MCU with multiple serial ports

Abstract

The utility model relates to the technical field of MCUs, and discloses an MCU with multiple serial ports. The MCU with the multiple serial ports comprises a circuit board, a main MCU is fixedly connected to one side of the upper portion of the circuit board, a vertical cooling fin is fixedly connected to the outer side of the main MCU, a connecting piece is fixedly connected to one side of the vertical cooling fin, a bottom piece is fixedly connected to one side of the connecting piece, and an attaching piece is fixedly connected to the upper portion of the bottom piece. The bottom sheet is connected above the circuit board, the upper portion of the bottom sheet is fixedly connected with the attaching sheet, the MCU structure is installed above the attaching sheet, and the attaching sheet and the bottom sheet are different in height, so that a certain distance exists between the bottom sheet and the MCU structure, heat dissipation of the MCU structure is facilitated, the situation that the multi-serial-port MCU chip is damaged is avoided, and the service life of the multi-serial-port MCU chip is prolonged. According to the MCU with the multi-path serial port, the use effect of the MCU chip is improved, the information resource processing work is convenient, meanwhile, the situation that MCU connection is unstable is avoided, and the use effect of the MCU with the multi-path serial port is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of MCU, in particular to an MCU with multiple serial ports. Background Art

[0002] A microcontroller unit (MCU), also known as a single-chip microcomputer or a single-chip microcomputer, appropriately reduces the frequency and specifications of the central processing unit (CPU), and integrates peripheral interfaces such as memory, timer, USB, A / D conversion, UART, PLC, DMA, and even LCD driver circuits on a single chip to form a chip-level computer, which can perform different combination controls for different application scenarios.

[0003] The existing Chinese utility model patent with reference announcement number CN201936300U discloses a USB extended multi-channel serial port device. The utility model USB extended multi-channel serial port device comprises a USB interface circuit (2), a plurality of serial interfaces and a single chip microcomputer (1) connected between the USB interface circuit (2) and the plurality of serial interfaces. The 1-2 serial ports inherent to the single chip microcomputer (1) are respectively connected to a serial interface. The single chip microcomputer (1) also has at least two serial ports implemented by software simulation on the general programmable input and output port GPIO pins. The serial ports implemented by software simulation are respectively connected to a serial interface. The utility model implements the USB extended multi-channel serial port based on the hardware and software of the single chip microcomputer, has the advantages of simple circuit and low cost, and has a wide range of applications in actual processes.

[0004] The MCU chip with multiple serial ports is installed in the device for information and other resource processing, which may cause the device to heat up during operation, easily causing damage to the MCU chip with multiple serial ports, reducing the use effect of the MCU chip and affecting the information resource processing. In addition, the MCU structure may shake during installation and use, resulting in unstable connection. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides an MCU with multiple serial ports, which has the advantages of increasing the use of the heat dissipation function of the MCU chip with multiple serial ports, and solves the above technical problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solution: the MCU with multiple serial ports includes a circuit board for installation and use, a main MCU for connection is fixedly connected to one side of the upper side of the circuit board, a vertical heat sink for heat dissipation of the MCU structure is fixedly connected to the outer side of the main MCU, a connecting piece for connection and use is fixedly connected to one side of the vertical heat sink, a bottom plate for installation is fixedly connected to one side of the connecting piece, and a bonding piece for use in conjunction with the vertical heat sink is fixedly connected to the top of the bottom plate.

[0009] As a preferred technical solution of the utility model, a power interface is fixedly connected to the top of the circuit board, and a conveying module is fixedly connected to one side of the power interface; the power interface is used to connect and cooperate with an external power supply.

[0010] As the preferred technical solution of the utility model, a single-chip body is fixedly connected to the upper edge of one side of the circuit board, a single-chip interface is fixedly connected to one side of the single-chip body, and the upper part of the circuit board is fixedly connected below the single-chip interface; the single-chip body and the MCU structure of the multi-channel serial port are connected and matched for use.

[0011] As a preferred technical solution of the utility model, a right MCU is fixedly connected to one side of the main MCU, and a left MCU is fixedly connected to the other side of the main MCU; the right MCU and the left MCU are both installed on the upper side of the circuit board.

[0012] As a preferred technical solution of the utility model, one side of the conveying module is fixedly connected to the main MCU, and the two ends of the conveying module are fixedly connected to the right MCU and the left MCU; the conveying module and the multi-channel serial port MCU structure are connected and used in coordination.

[0013] As the preferred technical solution of the utility model, the bottom plate is fixedly connected to the upper side of the circuit board, the connecting plate is fixedly connected to the bottom of the main MCU, and the vertical heat sink is in an "L" shape; the vertical heat sink and the connecting plate have the same structural shape.

[0014] As a preferred technical solution of the utility model, the main MCU is fixedly connected to the top of the bonding sheet, and the bottom of the vertical heat sink is fixedly connected to the top of the circuit board; the main MCU and the right MCU, as well as the left MCU are connected to the same heat dissipation structure below.

[0015] Compared with the prior art, the present invention provides an MCU with multiple serial ports, which has the following features:

[0016] Beneficial effects:

[0017] The utility model has a bottom film connected to the top of the circuit board, the top of the bottom film is fixedly connected to the bonding film, an MCU structure is installed above the bonding film, the bonding film and the bottom film are inconsistent in height, so that there is a certain distance between the bottom film and the MCU structure, which is convenient for heat dissipation of the MCU structure, avoids damage to the MCU chip with multiple serial ports, improves the use effect of the MCU chip, and facilitates the use of information resource processing. At the same time, the outer surface of the bottom film is fixedly connected to the connecting piece, and the connecting piece is fixedly connected to the vertical heat sink, so that the vertical heat sink is connected to the four outer corners of the MCU structure, which is convenient for auxiliary clamping of the MCU structure, avoids damage to the MCU structure caused by shaking during use, avoids unstable connection of the MCU, and further increases the use effect of the MCU with multiple serial ports. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall schematic diagram of the utility model;

[0019] Figure 2 This is a schematic diagram of the power interface of the utility model;

[0020] Figure 3 This is a schematic diagram of the single-chip body of the utility model;

[0021] Figure 4 It is a schematic diagram of the vertical heat sink of the utility model.

[0022] Among them: 1. Circuit board; 2. Power interface; 21. Conveying module; 3. Single chip body; 31. Single chip interface; 4. Main MCU; 5. Right MCU; 6. Left MCU; 7. Vertical heat sink; 71. Connecting sheet; 72. Bottom sheet; 73. Bonding sheet. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0024] In the description of the present invention, unless otherwise specified, "multiple" means two or more than two; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Combined with Figure 1-Figure 4 In this embodiment, the MCU with multiple serial ports includes a circuit board 1, a main MCU 4 is fixedly connected to the upper side of the circuit board 1, a vertical heat sink 7 is fixedly connected to the outer side of the main MCU 4, a connecting piece 71 is fixedly connected to one side of the vertical heat sink 7, a bottom piece 72 is fixedly connected to one side of the connecting piece 71, and a bonding piece 73 is fixedly connected to the top of the bottom piece 72.

[0027] Specifically, a main MCU4 structure is connected to the top of the circuit board 1, a vertical heat sink 7 is connected to the outside of the main MCU4 structure, one side of the vertical heat sink 7 is fixedly connected to a connecting piece 71, and the connecting piece 71 has the same structural shape as the vertical heat sink 7, thereby achieving the heat dissipation function of the main MCU4 structure and increasing the service life of the MCU with multiple serial ports. At the same time, the connecting piece 71 is installed on the outside of the base film 72, and a bonding piece 73 is connected to the top of the base film 72. The bonding piece 73 is connected to the bottom of the main MCU4 structure, and the heights of the bonding piece 73 and the base film 72 are inconsistent, so that the bonding piece 73 and the base film 72 are spaced apart for heat dissipation, which is convenient for coordination between MCU structures with multiple serial ports.

[0028] A power interface 2 is fixedly connected to the top of the circuit board 1 , and a conveying module 21 is fixedly connected to one side of the power interface 2 .

[0029] A single chip body 3 is fixedly connected to one edge of the upper side of the circuit board 1 , a single chip interface 31 is fixedly connected to one side of the single chip body 3 , and the upper side of the circuit board 1 is fixedly connected below the single chip interface 31 .

[0030] A right MCU5 is fixedly connected to one side of the main MCU4 , and a left MCU6 is fixedly connected to the other side of the main MCU4 .

[0031] One side of the conveying module 21 is fixedly connected to the main MCU 4 , and both ends of the conveying module 21 are fixedly connected to the right MCU 5 and the left MCU 6 .

[0032] Specifically, a power interface 2 is connected above the circuit board 1, and the power interface 2 is used to connect to an external power supply, so that the MCU with multiple serial ports and the power supply connection are used in conjunction with each other. One side of the power interface 2 is fixedly connected to the conveying module 21, and one end of the conveying module 21 is connected to the main MCU4, the right MCU5, and the left MCU6, so as to achieve the connection between the MCU structure and the power supply. At the same time, it is fixedly connected to the single-chip body 3 above the circuit board 1, and a single-chip interface 31 is connected to one side of the single-chip body 3, and the single-chip is used in conjunction with the MCU structure.

[0033] The bottom plate 72 is fixedly connected to the upper side of the circuit board 1 , the connecting plate 71 is fixedly connected to the lower side of the main MCU 4 , and the vertical heat sink 7 presents an “L” shape.

[0034] The main MCU 4 is fixedly connected to the upper side of the bonding sheet 73 , and the lower side of the vertical heat sink 7 is fixedly connected to the upper side of the circuit board 1 .

[0035] Specifically, the vertical heat sink 7 adopts a copper heat dissipation structure, and the vertical heat sink 7 and the connecting plate 71 are made of the same structural material, which is convenient for assisting the heat dissipation of the MCU structure as a whole. At the same time, the vertical heat sink 7 is connected to the four outer corners of the MCU structure, which is convenient for assisting the fixation of the MCU structure, avoiding the shaking of the MCU structure during coordinated use, increasing the MCU connection stability, and facilitating the installation of an MCU with multiple serial ports in the device for use in coordinated information and other resource processing.

[0036] Working principle: When the MCU with multiple serial ports is installed in the equipment to cooperate with information resource processing, it is connected to the external power supply through the power interface 2, and one side of the power interface 2 is fixedly connected to the conveying module 21. A power harness is arranged inside the conveying module 21, and the harness is used to connect to the MCU structure of the multiple serial ports on one side. The branch serial port MCUs include the main MCU4, the right MCU5, and the left MCU6 structure. When the MCU cooperates with the operation of the equipment, damage to multiple MCU structures is avoided. The bottom film 72 is fixedly connected to the bottom film 72 above the circuit board 1, and the bottom film 72 is fixedly connected to the bonding sheet 73. The bonding sheet 73 is used to be connected to the bottom of the multiple MCU structures. The bonding sheet 73 is the same as the vertical heat sink 7, which is convenient for auxiliary use of the heat dissipation function of the MCU structure. Then the outer surface of the bottom film 72 is fixedly connected to the connecting sheet 71, and the connecting sheet 71 is fixedly connected to the vertical heat sink 7. The vertical heat sink 7 is connected to the four corners of the outer side of the MCU structure. The MCU with multiple serial ports is assisted and fixed by the vertical heat sink 7, which is convenient for increasing the stability of the use of the MCU with multiple serial ports and facilitating the use of the MCU with equipment.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An MCU with multiple serial ports, the MCU with multiple serial ports comprising a circuit board (1), a main MCU (4) being fixedly connected to one side above the circuit board (1), a vertical heat sink (7) being fixedly connected to the outer side of the main MCU (4), characterized in that: A connecting sheet (71) is fixedly connected to one side of the vertical heat sink (7), a bottom sheet (72) is fixedly connected to one side of the connecting sheet (71), and a bonding sheet (73) is fixedly connected above the bottom sheet (72).

2. The MCU with multiple serial ports according to claim 1, characterized in that: A power interface (2) is fixedly connected above the circuit board (1), and a conveying module (21) is fixedly connected to one side of the power interface (2).

3. The MCU with multiple serial ports according to claim 1, characterized in that: A single-chip computer body (3) is fixedly connected to an edge of one side of the upper side of the circuit board (1), a single-chip computer interface (31) is fixedly connected to one side of the single-chip computer body (3), and the upper side of the circuit board (1) is fixedly connected to the lower side of the single-chip computer interface (31).

4. The MCU with multiple serial ports according to claim 1, characterized in that: A right MCU (5) is fixedly connected to one side of the main MCU (4), and a left MCU (6) is fixedly connected to the other side of the main MCU (4).

5. The MCU with multiple serial ports according to claim 2, characterized in that: One side of the conveying module (21) is fixedly connected to a main MCU (4), and both ends of the conveying module (21) are fixedly connected to a right MCU (5) and a left MCU (6).

6. The MCU with multiple serial ports according to claim 1, characterized in that: The bottom plate (72) is fixedly connected to the upper side of the circuit board (1), the connecting plate (71) is fixedly connected to the lower side of the main MCU (4), and the vertical heat sink (7) presents an "L" shape.

7. The MCU with multiple serial ports according to claim 1, characterized in that: The main MCU (4) is fixedly connected to the upper part of the bonding sheet (73), and the lower part of the vertical heat sink (7) is fixedly connected to the upper part of the circuit board (1).

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