Automatic hot pressing device of FPC (flexible printed circuit)
By designing an automated hot pressing device for FPC flexible circuit boards, using the rolling barrel, film traction mechanism, sheet cutting mechanism and pressing mechanism, the automatic cutting and hot pressing of FPC soft board and PI film is achieved, solving the existing technology The problem of low thermal pressing efficiency improves mechanical performance and processing efficiency.
Patent Information
- Application Number
- CN202420584967.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-22
AI Technical Summary
The hot pressing process of existing FPC flexible circuit boards is inefficient, and multiple equipment need to be transferred and operated by each other, resulting in low efficiency in improving mechanical performance.
An automatic hot pressing device is designed, including a rolling barrel, a film traction mechanism, a sheet cutting mechanism, a reciprocating movement mechanism, a pressure bearing table and a pressing mechanism. Through automatic cutting and hot pressing, the PI film and FPC soft plate are realized. Automatic bonding.
The pressing processing efficiency of FPC soft board and PI film is greatly improved, manual operation is reduced, and more stable bonding effect and higher mechanical properties are achieved.
Smart Images

Figure CN222170118U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of hot pressing devices for flexible circuit boards, in particular to an automatic hot pressing device for FPC flexible circuit boards. Background Art
[0002] The hot pressing device is one of the most important processing equipment on the sheet production line. However, some sheets need to be processed by specific processes during hot pressing, such as FPC boards. Flexible printed circuit boards (Flexible Printed Circuit Boards), also known as "FPC soft boards", are printed circuits made of flexible insulating substrates. They have many advantages that rigid printed circuit boards do not have. For example, they can be bent, wound, and folded freely, can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the size of electronic products, which is suitable for the development of electronic products towards high density, miniaturization, and high reliability.
[0003] In the prior art, in order to improve the mechanical properties of the FPC soft board, it is often necessary to laminate a layer of PI film on the FPC soft board to compensate for the slight deficiency of the flexible substrate in the component bearing capacity. However, the traditional PI film needs to be cut in advance, and then placed on the surface of the FPC soft board by a robot, and then hot-pressed and laminated by a hot press. The hot pressing process requires multiple devices to transfer and operate with each other, resulting in low lamination efficiency of the FPC soft board.
[0004] Therefore, the prior art has defects and needs to be improved. Utility Model Content
[0005] The technical problem to be solved by the utility model is to provide an automatic hot pressing device for FPC flexible circuit boards which has a high degree of automation and improves production efficiency.
[0006] To achieve this purpose, the utility model adopts the following technical scheme: an automatic hot pressing device for FPC flexible circuit board, including a coil drum, a frame, a film traction mechanism, a cutting mechanism, a reciprocating mechanism, a pressure platform, a heating tube and a pressing mechanism;
[0007] The reel is arranged at the side end of the frame to be used for reeling up the PI film hot-pressed with the FPC soft board;
[0008] The film pulling mechanism is arranged on the frame to pull the PI film out from the reel, and the sheet cutting mechanism is arranged at the discharge end of the film pulling mechanism to cut the PI film into a sheet structure;
[0009] The pressure-bearing platform is arranged at the side end of the cutting mechanism, and a plurality of adsorption holes are arranged on the pressure-bearing platform for adsorbing the sheet-shaped PI film and the FPC soft board;
[0010] The reciprocating mechanism is connected to the bottom of the pressure platform, and the reciprocating mechanism is used to drive the pressure platform to move horizontally along a first direction;
[0011] The heating tube is arranged in the pressure platform to heat the PI film and the FPC soft board on the pressure platform. The pressing mechanism is arranged on the top of the frame and above the pressure platform. The pressing mechanism is used to press the PI film and the FPC soft board on the pressure platform.
[0012] According to the above technical solution, in the automatic hot pressing device for the FPC flexible circuit board, the cutting mechanism includes a lifting assembly, a lifting plate, a cutting knife, a cutting seat and an elastic film pressing assembly;
[0013] The cutting seat is arranged on the frame, and a channel groove for guiding and conveying the PI film is arranged on the cutting seat. The lifting assembly is connected with the lifting plate to drive the lifting plate to move up and down in the vertical direction. The cutter is arranged on the lifting plate, and the cutter can cut the PI film on the cutting seat as the lifting plate moves up and down;
[0014] Two groups of the elastic film pressing components are located on the lifting plates on both sides of the cutter. When the cutter is cutting the PI film, the elastic film pressing components are used to apply a pressing force to the PI film.
[0015] By adopting the above-mentioned technical solutions, in the automatic hot pressing device for the FPC flexible circuit board, the elastic film pressing assembly includes a guide rod, a spring and a pressing block;
[0016] The guide rod passes through the lifting plate from top to bottom and is connected to the pressing block. The spring is sleeved on the guide rod between the lifting plate and the pressing block. The spring is used to apply a downward elastic force to the pressing block.
[0017] By adopting the above-mentioned technical solutions, in the automatic hot pressing device for the FPC flexible circuit board, the lifting assembly includes a rotating motor, an eccentric sleeve, a rectangular frame, a guide column and a linear bearing;
[0018] The linear bearings are arranged on the frames on both sides of the cutting seat, and the guide posts pass through the linear bearings from bottom to top and are connected to the lifting plate;
[0019] The rectangular frame is connected to the bottom of the guide column, the eccentric sleeve is located in the rectangular frame, and the rectangular frame can be reciprocated and lifted as the eccentric sleeve rotates;
[0020] The output shaft of the rotating motor is connected to the eccentric sleeve to drive the eccentric sleeve to rotate.
[0021] By adopting the above-mentioned technical solutions, in the automatic hot pressing device for the FPC flexible circuit board, the reciprocating mechanism includes a push-pull cylinder, a slide rail, a moving plate and a connecting plate;
[0022] The slide rail is horizontally arranged on the frame along a first direction, the movable plate is slidably connected to the slide rail through a slider, the movable end of the push-pull cylinder is connected to the movable plate to drive the movable plate to move along the slide rail, and the connecting plate is arranged on the movable plate and connected to the pressure platform.
[0023] By adopting the above-mentioned technical solutions, the automatic hot pressing device for the FPC flexible circuit board also includes an upward push cylinder, which is arranged on the connecting plate, and the movable end of the upward push cylinder is arranged upward and connected to the pressure platform, and the upward push cylinder is used to adjust the height of the pressure platform.
[0024] By adopting the above-mentioned technical solutions, in the automatic hot pressing device for the FPC flexible circuit board, the pressing mechanism includes a pressing cylinder, a pressing seat and a rubber pad;
[0025] The pressing cylinder is connected to the top of the frame through a mounting frame, the movable end of the pressing cylinder is set downward and connected to the pressing seat, the rubber pad is arranged at the bottom of the pressing seat, and the pressing cylinder is used to drive the pressing seat to be pressed tightly on the pressure platform so that the PI film on the pressure platform can be pressed with the FPC soft board.
[0026] By adopting the above-mentioned technical solutions, in the automatic hot pressing device for the FPC flexible circuit board, the film traction mechanism includes an active rubber roller, a driven rubber roller, a driving motor and a pulley transmission assembly;
[0027] The driven rubber roller and the active rubber roller are respectively arranged on the frame, and a gap is provided between the driven rubber roller and the active rubber roller for the PI film to pass through;
[0028] The shaft ends of the driven rubber roller and the active rubber roller are respectively provided with gears meshing with each other, and the output shaft of the driving motor is connected with the active rubber roller through the pulley transmission assembly.
[0029] Compared with the prior art, the utility model has the following beneficial effects:
[0030] The winding drum of the utility model can be wound up with the PI film for hot pressing with the FPC soft board, the film traction mechanism can pull and extract the PI film from the winding drum, the sheet cutting mechanism can cut the PI film into a sheet structure, the pressure platform can adsorb and carry the PI film and the FPC soft board through vacuum adsorption force, and then the reciprocating movement mechanism can drive the pressure platform to move under the pressing mechanism, the pressing mechanism can provide a certain pressure to the pressure platform, so that the PI film on the pressure platform and the FPC soft board can be stably pressed, during the pressing process, the heating tube can generate a certain amount of heat to partially melt the PI film, so that it can be firmly bonded with the FPC soft board, the whole PI film unloading, cutting and hot pressing process are automatically performed, eliminating the tedious manual operation, and greatly improving the pressing processing efficiency between the FPC soft board and the PI film. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0032] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.
[0033] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0034] Figure 2 This is a schematic diagram of the reciprocating mechanism structure of the utility model;
[0035] Figure 3 This is a schematic diagram of the structure of the film traction mechanism of the utility model;
[0036] Figure 4 This is a schematic diagram of the structure of the cutting mechanism of the utility model;
[0037] Figure 5 This is a structural schematic diagram of the cutting mechanism of the utility model from another perspective. DETAILED DESCRIPTION
[0038] In order to make the utility model's purpose, features, and advantages more obvious and easy to understand, the following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. Obviously, the embodiments described below are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0039] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.
[0040] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.
[0041] like Figures 1 to 5 As shown, the embodiment of the utility model provides an automatic hot pressing device for FPC flexible circuit board, including a coil drum 1, a frame 2, a film traction mechanism 3, a cutting mechanism 4, a reciprocating mechanism 5, a pressure platform 6, a heating tube 7 and a pressing mechanism 8;
[0042] The reel 1 is arranged at the side end of the frame 2 to be used for winding up the PI film that is hot-pressed with the FPC soft board. The film traction mechanism 3 is arranged on the frame 2 to be used for pulling and extracting the PI film from the reel 1. The cutting mechanism 4 is arranged at the discharge end of the film traction mechanism 3 to be used for cutting the PI film into a sheet structure. The reel 1 is used for winding up and supplying the PI film. The PI film has high tensile strength and wear resistance. By laminating the PI film on the FPC soft board, the mechanical strength of the FPC can be enhanced, so that it has better tensile resistance, bending resistance and extrusion resistance. The film traction mechanism 3 can provide a certain traction force to extract the PI film from the reel 1, and the cutting mechanism 4 can cut the PI film into a sheet structure of a required size to laminar it on a specific area of the FPC soft board.
[0043] The pressure platform 6 is arranged at the side end of the cutting mechanism 4, and a plurality of adsorption holes 61 are provided on the pressure platform 6 for adsorbing the sheet-like PI film and FPC soft board. The reciprocating mechanism 5 is connected to the bottom of the pressure platform 6, and the reciprocating mechanism 5 is used to drive the pressure platform 6 to move horizontally along the first direction. The heating tube 7 is arranged in the pressure platform 6 for heating the PI film and FPC soft board on the pressure platform 6. The pressing mechanism 8 is arranged on the top of the frame 2 and is located above the pressure platform 6. The pressing mechanism 8 is used to press the PI film and FPC soft board on the pressure platform 6. The pressure platform 6 can stably adsorb the PI film and the FPC soft board through the vacuum adsorption force. The reciprocating mechanism 5 can move and adjust the position of the pressure platform 6. When the PI film needs to be sliced, the reciprocating mechanism 5 can drive the pressure platform 6 to move to the side end of the cutting mechanism 4 to receive the cut PI film sheet. When hot pressing is required, the reciprocating mechanism 5 can drive the pressure platform 6 to move to the bottom of the pressing mechanism 8 to facilitate the hot pressing of the PI film sheet and the FPC soft board. During the hot pressing process, the heating tube 7 can continuously generate a certain amount of heat to achieve the melting of the PI film and ensure that it is firmly bonded to the interlayer of the FPC soft board.
[0044] like Figure 4 and Figure 5 As shown, further, the cutting mechanism 4 includes a lifting component 41, a lifting plate 42, a cutter 43, a cutting seat 44 and an elastic film pressing component 45. The cutting seat 44 is arranged on the frame 2. The cutting seat 44 is provided with a channel groove 441 for guiding and conveying the PI film. The lifting component 41 is connected to the lifting plate 42 to drive the lifting plate 42 to move up and down in the vertical direction. The cutter 43 is arranged on the lifting plate 42. The cutter 43 can cut the PI film on the cutting seat 44 as the lifting plate 42 moves up and down. Two groups of the elastic film pressing components 45 are located on the lifting plate 42 on both sides of the cutter 43. When the cutter 43 cuts the PI film, the elastic film pressing component 45 is used to apply a clamping force to the PI film. A channel groove 441 is provided on the cutting seat 44 for guiding and conveying the PI film. The cutter 43 is located on the outer wall of the cutting seat 44. When the PI film needs to be cut into slices, the lifting assembly 41 can drive the lifting plate 42 to descend, and then the elastic film pressing assembly 45 can be pressed against the surface of the PI film to prevent the PI film from warping during cutting. Then the cutter 43 contacts the PI film, thereby realizing sheet cutting.
[0045] like Figure 4As shown, further, the elastic film pressing assembly 45 includes a guide rod 451, a spring 452 and a pressure block 453. The guide rod 451 passes through the lifting plate 42 from top to bottom and is connected to the pressure block 453. The spring 452 is sleeved on the guide rod 451 between the lifting plate 42 and the pressure block 453. The spring 452 is used to apply a downward elastic force to the pressure block 453 so that the pressure block 453 has a downward clamping force, ensuring that the PI film can be subjected to appropriate pressure during the cutting process, thereby ensuring the stability of the cutting.
[0046] like Figure 4 As shown, further, the lifting assembly 41 includes a rotating motor 411, an eccentric sleeve 412, a rectangular frame 413, a guide column 414 and a linear bearing 415. The linear bearing 415 is arranged on the frame 2 on both sides of the cutting seat 44. The guide column 414 passes through the linear bearing 415 from bottom to top and is connected to the lifting plate 42. The rectangular frame 413 is connected to the bottom of the guide column 414. The eccentric sleeve 412 is located in the rectangular frame 413. The rectangular frame 413 can be reciprocated and lifted with the rotation of the eccentric sleeve 412. The output shaft of the rotating motor 411 is connected to the eccentric sleeve 412 to drive the eccentric sleeve 412 to rotate. The rotating motor 411 can drive the eccentric sleeve 412 to rotate, thereby driving the lifting plate 42 to perform reciprocating lifting and lowering motions through the rectangular frame 413, thereby realizing the cutting action of the cutter 43 on the PI film.
[0047] like Figure 2 As shown, further, the reciprocating mechanism 5 includes a push-pull cylinder 51, a slide rail 52, a moving plate 53 and a connecting plate 54. The slide rail 52 is horizontally arranged on the frame 2 along a first direction. The moving plate 53 is slidably connected to the slide rail 52 through a slider. The movable end of the push-pull cylinder 51 is connected to the moving plate 53 to drive the moving plate 53 to move along the slide rail 52. The connecting plate 54 is arranged on the moving plate 53 and connected to the pressure platform 6. When the PI film needs to be cut, the push-pull cylinder 51 can drive the moving plate 53 to move toward one side of the cutting mechanism 4 so that the pressure platform 6 receives the cut PI film, and vice versa.
[0048] like Figure 2 As shown, further, it also includes an upward push cylinder 55, which is arranged on the connecting plate 54, and the movable end of the upward push cylinder 55 is arranged upward and connected to the pressure platform 6, and the upward push cylinder 55 is used to adjust the height of the pressure platform 6. By adjusting the height of the pressure platform 6, it is possible to ensure good contact between the PI film and the FPC soft board during the hot pressing process, avoid the generation of bubbles, defects and other problems, and improve the pressing quality of the product.
[0049] like Figure 1 As shown, further, the pressing mechanism 8 includes a pressing cylinder 81, a pressing seat 82 and a rubber pad 83. The pressing cylinder 81 is connected to the top of the frame 2 through a mounting frame 84. The movable end of the pressing cylinder 81 is set downward and connected to the pressing seat 82. The rubber pad 83 is set at the bottom of the pressing seat 82. The pressing cylinder 81 is used to drive the pressing seat 82 to press against the pressure platform 6, so that the PI film on the pressure platform 6 is pressed against the FPC soft board. The rubber pad 83 has a certain degree of softness and elasticity, which can play a role in pressing protection to avoid scratches or damage to the surface of the PI film and the FPC soft board during the pressing process.
[0050] like Figure 1 and Figure 3 As shown, further, the film traction mechanism 3 includes an active rubber roller 31, a driven rubber roller 32, a driving motor 33 and a pulley transmission assembly 34. The driven rubber roller 32 and the active rubber roller 31 are respectively arranged on the frame 2 from top to bottom. A gap for the PI film to pass through is provided between the driven rubber roller 32 and the active rubber roller 31. The shaft ends of the driven rubber roller 32 and the active rubber roller 31 are respectively provided with gears 300 that are meshed and connected to each other. The output shaft of the driving motor 33 is connected to the active rubber roller 31 through the pulley transmission assembly 34. The driving motor 33 can drive the active rubber roller 31 to rotate through the pulley transmission assembly 34, and the driven rubber roller 32 can rotate following the active rubber roller 31. The PI film is introduced into the gap between the active rubber roller 31 and the driven rubber roller 32. As the active rubber roller 31 rotates, the PI film is clamped between the active rubber roller 31 and the driven rubber roller 32, thereby achieving stable traction and transportation of the PI film.
[0051] The reel 1 of the utility model can be wound up with the PI film for hot pressing with the FPC soft board, the film traction mechanism 3 can pull and extract the PI film from the reel 1, the sheet cutting mechanism 4 can cut the PI film into a sheet structure, the pressure platform 6 can adsorb and carry the PI film and the FPC soft board through vacuum adsorption force, and then the reciprocating mechanism 5 can drive the pressure platform 6 to move under the pressing mechanism 8, and the pressing mechanism 8 can provide a certain pressure on the pressure platform 6 to stably press the PI film on the pressure platform 6 and the FPC soft board. During the pressing process, the heating tube 7 can generate a certain amount of heat to partially melt the PI film so that it can be firmly bonded to the FPC soft board. The entire PI film unloading, cutting and hot pressing process are automatically performed, eliminating the tedious manual operation and greatly improving the pressing processing efficiency between the FPC soft board and the PI film.
[0052] As described above, the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.
Claims
1. An automatic hot pressing device for FPC flexible circuit board, characterized in that: It includes a coil drum, a frame, a film pulling mechanism, a sheet cutting mechanism, a reciprocating moving mechanism, a pressure platform, a heating tube and a pressing mechanism; The reel is arranged at the side end of the frame to be used for reeling up the PI film hot-pressed with the FPC soft board; The film pulling mechanism is arranged on the frame to pull the PI film out from the reel, and the sheet cutting mechanism is arranged at the discharge end of the film pulling mechanism to cut the PI film into a sheet structure; The pressure-bearing platform is arranged at the side end of the cutting mechanism, and a plurality of adsorption holes are arranged on the pressure-bearing platform for adsorbing the sheet-shaped PI film and the FPC soft board; The reciprocating mechanism is connected to the bottom of the pressure platform, and the reciprocating mechanism is used to drive the pressure platform to move horizontally along a first direction; The heating tube is arranged in the pressure platform to heat the PI film and the FPC soft board on the pressure platform. The pressing mechanism is arranged on the top of the frame and above the pressure platform. The pressing mechanism is used to press the PI film and the FPC soft board on the pressure platform.
2. The automatic hot pressing device for FPC flexible circuit board according to claim 1 is characterized in that: The cutting mechanism comprises a lifting assembly, a lifting plate, a cutting knife, a cutting seat and an elastic film pressing assembly; The cutting seat is arranged on the frame, and a channel groove for guiding and conveying the PI film is arranged on the cutting seat. The lifting assembly is connected with the lifting plate to drive the lifting plate to move up and down in the vertical direction. The cutter is arranged on the lifting plate, and the cutter can cut the PI film on the cutting seat as the lifting plate moves up and down; Two groups of the elastic film pressing components are located on the lifting plates on both sides of the cutter. When the cutter is cutting the PI film, the elastic film pressing components are used to apply a pressing force to the PI film.
3. The automatic hot pressing device for FPC flexible circuit board according to claim 2 is characterized in that: The elastic film pressing assembly comprises a guide rod, a spring and a pressing block; The guide rod passes through the lifting plate from top to bottom and is connected to the pressing block. The spring is sleeved on the guide rod between the lifting plate and the pressing block. The spring is used to apply a downward elastic force to the pressing block.
4. The automatic hot pressing device for FPC flexible circuit board according to claim 2 is characterized in that: The lifting assembly includes a rotating motor, an eccentric sleeve, a rectangular frame, a guide column and a linear bearing; The linear bearings are arranged on the frames on both sides of the cutting seat, and the guide posts pass through the linear bearings from bottom to top and are connected to the lifting plate; The rectangular frame is connected to the bottom of the guide column, the eccentric sleeve is located in the rectangular frame, and the rectangular frame can be reciprocated and lifted as the eccentric sleeve rotates; The output shaft of the rotating motor is connected to the eccentric sleeve to drive the eccentric sleeve to rotate.
5. The automatic hot pressing device for FPC flexible circuit board according to claim 1, characterized in that: The reciprocating mechanism includes a push-pull cylinder, a slide rail, a moving plate and a connecting plate; The slide rail is horizontally arranged on the frame along a first direction, the movable plate is slidably connected to the slide rail through a slider, the movable end of the push-pull cylinder is connected to the movable plate to drive the movable plate to move along the slide rail, and the connecting plate is arranged on the movable plate and connected to the pressure platform.
6. The automatic hot pressing device for FPC flexible circuit board according to claim 5, characterized in that: It also includes an upward push cylinder, which is arranged on the connecting plate, with the movable end of the upward push cylinder arranged upward and connected to the pressure platform, and the upward push cylinder is used to adjust the height of the pressure platform.
7. The automatic hot pressing device for FPC flexible circuit board according to claim 1, characterized in that: The pressing mechanism comprises a pressing cylinder, a pressing seat and a rubber pad; The pressing cylinder is connected to the top of the frame through a mounting frame, the movable end of the pressing cylinder is set downward and connected to the pressing seat, the rubber pad is arranged at the bottom of the pressing seat, and the pressing cylinder is used to drive the pressing seat to be pressed tightly on the pressure platform so that the PI film on the pressure platform can be pressed with the FPC soft board.
8. The automatic hot pressing device for FPC flexible circuit board according to claim 1, characterized in that: The film traction mechanism includes an active rubber roller, a driven rubber roller, a driving motor and a pulley transmission assembly; The driven rubber roller and the active rubber roller are respectively arranged on the frame, and a gap is provided between the driven rubber roller and the active rubber roller for the PI film to pass through; The shaft ends of the driven rubber roller and the active rubber roller are respectively provided with gears meshing with each other, and the output shaft of the driving motor is connected with the active rubber roller through the pulley transmission assembly.
