Thermal conductivity improving device applied to satellite communication

Abstract

The utility model provides a device for improving heat conductivity applied to satellite communication, which comprises a heat conduction connecting base, the heat conduction connecting base is arranged on a communication antenna heating component through a fixing bolt, a heat dissipation device is arranged on the upper side of the heat conduction connecting base, the heat dissipation device is arranged on the heat conduction connecting base through a fixing bolt, and the heat dissipation device is arranged on the heat conduction connecting base. A plurality of temperature sensors are arranged on one side of the heat conduction connecting base, the heat conduction connecting base comprises a connecting base body, a heat dissipation fin mounting groove is formed in the connecting base body, a plurality of heat dissipation fins are arranged in the heat dissipation fin mounting groove, and the heat dissipation fins are arranged in the heat dissipation fin mounting groove in parallel; according to the utility model, the heat dissipation efficiency of the equipment can be greatly improved, meanwhile, the temperature of the equipment can be accurately acquired, the normal operation of the communication equipment is ensured, and the communication quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of communication equipment, in particular to a device for improving thermal conductivity used in satellite communication. Background Art

[0002] Satellite communication technology is a communication between two or more earth stations using artificial earth satellites as relay stations to forward radio waves. Since the 1990s, the rapid development of satellite mobile communications has promoted the progress of antenna technology. Satellite communication has many advantages, such as wide coverage, large communication capacity, good transmission quality, convenient and rapid networking, and easy to achieve global seamless connection. It is considered to be an indispensable and important means to establish global personal communications.

[0003] A Chinese patent discloses an antenna device with integrated heat dissipation function (patent number: 201510390266.6), which includes a heat dissipation component and an antenna component, wherein the heat dissipation component includes a heat dissipation substrate, and the antenna component includes at least one antenna, which is formed by extending upward from a surface of the heat dissipation substrate and is located at the periphery of the heat dissipation substrate. However, its heat dissipation efficiency is poor. Utility Model Content

[0004] The technical problem solved by the utility model is to provide a device for improving thermal conductivity applied to satellite communications, so as to solve the problems raised in the above-mentioned background technology.

[0005] The technical problem solved by the utility model is achieved by the following technical scheme: a device for improving thermal conductivity used in satellite communication, comprising: a thermally conductive connecting base, the thermally conductive connecting base is installed on a heating component of a communication antenna by fixing bolts, a heat dissipation device is provided on the upper side of the thermally conductive connecting base, the heat dissipation device is installed on the thermally conductive connecting base by fixing bolts, a plurality of temperature sensors are provided on one side of the thermally conductive connecting base, the thermally conductive connecting base comprises a connecting base body, a heat dissipation fin mounting groove is provided in the connecting base body, a plurality of heat dissipation fins are provided in the heat dissipation fin mounting groove, the heat dissipation fins are arranged in parallel in the heat dissipation fin mounting groove, the connecting base body comprises a connecting base shell, a contact bottom plate is provided at the lower end of the connecting base shell, a shell fixing ear is provided on the outer side of the connecting base shell, a plurality of sensor mounting grooves are provided on one side of the connecting base shell, a fin positioning grid plate is provided in the connecting base shell, and the heat dissipation fins are installed on the fin positioning grid plate in the connecting base shell.

[0006] Furthermore, the lower end surface of the thermally conductive connection base is an arc-shaped structure, and the lower end surface of the thermally conductive connection base is in close contact with the heating component of the communication antenna.

[0007] Furthermore, the shell fixing ear is welded and fixed to the connecting seat shell, and a bolt fixing hole is provided on the shell fixing ear.

[0008] Furthermore, the heat dissipation fin is a wave-shaped folded structure, the bottom end of the heat dissipation fin is in close contact with the connection seat body, and the two ends of the heat dissipation fin are in close contact with the connection seat body.

[0009] Furthermore, the heat dissipation device includes fan blades, and the fan blades are mounted on the output end of the fan drive motor and on the motor mounting seat on which the housing of the fan drive motor is mounted.

[0010] Furthermore, the outer end of the motor mounting seat is mounted on the fan mounting seat, and the fan mounting seat is provided with a plurality of connecting and fixing holes.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention can greatly improve the heat dissipation efficiency of the equipment, and at the same time, can accurately collect the temperature of the equipment, ensure the normal operation of the communication equipment, and improve the communication quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of the utility model.

[0013] Figure 2 It is a schematic diagram of the structure of the heat-conducting connection base of the utility model.

[0014] Figure 3 It is a schematic diagram of the structure of the connecting seat body of the utility model.

[0015] Figure 4 It is a schematic diagram of the heat dissipation fin structure of the utility model.

[0016] Figure 5 It is a schematic diagram of the structure of the heat dissipation device of the present utility model. DETAILED DESCRIPTION

[0017] In order to make the technical means for realizing the utility model, creative features, objectives and effects easy to understand, the utility model is further explained below in conjunction with specific diagrams. In the description of the utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection, or an integral connection can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components.

[0018] Example 1

[0019] like Figures 1 to 5As shown, a device for improving thermal conductivity used in satellite communication includes: a heat-conducting connection base 2, the heat-conducting connection base 2 is installed on the heating component of the communication antenna through fixing bolts, a heat dissipation device 3 is provided on the upper side of the heat-conducting connection base 2, the heat dissipation device 3 is installed on the heat-conducting connection base 2 through fixing bolts, a plurality of temperature sensors 3 are provided on one side of the heat-conducting connection base 2, the heat-conducting connection base 2 includes a connection base body 21, a heat dissipation fin mounting groove 22 is provided in the connection base body 21, and the heat dissipation fin mounting groove 22 A plurality of heat dissipation fins 23 are arranged in parallel in the heat dissipation fin mounting groove 22. The connection seat body 21 includes a connection seat shell 211. A contact bottom plate 212 is arranged at the lower end of the connection seat shell 211. A shell fixing ear 215 is arranged on the outer side of the connection seat shell 211. A plurality of sensor mounting grooves 214 are arranged on one side of the connection seat shell 211. A fin positioning grid plate 213 is arranged in the connection seat shell 211. The heat dissipation fins 23 are mounted on the fin positioning grid plate 213 in the connection seat shell 211. The shell fixing ear 215 is welded and fixed on the connection seat shell 211. The shell fixing ear 215 is provided with a bolt fixing hole 216. The heat dissipation fins 23 are a wave-shaped folding structure. The bottom end of the heat dissipation fins 23 is in close contact with the connection seat body 21, and the two ends of the heat dissipation fins 23 are in close contact with the connection seat body 21.

[0020] Example 2

[0021] like Figures 1 to 5 As shown, a device for improving thermal conductivity used in satellite communication includes: a thermally conductive connection base 2, which is installed on a heating component of a communication antenna through fixing bolts, a heat dissipation device 3 is provided on the upper side of the thermally conductive connection base 2, and the heat dissipation device 3 is installed on the thermally conductive connection base 2 through fixing bolts, a plurality of temperature sensors 3 are provided on one side of the thermally conductive connection base 2, and the lower end surface of the thermally conductive connection base 2 is an arc-shaped structure, and the lower end surface of the thermally conductive connection base 2 is in close contact with the heating component of the communication antenna.

[0022] Example 3

[0023] like Figures 1 to 5As shown, a device for improving thermal conductivity used in satellite communication includes: a heat-conducting connection base 2, the heat-conducting connection base 2 is mounted on the heat-generating component of the communication antenna through fixing bolts, a heat sink 3 is provided on the upper side of the heat-conducting connection base 2, the heat sink 3 is mounted on the heat-conducting connection base 2 through fixing bolts, a plurality of temperature sensors 3 are provided on one side of the heat-conducting connection base 2, the heat sink 3 includes a fan blade 31, the fan blade 31 is mounted on the output end of a fan drive motor 32, and the housing of the fan drive motor 32 is mounted on a motor mounting seat 33. The outer end of the motor mounting seat 33 is mounted on a fan mounting seat 34, and the fan mounting seat 34 is provided with a plurality of connection fixing holes 35.

[0024] The thermally conductive connection base 2 of the utility model is installed on the heating component of the communication antenna through fixing bolts, a heat dissipation device 3 is provided on the upper side of the thermally conductive connection base 2, and the heat dissipation device 3 is installed on the thermally conductive connection base 2 through fixing bolts, and a plurality of temperature sensors 3 are provided on one side of the thermally conductive connection base 2, which can greatly improve the heat dissipation efficiency of the equipment. At the same time, the temperature of the equipment can be accurately collected to ensure the normal operation of the communication equipment and improve the communication quality.

[0025] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A device for improving thermal conductivity used in satellite communications, comprising: A heat-conducting connection base (2), wherein the heat-conducting connection base (2) is mounted on a heating component of a communication antenna by means of fixing bolts, and is characterized in that: a heat dissipation device (3) is provided on the upper side of the heat-conducting connection base (2), and the heat dissipation device (3) is mounted on the heat-conducting connection base (2) by means of fixing bolts; a plurality of temperature sensors are provided on one side of the heat-conducting connection base (2); the heat-conducting connection base (2) comprises a connection base body (21), a heat-dissipating fin mounting groove (22) is provided in the connection base body (21), and a plurality of heat-dissipating fins (23) are provided in the heat-dissipating fin mounting groove (22); The heat dissipation fins (23) are arranged in parallel in the heat dissipation fin mounting grooves (22); the connection seat body (21) comprises a connection seat shell (211); a contact bottom plate (212) is provided at the lower end of the connection seat shell (211); a shell fixing ear (215) is provided on the outer side of the connection seat shell (211); a plurality of sensor mounting grooves (214) are provided on one side of the connection seat shell (211); a fin positioning grid plate (213) is provided in the connection seat shell (211); and the heat dissipation fins (23) are mounted on the fin positioning grid plate (213) in the connection seat shell (211).

2. The device for improving thermal conductivity used in satellite communications according to claim 1, characterized in that: The lower end surface of the heat-conducting connection base (2) is an arc-shaped structure, and the lower end surface of the heat-conducting connection base (2) is in close contact with the heating component of the communication antenna.

3. The device for improving thermal conductivity used in satellite communications according to claim 1, characterized in that: The housing fixing ear (215) is welded and fixed on the connecting seat housing (211), and a bolt fixing hole (216) is provided on the housing fixing ear (215).

4. The device for improving thermal conductivity used in satellite communications according to claim 1, characterized in that: The heat dissipation fins (23) are of a wave-shaped folded structure; the bottom ends of the heat dissipation fins (23) are in close contact with the connection seat body (21); and the two ends of the heat dissipation fins (23) are in close contact with the connection seat body (21).

5. The device for improving thermal conductivity used in satellite communications according to claim 1, characterized in that: The heat dissipation device (3) comprises a fan blade (31), wherein the fan blade (31) is mounted on the output end of a fan drive motor (32) and on a motor mounting seat (33) on which a housing of the fan drive motor (32) is mounted.

6. The device for improving thermal conductivity used in satellite communications according to claim 5, characterized in that: The outer end of the motor mounting seat (33) is mounted on the fan mounting seat (34), and the fan mounting seat (34) is provided with a plurality of connection fixing holes (35).

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