Wafer spin-drying device
By designing an automated chip drying device, the motor and pallet unit combined with centrifugal force is used to achieve efficient drying, solving the problems of low drying efficiency of indium phosphide wafers and employee safety, realizing automated drying, improving efficiency and safety.
Patent Information
- Application Number
- CN202323618674.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-28
AI Technical Summary
Indium phosphide wafers are inefficient during the grinding and drying process, and manual operations can easily lead to employee injuries.
A wafer drying device is designed, including upper and lower lifting device modules and drying components. The motor drives the drying component to rotate, and combines the pallet unit and centrifugal force to achieve automatic drying, avoiding manual operation.
Improves chip drying efficiency, avoids employee injuries, reduces costs, and ensures the safety and integrity of the chip during the drying process.
Smart Images
Figure CN222190665U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor substrate material manufacturing, in particular to a wafer drying device. Background Art
[0002] Indium phosphide substrates have an application market in the manufacture of high-frequency and high-power devices, optical fiber communications, wireless transmission, radio astronomy and other RF devices. RF devices made using indium phosphide substrates have demonstrated excellent performance in application scenarios such as satellites and radars. They are highly competitive in the RF front end of radar and communication systems, and analog / mixed signal wide-bandwidth circuits, and are suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion.
[0003] However, grinding and drying of indium phosphide wafers before polishing is a time-consuming and labor-intensive process. In the prior art, after indium phosphide is ground, it is manually unloaded using an air gun, and then the ground indium phosphide wafers are manually removed from the grinder, manually rinsed with water and blown dry with an air gun, which is inefficient and employees are prone to injury during manual handling. Utility Model Content
[0004] The technical problem to be solved by the utility model is: how to improve the drying efficiency of wafers.
[0005] In order to solve the above technical problems, the utility model provides a wafer drying device, comprising:
[0006] A box body, wherein an upper chamber and a lower chamber are provided in the box body, an upper lifting device module is provided at the top of the upper chamber, a lower lifting device module is provided at the bottom of the lower chamber, a limiting cylinder is provided in the upper chamber, and a motor is provided in the lower chamber; and
[0007] The spin-drying component is arranged between the upper lifting device module and the lower lifting device module, and the upper lifting device module and the lower lifting device module can realize the lifting and lowering of the spin-drying component. The spin-drying component includes a spin-drying cylinder and a tray unit arranged in the spin-drying cylinder. The top of the spin-drying cylinder is placed in the limiting cylinder, and the bottom of the spin-drying cylinder is provided with an axial hole corresponding to the rotating shaft of the motor.
[0008] Further preferably, a lateral balancing module is provided in the box along the height direction of the spin-drying drum, and the lateral balancing module is symmetrically arranged on both sides of the spin-drying drum.
[0009] Further preferably, the spin-drying cylinder is a hollow structure, the tray units are in plurality and are arranged at intervals along the axial direction of the spin-drying cylinder, and a window for taking in or putting out materials is provided on the side wall of the spin-drying cylinder.
[0010] Further preferably, the tray unit is fixedly connected to the inner wall of the spin-drying cylinder.
[0011] Further preferably, the inner side wall of the spin-drying drum is provided with tray mounting members spaced apart along the axial direction thereof, and the tray unit is detachably mounted on the tray mounting members.
[0012] Further preferably, the tray unit includes a tray body, the upper surface of the tray body is recessed inward to form a wafer placement groove, and a robot entry slot and a drainage hole are provided on the side of the tray body, and the robot entry slot corresponds to the window setting.
[0013] Further preferably, a symmetrical arc groove is formed in the tray body in the wafer placement groove, an adjusting member is arranged in the arc groove, and a spring unit abutting against the adjusting member is arranged at one end of the arc groove.
[0014] Further preferably, a plurality of blocks are arranged at intervals on the inner wall of the arc groove.
[0015] Further preferably, the side wall of the spin-drying cylinder is further provided with a plurality of grooves, and the grooves are arranged along the circumference of the spin-drying cylinder; or
[0016] The side wall of the spin-drying cylinder is provided with slots to form a screen structure.
[0017] Further preferably, the box body is provided with a first drain pipe and a second drain pipe which are communicated with the upper chamber and the lower chamber respectively.
[0018] Compared with the prior art, the chip drying device provided by the utility model has the following beneficial effects: the utility model respectively arranges an upper lifting device module and a lower lifting device module at the upper and lower ends of the drying component, and utilizes the upper lifting device module and the lower lifting device module to realize the lifting and lowering of the drying component, so as to facilitate the taking and putting of the chips to be dried; when the drying component descends to the point where the shaft hole matches the rotating shaft of the motor, the motor can be started to drive the drying component to rotate, thereby drying the chips; in addition, a tray unit is arranged in the drying cylinder to fix the chips, thereby ensuring that the chips will not fall off and be damaged during the drying process; the chip drying tray has a simple structure, utilizes centrifugal force to dry the moisture on the chips, has a high drying efficiency, and does not require manual operation, which can effectively avoid injuries to employees, thereby achieving the purpose of reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a stereoscopic diagram of a wafer drying device described in the utility model.
[0020] Figure 2 It is a front view of a wafer drying device described in the utility model.
[0021] Figure 3 It is a cross-sectional view of a wafer drying device described in the utility model.
[0022] Figure 4 This is a structural diagram of a wafer drying device described in the utility model from another perspective.
[0023] Figure 5 It is a structural schematic diagram of the spin-drying assembly of the utility model.
[0024] Figure 6 It is a structural schematic diagram of the spin-drying drum body of the utility model.
[0025] Figure 7 It is a structural schematic diagram of the tray unit of the utility model.
[0026] In the figure:
[0027] 10. Box body; 11. Upper chamber; 12. Lower chamber; 13. Motor; 131. Rotating shaft; 14. Limiting cylinder; 15. Upper lifting device module; 16. Lower lifting device module; 17. Lateral balancing module; 18. First drain pipe; 19. Second drain pipe;
[0028] 20. Drying assembly; 21. Drying cylinder; 211. Axis hole; 212. Window; 213. Channel; 214. Tray mounting member; 22. Tray unit; 221. Tray body; 222. Wafer placement slot; 223. Manipulator enters slot; 224. Drain hole; 225. Arc slot; 226. Adjustment member; 227. Block; 228. Spring unit. DETAILED DESCRIPTION
[0029] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0030] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "between", "axial", "top", "bottom", "height" and the like used in the present invention to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0031] The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; the terms "plurality" and "several" both represent a number of not less than 2, that is, it can be 2, 3, 4, 5...8 or more. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0032] like Figure 1-Figure 3 As shown, this embodiment provides a wafer spin-drying device, including a box body 10 and a spin-drying assembly 20 , wherein the spin-drying assembly 20 is arranged inside the box body 10 .
[0033] In a specific embodiment, an upper chamber 11 and a lower chamber 12 are provided in the box body 10, an upper lifting device module 15 is provided at the top of the upper chamber, and a lower lifting device module 16 is provided at the bottom of the lower chamber 12, a limiting cylinder 14 is provided in the upper chamber 11, and a motor 13 is provided in the lower chamber 12; the spin-drying component 20 is provided between the upper lifting device module 15 and the lower lifting device module 16, and the upper lifting device module 15 and the lower lifting device module 16 can realize the lifting and lowering of the spin-drying component 20, the spin-drying component 20 includes a spin-drying cylinder 21 and a tray unit 22 provided in the spin-drying cylinder 21, the top of the spin-drying cylinder 21 is placed in the limiting cylinder 14, and the bottom of the spin-drying cylinder 21 is provided with an axial hole 211 corresponding to the rotating shaft 131 of the motor 13.
[0034] In the above embodiment, an upper lifting device module 15 and a lower lifting device module 16 are respectively arranged at the upper and lower ends of the spin-drying component 20, and the upper lifting device module 15 and the lower lifting device module 16 are used to realize the lifting and lowering of the spin-drying component 20, so as to facilitate the taking and putting of the chips to be dried. When the spin-drying component 20 is lowered to the point where the shaft hole 211 matches the rotating shaft 131 of the motor 13, the motor 13 is started to drive the spin-drying component 20 to rotate, thereby drying the chips. In addition, a tray unit 22 is arranged in the spin-drying cylinder 21 to fix the chips, ensuring that the chips will not fall off and be damaged during the drying process. The chip drying tray has a simple structure, uses centrifugal force to dry the moisture on the chips, has a high drying efficiency, and does not require manual operation, which can effectively avoid employee injuries, thereby achieving the purpose of reducing costs.
[0035] In some embodiments, a lateral balancing module 17 is provided in the box body 10 along the height direction of the spin dryer drum 21. The lateral balancing module 17 is symmetrically arranged on both sides of the spin dryer drum 21. The lateral balancing module 17 can ensure the radial movement of the spin dryer drum 21 during rotation, while the upper lifting device module 15 and the lower lifting device module 16 can limit the axial movement of the spin dryer drum 21 during rotation, thereby ensuring that the spin dryer drum 21 can achieve stable rotation under the action of the motor 13.
[0036] It should be noted that the upper lifting device module 15, the lower lifting device module 16 and the lateral balancing module 17 are all modules based on magnetic levitation technology. The modules are composed of a ring-shaped permanent magnet or an electromagnet to form a main magnetic field. Four main coils are arranged above the ring-shaped permanent magnet or the electromagnet, which are set as coil one, coil two, coil three and coil four. Coil five is wound around the ring-shaped permanent magnet or the electromagnet. Coil one to coil five are wound counterclockwise. They also include a driving chip, a power supply, a float, an amplifier and a Hall element. In this embodiment, the floats are respectively arranged on the upper, lower and side walls of the spin drying drum 21. The spin drying drum 21 can be stably lifted by magnetic levitation. It should be explained that the magnetic levitation technologies used by the upper lifting device module 15, the lower lifting device module 16 and the lateral balancing module 17 of this embodiment are all existing technologies, and reference can be made to the existing technologies (such as announcement numbers CN110803661B and CN110677075B).
[0037] In some embodiments, the spin drying cylinder 21 is a hollow structure, the number of tray units 22 is plural and the tray units 22 are arranged at intervals along the axial direction of the spin drying cylinder 21, and a window 212 for taking or putting materials is provided on the side wall of the spin drying cylinder 21; thus, by arranging multiple spin drying cylinders 21 in the spin drying cylinder 21, the chip drying device can simultaneously dry multiple chips at a time, thereby effectively improving the drying efficiency.
[0038] In some embodiments, the tray unit 22 can be fixedly connected to the inner wall of the spin-drying cylinder 21, and during use, it is only necessary to complete the individual placement and removal of the wafers.
[0039] In other embodiments, Figure 6 As shown, tray mounting members 214 may also be provided on the inner side wall of the spin drying drum 21 along its axial intervals, and the tray unit 22 may be detachably mounted on the tray mounting members 214, and the detachable mounting methods include snap connection, threaded connection, pin hole connection, adhesive connection, etc., so that the tray unit 22 can be taken out, which is beneficial for the subsequent replacement or cleaning of the tray unit 22.
[0040] In some embodiments, Figure 7As shown, the tray unit 22 includes a tray body 221, the upper surface of the tray body 221 is recessed inward to form a chip placement groove 222, and the side of the tray body 221 is provided with a robot entry slot 223 and a drainage hole 224. Specifically, the robot entry slot 223 is set corresponding to the window 212 to facilitate automatic placement of chips by the robot.
[0041] In the above embodiment, the upper surface of the tray body 221 is recessed inward to form a chip placement groove 222. The chip placement groove 222 can be a concave spherical surface. Therefore, when the chip is placed in the chip placement groove 222, the bottom of the chip is not in direct contact with the tray body 221, which is conducive to the water being thrown out from the drainage hole 224 under the action of centrifugal force.
[0042] In another embodiment, the chip placement groove 222 can also be a concave cone, and its taper θ satisfies: 1°≤θ≤10°. In this way, the concave cone can also prevent the bottom of the chip from directly contacting the tray body 221, thereby facilitating the water to be thrown out from the drainage hole 224 under the action of centrifugal force; in this embodiment, θ=10° is preferably set to avoid the cone angle being too large to prevent the internal water from being unable to be thrown out.
[0043] In some embodiments, a symmetrical arc groove 225 is formed in the tray body 221 within the wafer placement groove 222, an adjusting member 226 is provided in the arc groove 225, and a spring unit 228 abutting against the adjusting member 226 is provided at one end of the arc groove 225; thereby, the position and deformation curvature of the adjusting member 226 can be adjusted through the spring unit 228, so that the adjusting member 226 can fix wafers of different sizes to be dried, while preventing the wafers from falling off and being damaged during the drying process.
[0044] In some embodiments, in order to fix chips of different sizes, a plurality of blocks 227 are arranged at intervals on the inner wall of the arc groove 225, and one end of the adjusting member 226 away from the spring unit 228 abuts against any block 227. The deformation curvature of the adjusting member 226 can be adjusted by the abutment between the adjusting member 226 and the block 227 until it matches a chip of a specific size, thereby achieving stable clamping of the chip.
[0045] In some embodiments, after the wafer is ground, the employee can take it out of the grinder by hand and directly place it on the tray unit 22. During the rotation, the wafer can be rinsed and dried by water, which can save the steps of manual flushing and drying with an air gun. In order to avoid the accumulation of water in the box body 10, the box body 10 is provided with a first drain pipe 18 and a second drain pipe 19 respectively connected to the upper chamber 11 and the lower chamber 12. Figure 4 As shown, the first drain pipe 18 and the second drain pipe 19 are used to drain the flushing water in time, thereby ensuring the working stability of the wafer drying device and extending its service life.
[0046] In some embodiments, Figure 5 As shown, the window 212 can be used as a drainage window to discharge water out of the spin drying drum 21.
[0047] In other embodiments, Figure 5 As shown, in order to improve the drying and drainage efficiency of the drying drum 21, a plurality of grooves 213 can be opened on the side wall of the drying drum 21. The grooves 213 are arranged along the circumference of the drying drum 21. The window 212 and the grooves 213 jointly play a role in drainage, and the drainage efficiency is higher than that of a single window 212.
[0048] In other embodiments, the side wall of the spin drying drum 21 is provided with slots to form a screen structure, and the screen structure can also achieve the function of the groove 213, but the manufacturing process of the screen structure is more complicated than that of the groove 213.
[0049] In summary, the embodiment of the utility model provides a chip drying device, which respectively sets an upper lifting device module 15 and a lower lifting device module 16 at the upper and lower ends of the drying component 20, and uses the upper lifting device module 15 and the lower lifting device module 16 to realize the lifting and lowering of the drying component 20, so as to facilitate the taking and putting of the chips to be dried. When the drying component 20 is lowered to the shaft hole 211 and matches the rotating shaft 131 of the motor 13, starting the motor 13 can drive the drying component 20 to rotate, so as to dry the chips. In addition, a tray unit 22 is set in the drying cylinder 21 to fix the chips to ensure that the chips will not fall off and be damaged during the drying process. The chip drying tray has a simple structure, uses centrifugal force to dry the moisture on the chips, has high drying efficiency, and does not require manual operation, which can effectively avoid employee injuries, thereby achieving the purpose of reducing costs.
[0050] The above is only a preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the utility model, and these improvements and substitutions should also be regarded as the protection scope of the utility model. The above shows and describes the basic principles, main features and advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above preferred embodiments. The embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the utility model.
[0051] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A wafer drying device, characterized in that: include: A box body, wherein an upper chamber and a lower chamber are provided in the box body, an upper lifting device module is provided at the top of the upper chamber, a lower lifting device module is provided at the bottom of the lower chamber, a limiting cylinder is provided in the upper chamber, and a motor is provided in the lower chamber; as well as The spin-drying component is arranged between the upper lifting device module and the lower lifting device module, and the upper lifting device module and the lower lifting device module can realize the lifting and lowering of the spin-drying component. The spin-drying component includes a spin-drying cylinder and a tray unit arranged in the spin-drying cylinder. The top of the spin-drying cylinder is placed in the limiting cylinder, and the bottom of the spin-drying cylinder is provided with an axial hole corresponding to the rotating shaft of the motor.
2. A wafer drying device according to claim 1, characterized in that: A lateral balancing module is provided in the box along the height direction of the spin-drying drum, and the lateral balancing module is symmetrically arranged on both sides of the spin-drying drum.
3. A wafer drying device according to claim 1, characterized in that: The spin-drying cylinder is a hollow structure, the tray units are in plurality and are arranged at intervals along the axial direction of the spin-drying cylinder, and a window for taking in or putting out materials is provided on the side wall of the spin-drying cylinder.
4. A wafer drying device according to claim 1, characterized in that: The tray unit is fixedly connected to the inner wall of the spin-drying cylinder.
5. The wafer drying device according to claim 1, characterized in that: The inner side wall of the spin-drying cylinder is provided with tray mounting pieces at intervals along the axial direction thereof, and the tray unit is detachably mounted on the tray mounting pieces.
6. A wafer drying device according to claim 3, characterized in that: The tray unit comprises a tray body, the upper surface of which is inwardly recessed to form a wafer placement slot, and a robot entry slot and a drainage hole are provided on the side of the tray body, wherein the robot entry slot corresponds to the window arrangement.
7. A wafer drying device according to claim 6, characterized in that: A symmetrical arc groove is formed in the tray body in the wafer placement groove, an adjusting member is arranged in the arc groove, and a spring unit abutting against the adjusting member is arranged at one end of the arc groove.
8. A wafer drying device according to claim 7, characterized in that: A plurality of clamping blocks are arranged at intervals on the inner wall of the arc groove.
9. The wafer drying device according to claim 1, characterized in that: The side wall of the spin-drying cylinder is also provided with a plurality of grooves, and the grooves are arranged along the circumference of the spin-drying cylinder; or The side wall of the spin-drying cylinder is provided with slots to form a screen structure.
10. The wafer drying device according to claim 1, characterized in that: The box body is provided with a first drain pipe and a second drain pipe which are communicated with the upper chamber and the lower chamber respectively.