Bar arrangement structure for laser end face coating and laser

Abstract

The utility model provides a bar arrangement structure for laser end face coating, which comprises a plurality of front strips arranged side by side, the back surface of each front strip is attached to the front surface of another adjacent front strip, and two ends of the back surface of each front strip along the cavity length direction are provided with chamfers. And a gap is formed between the two ends of the binding surfaces of the two adjacent positive strips in the cavity length direction. According to the utility model, the chamfer is arranged on the back surface of the front strip, so that an independent accompanying strip material does not need to be used in the laser end surface coating and bar arranging process, the structure is simplified, and the cost is reduced; and meanwhile, by controlling the chamfer size, the position of the coating line can be accurately controlled, the back surface is completely prevented from being coated with a film, and the problem of overshoot of the coating line in the end surface coating process is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a bar row structure used for coating of a laser end face and a laser. Background Art

[0002] The end coating of the laser usually uses an independent companion bar material to separate the laser bar (also known as a bar bar). The width of the companion bar is required to be 10-30um smaller than the laser bar. The laser bar and the companion bar are arranged alternately, and the end face of the laser bar is exposed to the outside. Only in this way can the end face of the laser bar be completely coated with AR film and HR film. However, the existing bar row structure of the laser is not only more complicated and costly, but also there is a certain distance between the end face of the independent companion bar material and the end face of the laser bar, which may cause the coating line to overshoot and cannot completely avoid the problem of back coating being plated on the metal. In addition, the companion bar needs to be made independently. At the same time, due to the problem of back gold tearing, an additional back lithography is required. In addition, the step difference is determined by the width difference between the main bar and the companion bar, and also by the height difference of the bar row fixture boss. These two processes have high production costs for the companion bar and high difficulty in making the fixture, which further increases the process difficulty and cost of making the bar row structure. Utility Model Content

[0003] The purpose of the utility model is to provide a bar row structure for laser end face coating, which can at least solve some of the defects existing in the prior art.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A bar row structure for laser end face coating comprises a plurality of positive bars arranged side by side, the back side of each positive bar being bonded to the front side of another adjacent positive bar, and both ends of the back side of each positive bar along the cavity length direction are chamfered, so that a gap is formed between the two ends of the bonding surface of two adjacent positive bars along the cavity length direction.

[0006] Furthermore, the lengths of the positive strips are equal, and both ends of the lengths of the positive strips are arranged flush.

[0007] Furthermore, the chamfers at both ends of the back side of the positive strip along the cavity length direction are arranged symmetrically.

[0008] Furthermore, the angle between the chamfer on the back side of the front strip and the vertical direction is 30 to 60 degrees.

[0009] Furthermore, the chamfer depth h of the back side of the positive strip is 10-20 μm, and the width l is 5-10 μm.

[0010] Furthermore, a back metal layer is provided on the back side of the positive strip.

[0011] Furthermore, the positive strip is produced by the following process: a cutting line is formed on the front side of the laser wafer according to the designed positive strip size, and a V-shaped groove is formed on the back side of the laser wafer by laser scribing, and the position of the V-shaped groove corresponds to the cutting line on the front side of the laser wafer. Then, the laser wafer is cut at the cutting line on the front side and split at the V-shaped groove on the back side to form positive strips.

[0012] In addition, the utility model also provides a laser, including a positive bar, wherein the positive bar is formed by the above-mentioned bar row structure coating.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] (1) The bar row structure for laser end face coating provided by the utility model provides a chamfer on the back of the main bar, thereby eliminating the need to use independent companion bar materials during the laser end face coating bar row process, thereby simplifying the structure and reducing costs; at the same time, by controlling the chamfer size, the position of the coating line can be accurately controlled, and the coating on the back side can be completely avoided. In the process of end face coating, the overshoot problem of the coating line is avoided.

[0015] (2) With the bar row structure provided by the utility model, only the main bar needs to be clamped and no accompanying bar is required. Therefore, the bar row fixture required in the laser end face coating bar row process does not need to be designed with a height difference, which reduces the processing of the bar row fixture. At the same time, the number of main bars per bar row fixture is doubled, thereby improving efficiency.

[0016] The present invention will be described in further detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a top view of the bar row structure used for laser end face coating of the utility model;

[0018] Figure 2 This is a left view of the bar row structure used for laser end face coating of the utility model;

[0019] Figure 3 yes Figure 2 Enlarged view of the middle part I;

[0020] Figure 4 It is a structural schematic diagram of a V-shaped groove processed on the back of a laser wafer in the utility model;

[0021] Figure 5 yes Figure 4 Enlarged view of part A in the middle.

[0022] Explanation of the reference numerals: 1. straight line; 2. gap; 3. chamfer; 4. front side; 5. back side; 6. laser wafer; 7. V-shaped groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

[0027] like Figure 1 , Figure 2 and Figure 3As shown, this embodiment provides a bar row structure for laser end face coating, including a plurality of positive bars 1 arranged side by side, wherein the arrangement direction is the thickness direction of the positive bars 1, the back side 5 of the positive bar 1 is bonded to the front side 4 of another adjacent positive bar 1, and the back side 5 of each positive bar 1 has chamfers 3 at both ends along the cavity length direction (i.e., the distance between the end faces to be coated, also considered as the width direction), so that when the back side 5 of one positive bar 1 is bonded to the front side 4 of another adjacent positive bar 1, gaps 2 are formed at both ends of the bonding surface along the cavity length direction. The bar row structure of the present embodiment arranges a chamfer 3 on the back side 5 of the main bar 1, and utilizes the back side 5 with the chamfer 3 on the main bar 1 to play the role of an original independent companion bar, thereby eliminating the need to use independent companion bar materials during the laser end face coating bar row process, thereby simplifying the structure and reducing costs; at the same time, during the laser end face coating bar row process, since only the main bar 1 needs to be clamped and no companion bar is required, the bar row fixture used does not need to be finely processed into two pairs of high and low bosses with a certain tolerance, but bosses of the same height can be used, thereby reducing the processing difficulty of the bar row fixture, and the number of main bars per bar row fixture is doubled, thereby improving efficiency.

[0028] Among them, the shapes and sizes of the main strips 1 are designed to be the same; specifically, the lengths of the main strips 1 are equal. When arranging the bars, the two ends of the lengths of the main strips 1 are arranged flush. The back side 5 of the main strip 1 is provided with a back metal layer (not shown in the figure). Since the back side 5 of the main strip 1 is chamfered 3, its back side 5 is narrower than the front side 4. When the front and back sides of two adjacent main strips 1 are attached to each other, the back side 5 of the main strip 1 will be completely covered by the front side 4 of another adjacent main strip 1. Therefore, during the end face coating process, the back side 5 of the main strip 1 can be protected from being coated with the coating line and affecting the height of the back metal layer, thereby effectively avoiding the problem of overshoot of the coating line.

[0029] Furthermore, the chamfers 3 at both ends of the back side 5 of the main strip 1 are symmetrically arranged along the cavity length direction, and the angle between the chamfer 3 and the vertical direction is 30 to 60° to obtain a reasonable gap opening width; and the depth h of the chamfer 3 is designed to be 10 to 20 μm, and the width l is 5 to 10 μm. By controlling the size of the chamfer 3, the position of the coating line can be accurately controlled, further avoiding the problem of overshoot of the coating line.

[0030] As a specific implementation method, the manufacturing process of the main strip 1 is as follows: Figure 4 and Figure 5As shown, first, the front side of the laser wafer 6 used to make the positive strip 1 can be scribed to form a cutting path according to the designed size of the positive strip 1, and then a V-shaped groove 7 can be formed on the back side of the laser wafer 6 by laser scribing. The position of the V-shaped groove 7 corresponds to the cutting path on the front side of the laser wafer 6 one by one, and then a single positive strip 1 is formed by cleaving in the traditional way of front scribing and back splitting; wherein, the back split position is at the bottom tip of the V-shaped groove 7, and the V-shaped groove 7 is split into two after splitting to form a chamfered structure on the back side of the positive strip 1. Specifically, in this embodiment, the positive strip 1 is made by using a laser surface cutting device, which has a low cost of use. The width of the V-shaped groove 7 formed by laser scribing is 10 to 20 μm, and the depth is 10 to 20 μm. By controlling the depth of laser scribing, the position of the coating line can be accurately controlled.

[0031] In summary, the bar row structure for laser end face coating provided by the utility model simplifies the structure and reduces the cost by setting a chamfer on the back side of the main bar, thereby eliminating the need to use independent companion bar materials during the laser end face coating bar row process; at the same time, by controlling the chamfer size, the position of the coating line can be accurately controlled, and the coating on the back side can be completely avoided, and the overshoot problem of the coating line can be avoided during the end face coating process.

[0032] The above examples are merely illustrative of the present invention and do not constitute a limitation on the protection scope of the present invention. All designs that are identical or similar to the present invention fall within the protection scope of the present invention.

Claims

1. A bar row structure for laser end face coating, Features: It comprises a plurality of main strips arranged side by side, the back side of each main strip being fitted with the front side of another adjacent main strip, and the back side of each main strip having chamfers at both ends along the cavity length direction, so that a gap is formed between the two ends of the fitting surface of the two adjacent main strips along the cavity length direction.

2. The bar row structure for laser end face coating according to claim 1, Features: The lengths of the positive strips are equal, and the two ends of the lengths of the positive strips are arranged flush.

3. The bar row structure for laser end face coating according to claim 1, Features: The chamfers at both ends of the back side of the positive strip along the cavity length direction are arranged symmetrically.

4. The bar row structure for laser end face coating according to claim 1, Features: The included angle between the chamfer of the back side of the front strip and the vertical direction is 30-60°.

5. The bar row structure for laser end face coating according to claim 1, Features: The chamfer depth h of the back side of the positive strip is 10-20 μm, and the width l is 5-10 μm.

6. The bar row structure for laser end face coating according to claim 1, Features: A back metal layer is provided on the back side of the front strip.

7. The bar row structure for laser end face coating according to claim 1, Features: The positive strip is made by the following process: a cutting line is formed on the front side of the laser wafer according to the designed positive strip size, a V-shaped groove is formed on the back side of the laser wafer by laser scribing, and the position of the V-shaped groove corresponds to the cutting line on the front side of the laser wafer, and then the laser wafer is cut at the cutting line on the front side and split at the V-shaped groove on the back side to form positive strips.

8. A laser, Features: It comprises a main strip, and the main strip is formed by the bar structure coating according to any one of claims 1 to 7.

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