Sensor test calibration device

Abstract

The utility model relates to a sensor test calibration device, which belongs to the technical field of sensor test calibration and comprises a main control board connected with a sub-control board, an inspection instrument, an incubator and a PC (Personal Computer). The sub-control board is connected with a carrier plate, the carrier plate is arranged in the incubator, and a test seat for mounting a temperature sensor to be tested is integrated on the carrier plate; the inspection instrument is connected with a platinum resistor, the platinum resistor is arranged in an incubator, a top cover is arranged at the top end of the incubator, an avoiding hole is formed in the edge of the top cover, a telescopic mechanism which stretches out and draws back in the vertical direction is arranged at the bottom end of the incubator, and a clamping plate groove is formed in the upper end of the telescopic mechanism. The initial state of the telescopic part is a contraction state, and the mounting plate is located at the upper end opening of the incubator, so that the carrier plate is conveniently mounted in the plate clamping groove, the carrier plate is orderly placed, a switch integrated on the outer side wall of the incubator is pressed, the electromagnetic valve is powered on, the telescopic part is controlled to extend, the mounting plate is driven to move downwards, an operator does not need to stretch into the incubator to mount the carrier plate, and operation is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of sensor testing and calibration, in particular to a sensor testing and calibration device. Background Art

[0002] A sensor is a device that converts sensory signals into electrical signals that can be used for information processing, including temperature sensors, pressure sensors, photoelectric sensors, etc.

[0003] A temperature sensor is a device or sensor used to measure and monitor the temperature of an object or environment. It is able to convert temperature into an electrical signal or other types of output signals for temperature measurement, monitoring and control. Temperature sensors are used in a variety of fields and applications, including industrial production, scientific research, environmental monitoring, medical equipment, electronic equipment, etc. They play an important role in many systems and devices, such as temperature control systems, climate control systems, cooling systems, etc. Temperature sensors play a key role in various applications, helping to measure and control temperature and keep the system running and safe.

[0004] In practical applications, the data output by temperature sensors is often affected by environmental, physical, electronic and other factors, resulting in errors. Temperature sensors usually need to be calibrated to ensure the accuracy and reliability of their measurement results. Calibration is a calibration process that determines the difference between the sensor output and the actual temperature by comparing it with a known precise temperature value, and makes corrections to improve the precision and accuracy of the sensor's output data.

[0005] When calibrating a temperature sensor, the sensor is usually placed in a temperature chamber. In order to ensure that the spacing between sensors is appropriate, a calibration rack or bracket is used to organize the placement of the sensors. The calibration rack or bracket is usually placed in the temperature chamber, which is inconvenient to install and disassemble and inconvenient to use. Utility Model Content

[0006] The utility model provides a sensor testing and calibration device, comprising a main control board, the main control board is connected with a sub-control board, a patrol meter, a temperature box and a PC;

[0007] The sub-control board is connected to a carrier board, which is placed in a temperature box. A test socket for installing a temperature sensor to be tested is integrated on the carrier board;

[0008] The inspection instrument is connected to a platinum resistor, which is placed in a temperature box;

[0009] A top cover is arranged at the top of the thermostat, and a avoidance hole is opened at the edge of the top cover;

[0010] A telescopic mechanism that can be telescoped in a vertical direction is arranged at the bottom end of the temperature box, and a card slot for fixing a carrier plate is arranged at the upper end of the telescopic mechanism.

[0011] Further, the telescopic mechanism includes a mounting plate and a fixed plate fixedly connected to the bottom end of the incubator, a card slot is opened at the upper end of the mounting plate, one end of the fixed plate is provided with a first track extending in the horizontal direction, and the other end of the fixed plate is connected with a telescopic member arranged in the horizontal direction;

[0012] A second track extending in the horizontal direction is provided at the lower part of the mounting plate, and a sliding member is slidably connected to the second track;

[0013] The sliding member includes a first sliding part and a second sliding part, the middle parts of the first sliding part and the second sliding part are rotatably connected through a hinge, the upper ends of the first sliding part and the second sliding part are both slidably connected to the second track, the lower end of the first sliding part is rotatably connected to the slider, and the lower end of the slider is slidably connected to the first track;

[0014] The output end of the telescopic member is connected to the slider.

[0015] Furthermore, a switch for controlling the extension and retraction of the telescopic member is integrated into the side wall of the incubator.

[0016] Further, the main control board is connected to a test power supply;

[0017] The main control board includes MCU, USB protocol stack chip, Ethernet protocol stack chip and serial port to USB communication chip;

[0018] The USB protocol stack chip, the Ethernet protocol stack chip and the serial port to USB communication chip are all connected to the MCU.

[0019] Furthermore, the USB protocol stack chip is connected to a first USB interface, and the first USB interface is connected to the inspection instrument signal.

[0020] Furthermore, the Ethernet protocol stack chip is connected to a LAN port, and the LAN port is connected to the temperature box signal.

[0021] Furthermore, the serial port to USB communication chip is connected to a second USB interface, and the second USB interface is connected to the PC signal.

[0022] Furthermore, the main control board also includes an SPI host interface, and the sub-control board includes an SPI slave interface and a sub-MCU;

[0023] The sub-MCU is connected to the MCU signal through the SPI slave interface and the SPI master interface;

[0024] The SPI slave interface and the SPI master interface are connected via cable signals.

[0025] The beneficial effects of the utility model are as follows: the initial state of the telescopic member is a contracted state, and the mounting plate is located at the upper port of the temperature box, which facilitates the mounting of the carrier plate in the card slot, and the carrier plates are neatly arranged;

[0026] By pressing the switch integrated in the outer wall of the temperature box, the solenoid valve is energized, controlling the extension of the telescopic part, driving the mounting plate to move downward, and the operator does not need to reach into the temperature box to install the carrier plate, which is convenient to operate.

[0027] These and other purposes, features and advantages of the present invention are fully reflected in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The schematic diagram of the structure in the temperature box of the sensor testing and calibration device of the utility model is shown.

[0029] Figure 2 The schematic diagram of the structure of the sensor testing and calibration device of the utility model is shown.

[0030] Figure markings: 1-main control board, 101-MCU, 1011-SPI host interface, 102-USB protocol stack chip, 1021-first USB interface, 103-USB protocol stack chip, 1031-LAN network port, 104-serial port to USB communication chip, 1041-second USB interface, 2-sub-control board, 201-SPI slave interface, 202-sub-MCU, 3-inspection instrument, 4-temperature box, 5-PC, 6-carrier board, 7-platinum resistor, 8-telescopic mechanism, 9-card slot, 10-second track, 11-slider, 12-telescopic member, 1301-first sliding part, 1302-second sliding part, 14-mounting plate, 15-first track, 16-fixed plate. DETAILED DESCRIPTION

[0031] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0032] Those skilled in the art should understand that, in the disclosure of the specification, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0033] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0034] refer to Figure 1 to Figure 2 A sensor testing and calibration device according to a preferred embodiment of the utility model will be described in detail below. The calibration device includes a main control board 1, the main control board 1 is connected to a sub-control board 2, a patrol meter 3, a temperature box 4 and a PC5, the sub-control board 2 is connected to a carrier board 6, the patrol meter 3 is connected to a platinum resistor 7, and the carrier board 6 and the platinum resistor 7 are both placed in the temperature box 4.

[0035] In order to improve the test and calibration efficiency of the temperature sensor, the main control board 1 is usually connected to several sub-control boards 2, each of which has a carrier board 6, on which a test socket for installing the temperature sensor to be tested is integrated, and the carrier board 6 is placed in the temperature box 4. A top cover is provided at the top of the temperature box 4, and a clearance groove is provided at the edge of the top cover. The connection line of the carrier board 6 passes through the clearance groove and is connected to the sub-control board 2.

[0036] The bottom end of the thermostat 4 is provided with a telescopic mechanism 8 that is telescopic in the vertical direction. The telescopic mechanism 8 includes a mounting plate 14 and a fixed plate 16 fixedly connected to the bottom end of the thermostat 4. One end of the fixed plate 16 is provided with a first track 15 extending in the horizontal direction. The other end of the fixed plate 16 is connected with a telescopic member 12 that is arranged in the horizontal direction. The telescopic member 12 is telescopic in the horizontal direction, and the telescopic member 12 is implemented as a cylinder. The outer wall of the thermostat 4 is integrated with a switch button of a solenoid valve that controls the cylinder. The solenoid valve is controlled by the switch. When the cylinder needs to be extended, the switch is turned on to energize the solenoid valve, thereby extending the cylinder. When the cylinder needs to be retracted, the switch is turned off to cut off the power, so that the solenoid valve is closed, and the cylinder will retract.

[0037] The output end of the telescopic member 12 is connected to the slider 11 , and the lower end of the slider 11 is slidably connected to the first track 15 via a pulley.

[0038] The upper part of the mounting plate 14 is provided with card slots 9 for fixing the carrier plate 6 at equal intervals. The card slots 9 are parallel to the wide side of the temperature box 4 and are used to clamp the carrier plate 6 and fix the carrier plate 6 to the upper end of the mounting plate 14 at equal intervals. The lower part of the mounting plate 14 is provided with a second track 10 extending in the horizontal direction, and the second track 10 is slidably connected with a sliding member. The sliding member includes a first sliding part 1301 and a second sliding part 1302. The middle parts of the first sliding part 1301 and the second sliding part 1302 are rotatably connected by a hinge. The upper ends of the first sliding part 1301 and the second sliding part 1302 are both slidably connected to the second track 10 through pulleys, and the lower end of the first sliding part 1301 is rotatably connected to the slider 11 through a bearing.

[0039] The inspection instrument 3 is connected with a platinum resistor 7, which is placed in the temperature box 4. The connecting wire of the platinum resistor 7 passes through the avoidance groove and then connects to the inspection instrument 3 to avoid a cluttered wire harness.

[0040] The main control board 1 is connected to a test power supply, and includes an MCU 101, a USB protocol stack chip 102, an Ethernet protocol stack chip 103, and a serial-to-USB communication chip 104. The USB protocol stack chip 102, the Ethernet protocol stack chip 103, and the serial-to-USB communication chip 104 are all connected to the MCU 101 signal. The sub-control board 2, the inspection instrument 3, the temperature box 4, and the PC 5 are all connected to the main control board 1.

[0041] The USB protocol stack chip 102 is connected to the first USB interface 1021, and the first USB interface 1021 is connected to the inspection meter 3 by signal. The USB protocol stack chip 102 is connected to the inspection meter 3 by signal through the first USB interface 1021; the MCU 101 communicates with the inspection meter 3 through the USB protocol stack chip 102 and the first USB interface 1021.

[0042] The Ethernet protocol stack chip 103 is connected to a LAN port 1031 , which is connected to the incubator 4 , and the LAN port 1031 is signal-connected to the incubator 4 . The MCU 101 communicates with the incubator 4 via the Ethernet protocol stack chip 103 and the LAN port 1031 .

[0043] The serial port to USB communication chip 104 is connected to the second USB interface 1041, and the second USB interface 1041 is connected to the PC 5 signal. The MCU 101 communicates with the PC 5 computer host through the serial port to USB communication chip 104 and the second USB interface 1041.

[0044] The main control board 1 also includes an SPI host interface 1011, and the sub-control board 2 includes an SPI slave interface 201 and a sub-MCU 202. The SPI slave interface 201 is connected to the SPI host interface 1011 via a cable signal. The sub-MCU 202 communicates with the MCU 101 via the SPI slave interface 201 and the SPI host interface 1011.

[0045] Working principle and workflow:

[0046] The initial state of the telescopic member 12 is the contracted state, and the mounting plate 14 is close to the upper port of the temperature box 4. When testing the temperature sensor, the carrier plate 6 is installed in the card slot 9, the platinum resistor 7 is placed in the temperature box 4, and the top cover of the temperature box 4 is closed, and the connecting wires of the platinum resistor 7 and the carrier plate 6 are led out from the avoidance slot. Press the switch integrated in the outer wall of the temperature box 4, the solenoid valve is energized, and the telescopic member 12 is controlled to extend, and the telescopic member 12 drives the slider 11 to move along the first track 15, and the slider 11 drives the first sliding part 1301 to move, and the angle between the first sliding part 1301 and the second sliding part 1302 becomes larger, and the upper ends of the first sliding part 1301 and the second sliding part 1302 move along the second track 10, and the vertical direction of the first sliding part 1301 and the second sliding part 1302 becomes shorter, and the horizontal distance becomes longer, driving the mounting plate 14 to move downward.

[0047] The temperature sensor is installed on the carrier board 6, which is located in the temperature box 4. The MCU101 communicates with the temperature box 4 through the Ethernet protocol stack chip 103 and the LAN network port 1031. The MCU101 can control the temperature in the temperature box 4, and transmit the detected temperature of the temperature box 4 to the sub-MCU202 of the sub-control board 2 through the carrier board 6, and transmit it to the MCU101 of the main control board 1 through the SPI slave interface 201 and the SPI host interface 1011. At the same time, the platinum resistor 7 placed in the temperature box 4 is connected to the inspection instrument 3, and the MCU101 communicates with the inspection instrument 3 through the USB protocol stack chip 102 and the first USB interface 1021. The MCU101 of the main control board 2 communicates with the PC5 computer host through the serial port to USB communication chip 104 and the second USB interface 1041, and can burn in the calibration program.

[0048] Calibration is divided into two steps: temperature rotation and temperature translation, among which temperature translation is further divided into coarse adjustment and fine adjustment.

[0049] Temperature rotation is to measure the temperature with the chip at 0℃ and 85℃ respectively, and calculate the chip temperature error at the two temperatures respectively. The temperature error ΔT = chip temperature measurement result - temperature value of platinum resistance. After calculating the temperature error at 0℃ and 85℃, the position of the fuse to be adjusted is located according to the size of the rotation, and then the corresponding fuse is burned out to complete the adjustment.

[0050] Temperature translation is to measure the temperature with the chip at 25°C, and calculate the chip temperature error at 25°C. The temperature error ΔT = chip temperature measurement result - temperature value of platinum resistance. The temperature translation lookup table is used to find the closest condition. First, a rough adjustment calculation is performed, and then a fine adjustment calculation is performed. Then, the corresponding fuse is adjusted according to the table. After completing the rotation and translation fuse adjustment, the temperature of the chip can be read and compared with the temperature of the temperature acquisition instrument to determine the temperature error of the calibrated product and determine whether the calibration is successful. After the test is completed, turn off the switch, turn off the power, close the solenoid valve, shrink the telescopic member 12, and move the slider 11 to the end close to the telescopic member 12, driving the mounting plate 14 to move upward, thereby driving the carrier plate 6 to move upward, making it easy to remove the carrier plate 6.

[0051] In addition, each part of the telescopic mechanism 8 is covered with an insulating layer to prevent electric shock.

[0052] It should be noted that the terms "first, second" in the present invention are only used for descriptive purposes and do not indicate any order. They cannot be understood as indicating or implying relative importance. These terms can be interpreted as names.

[0053] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A sensor testing and calibration device, characterized in that: The invention comprises a main control board (1), wherein the main control board (1) is connected to a sub-control board (2), a patrol meter (3), a temperature box (4) and a PC (5); The sub-control board (2) is connected to a carrier board (6), the carrier board (6) is placed in the temperature box (4), and a test socket for mounting a temperature sensor to be tested is integrated on the carrier board (6); The inspection instrument (3) is connected to a platinum resistor (7), and the platinum resistor (7) is placed in a temperature box (4); A top cover is arranged at the top of the temperature box (4), and an avoidance groove is arranged at the edge of the top cover; A telescopic mechanism (8) that is telescopic in the vertical direction is provided at the bottom end of the temperature box (4), and a card slot (9) for fixing the carrier plate (6) is provided at the upper end of the telescopic mechanism (8).

2. The sensor testing and calibration device according to claim 1, characterized in that: The telescopic mechanism (8) comprises a mounting plate (14) and a fixing plate (16) fixedly connected to the bottom end of the temperature box (4); a card slot (9) is provided at the upper end of the mounting plate (14); one end of the fixing plate (16) is provided with a first track (15) extending in a horizontal direction; and the other end of the fixing plate (16) is connected with a telescopic member (12) arranged in a horizontal direction; A second track (10) extending in the horizontal direction is provided at the lower part of the mounting plate (14), and a sliding member is slidably connected to the second track (10); The sliding member comprises a first sliding part (1301) and a second sliding part (1302); the middle parts of the first sliding part (1301) and the second sliding part (1302) are rotatably connected via a hinge; the upper ends of the first sliding part (1301) and the second sliding part (1302) are both slidably connected to the second track (10); the lower end of the first sliding part (1301) is rotatably connected to a slider (11); and the lower end of the slider (11) is slidably connected to the first track (15); The output end of the telescopic member (12) is connected to the slider (11).

3. The sensor testing and calibration device according to claim 2, characterized in that: A switch for controlling the extension and retraction of the telescopic member (12) is integrated on the side wall of the temperature box (4).

4. The sensor testing and calibration device according to claim 1, characterized in that: The main control board (1) is connected to a test power supply; The main control board (1) comprises an MCU (101), a USB protocol stack chip (102), an Ethernet protocol stack chip (103) and a serial port to USB communication chip (104); The USB protocol stack chip (102), the Ethernet protocol stack chip (103) and the serial port to USB communication chip (104) are all connected to the MCU (101).

5. The sensor testing and calibration device according to claim 4, characterized in that: The USB protocol stack chip (102) is connected to a first USB interface (1021), and the first USB interface (1021) is signal-connected to the inspection instrument (3).

6. The sensor testing and calibration device according to claim 4, characterized in that: The Ethernet protocol stack chip (103) is connected to a LAN network port (1031), and the LAN network port (1031) is signal-connected to the incubator (4).

7. The sensor testing and calibration device according to claim 4, characterized in that: The serial port to USB communication chip (104) is connected to a second USB interface (1041), and the second USB interface (1041) is signal-connected to the PC (5).

8. The sensor testing and calibration device according to any one of claims 4 to 7, characterized in that: The main control board (1) further comprises an SPI host interface (1011), and the sub-control board (2) comprises an SPI slave interface (201) and a sub-MCU (202); The sub-MCU (202) is connected to the MCU (101) through the SPI slave interface (201) and the SPI host interface (1011); The SPI slave interface (201) is connected to the SPI host interface (1011) via a cable signal.

Images