Miniature LED circuit board structure

Abstract

The utility model discloses a miniature LED circuit board structure, which belongs to the technical field of circuit boards, and comprises a substrate, one end of the substrate is fixedly connected with a pair of connecting terminals, the center of the top surface of the substrate is fixedly connected with a pair of chips, the center of the bottom surface of the substrate is fixedly connected with a pair of patches, and the bottom surface of the substrate is fixedly connected with a pair of chips. A heat dissipation mechanism is arranged in the middle of the patch, side frames are arranged at the positions, close to the outer sides, of the two ends of the patch in a sleeving mode, a set of positioning holes are formed in the positions, close to the top faces, of the front and rear positions of the side frames, and sliding blocks are fixedly connected to the positions, close to the inner sides, of the two ends of the side frames. The circuit board is arranged on the substrate, normal use of the circuit board is guaranteed, heat dissipation and cooling are performed on the chip through alignment of the heat dissipation assembly and the chip, the problem that the joint of the chip and the substrate is melted and loosened due to high temperature is solved, and meanwhile the service life of the circuit board is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a micro LED circuit board structure. Background Art

[0002] The main function of the circuit board is to connect and support electronic components, realize the layout design of complex circuits in electrical and electronic equipment and the transmission of electrical signals. The LED circuit board is a type of circuit board. It is a semiconductor that can convert electrical energy into visible light. It changes the principle of tungsten filament luminescence of incandescent lamps and three-primary color powder luminescence of energy-saving lamps, and adopts electric field luminescence.

[0003] Based on the above, the inventors found that the existing LED circuit boards use tin bars to fix the chips, and the mounting feet of the chips are fixed to the substrate by tin bars that melt at high temperature. The chips are prone to generate high temperatures when working, which can easily cause the tin points at the connections to melt over time, causing them to fall off, affecting the normal use of the circuit boards. There is a lack of reinforced protective structures, so in view of this, the existing structures are studied and improved, and a micro LED circuit board structure is provided, in order to achieve a more practical purpose. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide a micro LED circuit board structure. This solution uses a reinforcement component to connect and reinforce the chip, thereby reducing the problem of chip loosening and falling off, ensuring the normal use of the circuit board, and aligning the heat dissipation component with the position of the chip to dissipate heat and cool the chip, thereby reducing the problem of melting and loosening at the connection between the chip and the substrate due to high temperature, and extending the service life of the circuit board.

[0006] 2. Technical solution

[0007] To solve the above problems, the utility model adopts the following technical solutions.

[0008] A micro LED circuit board structure, comprising a substrate, one end of which is fixedly connected to a pair of connection terminals, a top surface of which is centrally fixedly connected to a pair of chips, a bottom surface of which is centrally fixedly connected to a pair of patches, a heat dissipation mechanism is provided in the middle of the patches, and both ends of the patches are sleeved with side frames on the outside, a group of positioning holes are provided at the front and rear positions of the side frames on the top surface, and both ends of the side frames are fixedly connected to sliding blocks on the inside, a guide rod is provided through the middle of the sliding block, and a positioning spring is sleeved on the outside of the guide rod;

[0009] The heat dissipation mechanism comprises a heat absorbing plate, a group of heat conducting rods are fixedly connected to the bottom surface of the heat absorbing plate, an extrusion spring is sleeved on the outer side of the heat conducting rods, and a heat sink is fixedly connected to the bottom end of the heat conducting rods.

[0010] Furthermore, the two patches are aligned with the two chips respectively, and the connecting ends of the chips penetrate the substrate and are snap-connected with the positioning holes.

[0011] Furthermore, the side frame is arranged in a concave shape, the sliding block is located on the inner side of the patch, and the sliding block is slidably connected to the patch.

[0012] Furthermore, the guide rod is fixedly connected to the patch, and two ends of the positioning spring are respectively fixedly connected to the inner surface of the patch and the sliding block.

[0013] Furthermore, the heat absorbing plate is located in the center of the patch, and the top surface of the heat absorbing plate is in contact with the bottom surface of the substrate.

[0014] Furthermore, the heat conducting rod is slidably connected to the patch, and the heat sink is located outside the patch.

[0015] Furthermore, two ends of the extrusion spring are fixedly connected to the bottom surface of the heat absorbing plate and the inner surface of the patch respectively.

[0016] 3. Beneficial effects

[0017] Compared with the prior art, the advantages of the present invention are:

[0018] (1) This solution arranges the chip connection pins to pass through the substrate, and then pulls the side frame outward so that the chip connection pins engage with the positioning holes. At this time, the positioning spring produces a reverse pull, causing the side frame to pull the chip connection pins in the reverse direction, thereby achieving chip connection reinforcement. Compared with the prior art, the chip connection is reinforced by a reinforcement component, which reduces the problem of chip loosening and falling off, thereby ensuring the normal use of the circuit board.

[0019] (2) By setting up a heat dissipation mechanism, when the patch contacts the back side of the substrate, the extrusion spring reversely squeezes the heat absorbing plate to fit the substrate, and the temperature of the substrate is absorbed by the heat absorbing plate and transferred to the heat sink through the heat conducting rod to dissipate heat and cool down the chip. Compared with the prior art, the heat dissipation component is aligned with the position of the chip to dissipate heat and cool down the chip, thereby reducing the problem of melting and loosening of the connection between the chip and the substrate due to high temperature, and at the same time extending the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the bottom structure of the utility model;

[0022] Figure 3 It is a cross-sectional view of the patch of the utility model;

[0023] Figure 4 It is a structural schematic diagram of the side frame of the utility model;

[0024] Figure 5 It is a structural schematic diagram of the heat dissipation mechanism of the utility model.

[0025] Explanation of the numbers in the figure: 1. substrate; 2. connecting terminal; 3. chip; 4. patch; 5. heat dissipation mechanism; 6. side frame; 7. positioning hole; 8. sliding block; 9. guide rod; 10. positioning spring; 11. heat absorbing plate; 12. heat conducting rod; 13. extrusion spring; 14. heat sink. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the utility model in conjunction with the drawings in the embodiments of the utility model; it is obvious that the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the utility model without making creative work are within the scope of protection of the utility model.

[0027] Example:

[0028] See also Figure 1-5 , a micro LED circuit board structure, including a substrate 1, one end of the substrate 1 is fixedly connected with a pair of connection terminals 2, and a pair of chips 3 are fixedly connected in the middle of the top surface of the substrate 1, a pair of patches 4 are fixedly connected in the middle of the bottom surface of the substrate 1, a heat dissipation mechanism 5 is arranged in the middle of the patch 4, and both ends of the patch 4 are sleeved with side frames 6 on the outside, a group of positioning holes 7 are opened on the top surface of the front and rear positions of the side frame 6, and both ends of the side frame 6 are fixedly connected with sliding blocks 8 on the inside, a guide rod 9 is arranged through the middle of the sliding block 8, and a positioning spring 10 is sleeved on the outside of the guide rod 9;

[0029] The heat dissipation mechanism 5 includes a heat absorbing plate 11, a group of heat-conducting rods 12 are fixedly connected to the bottom surface of the heat absorbing plate 11, an extrusion spring 13 is sleeved on the outer side of the heat-conducting rods 12, and a heat sink 14 is fixedly connected to the bottom end of the heat-conducting rods 12. In order to adjust the heat dissipation of the chip 3 and reduce the temperature of the circuit board, the heat dissipation mechanism 5 is provided.

[0030] See also Figure 3 The two patches 4 are aligned with the two chips 3 respectively. The connecting end of the chip 3 passes through the substrate 1 and is clamped with the positioning hole 7. The chip 3 is fixed to the substrate 1 through the tin bar, so that the connecting pins of the chip 3 pass through the substrate 1, and then the patch 4 is placed on the back of the substrate 1 at a position aligned with the chip 3.

[0031] See also Figure 4 The side frame 6 is set in a concave shape, the sliding block 8 is located on the inner side of the patch 4, and the sliding block 8 is slidably connected to the patch 4, and the side frame 6 is slid outward. The sliding block 8 cooperates with the guide rod 9 to ensure the movement stability of the side frame 6 until the positioning holes 7 at the front and rear positions of the side frame 6 are engaged with the connecting pins of the chip 3.

[0032] See also Figure 4 The guide rod 9 is fixedly connected to the patch 4, and the two ends of the positioning spring 10 are respectively fixedly connected to the inner surface of the patch 4 and the sliding block 8. The movement of the sliding block 8 squeezes the positioning spring 10, and at the same time, the positioning spring 10 produces a reverse pull, so that the side frame 6 reversely pulls the connecting pin of the chip 3, thereby fixing the patch 4 and reinforcing the connection of the chip 3.

[0033] See also Figure 5 The heat absorbing plate 11 is located in the center of the patch 4 , and the top surface of the heat absorbing plate 11 is in contact with the bottom surface of the substrate 1 . When the patch 4 contacts the back surface of the substrate 1 , the heat absorbing plate 11 is squeezed.

[0034] See also Figure 5 The heat conducting rod 12 is slidably connected to the patch 4 , and the heat sink 14 is located outside the patch 4 . The movement of the heat absorbing plate 11 drives the heat conducting rod 12 and the heat sink 14 to move downward, while compressing the extrusion spring 13 .

[0035] See also Figure 5 The two ends of the extrusion spring 13 are fixedly connected to the bottom surface of the heat absorbing plate 11 and the inner surface of the patch 4 respectively. Under the reverse action of the extrusion spring 13, the heat absorbing plate 11 is attached to the substrate 1. In the working state, the temperature of the substrate 1 is absorbed by the heat absorbing plate 11 and transferred to the heat sink 14 through the heat conducting rod 12 to dissipate heat and cool down.

[0036] When in use: fix the chip 3 to the substrate 1 through the tin bar, so that the connecting pins of the chip 3 pass through the substrate 1, and then place the patch 4 on the back of the substrate 1 at a position aligned with the chip 3. When the patch 4 contacts the back of the substrate 1, it squeezes the heat absorbing plate 11. The movement of the heat absorbing plate 11 drives the heat conducting rod 12 and the heat sink 14 to move downward, and at the same time compresses the squeezing spring 13. Under the reverse action of the squeezing spring 13, the heat absorbing plate 11 is fitted with the substrate 1, and then the side frame 6 is slid outward, and the sliding block 8 cooperates with the guide rod 9 to ensure the movement stability of the side frame 6 until the positioning holes 7 at the front and rear positions of the side frame 6 are engaged with the connecting pins of the chip 3. The movement of the sliding block 8 squeezes the positioning spring 10, and at the same time, the positioning spring 10 produces a reverse pull, so that the side frame 6 pulls the connecting pins of the chip 3 in the reverse direction, thereby realizing the connection reinforcement of the chip 3. In the working state, the temperature of the substrate 1 is absorbed by the heat absorbing plate 11, and is transmitted to the heat sink 14 through the heat conducting rod 12 to dissipate heat and cool down.

[0037] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0038] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A micro LED circuit board structure, comprising a substrate (1), one end of the substrate (1) being fixedly connected to a pair of connection terminals (2), and a top surface of the substrate (1) being fixedly connected to a pair of chips (3), characterized in that: A pair of patches (4) are fixedly connected in the center of the bottom surface of the substrate (1), a heat dissipation mechanism (5) is provided in the middle of the patches (4), and side frames (6) are sleeved on both ends of the patches (4) near the outside, a group of positioning holes (7) are opened on the top surface of the front and rear positions of the side frames (6), and sliding blocks (8) are fixedly connected on both ends of the side frames (6) near the inside, a guide rod (9) is provided through the middle of the sliding block (8), and a positioning spring (10) is sleeved on the outside of the guide rod (9); The heat dissipation mechanism (5) comprises a heat absorbing plate (11), the bottom surface of which is fixedly connected to a group of heat conducting rods (12), the outer sides of the heat conducting rods (12) are sleeved with compression springs (13), and the bottom ends of the heat conducting rods (12) are fixedly connected to heat sinks (14).

2. The micro LED circuit board structure according to claim 1, characterized in that: The two patches (4) are aligned with the two chips (3) respectively, and the connection ends of the chips (3) penetrate the substrate (1) and are clamped with the positioning holes (7).

3. The micro LED circuit board structure according to claim 1, characterized in that: The side frame (6) is arranged in a concave shape, the sliding block (8) is located on the inner side of the patch (4), and the sliding block (8) is slidably connected to the patch (4).

4. The micro LED circuit board structure according to claim 1, characterized in that: The guide rod (9) is fixedly connected to the patch (4), and the two ends of the positioning spring (10) are respectively fixedly connected to the inner surface of the patch (4) and the sliding block (8).

5. The micro LED circuit board structure according to claim 1, characterized in that: The heat absorbing plate (11) is located in the center of the patch (4), and the top surface of the heat absorbing plate (11) is in contact with the bottom surface of the substrate (1).

6. The micro LED circuit board structure according to claim 1, characterized in that: The heat conducting rod (12) is slidably connected to the patch (4), and the heat sink (14) is located outside the patch (4).

7. The micro LED circuit board structure according to claim 1, characterized in that: The two ends of the extrusion spring (13) are respectively fixedly connected to the bottom surface of the heat absorbing plate (11) and the inner surface of the patch (4).

Images