they are also much less than the pads required for the RGB three-in-one micro-luminescent packaging chip.
[0056] In detail, Figure 8-Figure 9 As shown, in an optional embodiment of the present utility model, Figure 7 The larger blue sub-pixel 2c shown is divided into two smaller blue sub-pixels 2c. The corresponding sub-pixel array 2 includes 3 red sub-pixels 2a, 2 green sub-pixels 2b and 2 blue sub-pixels 2c. The 3 red sub-pixels 2a, 2 green sub-pixels 2b and 2 blue sub-pixels 2c are arranged in an irregular array to constitute 4 pixels.
[0057] In more detail, Figure 8 As shown, the first pixel P1 and the third pixel P3 share the first green sub-pixel 2b (i.e., the first green sub-pixel 2b from left to right in the figure), the first pixel P1 and the third pixel P3 share the first blue sub-pixel 2c (i.e., the first blue sub-pixel 2c from left to right in the figure), the third pixel P3 and the fourth pixel P4 share the third red sub-pixel 2a (i.e., the red sub-pixel 2a in the second row of the figure), the second pixel P2 and the fourth pixel P4 share the second green sub-pixel 2b (i.e., the second green sub-pixel 2b from left to right in the figure), and the second pixel P2 and the fourth pixel P4 share the second blue sub-pixel 2c (i.e., the second blue sub-pixel 2c from left to right in the figure).
[0058] Among them, relative to Figure 7 In the embodiment shown, the sub-pixel array 2 adds one blue sub-pixel 2c, and the corresponding pad array 3 needs to add one pad (here 8 pads are needed), such as Fig. 9 As shown, but also Figure 3 The 13 pads shown are much fewer.
[0059] It should be emphasized that the above embodiments are all developed for 2×2 micro-luminescent package chips, and the corresponding micro-luminescent package chips include 4 effective pixels. However, the micro-luminescent package chip optimization design scheme based on sub-pixel sharing in the present invention is not limited to a 4-pixel structure, but can also be a micro-luminescent package chip structure with more different numbers of pixels, such as a 6-pixel structure, an 8-pixel structure, etc., which is not limited here.
[0060] In detail, in an optional embodiment of the present invention, as Figure 10-11 As shown, a micro-luminescent package chip with an 8-pixel structure is proposed.
[0061] In more detail, Fig.10As shown, the sub-pixel array 2 includes 4 red sub-pixels 2a, 4 green sub-pixels 2b and 1 blue sub-pixel 2c. The 4 red sub-pixels 2a, 4 green sub-pixels 2b and 1 blue sub-pixel 2c are arranged in a 3×3 array to form 8 pixels P1-P8.
[0062] Among them, the first pixel P1 and the third pixel P3 share the first green sub-pixel 2b (i.e., the first green sub-pixel 2b in the first row from left to right in the figure), the first pixel P1 and the second pixel P2 share the first red sub-pixel 2a (i.e., the red sub-pixel 2a in the first row in the figure), the second pixel P2 and the fourth pixel P4 share the second green sub-pixel 2b (i.e., the second green sub-pixel 2b in the first row from left to right in the figure), the third pixel P3 and the fifth pixel P5 share the second red sub-pixel 2a (i.e., the first red sub-pixel 2a in the second row from left to right in the figure), and the fourth pixel P4 and The 6th pixel P6 shares the 3rd red sub-pixel 2a (i.e. the 2nd red sub-pixel 2a in the second row from left to right in the figure), the 5th pixel P5 and the 7th pixel P7 share the 3rd green sub-pixel 2b (i.e. the 1st green sub-pixel 2b in the third row from left to right in the figure), the 7th pixel P7 and the 8th pixel P8 share the 4th red sub-pixel 2a (i.e. the red sub-pixel 2a in the third row in the figure), the 6th pixel P6 and the 8th pixel P8 share the 4th green sub-pixel 2b (i.e. the 2nd green sub-pixel 2b in the third row from left to right in the figure), and the 8 pixels P1~P8 share the blue sub-pixel 2c.
[0063] So, like Fig.10 The sub-pixel array 2 shown in the figure has 8 effective pixels formed by 9 sub-pixels arranged in an interlaced manner. Correspondingly, on the basis of a common cathode, only 9+1=10 pads are required. Fig.11 As shown, the pad array 3 on the back of the substrate 1 includes 9 first pads 3a and 1 second pad 3b, the 9 first pads 3a are used to electrically lead out the anodes of 9 sub-pixels in a one-to-one correspondence, and the second pad 3b is used to electrically lead out the common cathode of the 9 sub-pixels.
[0064] Similarly, the area of the sub-pixel can be optimized by combining the number of times each sub-pixel is shared and the luminous efficiency, such as Fig.10 As shown, the blue sub-pixel 2c has the largest area, and the red sub-pixel 2a has the smallest area.
[0065] The structure of the traditional 8-pixel RGB three-in-one micro-luminescent package chip is as follows Figure 12-13As shown, it needs 8 red sub-pixels 2a, 8 green sub-pixels 2b and 8 blue sub-pixels 2c, correspondingly 28 pads are drawn out from the back of the substrate 1, including 24 first pads 3a and 4 second pads 3b, and two adjacent pixels share one second pad 3b. Figure 10-11 The sub-pixel-shared micro-luminescent package chip shown requires more sub-pixels while ensuring 8 effective pixels, which corresponds to more pads, more complex wiring, and a larger area.
[0066] From the above analysis, it can be seen that the utility model, based on the design of the micro-luminescent packaging chip in combination with the substrate, sub-pixel array and pad array, allows multiple red sub-pixels, green sub-pixels and blue sub-pixels in the sub-pixel array to be staggered, and some red sub-pixels, some green sub-pixels and some blue sub-pixels are shared by two or more pixels, so that multiple adjacent pixels can share sub-pixels as much as possible, reducing the number of required sub-pixels while ensuring that the number of effective pixels remains unchanged, reducing the number of pads of the micro-luminescent packaging chip, reducing the complexity of wiring, and reducing the area of the micro-luminescent packaging chip.
[0067] It should be noted that the micro-luminescent package chip also includes a packaging shell for sealing and protecting each sub-pixel element. For details, please refer to the prior art and will not be repeated here.
[0068] Based on the same inventive concept, the utility model also provides a micro display device, which includes a circuit board, a plurality of the micro luminescent packaged chips and a plurality of driving chips, wherein the plurality of the micro luminescent packaged chips and the plurality of driving chips are respectively arranged on the circuit board, the plurality of the micro luminescent packaged chips are spliced to form a display array, and the plurality of the micro luminescent packaged chips are connected to the plurality of driving chips for driving and lighting.
[0069] In the above-mentioned micro display device, based on the sharing of sub-pixels in each micro-luminescent package chip, the number of required sub-pixels is reduced while ensuring that the number of effective pixels remains unchanged, the number of pads and wiring complexity of a single micro-luminescent package chip are reduced, and the area of a single micro-luminescent package chip is reduced. When it is applied to a micro display device, the number of pads on the subsequent circuit board is reduced, the wiring complexity of the circuit board is reduced, and the number of corresponding driver chips is reduced, which not only reduces the cost, but also reduces the process difficulty and is easier to implement.
[0070] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made according to the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.
Claims
1. A micro-luminescent package chip, characterized in that: include: A substrate having a front side and a back side arranged opposite to each other; a sub-pixel array, arranged on the front side of the substrate, comprising a plurality of sub-pixels arranged in an array, the sub-pixels comprising red sub-pixels, green sub-pixels and blue sub-pixels, the plurality of the red sub-pixels, the green sub-pixels and the blue sub-pixels being arranged alternately, one adjacent red sub-pixel, one adjacent green sub-pixel and one adjacent blue sub-pixel constituting one pixel, and at least some of the red sub-pixels, some of the green sub-pixels and some of the blue sub-pixels being shared by two or more of the pixels; The pad array is arranged on the back side of the substrate and includes a plurality of pads arranged in an array and used for electrically leading out the first electrode and the common second electrode of each sub-pixel.
2. The micro-luminescent package chip according to claim 1, characterized in that: The sub-pixel array includes 3 red sub-pixels, 2 green sub-pixels and 1 blue sub-pixel. The 3 red sub-pixels, 2 green sub-pixels and 1 blue sub-pixel are arranged in a 2×3 array to form 4 pixels.
3. The micro-luminescent package chip according to claim 2, characterized in that: The first pixel and the third pixel share the first green sub-pixel, the third pixel and the fourth pixel share the third red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, and the four pixels share the blue sub-pixel.
4. The micro-luminescent package chip according to claim 3, characterized in that: The area of the blue sub-pixel is greater than the area of the red sub-pixel, and the area of the blue sub-pixel is greater than the area of the green sub-pixel.
5. The micro-luminescent package chip according to claim 1, characterized in that: The sub-pixel array includes 3 red sub-pixels, 2 green sub-pixels, and 2 blue sub-pixels. The 3 red sub-pixels, 2 green sub-pixels, and 2 blue sub-pixels constitute 4 pixels.
6. The micro-luminescent package chip according to claim 5, characterized in that: The first pixel and the third pixel share the first green sub-pixel, the first pixel and the third pixel share the first blue sub-pixel, the third pixel and the fourth pixel share the third red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, and the second pixel and the fourth pixel share the second blue sub-pixel.
7. The micro-luminescent package chip according to claim 6, characterized in that: The sub-pixel array includes 4 red sub-pixels, 4 green sub-pixels and 1 blue sub-pixel, and the 4 red sub-pixels, 4 green sub-pixels and 1 blue sub-pixel are arranged in a 3×3 array to constitute 8 pixels.
8. The micro-luminescent package chip according to claim 7, characterized in that: The first pixel and the third pixel share the first green sub-pixel, the first pixel and the second pixel share the first red sub-pixel, the second pixel and the fourth pixel share the second green sub-pixel, the third pixel and the fifth pixel share the second red sub-pixel, the fourth pixel and the sixth pixel share the third red sub-pixel, the fifth pixel and the seventh pixel share the third green sub-pixel, the seventh pixel and the eighth pixel share the fourth red sub-pixel, the sixth pixel and the eighth pixel share the fourth green sub-pixel, and the eighth pixel share the blue sub-pixel.
9. The micro-luminescent package chip according to claim 8, characterized in that: The area of the blue sub-pixel is greater than the area of the red sub-pixel, and the area of the blue sub-pixel is greater than the area of the green sub-pixel.
10. A micro display device, characterized in that: It comprises the micro-luminescent package chip according to any one of claims 1 to 9.