Shielding assembly with heat dissipation function and vehicle

Abstract

The utility model relates to the technical field of automobile accessories, in particular to a shielding assembly with a heat dissipation function and a vehicle. The shielding assembly with the heat dissipation function comprises a circuit board, a shielding cover, a first heat conduction piece and a heat dissipation piece, wherein a chip is arranged on the surface of the circuit board; the shielding case is connected with the circuit board, the shielding case forms a shell structure buckled on the chip, and a downward concave groove is formed in one surface, back to the circuit board, of the shielding case, so that a boss is formed on one side, facing the chip, of the shielding case; the first heat conduction piece is clamped between the chip and the boss; the heat dissipation piece is connected with the shielding cover, and a protruding heat dissipation part is formed on the face, back on to the shielding cover, of the heat dissipation piece. According to the utility model, the working temperature heat dissipation requirement of the vehicle-mounted controller chip is met, the chip is ensured to be in an optimal working state, meanwhile, the shielding effect of the chip on external electromagnetic interference can be realized, and the vehicle specification requirement of electromagnetic interference shielding is met, so that the model selection application of a high-power-consumption chip is met, and the performance of the vehicle-mounted controller is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile accessories, in particular to a shielding component with heat dissipation function and a vehicle. Background Art

[0002] The current automotive market is paying more and more attention to the end-user experience, and the functional requirements for vehicle controllers are becoming increasingly rich, which leads to a continuous increase in the power consumption of vehicle controllers, causing the performance of chips and modules integrated in PCBA to decrease as the temperature rises. Therefore, it is necessary to solve the heat dissipation problem of chips and modules. In addition, when high-power chips and modules are working, they will cause radiation interference to surrounding RF-related devices. In order to meet automotive regulations, chips and modules also need to be shielded.

[0003] At present, the shielding cover used in vehicle controllers is mainly used to shield interference because the power consumption is not high and the chip heat generation is not large. The structure can be realized by a simple stamped flat cover. However, this simple shielding cover structure cannot dissipate the heat generated by the high-power chip, and cannot meet the application needs of vehicle controllers with increasingly rich functional requirements and increasing heat generation, thus greatly limiting the selection and application of high-power chips and the functions of vehicle controllers. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide a shielding assembly and a vehicle with a heat dissipation function, so as to solve the problem that the existing shielding cover cannot effectively dissipate the heat generated by the high-power consumption chip.

[0005] The first aspect of the utility model provides a shielding assembly with a heat dissipation function, wherein the shielding assembly with a heat dissipation function comprises:

[0006] A circuit board, a chip is arranged on the surface of the circuit board;

[0007] A shielding cover connected to the circuit board, the shielding cover is formed as a shell structure buckled on the chip, a side of the shielding cover facing away from the circuit board is formed with a downwardly concave groove, so that a side of the shielding cover facing the chip is formed with a boss;

[0008] A first heat conducting member, sandwiched between the chip and the boss;

[0009] A heat sink is connected to the shielding cover, and a protruding heat sink is formed on a side of the heat sink facing away from the shielding cover.

[0010] Preferably, the heat sink is mounted on the top of the shielding cover, the top of the shielding cover is formed into a stepped structure, and at least a portion of the bottom of the heat sink is conformed to the stepped structure.

[0011] Preferably, the heat dissipation portion is arranged on the top of the heat dissipation element, and the heat dissipation portion is formed into a vertically arranged sheet structure;

[0012] Along the protruding direction of the heat dissipation portion on the heat dissipation element, the thickness of the heat dissipation portion gradually decreases.

[0013] Preferably, a plurality of the heat dissipation parts are provided, and the plurality of heat dissipation parts are arranged at intervals in a thickness direction of the heat dissipation part.

[0014] Preferably, the boss is arranged directly above the chip and is arranged in one-to-one correspondence with the chip.

[0015] Preferably, a protruding abutting portion is formed on a side of the heat sink facing the shielding cover, and the abutting portion can extend into the groove.

[0016] Preferably, the shielding component with heat dissipation function further includes:

[0017] The second heat conducting member is sandwiched between the abutting portion and the groove wall of the groove.

[0018] Preferably, the shielding component with heat dissipation function further includes:

[0019] A clamping piece is fixed on the circuit board, and the clamping piece has a clamping claw extending toward the shielding cover, and the clamping claw clamps the side wall of the shielding cover.

[0020] Preferably, a plurality of the clamping members are provided, and the plurality of the clamping members are arranged at intervals around the circumference of the shielding cover.

[0021] A second aspect of the utility model provides a vehicle, comprising a shielding assembly with heat dissipation function as described in any of the above technical solutions.

[0022] Compared with the prior art, the beneficial effects of the utility model are:

[0023] The shielding component with heat dissipation function of the utility model can quickly transfer the heat generated by the chip to the shielding cover by arranging a boss protruding toward the chip and a first heat conductive member clamped between the boss and the chip on the shielding cover. The connection between the heat dissipation member and the shielding cover can realize the rapid removal of the heat on the shielding cover by the heat dissipation part, thereby meeting the operating temperature heat dissipation requirements of the vehicle controller chip and ensuring that the chip is in the best working state. At the same time, the chip can be shielded from external electromagnetic interference and meet the vehicle regulations for shielding electromagnetic interference, thereby meeting the selection and application of high-power consumption chips, improving the performance of the vehicle controller, and giving users a better car experience.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 An exploded view of the structure of a shielding assembly with heat dissipation function provided in an embodiment of the utility model;

[0027] Figure 2 A schematic diagram of the structure of a shielding cover in a shielding assembly with heat dissipation function provided in an embodiment of the utility model;

[0028] Figure 3 A partial structural cross-sectional view of a shielding assembly with heat dissipation function provided in an embodiment of the utility model.

[0029] Icons: 10 - circuit board; 11 - chip; 20 - shielding cover; 21 - groove; 22 - boss; 30 - first heat conducting member; 40 - second heat conducting member; 50 - heat sink; 51 - heat sink; 52 - abutment portion; 60 - clamping member; 61 - clamping claw. DETAILED DESCRIPTION

[0030] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0031] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0032] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, “bound to”, “over”, or “covering” another element, it may be directly “on”, “connected to”, “bound to”, “over”, or “covering” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, “directly bound to”, “directly over”, or “directly covering” another element, there may be no other elements present between them.

[0033] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0034] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, component, region, layer, or portion referred to may also be referred to as the second member, component, region, layer, or portion.

[0035] For ease of description, spatial relational terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0036] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprise" and "have" list the stated features, quantities, operations, components, elements and / or their combinations that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0037] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0038] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0039] According to a first aspect of the present invention, a shielding assembly with a heat dissipation function is provided, which includes a circuit board 10 , a shielding cover 20 , a first heat conducting member 30 and a heat dissipating member 50 .

[0040] In this embodiment, if Figure 1 As shown, a chip 11 is disposed on the surface of the circuit board 10. Specifically, the chip 11 is disposed on the top of the circuit board 10. The chip 11 can be configured as one or more chips according to actual needs. In this embodiment, the chip 11 is a high power consumption chip.

[0041] In this embodiment, if Figures 1 to 3 As shown, the shielding cover 20 is connected to the circuit board 10. Specifically, the shielding cover 20 is formed into a shell structure with an opening, and the opening faces the chip 11 so that the shielding cover 20 is buckled on the circuit board 10 and the chip 11 is arranged in the space surrounded by the shielding cover 20 and the circuit board 10, so that the shielding effect of external electromagnetic interference can be achieved and the automotive regulations for shielding electromagnetic interference can be met. In this embodiment, the shielding cover 20 is formed of iron material, but the material of the shielding cover 20 is not limited to this, as long as it has the effect of shielding electromagnetic interference.

[0042] Furthermore, in this embodiment, if Figure 2 and Figure 3 As shown, a downwardly recessed groove 21 is formed on the side of the shielding cover 20 facing away from the circuit board 10, and the groove 21 is formed by stamping the shell structure, so that a protruding boss 22 is formed on the side of the shielding cover 20 facing the chip 11, thereby shortening the distance between the shielding cover 20 and the chip 11, so that the heat generated by the chip 11 during operation can be quickly conducted to the shielding cover 20.

[0043] In a preferred embodiment, Figure 1 and Figure 3 As shown, the boss 22 is disposed directly above the chip 11 and is disposed one-to-one with the chip 11 , thereby improving the heat conduction effect of the boss 22 on the chip 11 .

[0044] Furthermore, in this embodiment, if Figure 1 and Figure 3 As shown, the first heat conducting member 30 is sandwiched between the chip 11 and the boss 22, so as to fill the gap between the boss 22 and the chip 11, thereby further improving the heat conduction efficiency of the heat generated by the chip 11 during operation to the shielding cover 20. In this embodiment, the first heat conducting member 30 can be a thermal pad, which is first pasted on the boss 22 and then pressed against the chip 11, so that the thermal pad is arranged between the chip 11 and the boss 22 in a compressed state.

[0045] In addition, in this embodiment, Figure 1 and Figure 3 As shown, the heat sink 50 is connected to the shielding cover 20, and a protruding heat sink 51 is formed on the side of the heat sink 50 facing away from the shielding cover 20, so that the heat on the shielding cover 20 can be quickly removed by the heat sink 51, thereby meeting the operating temperature heat dissipation requirements of the high-power chip 11 in the vehicle controller and ensuring that the chip 11 is in the best working state. In addition, in this embodiment, the shielding cover 20 and the heat sink 50 can be assembled by means of snap connection, screw connection, etc.

[0046] Specifically, in this embodiment, Figure 1 and Figure 3 As shown, the heat dissipation portion 51 is arranged on the top of the heat dissipation element 50, and the heat dissipation portion 51 is formed into a vertically arranged sheet structure; along the protruding direction of the heat dissipation portion 51 on the heat dissipation element 50, the thickness of the heat dissipation portion 51 gradually decreases, thereby increasing the heat dissipation area of ​​the heat dissipation portion 51, so that the heat dissipation portion 51 is fully in contact with the air, thereby achieving rapid heat dissipation. It should be noted that the protruding direction of the heat dissipation portion 51 on the heat dissipation element 50 is Figure 3 In the vertical and upward direction under the viewing angle, the thickness direction of the heat dissipation portion 51 is Figure 3 Horizontal direction of viewing angle.

[0047] More specifically, in this embodiment, if Figure 3 As shown, a plurality of heat dissipation parts 51 are provided, and the plurality of heat dissipation parts 51 are arranged at intervals in the thickness direction of the heat dissipation part 51, thereby further improving the heat dissipation effect of the heat dissipation element 50. The plurality of heat dissipation parts 51 are preferably formed to be arranged at equal intervals to ensure uniform heat dissipation.

[0048] In a preferred embodiment, Figure 1As shown, the heat sink 50 is installed on the top of the shielding cover 20, and the top of the shielding cover 20 is formed into a stepped structure. At least part of the bottom of the heat sink 50 is conformed to the stepped structure, that is, at least part of the bottom of the heat sink 50 is also formed into a stepped structure so that it can conform to the stepped structure on the top of the shielding cover 20, so as to increase the contact area between the heat sink 50 and the shielding cover 20 after assembly, thereby increasing the rate at which the heat on the shielding cover 20 is conducted to the heat sink 50. In addition, there are at least two steps in the stepped structure in this embodiment, and the groove 21 is provided on one of the steps of the stepped structure.

[0049] To further improve the heat conduction efficiency of the shielding cover 20 at the location where the chip 11 is disposed, in this embodiment, Figure 3 As shown, a protruding abutting portion 52 is formed on one side of the heat sink 50 facing the shielding cover 20 , and the abutting portion 52 can extend into the groove 21 , thereby increasing the contact area between the heat sink 50 and the shielding cover 20 and improving the heat dissipation effect.

[0050] Furthermore, in this embodiment, if Figure 1 and Figure 3 As shown, the shielding assembly with heat dissipation function also includes a second heat conductive member 40 sandwiched between the abutting portion 52 and the groove wall of the groove 21, so that the second heat conductive member 40 can fill the gap between the abutting portion 52 and the groove 21, thereby improving the heat conduction efficiency. Specifically, in this embodiment, the second heat conductive member 40 can also be a thermal pad, firstly the second heat conductive member 40 is attached to the bottom of the abutting portion 52, and then pressed against the bottom wall of the groove 21, so that the second heat conductive member 40 is arranged between the abutting portion 52 and the groove 21 in a compressed state.

[0051] In addition, in order to improve the shielding effect of the shielding cover 20 and ensure that the shielding cover 20 is reliably connected to the circuit board 10, in this embodiment, Figure 1 and Figure 3 As shown, the shielding component with heat dissipation function also includes a clamping member 60 fixed to the circuit board 10, and the clamping member 60 has a clamping claw 61 extending toward the shielding cover 20. Two clamping claws 61 are provided, and the two clamping claws 61 respectively abut against the inner wall and the outer wall of the shielding cover 20 and apply a predetermined pressure to the shielding cover 20, so that the clamping member 60 clamps the side wall of the shielding cover 20.

[0052] Further, in a preferred embodiment, Figure 1 As shown, a plurality of clamping members 60 are provided, and the plurality of clamping members 60 are arranged at intervals in the circumferential direction around the shielding cover 20 to further ensure that the shielding cover 20 is firmly and reliably connected to the circuit board 10, thereby achieving the best shielding effect.

[0053] It should be noted that, in addition to the fixing method of the shielding cover 20 to the circuit board 10 by the clamp 60, the shielding cover 20 and the circuit board 10 can also be connected in a snap-on manner, as long as the shielding cover 20 and the circuit board 10 are firmly connected.

[0054] According to the shielding component with heat dissipation function of the utility model, by arranging a boss protruding toward the chip on the shielding cover and a first heat conductor clamped between the boss and the chip, the heat generated by the chip can be quickly transferred to the shielding cover. The connection between the heat sink and the shielding cover can realize the rapid removal of the heat on the shielding cover by the heat dissipation part, and a second heat conductor is arranged between the heat sink and the shielding cover to further improve the heat dissipation effect. In this way, the operating temperature heat dissipation requirements of the vehicle controller chip are met, and the chip is ensured to be in the best working state. At the same time, the chip can be shielded from external electromagnetic interference and meet the vehicle regulations for shielding electromagnetic interference, thereby meeting the selection and application of high-power consumption chips and improving the performance of the vehicle controller.

[0055] The second aspect of the utility model provides a vehicle, in which a shielding component with a heat dissipation function installed on the vehicle meets the operating temperature heat dissipation requirements of an on-board controller chip, ensuring that the chip is in the best working state, and at the same time can realize the chip's shielding effect on external electromagnetic interference, meeting the vehicle regulations for shielding electromagnetic interference, thereby meeting the selection and application of high-power consumption chips, improving the performance of the on-board controller, and giving users a better car experience.

[0056] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A shielding component with heat dissipation function, characterized in that: The shielding component with heat dissipation function comprises: A circuit board, a chip is arranged on the surface of the circuit board; A shielding cover connected to the circuit board, the shielding cover is formed as a shell structure buckled on the chip, a side of the shielding cover facing away from the circuit board is formed with a downwardly concave groove, so that a side of the shielding cover facing the chip is formed with a boss; A first heat conducting member, sandwiched between the chip and the boss; A heat sink is connected to the shielding cover, and a protruding heat sink is formed on a side of the heat sink facing away from the shielding cover.

2. The shielding assembly with heat dissipation function according to claim 1, characterized in that: The heat sink is mounted on the top of the shielding cover. The top of the shielding cover is formed into a stepped structure. At least a portion of the bottom of the heat sink is conformed to the stepped structure.

3. The shielding assembly with heat dissipation function according to claim 1, characterized in that: The heat dissipation portion is arranged on the top of the heat dissipation element, and the heat dissipation portion is formed into a vertically arranged sheet structure; Along the protruding direction of the heat dissipation portion on the heat dissipation element, the thickness of the heat dissipation portion gradually decreases.

4. The shielding assembly with heat dissipation function according to claim 1, characterized in that: A plurality of the heat dissipating portions are provided, and the plurality of heat dissipating portions are arranged at intervals in a thickness direction of the heat dissipating portion.

5. The shielding assembly with heat dissipation function according to claim 1, characterized in that: The bosses are arranged directly above the chips and correspond to the chips one by one.

6. The shielding assembly with heat dissipation function according to claim 1, characterized in that: A protruding abutting portion is formed on a side of the heat sink facing the shielding cover, and the abutting portion can extend into the groove.

7. The shielding assembly with heat dissipation function according to claim 6, characterized in that: The shielding component with heat dissipation function also includes: The second heat conducting member is sandwiched between the abutting portion and the groove wall of the groove.

8. The shielding assembly with heat dissipation function according to claim 1, characterized in that: The shielding component with heat dissipation function also includes: A clamping piece is fixed on the circuit board, and the clamping piece has a clamping claw extending toward the shielding cover, and the clamping claw clamps the side wall of the shielding cover.

9. The shielding assembly with heat dissipation function according to claim 8, characterized in that: A plurality of the clamping members are provided, and the plurality of the clamping members are arranged at intervals around the circumference of the shielding cover.

10. A vehicle, characterized in that: A shielding assembly with heat dissipation function comprising any one of claims 1 to 9.

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