Semiconductor light-emitting element and packaging body

Abstract

The utility model discloses a semiconductor light-emitting element and a packaging body, belongs to the technical field of semiconductor light-emitting elements, and aims to solve the problems that heat dissipation is uneven and packaging lacks positioning protection. The semiconductor light-emitting element comprises a substrate, the upper surface of the substrate is provided with a first conductive type semiconductor layer, and the first conductive type semiconductor layer is provided with a light-emitting layer; a second conductive semiconductor layer is arranged on the upper portion of the light-emitting layer, a transparent protection layer is arranged on the upper portion of the second conductive semiconductor layer, and a second bonding pad electrode is arranged on the surface of the lower portion of the second conductive semiconductor layer and arranged on one side of the substrate, the first conductive semiconductor layer and the light-emitting layer. A first bonding pad electrode is arranged on the surface of the lower part of the first conductive type semiconductor layer; according to the utility model, the heat dissipation silicone grease is filled in the heat dissipation groove between the insulating layer and the transparent protective layer, so that heat generated in the semiconductor light-emitting element in the light-emitting process can be effectively and uniformly dissipated, and the heat is prevented from being accumulated in the semiconductor light-emitting element to damage the semiconductor light-emitting element.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting elements, and in particular relates to a semiconductor light emitting element and a packaging body. Background Art

[0002] Light Emitting Diode (LED) is a semiconductor electronic component that can emit light. Epitaxial wafers are the primary finished products in the LED manufacturing process. Existing LED epitaxial wafers include substrates, N-type semiconductor layers, active layers, and P-type semiconductor layers. The substrate is used to provide a growth surface for the epitaxial material, the N-type semiconductor layer is used to provide electrons for compound luminescence, the P-type semiconductor layer is used to provide holes for compound luminescence, and the active layer is used for radiation compound luminescence of electrons and holes.

[0003] A semiconductor light-emitting element and package with patent announcement number CN211629129U in the prior art, the above patent includes a transparent substrate, a semiconductor light-emitting stacking layer, and an insulating layer, the transparent substrate has a first surface, the first surface has a first area covered by the semiconductor light-emitting stacking layer, and the first surface has a second area located around the bottom of the outer wall of the semiconductor light-emitting sequence stacking layer; it is characterized in that: it also includes an annular blocking structure, which is formed on the second area of ​​the first surface, and the blocking structure has an inner side wall and an outer side wall, a groove is formed between the inner side wall and the outer side wall of the semiconductor light-emitting sequence stacking layer, and the groove exposes part of the second area of ​​the first surface of the transparent substrate; the insulating layer covers the top surface and side wall of the semiconductor light-emitting stacking layer, and covers the bottom of the annular groove and the inner side wall and top surface of the positive blocking structure, but there are still the following deficiencies in actual use: from a practical point of view, heat is generated during the light-emitting process of the semiconductor light-emitting element in the patent, and it is difficult to dissipate the generated heat evenly in the patent. If the time is too long, it will cause heat accumulation and damage to it. At the same time, the package in the patent lacks positioning protection for the electrode of the semiconductor light-emitting element, and the packaging process is easy to cause damage to the electrode of the semiconductor light-emitting element.

[0004] Therefore, a semiconductor light emitting element and package are needed to solve the problems of uneven heat dissipation and lack of positioning protection of the package in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor light emitting element and a package to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor light-emitting element and a package, comprising a substrate, wherein the upper surface of the substrate has a first conductive semiconductor layer, the first conductive semiconductor layer has a light-emitting layer, the light-emitting layer has a second conductive semiconductor layer on top, the second conductive semiconductor layer has a transparent protective layer on top, the second conductive semiconductor layer has a second pad electrode on the lower surface and is arranged on one side of the substrate, the first conductive semiconductor layer and the light-emitting layer, the lower surface of the first conductive semiconductor layer has a first pad electrode and is arranged on a side away from the second pad electrode, the first pad electrode and the second pad electrode have an insulating layer on the outside and are arranged on the periphery, a heat dissipation groove is provided between the insulating layer and the transparent protective layer and on the upper part of the second conductive semiconductor layer, and the heat dissipation groove is filled with heat dissipation silicone grease.

[0007] It should be noted in the solution that the substrate is arranged between the first pad electrode and the second pad electrode and its edge is attached to the insulating layer.

[0008] It is further worth noting that the first conductive semiconductor layer is aligned with the edge of the light emitting layer and is disposed within the insulating layer.

[0009] It should be further explained that the edges of the second conductive semiconductor layer are attached to the insulating layer, and the top of the transparent protective layer is a slanted protrusion so that the top cross-section of the heat dissipation groove is larger than the bottom cross-section.

[0010] As a preferred embodiment, the packaging resin covers the top surface and surrounding areas of the semiconductor light-emitting element, a packaging substrate is provided at the bottom of the packaging resin at the bottom of the semiconductor light-emitting element, positioning grooves are provided on the packaging substrate corresponding to the first pad electrode and the second pad electrode, and a protective block is provided on the packaging substrate outside the positioning groove.

[0011] As a preferred embodiment, the packaging substrate is larger than the semiconductor light emitting element, and the packaging resin is laid on the packaging substrate and covers the protection block.

[0012] As a preferred implementation manner, the protection block is disposed around the periphery of the positioning groove and surrounds the periphery of the first pad electrode or the second pad electrode.

[0013] Compared with the prior art, the semiconductor light emitting element and package provided by the utility model have at least the following beneficial effects:

[0014] (1) By filling the heat dissipation groove between the insulating layer and the transparent protective layer with heat dissipation silicone grease, the heat generated inside the semiconductor light-emitting element during the light-emitting process can be effectively and evenly dissipated, preventing the heat from accumulating inside and causing damage to the semiconductor light-emitting element.

[0015] (2) By setting positioning grooves and protective blocks at the positions where the electrodes of the semiconductor light-emitting element are located corresponding to the packaging substrate during packaging, the packaging resin is prevented from invading the interior of the semiconductor light-emitting element and causing damage to the element, while providing corresponding protection for the electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the split structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of a semiconductor light emitting element of the utility model;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the semiconductor light-emitting element of the present utility model.

[0020] In the figure: 101, substrate; 102, first conductive semiconductor layer; 103, light-emitting layer; 104, second conductive semiconductor layer; 105, transparent protective layer; 106, insulating layer; 107, heat dissipation groove; 108, heat dissipation silicone grease; 109, first pad electrode; 110, second pad electrode; 2, packaging resin; 201, packaging substrate; 202, protective block; 203, positioning groove. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the embodiments.

[0022] See also Figure 1-4 The utility model provides a semiconductor light-emitting element and a package, including a substrate 101, wherein the upper surface of the substrate 101 has a first conductive semiconductor layer 102, the first conductive semiconductor layer 102 has a light-emitting layer 103, the light-emitting layer 103 has a second conductive semiconductor layer 104 on the upper part, the second conductive semiconductor layer 104 has a transparent protective layer 105 on the upper part, the second conductive semiconductor layer 104 has a second pad electrode 110 on the lower surface of the second conductive semiconductor layer 104 and is arranged on one side of the substrate 101, the first conductive semiconductor layer 102 and the light-emitting layer 103, the lower surface of the first conductive semiconductor layer 102 has a first pad electrode 109 and is arranged on a side away from the second pad electrode 110, an insulating layer 106 is provided outside the first pad electrode 109 and the second pad electrode 110 and is arranged on the outer periphery, a heat dissipation groove 107 is provided between the insulating layer 106 and the transparent protective layer 105 and on the upper part of the second conductive semiconductor layer 104, and the heat dissipation groove 107 is filled with heat dissipation silicone grease 108.

[0023] Further as Figure 1 , Figure 2 and Figure 3As shown, it is worth to explain in detail that the substrate 101 is arranged between the first pad electrode 109 and the second pad electrode 110 and the edge of the substrate 101 is attached to the insulating layer 106 .

[0024] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth to explain in detail that the first conductive semiconductor layer 102 is aligned with the edge of the light emitting layer 103 and is disposed in the insulating layer 106 .

[0025] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth explaining in detail that the edges of the second conductive semiconductor layer 104 are attached to the insulating layer 106 , and the top of the transparent protective layer 105 is a bevel protrusion so that the top cross-section of the heat dissipation groove 107 is larger than the bottom cross-section, thereby improving the heat dissipation efficiency of the heat dissipation silicone grease 108.

[0026] According to the above working process, it can be known that by filling the heat dissipation silicone grease 108 in the heat dissipation groove 107 between the insulating layer 106 and the transparent protective layer 105, the heat generated internally during the light emission process of the semiconductor light emitting element can be effectively and evenly dissipated to prevent the heat from accumulating inside and causing damage to the semiconductor light emitting element.

[0027] Further as Figure 1 and Figure 2 As shown, it is worth explaining in detail that the packaging resin 2 covers the top surface and all around the semiconductor light emitting element, and a packaging substrate 201 is provided at the bottom of the packaging resin 2 at the bottom of the semiconductor light emitting element, and a positioning groove 203 is provided on the packaging substrate 201 corresponding to the first pad electrode 109 and the second pad electrode 110, and a protective block 202 is provided on the packaging substrate 201 outside the positioning groove 203.

[0028] Further as Figure 1 and Figure 2 As shown, it is worth explaining in detail that the packaging substrate 201 is larger than the semiconductor light emitting element, and the packaging resin 2 is laid on the packaging substrate 201 and covers the protection block 202 .

[0029] Further as Figure 1 and Figure 2 As shown, it is worth to explain in detail that the protection block 202 is arranged around the positioning groove 203 and around the first pad electrode 109 or the second pad electrode 110 to provide protection therefor and prevent them from being damaged.

[0030] This scheme has the following working process: when this device is used, the semiconductor light-emitting element is soldered on the circuit board through the first pad electrode 109 and the second pad electrode 110. When it emits light, the transparent protective layer 105 is set to refract the light and emit it, thereby improving its luminance and range. At the same time, the heat dissipation silicone grease 108 is filled in the heat dissipation groove 107, so that the heat generated during the operation of the semiconductor light-emitting element is discharged on the heat dissipation silicone grease 108. The enlarged top cross-section is set to improve the heat dissipation effect and prevent the internal damage of the semiconductor light-emitting element. When the semiconductor light-emitting element is packaged, the first pad electrode 109 and the second pad electrode 110 are used to position the positioning groove 203 set on the packaging substrate 201, and the first pad electrode 109 and the second pad electrode 110 of the semiconductor light-emitting element are protected by the protective block 202 to prevent its packaging from being damaged and affecting its use. Finally, the packaging resin 2 is covered on the outside of the semiconductor light-emitting element to package it.

[0031] In summary: by filling the heat dissipation silicone grease 108 in the heat dissipation groove 107 between the insulating layer 106 and the transparent protective layer 105, the heat generated internally during the light emission process of the semiconductor light-emitting element can be effectively and evenly dissipated to prevent the heat from accumulating inside and causing damage to the semiconductor light-emitting element. When the semiconductor light-emitting element is packaged, the positioning groove 203 and the protective block 202 are set at the corresponding position of the electrode of the semiconductor light-emitting element at the packaging substrate 201 during packaging, so as to prevent the packaging resin 2 from invading the interior of the semiconductor light-emitting element and causing damage to it during the packaging process, and at the same time provide corresponding protection for the electrode.

Claims

1. A semiconductor light emitting element, comprising a substrate (101), characterized in that: The upper surface of the substrate (101) has a first conductive semiconductor layer (102), the first conductive semiconductor layer (102) has a light-emitting layer (103), the light-emitting layer (103) has a second conductive semiconductor layer (104) on the upper part, the second conductive semiconductor layer (104) has a transparent protective layer (105) on the upper part, and the lower surface of the second conductive semiconductor layer (104) has a second pad electrode (110) disposed between the substrate (101), the first conductive semiconductor layer (102) and the light-emitting layer (103). The first conductive semiconductor layer (102) is provided with a first pad electrode (109) on its lower surface and is arranged on a side away from the second pad electrode (110); an insulating layer (106) is provided on the outer side of the first pad electrode (109) and the second pad electrode (110) and is arranged on the outer periphery; a heat dissipation groove (107) is provided between the insulating layer (106) and the transparent protective layer (105) and on the upper part of the second conductive semiconductor layer (104); and the heat dissipation groove (107) is filled with heat dissipation silicone grease (108).

2. A semiconductor light emitting element according to claim 1, characterized in that: The substrate (101) is arranged between the first pad electrode (109) and the second pad electrode (110), and its edge is attached to the insulating layer (106).

3. A semiconductor light emitting element according to claim 1, characterized in that: The first conductive type semiconductor layer (102) is arranged to be aligned with the edge of the light emitting layer (103) and is arranged inside the insulating layer (106).

4. A semiconductor light emitting element according to claim 1, characterized in that: The edges of the second conductive semiconductor layer (104) are attached to the insulating layer (106) at all sides, and the top of the transparent protective layer (105) is arranged as an inclined protrusion so that the top cross-section of the heat dissipation groove (107) is larger than the bottom cross-section.

5. A package according to any one of claims 1 to 4, comprising a packaging resin (2), characterized in that: The packaging resin (2) covers the top surface and surroundings of the semiconductor light-emitting element, and a packaging substrate (201) is provided at the bottom of the packaging resin (2) at the bottom of the semiconductor light-emitting element. Positioning grooves (203) are provided on the packaging substrate (201) corresponding to the first pad electrode (109) and the second pad electrode (110), and a protective block (202) is provided on the packaging substrate (201) outside the positioning groove (203).

6. A package according to claim 5, characterized in that: The packaging substrate (201) is larger than the semiconductor light emitting element, and the packaging resin (2) is laid on the packaging substrate (201) and covers the protection block (202).

7. A package according to claim 5, characterized in that: The protection block (202) is arranged around the periphery of the positioning groove (203) and around the periphery of the first pad electrode (109) or the second pad electrode (110).

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