Substrate with water-cooling heat dissipation and photovoltaic power module

Abstract

The utility model provides a substrate with water-cooling heat dissipation and a photovoltaic power module, and the substrate comprises a substrate body which comprises opposite heat dissipation welding surfaces. The boss is arranged on the heat dissipation surface of the substrate body; the boss is provided with a plurality of heat dissipation columns. The heat dissipation columns are attached to the heat dissipation surface of the substrate body and are in direct contact with the cooling liquid, so that the contact area of the cooling liquid and the substrate is increased, the heat transfer capacity of the cooling liquid is improved, the heat dissipation performance of the power module is effectively improved, and the efficiency of the photovoltaic inverter is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power module heat dissipation, in particular to a substrate with water cooling and heat dissipation and a photovoltaic power module. Background Art

[0002] With the rapid development of new energy technologies, the grid-connected power generation technology of renewable energy has become a key research direction in the field of power electronics. Among them, high-frequency grid-connected inverters play a vital role in distributed renewable energy systems such as wind power generation and solar photovoltaic power generation. As a key component, the technical requirements of photovoltaic inverters include: the inverter efficiency must be as high as 94% or more, the DC input range must be wide, the maximum power tracking function must be available, the anti-islanding effect function must be available, the waveform distortion rate must be small, TDD < 5%, and it must have high reliability and long life.

[0003] Among these technical requirements, the efficiency of the inverter is increasingly valued, because the improvement of efficiency is directly related to the improvement of economic benefits. One of the key factors that determine the efficiency of photovoltaic inverters is the selection of power electronic devices, mainly including power field effect tubes, namely power MOSFETs and insulated gate bipolar transistors IGBTs. IGBT modules are widely used due to their high reliability and safe working area. However, the heat dissipation performance of power modules is an important factor restricting their development.

[0004] At present, the common IGBT module heat dissipation structure is mainly planar, and heat is directly dissipated through planar printed thermal grease, but the heat dissipation efficiency is too low. Utility Model Content

[0005] Based on the above content, the utility model provides a substrate with water cooling and heat dissipation and a photovoltaic power module, aiming to improve the heat dissipation efficiency of the power module.

[0006] A substrate with water cooling and heat dissipation, comprising:

[0007] The substrate body includes an opposing heat dissipation surface and a welding surface;

[0008] A boss, arranged on the heat dissipation surface of the substrate body;

[0009] The boss is provided with a plurality of heat dissipation columns.

[0010] Furthermore, the cross section of the heat dissipation column is circular.

[0011] Furthermore, the heat dissipation columns are arranged in an array.

[0012] Furthermore, the heat dissipation columns are arranged in a honeycomb array.

[0013] Furthermore, the height of the heat dissipation column is 1-10 mm.

[0014] Furthermore, the boss and the heat dissipation column are integrally formed.

[0015] Furthermore, the material of the heat dissipation column includes copper element.

[0016] Furthermore, the material of the boss includes copper element.

[0017] Furthermore, the thickness of the boss is 0-2 mm.

[0018] A photovoltaic power module, comprising:

[0019] A substrate with water cooling as described above;

[0020] A metallized ceramic substrate having a first surface welded to a welding surface of the substrate body,

[0021] A semiconductor chip and a PIN needle welded to the second surface of the metallized ceramic substrate; and

[0022] A plastic-sealed shell is combined with the substrate body through a sealant.

[0023] The beneficial technical effect of the use of the new type is that the heat dissipation surface of the substrate body is provided with heat dissipation columns, and the heat dissipation columns are in direct contact with the coolant, thereby increasing the contact area between the coolant and the substrate, improving the heat transfer capacity of the coolant, effectively improving the heat dissipation performance of the power module, and further improving the efficiency of the photovoltaic inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1-3 This is a schematic structural diagram of a substrate with water cooling and heat dissipation according to the utility model;

[0025] Figure 4-5 This is a schematic diagram of the structure of a photovoltaic power module of the utility model;

[0026] in,

[0027] 1-Substrate body;

[0028] 2- boss;

[0029] 3- heat dissipation column;

[0030] 4- Heat dissipation surface;

[0031] 5-welding surface;

[0032] 6-Plastic housing;

[0033] 7-PIN;

[0034] 8- Semiconductor chip;

[0035] 9-Metallized ceramic substrate;

[0036] 10- Connect the metal wires. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0039] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0040] join Figure 1-3 The utility model provides a substrate with water cooling and heat dissipation, comprising:

[0041] A substrate body (1) comprises a heat dissipation surface (4) and a welding surface (5) opposite to each other;

[0042] A boss (2) is arranged on the heat dissipation surface of the substrate body (1);

[0043] The boss (2) is provided with a plurality of heat dissipation columns (3).

[0044] The heat dissipation column (3) is attached to the heat dissipation surface of the substrate body (1), and the heat dissipation column (3) is in direct contact with the cooling liquid, thereby increasing the contact area between the cooling liquid and the substrate, improving the heat transfer capacity of the cooling liquid, effectively improving the heat dissipation performance of the power module, and further improving the efficiency of the photovoltaic inverter.

[0045] Furthermore, the cross section of the heat dissipation column (3) is circular.

[0046] The cross section of the heat dissipation column may also be other shapes, such as elliptical, rectangular, square or polygonal, or other irregular shapes.

[0047] Furthermore, the heat dissipation columns (3) are arranged in an array.

[0048] The heat dissipation columns are arranged in a certain pattern at the bottom of the copper substrate of the power module. The heat dissipation columns are in direct contact with the coolant, thereby increasing the contact area for heat dissipation.

[0049] Furthermore, the heat dissipation columns (3) are arranged in a honeycomb array.

[0050] The heat dissipation columns (3) are arranged in a honeycomb array while ensuring that the arrangement gap is appropriate. Compared with an array arranged in rows and columns, the arrangement is more compact, the contact area is larger, and the heat dissipation capacity is stronger. Furthermore, the height of the heat dissipation columns (3) is 1-10 mm.

[0051] Furthermore, the boss (2) and the heat dissipation column (3) are integrally formed.

[0052] That is, the boss (2) and the heat dissipation column (3) are integrally formed by integral casting.

[0053] Furthermore, the substrate body, the boss and the heat dissipation column are formed by integral casting.

[0054] Furthermore, the material of the heat dissipation column (3) contains copper element.

[0055] Furthermore, the material of the boss (2) contains copper.

[0056] Furthermore, the material of the substrate body (1) contains copper elements, and the heat dissipation column (3), the boss (2) and the substrate body (1) can be made of pure copper or copper alloy.

[0057] Furthermore, the thickness of the boss (2) is 0-2 mm.

[0058] Preferably, the boss is a chamfered rectangle.

[0059] A certain number of heat dissipation columns (3) are arranged in an array on the boss within a rectangular range of 85 mm×50 mm.

[0060] Preferably, the area of ​​the boss is 0.1-0.5m 2 between.

[0061] See also Figure 4-5 The utility model also provides a photovoltaic power module, including:

[0062] A substrate with water cooling as described above;

[0063] A metallized ceramic substrate (9) having a first surface welded to a welding surface (5) of the substrate body (1),

[0064] A semiconductor chip (8) and a PIN needle (7) welded to the second surface of the metallized ceramic substrate (9); and

[0065] A plastic-sealed shell (6), wherein the plastic-sealed shell (6) is combined with the substrate body (1) via a sealant.

[0066] The semiconductor chip (8) belongs to a power device chip used in the photovoltaic field.

[0067] Furthermore, the substrate body (1) and the metallized ceramic substrate (9) are welded using Sn solder.

[0068] The photovoltaic power module further comprises a connecting metal wire (10) welded on the semiconductor chip (8) or the metallized ceramic substrate (9).

[0069] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A substrate with water cooling, It is characterized in that include: A substrate body (1) comprises a heat dissipation surface (4) and a welding surface (5) opposite to each other; A boss (2) is arranged on the heat dissipation surface of the substrate body (1); The boss (2) is provided with a plurality of heat dissipation columns (3); The heat dissipation columns (3) are arranged in a honeycomb array; The cross section of the heat dissipation column (3) is an irregular shape; The boss (2) is a chamfered rectangle, and the area of ​​the boss (2) is 0.1-0.5m 2 The heat dissipation columns (3) are arranged in an array on the boss (2) within a rectangular range of 85 mm×50 mm.

2. A substrate with water cooling as claimed in claim 1, It is characterized in that The height of the heat dissipation column (3) is 1-10 mm.

3. A substrate with water cooling as claimed in claim 1, It is characterized in that The boss (2) and the heat dissipation column (3) are integrally formed.

4. A substrate with water cooling as claimed in claim 1, It is characterized in that The material of the heat dissipation column (3) contains copper element.

5. A substrate with water cooling as claimed in claim 1, It is characterized in that The material of the boss (2) contains copper elements.

6. A substrate with water cooling as claimed in claim 1, It is characterized in that The thickness of the boss (2) is 0-2 mm.

7. A photovoltaic power module, It is characterized in that include: A substrate with water cooling as claimed in any one of claims 1 to 6; A metallized ceramic substrate (9) having a first surface welded to a welding surface (5) of the substrate body (1), A semiconductor chip (8) and a PIN needle (7) welded to the second surface of the metallized ceramic substrate (9); and A plastic-sealed shell (6), wherein the plastic-sealed shell (6) is combined with the substrate body (1) via a sealant.

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