Device for pasting adhesive tape on FPC (Flexible Printed Circuit) board

Abstract

The device for pasting the adhesive tape on the FPC board comprises a horizontal table top, and the FPC board is positioned on the horizontal table top through a first positioning structure. The first positioning structure is arranged on the horizontal table top and used for positioning an FPC board, the second positioning structure is used for positioning a hot melting adhesive tape positioning film on the horizontal table top, the heating columns are arranged above the horizontal table top in a suspended mode and can be driven to move up and down, the number of the heating columns is consistent with the number of to-be-pasted areas on the upper surface of the FPC board, and the heating columns and the to-be-pasted areas are in one-to-one correspondence; the lower surface of each heating column is a heating surface, each heating surface is located at the same horizontal height, and the projection of each heating surface in the vertical direction all falls into each to-be-pasted area; all the hot-melt adhesive tapes to be pasted are pre-positioned on the hot-melt adhesive tape positioning film; according to the FPC board hot-melt adhesive tape heating device, multiple hot-melt adhesive tapes on an FPC board can be heated through one-time downward pressing heating of the multiple heating columns, the heating temperatures of the hot-melt adhesive tapes are consistent, the heating time is consistent, and the processing efficiency of the FPC board is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC manufacturing, in particular to a device for attaching adhesive tape to an FPC board. Background Art

[0002] FPC is a high-reliability, excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness, and good bending performance. During use, it is often folded into various shapes according to the specific use scenario. In order to locate the folded shape, hot melt tape is usually attached to the surface of FPC in the prior art. As is well known, hot melt tape needs to be heated to a certain temperature to be sticky. First, the hot melt tape is pre-placed on the surface of the FPC board, and then the upper surface of the hot melt tape is pressed from top to bottom by the heating column to heat it. During the heating process, the heating time and heating temperature must be accurately controlled. If the temperature is too low, the viscosity of the hot melt tape cannot reach the best, and the tape is easy to detach from the FPC. If the temperature is too high, it will damage the FPC board below. Therefore, in the prior art, multiple adhesive points on the FPC board are usually heated one by one, which greatly affects the processing efficiency of the FPC board.

[0003] Therefore, how to solve the above-mentioned deficiencies in the prior art has become a topic to be studied and solved in the present invention. Summary of the invention

[0004] The utility model aims to provide a device for attaching adhesive tape to an FPC board.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a device for pasting tape on FPC board, comprising a horizontal platform, a first positioning structure arranged on the horizontal platform for positioning the FPC board, a second positioning structure for positioning a hot-melt tape positioning film on the horizontal platform, and a heating column suspended above the horizontal platform and driven to move up and down, wherein the number of heating columns is consistent with the number of areas to be pasted on the upper surface of the FPC board, and the two correspond one to one; the lower surface of each of the heating columns is a heating surface, and the heating surfaces of each heating column are located at the same horizontal height, and the projections of each heating surface in the upper and lower directions all fall within each area to be pasted; each hot-melt tape to be pasted is all pre-positioned on a hot-melt tape positioning film.

[0006] In the above scheme, by placing the FPC board on a horizontal surface, the heating surfaces of each heating column are located at the same horizontal height, so that each heating column can reach the area to be pasted of the FPC board at the same time, and start heating the hot melt tapes pre-placed in each area to be pasted at the same time, and end heating at the same time. In this way, the hot melt tapes at multiple points can be heated at the same time, greatly improving the processing efficiency of the FPC board.

[0007] In the above scheme, before pasting, all the hot-melt tapes to be pasted are pre-positioned on a hot-melt tape positioning film, and the positions of the hot-melt tapes on the positioning film correspond to the areas to be pasted on the FPC board. When the FPC board is positioned on the horizontal surface, the hot-melt tape positioning film is positioned at the corresponding position on the horizontal surface through the second positioning structure. The positioned hot-melt tapes correspond exactly to the areas to be pasted, waiting to be heated and melted by the heating column above.

[0008] In the above scheme, the larger the area of ​​the heating surface, the better, and the larger the area, the more uniform the heating effect.

[0009] A further technical solution is that the first positioning structure includes several first positioning columns arranged corresponding to the outer contour of the FPC board, vacuum adsorption holes and air guide grooves opened corresponding to the lower surface of the FPC board. When the FPC board is positioned at the corresponding position by the first positioning columns, the vacuum adsorption holes are used to generate negative pressure to adsorb and fix the FPC board. The function of the air guide groove is to discharge the air between the horizontal platform surface and the FPC board bracket in time during vacuuming, so that the FPC can finally fit smoothly and tightly on the horizontal platform surface, making the subsequent heating process more stable.

[0010] A further technical solution is that the second positioning structure includes a plurality of second positioning posts arranged on the horizontal surface, and a plurality of positioning holes arranged on the hot-melt adhesive tape positioning film and corresponding one-to-one to the second positioning posts. After the FPC board is positioned on the horizontal surface, the hot-melt adhesive tape on the hot-melt adhesive tape positioning film is quickly and accurately covered to the FPC to-be-pasted area through the cooperation between the second positioning posts and the positioning holes.

[0011] According to a further technical solution, a heat insulation board is embedded on the horizontal platform surface, and the heat insulation board at least covers the projection area of ​​all heating surfaces in the upper and lower directions.

[0012] According to a further technical solution, the hot-melt adhesive tape positioning film is different in color from the hot-melt adhesive tape, and the hot-melt adhesive tape positioning film is transparent, so as to use visual difference to quickly check whether the hot-melt adhesive tape matches the area to be pasted.

[0013] According to a further technical solution, the heating column is made of brass, which has good thermal conductivity and high mechanical strength.

[0014] The working principle and advantages of this utility model are as follows:

[0015] The utility model comprises a device for pasting tape on an FPC board, comprising a horizontal platform, wherein the FPC board is positioned on the horizontal platform by a first positioning structure, a first positioning structure arranged on the horizontal platform for positioning the FPC board, a second positioning structure for positioning a hot-melt adhesive tape positioning film on the horizontal platform, and a heating column suspended above the horizontal platform for being driven to move up and down, wherein the number of the heating columns is consistent with the number of areas to be pasted on the upper surface of the FPC board, and the two correspond one to one; the lower surface of each of the heating columns is a heating surface, each of the heating surfaces is located at the same horizontal height, and the projections of each of the heating surfaces in the up and down directions all fall within each area to be pasted; each of the hot-melt adhesive tapes to be pasted is all pre-positioned on the hot-melt adhesive tape positioning film; the hot-melt adhesive tapes at multiple locations on the FPC board can be heated by pressing down and heating at one time by a plurality of heating columns, and the heating temperature and heating time of the hot-melt adhesive tapes at each location are consistent, thereby greatly improving the processing efficiency of the FPC board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 This is a schematic diagram of the structure of a device for applying adhesive tape according to an embodiment of the utility model;

[0017] Attached Figure 2 It is a schematic diagram of the cross-sectional structure of the device of the embodiment of the utility model;

[0018] Attached Figure 3 This is a schematic diagram of the structure of the horizontal platform of the embodiment of the utility model (without FPC board);

[0019] Attached Figure 4 This is a schematic structural diagram of a hot-melt adhesive tape positioning film pre-attached with a hot-melt adhesive tape according to an embodiment of the utility model;

[0020] Attached Figure 5 It is a schematic diagram of the structure of the horizontal platform of the embodiment of the utility model when the FPC board and the hot melt tape are loaded.

[0021] In the above drawings: 1. Horizontal platform; 2. FPC board; 3. Hot melt tape positioning film; 4. Heating column; 5. Hot melt tape; 6. Area to be pasted; 7. First positioning column; 8. Vacuum adsorption hole; 9. Air guide groove; 10. Second positioning column; 11. Positioning hole; 12. Heat insulation board; 13. Aluminum heating plate; 14. Cylinder driver; 15. Plate removal slot. Implementation

[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0023] Embodiment: The present invention will be clearly described below with diagrams and detailed descriptions. After understanding the embodiments of the present invention, any person skilled in the art can make changes and modifications based on the techniques taught by the present invention without departing from the spirit and scope of the present invention.

[0024] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0025] The terms “first”, “second”, etc. used in this document do not specifically refer to an order or sequence, nor are they used to limit the present case. They are only used to distinguish components or operations described with the same technical terms.

[0026] As used herein, “connected” or “positioned” may refer to two or more components or devices being in direct physical contact with each other, or being in indirect physical contact with each other, or may refer to two or more components or devices operating or moving with each other.

[0027] The terms “include,” “including,” “have,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0028] The terms used in this document generally have the ordinary meaning of each term used in this field, in the context of the case and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present invention.

[0029] The terms “upper” and “lower” used in this article are directional terms. In this case, they are only used to illustrate the positional relationship between the structures and are not used to limit the protection plan of this case and the specific direction during actual implementation.

[0030] See attached Figure 1-5 As shown, a device for attaching adhesive tape to FPC board comprises a horizontal surface 1, a first positioning structure arranged on the horizontal surface 1 for positioning FPC board 2, a second positioning structure for positioning hot melt adhesive tape positioning film 3 on the horizontal surface 1, and a heating column 4 suspended above the horizontal surface 1 and driven to move up and down, wherein the number of heating columns 4 is consistent with the number of to-be-attached areas 6 on the upper surface of FPC board 2, and the two correspond one to one, the lower surface of each heating column 4 is a heating surface, each heating surface is at the same horizontal height, and the projection of each heating surface in the up and down direction all falls within each to-be-attached area 6; each hot melt adhesive tape 5 to be attached is all predetermined to be positioned on the hot melt adhesive tape positioning film 3. The heating column 4 is a heating column 4 made of brass, and the heating column 4 can be heated by an aluminum heating plate 13 on the device.

[0031] The first positioning structure includes a plurality of first positioning columns 7 arranged corresponding to the outer contour of the FPC board 2 , vacuum adsorption holes 8 and air guide grooves 9 opened corresponding to the lower surface of the FPC board 2 .

[0032] The second positioning structure includes a plurality of second positioning posts 10 disposed on the horizontal surface 1 , and a plurality of positioning holes 11 disposed on the hot melt adhesive tape positioning film 3 and corresponding to the second positioning posts 10 one by one.

[0033] A heat insulation board 12 is embedded on the horizontal platform 1, and the heat insulation board 12 at least covers the projection area of ​​all heating surfaces in the vertical direction to prevent high temperature from damaging the horizontal platform 1. The horizontal platform 1 is also provided with a board removal slot 15 for taking out the FPC board 2.

[0034] The hot melt tape positioning film 3 is different in color from the hot melt tape 5 . The hot melt tape positioning film 3 is transparent, and visual difference is used to quickly check whether the hot melt tape 5 matches the area to be pasted 6 .

[0035] Through the above structural composition, the structural principle of the utility model is now described as follows:

[0036] Corresponding to each area to be pasted 6 on the FPC board 2, each hot-melt adhesive tape 5 is positioned on a hot-melt adhesive tape positioning film 3 in advance; before heating, the heating temperature, heating time and downward pressure of the heating column 4 can be set first, and then the FPC board 2 is placed on the horizontal platform 1, and each first positioning column 7 is abutted against the outer contour of the FPC board 2, and the vacuum adsorption hole 8 generates negative pressure, and the air between the FPC board 2 and the horizontal platform 1 is extracted, so that the FPC board 2 is finally smoothly and tightly attached to the horizontal platform 1, and then the hot-melt adhesive tape positioning film 3 is positioned on the horizontal platform 1 through the second positioning structure. After positioning, each hot-melt adhesive tape 5 on the hot-melt adhesive tape positioning film 3 just coincides with the area to be pasted 6 of the FPC board 2, and then the cylinder driver 14 drives each heating column 4 to press down to the top of each hot-melt adhesive tape 5 at the same time to heat each hot-melt adhesive tape 5, and then drives each heating column 4 to rise and detach at the same time after heating is completed.

[0037] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A device for applying adhesive tape to FPC boards, characterized in that: The invention comprises a horizontal platform (1), a first positioning structure arranged on the horizontal platform (1) for positioning an FPC board (2), a second positioning structure for positioning a hot melt adhesive tape positioning film (3) on the horizontal platform (1), and a heating column (4) suspended above the horizontal platform (1) and driven to move up and down, wherein the number of the heating columns (4) is consistent with the number of the to-be-bonded areas (6) on the upper surface of the FPC board (2), and the two correspond to each other one by one, the lower surface of each heating column (4) is a heating surface, each heating surface is located at the same horizontal height, and the projections of each heating surface in the vertical direction all fall within each to-be-bonded area (6); each hot melt adhesive tape (5) to be bonded is all predetermined to be located on the hot melt adhesive tape positioning film (3).

2. The device for applying adhesive tape to FPC boards according to claim 1, characterized in that: The first positioning structure comprises a plurality of first positioning columns (7) arranged corresponding to the outer contour of the FPC board (2), vacuum adsorption holes (8) and air guide grooves (9) opened corresponding to the lower surface of the FPC board (2).

3. The device for applying adhesive tape to FPC boards according to claim 1, characterized in that: The second positioning structure comprises a plurality of second positioning posts (10) arranged on the horizontal surface (1), and a plurality of positioning holes (11) arranged on the hot melt adhesive tape positioning film (3) and corresponding one-to-one with the second positioning posts (10).

4. The device for applying adhesive tape to FPC boards according to claim 1, characterized in that: A heat insulation board (12) is embedded on the horizontal platform surface (1), and the heat insulation board (12) at least covers the projection area of ​​all heating surfaces in the up and down directions.

5. The device for applying adhesive tape to FPC boards according to claim 1, characterized in that: The hot melt adhesive tape positioning film (3) and the hot melt adhesive tape (5) are of different colors, and the hot melt adhesive tape positioning film (3) is transparent.

6. The device for applying adhesive tape to FPC board according to claim 1, characterized in that: The heating column (4) is a heating column (4) made of brass.

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