Gantry cross direct-drive platform applied to semiconductor

Abstract

The utility model discloses a gantry cross direct-drive platform applied to a semiconductor, which belongs to the technical field of direct-drive motors and comprises a marble platform. The Y-axis driving assembly is used for Y-axis movement, the X-axis driving assembly is used for X-axis movement, the organ cover is used for dust prevention, the wafer mounting assembly is used for swinging wafers, the wiring assembly is used for carding circuits, the buffering assembly is used for buffering, and the wafer mounting assembly comprises a mounting assembly and a swinging assembly. According to the mode, the wafer swinging mechanism can swing a wafer in the wafer detection process, so that a detection system can observe the surface of the wafer from different angles, and the detection system can comprehensively and accurately detect the characteristics and defects of the surface of the wafer, thereby ensuring the quality and reliability of the wafer; during use, cables of a laser, a camera and a light source directly penetrate through the wiring holes to be connected to a power distribution cabinet below, and wiring is simple and neat.

Description

[Technical field]

[0001] The utility model relates to the technical field of direct-drive motors, and in particular to a gantry cross direct-drive platform applied to semiconductors. [Background Technology]

[0002] The direct-drive motor platform has the advantages of high precision, high speed, high stability, high reliability and high flexibility in the semiconductor wafer inspection industry. It can meet the requirements for fine detection of wafer surface defects and features, and improve the performance and reliability of the wafer inspection system.

[0003] Chinese patent CN215727630U discloses a semiconductor wafer inspection platform, including a platform, an XY mobile platform, a camera lens mounting beam, and a vacuum adsorption fixture. The XY mobile platform is arranged on the platform, the camera lens mounting beam is arranged across the XY mobile platform, the camera lens mounting beam is connected to the platform, the vacuum adsorption fixture is arranged on the upper end surface of the XY mobile platform, the vacuum adsorption fixture includes a vacuum adsorption mechanism and a vacuum adsorption fixture body, a groove is arranged on one side of the vacuum adsorption fixture body, a vacuum adsorption mechanism is arranged on the other side of the vacuum adsorption fixture body, the vacuum adsorption mechanism includes a vacuum air inlet, an airway, and a vacuum adsorption hole, the airway passes through the outer cylindrical surface of the vacuum adsorption fixture body and is connected to the vacuum air inlet, the vacuum adsorption hole passes through the upper surface of the vacuum adsorption fixture body and is connected to the airway, at least two vacuum adsorption holes are arranged along the radius of the vacuum adsorption fixture body, and the groove is a W-shaped groove.

[0004] However, this patent cannot swing the wafer, and cannot perform comprehensive inspection of the wafer from different angles and positions.

[0005] Based on this, the utility model designs a gantry cross direct drive platform applied to semiconductors to solve the above problems. [Contents of the utility model]

[0006] In view of the above-mentioned shortcomings of the prior art, the utility model provides a gantry cross direct-drive platform applied to semiconductors.

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A gantry cross direct drive platform for semiconductors, comprising a marble platform;

[0009] It also includes a Y-axis drive assembly for Y-axis movement, an X-axis drive assembly for X-axis movement, an accordion cover for dust prevention, a wafer mounting assembly for swinging wafers, a wiring assembly for combing lines, and a buffer assembly for buffering. The Y-axis drive assembly is connected to the marble platform, the upper end of the Y-axis drive assembly is connected to the X-axis drive assembly, the wafer mounting assembly is connected to the X-axis drive assembly, one side of the upper end of the marble platform is connected to the wiring assembly, the X-axis drive assembly and the Y-axis drive assembly are both connected to the buffer assembly, and the X-axis drive assembly and the Y-axis drive assembly are both connected to the accordion cover;

[0010] The wafer mounting assembly comprises a mounting assembly and a swing assembly, wherein the mounting assembly is connected to the X-axis driving assembly, and the swing assembly is connected to the mounting assembly.

[0011] Furthermore, the Y-axis drive assembly includes a second linear module slide, a second slide rail and a second drag chain. The multiple second slide rails are fixedly connected in the outer shell of the second linear module slide. One end of the second drag chain is fixedly connected to the marble platform. The other end of the second drag chain is connected to the X-axis drive assembly. The second linear module slide is fixedly connected to the marble platform. The front and rear ends of the second linear module slide are respectively fixedly connected to the outer ends of the two accordion covers.

[0012] Furthermore, the X-axis drive assembly includes a first linear module slide, a first slide rail, a first drag chain and a first wiring harness connector. The first linear module slide is fixedly connected to the upper end of the slider of the second linear module slide. Multiple first slide rails are fixedly connected to the outer shell of the first linear module slide. One end of the first drag chain is fixedly connected to the outer shell of the first linear module slide. The other end of the first drag chain is fixedly connected to the slider of the first linear module slide. The first wiring harness connector is fixedly connected to the front end outer shell of the first linear module slide. The rear end of the second drag chain is fixedly connected to the side wall of the outer shell of the first linear module slide. The inner ends of the two accordion covers are respectively fixedly connected to the front and rear ends of the first linear module slide. The mounting assembly is connected to the slider of the first linear module slide.

[0013] Furthermore, the mounting assembly includes a mounting plate, a truncated table, a connecting bracket, a fixed block and a motor. The mounting plate is fixedly connected to the slider of the first linear module slide. The upper end of the mounting plate is fixedly connected to the truncated table. The upper end of the truncated table is fixedly connected to the connecting bracket. The upper inner wall of the connecting bracket is fixedly connected to the motor. The output end of the motor is connected to the swing assembly. The front and rear ends of the truncated table are fixedly connected to the fixed blocks, and the fixed blocks are connected to the swing assembly.

[0014] Furthermore, the swing assembly includes a protrusion, a rotating member, a connecting member, a rotating shaft and a carrier plate, the rear end of the protrusion is fixedly connected to the rotating member, the upper end of the rotating member is fixedly connected to the rotating shaft, the outer end of the rotating shaft passes through the middle end of the connecting member and is fixedly connected to the connecting member, and the upper end of the rotating member is fixedly connected to the carrier plate.

[0015] Furthermore, the output end of the motor passes through the connecting bracket and is fixedly connected to the protrusion, and the inner end of the fixing block is rotatably connected to the front and rear ends of the connecting member respectively.

[0016] Furthermore, the wiring assembly includes a marble column, a wiring hole and a second wiring harness connector. The marble column is fixedly connected to the upper right side of the marble platform. The inner end of the marble column is provided with a wiring hole. The right end of the marble platform is fixedly connected to the second wiring harness connector.

[0017] Furthermore, the buffer assembly includes a hard limiter and a hydraulic buffer, and the right end of the first linear module slide and the front end of the second linear module slide are fixedly connected with a plurality of hard limiters, and the hard limiters are fixedly connected with a hydraulic buffer.

[0018] Compared with the prior art, the utility model has the following advantages:

[0019] (1) The setting of the accordion cover of the utility model effectively reduces the impact of foreign matter such as dust and particles on the direct drive core components, reducing maintenance costs;

[0020] (2) When the utility model swings, the motor of the mounting assembly of the wafer mounting assembly is started, the motor drives the protrusion of the swing assembly to rotate, the protrusion drives the rotating member to swing under the joint action of the fixed block, the connecting member and the rotating shaft, the rotating member drives the carrier to swing, thereby driving the wafer to swing;

[0021] (3) The utility model can swing the wafer during the wafer inspection process, so that the inspection system can observe the wafer surface from different angles, ensuring that the inspection system can comprehensively and accurately check the characteristics and defects of the wafer surface, thereby ensuring the quality and reliability of the wafer;

[0022] (4) When the utility model is used, the laser, camera, and light source cables are directly connected to the power distribution cabinet below through the wiring holes, and the wiring is simple and neat;

[0023] (5) When the utility model performs buffering, when the slider reaches the limit position, the hydraulic buffer will first unload the relatively large impact force and then hit the hard limiter to play a buffering role, thereby preventing damage to the workpiece and changes in the slide rail accuracy caused by the collision. [Drawings]

[0024] Figure 1 The utility model is a three-dimensional gantry cross direct drive platform for semiconductors Figure 1 ;

[0025] Figure 2 It is a front view of a gantry cross direct drive platform applied to semiconductors according to the utility model;

[0026] Figure 3 This is a schematic diagram of the structure of a gantry cross direct drive platform applied to semiconductors according to the utility model;

[0027] Figure 4 for Figure 3 The enlarged view of point A in the middle;

[0028] Figure 5 for Figure 3 The enlarged view of point B in the middle;

[0029] Figure 6 The utility model is a swing component stereoscopic of a gantry cross direct drive platform for semiconductors Figure 1 ;

[0030] Figure 7 The utility model is a swing component stereoscopic of a gantry cross direct drive platform for semiconductors Figure 2 ;

[0031] In the figure: 1. marble platform; 2. accordion cover; 3. buffer assembly; 31. hard limiter; 32. hydraulic buffer; 4. X-axis drive assembly; 41. first linear module slide; 42. first slide rail; 43. first drag chain; 44. first harness connector; 5. Y-axis drive assembly; 51. second linear module slide; 52. second slide rail; 53. second drag chain; 6. wafer mounting assembly; 61. mounting assembly; 611. mounting plate; 612. round table; 613. connecting bracket; 614. fixing block; 615. motor; 62. shaking assembly; 621. bump; 622. rotating part; 623. connecting part; 624. rotating shaft; 625. carrier; 7. wiring assembly; 71. marble column; 72. wiring hole; 73. second harness connector. [Specific implementation method]

[0032] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] The utility model is further described below in conjunction with embodiments.

[0034] Example 1

[0035] Please refer to the instruction manual Figure 1-7 , a gantry cross direct drive platform applied to semiconductors, comprising a marble platform 1;

[0036] It also includes a Y-axis driving component 5 for Y-axis movement, an X-axis driving component 4 for X-axis movement, an accordion cover 2 for dust prevention, a wafer mounting component 6 for swinging the wafer, a wiring component 7 for combing the line, and a buffer component 3 for buffering. The Y-axis driving component 5 is connected to the marble platform 1, the upper end of the Y-axis driving component 5 is connected to the X-axis driving component 4, the wafer mounting component 6 is connected to the X-axis driving component 4, the upper end of the marble platform 1 is connected to the wiring component 7, the X-axis driving component 4 and the Y-axis driving component 5 are both connected to the buffer component 3, and the X-axis driving component 4 and the Y-axis driving component 5 are both connected to the accordion cover 2;

[0037] The wafer mounting assembly 6 includes a mounting assembly 61 and a swing assembly 62 . The mounting assembly 61 is connected to the X-axis driving assembly 4 , and the swing assembly 62 is connected to the mounting assembly 61 .

[0038] The setting of the bellows cover 2 effectively reduces the impact of foreign matter such as dust and particles on the direct drive core components, reducing maintenance costs;

[0039] The Y-axis driving assembly 5 includes a second linear module slide 51, a second slide rail 52 and a second drag chain 53. The plurality of second slide rails 52 are fixedly connected to the housing of the second linear module slide 51. One end of the second drag chain 53 is fixedly connected to the marble platform 1. The other end of the second drag chain 53 is connected to the X-axis driving assembly 4. The second linear module slide 51 is fixedly connected to the marble platform 1. The front and rear ends of the second linear module slide 51 are fixedly connected to the outer ends of the two accordion covers 2 respectively.

[0040] The X-axis drive assembly 4 includes a first linear module slide 41, a first slide rail 42, a first drag chain 43 and a first wiring harness connector 44. The first linear module slide 41 is fixedly connected to the upper end of the slider of the second linear module slide 51. Multiple first slide rails 42 are fixedly connected in the outer shell of the first linear module slide 41. One end of the first drag chain 43 is fixedly connected to the outer shell of the first linear module slide 41, and the other end of the first drag chain 43 is fixedly connected to the slider of the first linear module slide 41. The first wiring harness connector 44 is fixedly connected to the front end outer shell of the first linear module slide 41. The rear end of the second drag chain 53 is fixedly connected to the side wall of the outer shell of the first linear module slide 41. The inner ends of the two accordion covers 2 are respectively fixedly connected to the front and rear ends of the first linear module slide 41. The mounting assembly 61 is connected to the slider of the first linear module slide 41.

[0041] Preferably, the first drag chain 43 and the second drag chain 53 are dust-free drag chains to avoid dust generation due to friction during operation of the drag chains.

[0042] Preferably, both the first slide rail 42 and the second slide rail 52 are precision slide rails, and the left and right sides of the second slide rail 52 and the front and rear sides of the first slide rail 42 are fixedly connected with a plurality of slide rail adjustment mechanisms (eccentric nuts), which can adjust the slide rails at the micron level, saving debugging time and allowing the slide rails to be quickly adjusted to the ideal accuracy. This is the prior art and is not considered as an improvement point.

[0043] The mounting assembly 61 includes a mounting plate 611, a truncated table 612, a connecting bracket 613, a fixing block 614 and a motor 615. The mounting plate 611 is fixedly connected to the slider of the first linear module slide 41. The upper end of the mounting plate 611 is fixedly connected to the truncated table 612. The upper end of the truncated table 612 is fixedly connected to the connecting bracket 613. The upper inner wall of the connecting bracket 613 is fixedly connected to the motor 615. The output end of the motor 615 is connected to the swing assembly 62. The front and rear ends of the truncated table 612 are fixedly connected to the fixing block 614. The fixing block 614 is connected to the swing assembly 62.

[0044] The swing assembly 62 includes a protrusion 621, a rotating member 622, a connecting member 623, a rotating shaft 624 and a carrier plate 625. The rear end of the protrusion 621 is fixedly connected to the rotating member 622, the upper end of the rotating member 622 is fixedly connected to the rotating shaft 624, the outer end of the rotating shaft 624 passes through the middle end of the connecting member 623 and is fixedly connected to the connecting member 623, and the upper end of the rotating member 622 is fixedly connected to the carrier plate 625.

[0045] The output end of the motor 615 passes through the connecting bracket 613 and is fixedly connected to the protrusion 621 , and the inner end of the fixing block 614 is rotatably connected to the front and rear ends of the connecting member 623 .

[0046] When swinging, the motor 615 of the mounting assembly 61 of the wafer mounting assembly 6 is started, the motor 615 drives the protrusion 621 of the swing assembly 62 to rotate, the protrusion 621 drives the rotating member 622 to swing under the joint action of the fixed block 614, the connecting member 623 and the rotating shaft 624, the rotating member 622 drives the carrier 625 to swing, thereby driving the wafer to swing;

[0047] The utility model can swing the wafer during the wafer inspection process, so that the inspection system can observe the wafer surface from different angles, ensuring that the inspection system can comprehensively and accurately check the characteristics and defects of the wafer surface, thereby ensuring the quality and reliability of the wafer;

[0048] The wiring assembly 7 includes a marble column 71, a wiring hole 72 and a second wiring harness connector 73. The marble column 71 is fixedly connected to the upper right side of the marble platform 1. The inner end of the marble column 71 is provided with a wiring hole 72. The right end of the marble platform 1 is fixedly connected to the second wiring harness connector 73.

[0049] The laser, camera and lamp are all fixedly connected to the marble column 71, which is the prior art and is not considered as an improvement point.

[0050] When in use, the cables of the laser, camera, and light are directly connected to the power distribution cabinet below through the wiring hole 72 (not shown), which makes the wiring simple and neat;

[0051] The buffer assembly 3 includes a hard limiter 31 and a hydraulic buffer 32 . The right end of the first linear module slide 41 and the front end of the second linear module slide 51 are fixedly connected with a plurality of hard limiters 31 , and the hard limiters 31 are fixedly connected with a hydraulic buffer 32 .

[0052] During buffering, when the slider reaches the limit position, the hydraulic buffer 32 will first unload the relatively large impact force, and then hit the hard limiter 31, which plays a buffering role to prevent damage to the workpiece and change in the slide rail accuracy due to collision;

[0053] The cables of the motor 615 are installed in the first drag chain 43 and electrically connected to the first harness connector 44. The cables of the first linear module slide 41 and the first harness connector 44 are installed in the second drag chain 53. The cables in the second drag chain 53 are electrically connected to the second harness connector 73. The second harness connector 73 is electrically connected to the host.

[0054] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. The standard parts used can be purchased from the market, and special-shaped parts can be customized according to the records in the specification and drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0055] The present invention is not limited to the above-mentioned implementation modes, and any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention shall be considered as equivalent replacement modes and shall be included in the protection scope of the present invention.

Claims

1. A gantry cross direct drive platform for semiconductors, comprising a marble platform (1), characterized in that: It also includes a Y-axis drive assembly (5) for Y-axis movement, an X-axis drive assembly (4) for X-axis movement, an accordion cover (2) for dust prevention, a wafer mounting assembly (6) for swinging the wafer, a wiring assembly (7) for combing the line, and a buffer assembly (3) for buffering, wherein the Y-axis drive assembly (5) is connected to the marble platform (1), the upper end of the Y-axis drive assembly (5) is connected to the X-axis drive assembly (4), the wafer mounting assembly (6) is connected to the X-axis drive assembly (4), the upper end of the marble platform (1) is connected to the wiring assembly (7), the X-axis drive assembly (4) and the Y-axis drive assembly (5) are both connected to the buffer assembly (3), and the X-axis drive assembly (4) and the Y-axis drive assembly (5) are both connected to the accordion cover (2); The wafer mounting assembly (6) comprises a mounting assembly (61) and a swing assembly (62); the mounting assembly (61) is connected to the X-axis driving assembly (4), and the swing assembly (62) is connected to the mounting assembly (61).

2. The gantry cross direct drive platform for semiconductors according to claim 1, characterized in that: The Y-axis driving assembly (5) comprises a second linear module slide (51), a second slide rail (52) and a second drag chain (53); a plurality of second slide rails (52) are fixedly connected in the housing of the second linear module slide (51); one end of the second drag chain (53) is fixedly connected to the marble platform (1); the other end of the second drag chain (53) is connected to the X-axis driving assembly (4); the second linear module slide (51) is fixedly connected to the marble platform (1); and the front and rear ends of the second linear module slide (51) are respectively fixedly connected to the outer ends of the two accordion covers (2).

3. The gantry cross direct drive platform for semiconductors according to claim 2, characterized in that: The X-axis drive assembly (4) includes a first linear module slide (41), a first slide rail (42), a first drag chain (43) and a first wiring harness connector (44); the first linear module slide (41) is fixedly connected to the upper end of the slider of the second linear module slide (51); a plurality of first slide rails (42) are fixedly connected to the shell of the first linear module slide (41); one end of the first drag chain (43) is fixedly connected to the shell of the first linear module slide (41); the other end of the first drag chain (43) is fixedly connected to the slider of the first linear module slide (41); the first wiring harness connector (44) is fixedly connected to the front end shell of the first linear module slide (41); the rear end of the second drag chain (53) is fixedly connected to the side wall of the shell of the first linear module slide (41); the inner ends of the two accordion covers (2) are respectively fixedly connected to the front and rear ends of the first linear module slide (41); and the mounting assembly (61) is connected to the slider of the first linear module slide (41).

4. The gantry cross direct drive platform for semiconductors according to claim 3, characterized in that: The mounting assembly (61) comprises a mounting plate (611), a truncated table (612), a connecting bracket (613), a fixing block (614) and a motor (615); the mounting plate (611) is fixedly connected to a slider of a first linear module slide (41); the upper end of the mounting plate (611) is fixedly connected to a truncated table (612); the upper end of the truncated table (612) is fixedly connected to a connecting bracket (613); the inner wall of the upper end of the connecting bracket (613) is fixedly connected to a motor (615); the output end of the motor (615) is connected to the swing assembly (62); the front and rear ends of the truncated table (612) are fixedly connected to fixing blocks (614); and the fixing block (614) is connected to the swing assembly (62).

5. The gantry cross direct drive platform for semiconductors according to claim 4, characterized in that: The swing assembly (62) comprises a protrusion (621), a rotating member (622), a connecting member (623), a rotating shaft (624) and a carrier plate (625); the rear end of the protrusion (621) is fixedly connected to the rotating member (622); the upper end of the rotating member (622) is fixedly connected to the rotating shaft (624); the outer end of the rotating shaft (624) passes through the middle end of the connecting member (623) and is fixedly connected to the connecting member (623); and the upper end of the rotating member (622) is fixedly connected to the carrier plate (625).

6. The gantry cross direct drive platform for semiconductor applications according to claim 5, characterized in that: The output end of the motor (615) passes through the connecting bracket (613) and is fixedly connected to the protrusion (621), and the inner end of the fixing block (614) is rotatably connected to the front and rear ends of the connecting member (623) respectively.

7. The gantry cross direct drive platform for semiconductor applications according to claim 6, characterized in that: The wiring assembly (7) comprises a marble column (71), a wiring hole (72) and a second wiring harness connector (73); the marble column (71) is fixedly connected to the right side of the upper end of the marble platform (1); the wiring hole (72) is provided at the inner end of the marble column (71); and the right end of the marble platform (1) is fixedly connected to the second wiring harness connector (73).

8. The gantry cross direct drive platform for semiconductor applications according to claim 7, characterized in that: The buffer assembly (3) comprises a hard limiter (31) and a hydraulic buffer (32); the right end of the first linear module slide (41) and the front end of the second linear module slide (51) are both fixedly connected to a plurality of hard limiters (31); and the hard limiters (31) are both fixedly connected to a hydraulic buffer (32).

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