Chemical cleaning equipment for semiconductor display substrate

Abstract

The utility model relates to the technical field of semiconductor substrates, in particular to chemical cleaning equipment for a semiconductor display substrate, which comprises a cleaning box component used for soaking and cleaning the semiconductor display substrate, an up-down moving component is connected below one side of the cleaning box component, and a pushing component is connected above a base in the up-down moving component; the up-down moving assembly is connected with the clamping assembly through a connecting rod; a supporting assembly is arranged in a U-shaped frame in the clamping assembly, and one end of the supporting assembly is connected with the inner wall of a cleaning box in the cleaning box assembly. According to the chemical cleaning equipment for the semiconductor display substrate, the cleaning box assembly, the up-down moving assembly, the pushing assembly, the clamping assembly and the supporting assembly are installed in a combined mode, so that the semiconductor display substrate does not need to be stacked in a cleaning tank, the substrate is convenient to take out after being cleaned, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor substrates, in particular to chemical cleaning equipment for semiconductor display substrates. Background Art

[0002] Semiconductor display substrates need to go through multiple cleaning processes during the manufacturing process, such as chemical cleaning, ultrasonic cleaning, and ultra-high pressure water cleaning. Chemical cleaning is a cleaning method that immerses the semiconductor display substrate in chemical reagents for a period of time to remove dirt on the surface of the semiconductor display substrate. However, the existing chemical cleaning technology for semiconductor display substrates usually stacks multiple semiconductor display substrates and places a pad between two adjacent semiconductor display substrates to facilitate the contact between the chemical reagent and the semiconductor substrate.

[0003] When cleaning semiconductor display substrates in this way, it is necessary not only to stack the semiconductor display substrates one by one in the cleaning tank, but also to place a pad between two adjacent semiconductor display substrates. After cleaning, the semiconductor display substrates and the pads need to be taken out of the cleaning tank one by one, which is time-consuming and labor-intensive, and ultimately leads to low cleaning efficiency. Utility Model Content

[0004] The utility model aims to provide a chemical cleaning device for semiconductor display substrates in view of the defects and shortcomings of the prior art.

[0005] The utility model discloses a chemical cleaning device for semiconductor display substrates, which comprises a cleaning box assembly for soaking and cleaning semiconductor display substrates, wherein an up-and-down moving assembly is connected to the lower part of one side of the cleaning box assembly, and a pushing assembly is connected to the upper part of the base of the up-and-down moving assembly; the up-and-down moving assembly is connected to the clamping assembly through a connecting rod; a supporting assembly is arranged inside a U-shaped frame in the clamping assembly, and one end of the supporting assembly is connected to the inner wall of the cleaning box in the cleaning box assembly.

[0006] Furthermore, the cleaning box assembly includes a cleaning box, a support plate is connected to the upper side of the cleaning box, a filter is arranged in the middle of the support plate; a water inlet and a water outlet are arranged in sequence from top to bottom on one side of the cleaning box.

[0007] Furthermore, the up and down moving component includes a base connected to the side of the cleaning box, the base is a hollow structure, a power supply is arranged inside, a first electric telescopic rod is connected above it, and a connecting rod is connected to the side of the first electric telescopic rod, and the connecting rod is an L-shaped structure.

[0008] Furthermore, the pushing assembly includes a connecting column connected above the base, a second electric telescopic rod is arranged on the side of the connecting column, and a top plate is connected to the end of the second electric telescopic rod opposite to the connecting column.

[0009] Furthermore, the clamping assembly includes a U-shaped frame connected under the connecting rod, the open end of the U-shaped frame is connected to the main board, a square hole is opened in the middle position of the U-shaped frame, a first movable plate is arranged in the square hole and slides with the first movable plate in a clearance. The periphery of the first movable plate is fixedly connected to a second movable plate perpendicular to the first movable plate, one end of the first movable plate is connected to a third movable plate, and the end of the first movable plate opposite to the third movable plate passes through the main board and slides with the first movable plate in a clearance. Two rows of connecting plates are connected to the opposite side of the main board and pads are arranged on the opposite surfaces of the two rows of connecting plates.

[0010] Furthermore, the support assembly includes two L-shaped plates, one end of which is connected to the inner wall of the cleaning box.

[0011] After adopting the above structure, the beneficial effects of the utility model are as follows: the chemical cleaning equipment for a semiconductor display substrate described in the utility model adopts a combination installation of a cleaning box assembly, an up and down moving assembly, a pushing assembly, a clamping assembly and a supporting assembly, so that the chemical cleaning equipment for the semiconductor display substrate does not need to stack the semiconductor display substrate in the cleaning tank, and the substrate can be easily taken out after cleaning is completed, thereby improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application, but do not constitute an improper limitation of the present invention. In the drawings:

[0013] Figure 1 It is a schematic diagram of the structure of the clamping assembly of the utility model when it is immersed in the cleaning box;

[0014] Figure 2 It is a schematic diagram of the structure when the clamping assembly in the utility model is taken out of the cleaning box;

[0015] Figure 3 It is a structural schematic diagram of the clamping assembly in the utility model;

[0016] Figure 4 It is a structural schematic diagram of the clamping assembly and the supporting assembly in the utility model;

[0017] Figure 5 It is a structural schematic diagram of the support assembly in the utility model;

[0018] Description of reference numerals:

[0019] Cleaning box 101; support plate 102; water inlet 103; water outlet 104; filter screen 105;

[0020] Base 201; first electric telescopic rod 202; connecting rod 203;

[0021] Main board 301; connecting board 302; U-shaped frame 303; first movable board 304; second movable board 305; third movable board 306; gasket 307;

[0022] Connecting column 401; second electric telescopic rod 402; top plate 403;

[0023] L-shaped plate 501. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0026] like Figure 1-Figure 5 As shown, a chemical cleaning device for a semiconductor display substrate described in this specific embodiment includes a cleaning box assembly for soaking and cleaning the semiconductor display substrate, an up-and-down moving assembly is connected to the lower side of one side of the cleaning box assembly, and a pushing assembly is connected to the upper side of the base 201 in the up-and-down moving assembly; the up-and-down moving assembly is connected to the clamping assembly through a connecting rod 203; a supporting assembly is arranged inside the U-shaped frame 303 in the clamping assembly, and one end of the supporting assembly is connected to the inner wall of the cleaning box 101 in the cleaning box assembly.

[0027] Furthermore, the cleaning box assembly includes a cleaning box 101, a support plate 102 is connected to the upper side of the cleaning box 101, a filter screen 105 is arranged in the middle of the support plate 102; a water inlet 103 and a water outlet 104 are arranged on one side of the cleaning box 101 from top to bottom.

[0028] Furthermore, the up and down moving component includes a base 201 connected to the side of the cleaning box 101, the base 201 is a hollow structure, a power supply is arranged inside, a first electric telescopic rod 202 is connected above it, and a connecting rod 203 is connected to the side of the first electric telescopic rod 202, and the connecting rod 203 is an L-shaped structure.

[0029] Furthermore, the pushing assembly includes a connecting column 401 connected above the base 201 , a second electric telescopic rod 402 is provided on the side of the connecting column 401 , and a top plate 403 is connected to the opposite end of the second electric telescopic rod 402 to the connecting column 401 .

[0030] Furthermore, the clamping assembly includes a U-shaped frame 303 connected below the connecting rod 203, the open end of the U-shaped frame 303 is connected to the main board 301, a square hole is opened in the middle position of the U-shaped frame 303, a first movable plate 304 is arranged in the square hole to slide with the first movable plate 304, the periphery of the first movable plate 304 is fixedly connected to the second movable plate 305 perpendicular to the first movable plate 304, one end of the first movable plate 304 is connected to the third movable plate 306, the end of the first movable plate 304 opposite to the third movable plate 306 passes through the main board 301 and slides with the main board 301; two rows of connecting plates 302 are connected to the opposite side of the main board 301 and gaskets 307 are arranged on the opposite surfaces of the two rows of connecting plates 302.

[0031] Furthermore, the support assembly includes two L-shaped plates 501 , one end of which is connected to the inner wall of the cleaning box 101 .

[0032] The working principle of the utility model is specifically described as follows:

[0033] In this design, when the chemical cleaning device for the semiconductor display substrate is working, the semiconductor display substrate to be cleaned is first placed between the pads 307 on the plurality of connecting plates 302;

[0034] When the semiconductor display substrate is placed, the first electric telescopic rod 202 is started by power supply, and the first electric telescopic rod 202 moves downward and drives the U-shaped frame 303 to move downward through the connecting rod 203, and the U-shaped frame 303 moves downward and drives the main board 301 to move downward, and the main board 301 moves downward and drives the connecting plate 302 connected thereto to move downward, and the connecting plate 302 moves downward and drives the semiconductor display substrate to move downward through the pad 307; finally, all the semiconductor display substrates are immersed in the chemical reagent in the cleaning box 101;

[0035] When the U-shaped frame 303 moves downward, the L-shaped plate 501 below it faces the gap between the second movable plate 305 and the main plate 301. When the U-shaped frame 303 moves downward to a certain height, the bottom end of the L-shaped plate 501 touches the U-shaped frame 303 and stops moving. At this time, the L-shaped plate 501 plays a supporting role and fixes the position of the second movable plate 305, thereby limiting the movement of the first movable plate 304.

[0036] After the semiconductor display substrate is soaked for a period of time, the first electric telescopic rod 202 is started by power supply to take out the clamping assembly. When the clamping assembly moves to the top of the cleaning box 101, the second electric telescopic rod 402 is started by power supply. The second electric telescopic rod 402 pushes the third movable plate 306 in the clamping assembly through the top plate 403. After the third movable plate 306 moves, it drives the first movable plate 304 to move, and pushes out the semiconductor display substrate clamped between the pads 307. The semiconductor display substrate is pushed onto the filter screen 105 on the support plate 102, and the residual chemical liquid flows back from the filter screen 105 to the cleaning box 101; the chemical cleaning process of the semiconductor display substrate is completed.

[0037] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chemical cleaning device for semiconductor display substrate, characterized in that: It comprises a cleaning box assembly for soaking and cleaning a semiconductor display substrate, wherein a vertical moving assembly is connected to the lower side of one side of the cleaning box assembly, and a pushing assembly is connected to the upper side of a base (201) in the vertical moving assembly; the vertical moving assembly is connected to a clamping assembly via a connecting rod (203); a supporting assembly is arranged inside a U-shaped frame (303) in the clamping assembly, and one end of the supporting assembly is connected to the inner wall of a cleaning box (101) in the cleaning box assembly.

2. The chemical cleaning device for semiconductor display substrate according to claim 1, characterized in that: The cleaning box assembly comprises a cleaning box (101), wherein an upper side of the cleaning box (101) is connected to a support plate (102), and a filter screen (105) is arranged in the middle of the support plate (102); and a water inlet (103) and a water outlet (104) are arranged in sequence from top to bottom on one side of the cleaning box (101).

3. The chemical cleaning device for semiconductor display substrate according to claim 1, characterized in that: The up-and-down moving assembly comprises a base (201) connected to the side of the cleaning box (101); the base (201) is a hollow structure, a power source is arranged inside, a first electric telescopic rod (202) is connected above the base, a connecting rod (203) is connected to the side of the first electric telescopic rod (202), and the connecting rod (203) is an L-shaped structure.

4. The chemical cleaning device for semiconductor display substrate according to claim 1, characterized in that: The push assembly comprises a connecting column (401) connected above the base (201), a second electric telescopic rod (402) is arranged on the side of the connecting column (401), and a top plate (403) is connected to the end of the second electric telescopic rod (402) opposite to the connecting column (401).

5. The chemical cleaning device for semiconductor display substrate according to claim 1, characterized in that: The clamping assembly comprises a U-shaped frame (303) connected below the connecting rod (203), the open end of the U-shaped frame (303) is connected to the main board (301), a square hole is opened in the middle of the U-shaped frame (303), a first movable plate (304) is arranged in the square hole to slide with the first movable plate (304), a second movable plate (305) perpendicular to the first movable plate (304) is fixedly connected to the periphery of the first movable plate (304), a third movable plate (306) is connected to one end of the first movable plate (304), and the end of the first movable plate (304) opposite to the third movable plate (306) passes through the main board (301) to slide with the first movable plate (301); two rows of connecting plates (302) are connected to the side of the main board (301) opposite to the U-shaped frame (303), and gaskets (307) are arranged on the opposite surfaces of the two rows of connecting plates (302).

6. The chemical cleaning device for semiconductor display substrate according to claim 1, characterized in that: The support assembly comprises two L-shaped plates (501) one end of which is connected to the inner wall of the cleaning box (101).

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