Hollow conductive foam wrapping structure

Abstract

The utility model relates to the technical field of conductive foam equipment, in particular to a hollow conductive foam wrapping structure which comprises conductive foam, and conductive adhesive is attached to the conductive foam. One end of the conductive foam is bent to the position above the other end to be overlapped and pasted to the other end to form a hollow structure, or the conductive foam is bent to be located on the same horizontal plane with the other end to be pasted to the conductive adhesive to form a hollow structure. The conductive foam has the effect of improving the convenience of the conductive foam in the operation process.

Description

Technical Field

[0001] The present application relates to the technical field of conductive foam equipment, and in particular to a hollow wrapped conductive foam structure. Background Art

[0002] Since current electronic products need to partially solve the problems of conductivity, grounding, shielding and buffered contact connection of special parts, but there will be a certain gap between the assemblies and the components have a certain combination tolerance, it is necessary to use elastic conductors such as conductive foam to solve the gap tolerance problem and realize the functions of conduction, shielding and buffering.

[0003] The conductive foam published in the Chinese patent with announcement number CN202841826U includes a hollow body, a coating layer and a conductive layer. The hollow body is knitted by non-conductive fibers and has a hollow tubular shape. The cross-section of the hollow body is semicircular. The inner and outer surfaces of the hollow body are provided with a coating layer with a fixed support function, and the coating layer is a thermosetting polyimide resin slurry with a fixing function. The coating layer is applied to the hollow body by spraying or slurrying and then heat-treated and hardened to play a fixing role. After heat treatment and hardening, the coating layer plays a supporting role and fixes the shape. The surface of the coating layer provided on the outer surface of the hollow body is electroplated with a conductive layer, and the conductive layer is made of metal. However, the conductive foam material in this design has been hardened, the compression rate is low, and the height of the conductive foam cannot be changed according to the application scenario.

[0004] The smaller the working height or gap, the higher the compression ratio requirement for the conductive foam, and the greater the compression rebound force. Most of the conductive foams now have a coating structure with a foam core, but the compression rebound force of the conductive foam with a foam core is too large. The all-round conductive foam wrapping has a large rebound force and a low recovery rate when compressed, and the height of the conductive foam cannot be adjusted according to the needs of the application scenario, and the gap cannot be filled well. Utility Model Content

[0005] In order to improve the convenience of conductive foam during use, the present application provides a hollow wrapped conductive foam structure.

[0006] The present application provides a hollow wrapped conductive foam structure, which adopts the following technical solution:

[0007] A hollow wrapped conductive foam structure comprises conductive foam, on which conductive glue is attached, one end of the conductive foam is bent to overlap with the other end and adhered to the other end to form a hollow structure, or the conductive foam is bent to be on the same horizontal plane as the other end and adhered to the conductive glue to form a hollow structure.

[0008] By adopting the above technical solution, the height of the arch formed by the non-overlapping part of the conductive foam is adjusted by changing the overlapping distance from one end of the conductive foam to the top of the other end after it is bent, or by changing the distance from one end of the conductive foam to the other end attached to the conductive adhesive after it is bent. These two coating methods are free from the limitations of the foam core and adopt a hollow wrapping design, which is convenient for changing the height of the conductive foam in response to different working environments, so that the conductive foam can be compressed to a lower position while retaining low resilience.

[0009] In a specific possible implementation manner, one end of the conductive foam is adhered to the top of the other end of the conductive foam through an adhesive layer.

[0010] By adopting the above solution, the adhesive layer can adhere and fix the conductive foam into shape.

[0011] In a specific implementation manner, the adhesive layer is made of a hot melt adhesive film.

[0012] By adopting the above technical solution, hot melt adhesive is a plastic adhesive whose physical state changes with temperature within a certain temperature range, while its chemical properties remain unchanged. It is non-toxic and odorless, and is an environmentally friendly chemical product that can reduce pollution to the environment. At the same time, hot melt adhesive has a short operation time and is easy to paste quickly.

[0013] In a specific possible implementation manner, when the conductive foam is bent to be on the same horizontal plane as the other end, gaps are left at both ends of the conductive foam.

[0014] By adopting the above technical solution, space is provided for the conductive foam to expand when heated, thereby reducing the impact of compression on the conductive foam and facilitating the use of the conductive foam.

[0015] In a specific possible implementation manner, the conductive foam includes a first conductive cloth layer, a second hot melt adhesive layer is adhered to the first conductive cloth layer, a third polyimide film layer is adhered to the first conductive cloth layer through the second hot melt adhesive layer, and the conductive adhesive is adhered to the side of the first conductive cloth layer away from the third polyimide film layer.

[0016] By adopting the above technical solution, the polyimide film is resistant to high temperatures and has stable performance. It is not easy to lose elasticity in a long-term hot and humid environment, and can effectively enhance the life of the conductive foam. Conductive glue is adhered to the conductive cloth layer to facilitate the fixation of the conductive foam during use.

[0017] In a specific implementation manner, the conductive cloth layer is made of conductive cloth having a thickness of 0 to 0.02 mm.

[0018] In a specific embodiment, the polyimide film layer is a polyimide film with a thickness of 0 to 0.02 mm.

[0019] In summary, the present application includes at least one of the following beneficial technical effects:

[0020] 1. The height of the arch formed by the non-overlapping part of the conductive foam is adjusted by changing the overlapping distance from one end of the conductive foam to the other end after it is bent, or by changing the distance from one end of the conductive foam to the other end attached to the conductive adhesive. These two coating methods are free from the limitation of the foam core and adopt a hollow wrapping design, which is convenient for changing the height of the conductive foam in response to different working environments, so that the conductive foam can be compressed to a lower position while retaining low resilience.

[0021] 2. By setting the gaps at both ends of the conductive foam, space is provided for the conductive foam to expand when heated, thereby reducing the impact of compression on the conductive foam and facilitating the use of the conductive foam. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the conductive foam of the embodiment of the present application.

[0023] Figure 2 It is a schematic diagram of the conductive foam wrapping structure of Example 1 of the present application.

[0024] Figure 3 It is a schematic diagram of the conductive foam wrapping structure of Example 2 of the present application.

[0025] Explanation of the reference numerals: 1. conductive foam; 11. conductive cloth layer; 12. hot melt adhesive film layer; 13. polyimide film layer; 14. conductive adhesive; 15. adhesive layer. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-3 This application is described in further detail.

[0027] Embodiment 1:

[0028] The present application discloses a hollow wrapped conductive foam structure, referring to Figure 1 The conductive foam 1 includes a first conductive cloth layer 11, a second hot-melt adhesive film layer 12 is attached to the conductive cloth layer 11, and the first conductive cloth layer 11 is attached to a third polyimide film layer 13 through the second hot-melt adhesive film layer 12. The conductive cloth layer 11, the hot-melt adhesive film layer 12 and the polyimide film layer 13 together constitute the conductive foam 1.

[0029] The conductive cloth layer 11 is made of conductive cloth with a material thickness of 0.02 mm.

[0030] The hot melt adhesive film layer 12 is made of a material having a thickness of 0.05 mm and a pyrolysis temperature of 140 degrees Celsius to 160 degrees Celsius to melt and activate a viscous hot melt adhesive film.

[0031] The polyimide film layer 13 is made of a polyimide film with a material thickness of 0.02 mm.

[0032] The conductive cloth layer 11 needs to be electrostatically dusted before laminating to remove surface dust and enhance the bonding effect. The working temperature is set at an ambient temperature of 140 degrees Celsius to 160 degrees Celsius to activate the viscosity of the hot melt adhesive film layer 12 and laminate the hot melt adhesive film layer 12 on the conductive cloth layer 11. The polyimide film layer 13 also needs to be electrostatically dusted before laminating to ensure the adhesion performance of the conductive cloth layer 11 and the polyimide film layer 13. The polyimide film layer 13 is laminated on the conductive cloth layer 11 with the hot melt adhesive film layer 12, thereby completing the close bonding between the conductive cloth layer 11 and the polyimide film layer 13.

[0033] After the conductive foam 1 is pasted, it is necessary to cover the conductive foam 1. Figure 1 and Figure 2 A conductive adhesive 14 is attached to a surface of the first conductive cloth layer 11 away from the second hot melt adhesive film layer 12, and the conductive adhesive 14 is arranged near one end of the conductive foam 1. The end of the conductive foam 1 away from the conductive adhesive 14 is bent so that the conductive cloth layer 11 is on the outside, and the polyimide film layer 13 is wrapped inside by the conductive cloth layer 11. The end of the conductive foam 1 away from the conductive adhesive 14 is bent to above the end with the conductive adhesive 14, and the conductive cloth layer 11 is adhered to the polyimide film layer 13 through the adhesive layer 15 to form a hollow coating structure, and the non-overlapping part of the conductive foam 1 forms an arch. In this embodiment, the adhesive layer 15 is adhered with a hot melt adhesive film.

[0034] This method can be used to adjust the height of the arch formed by the non-overlapping part of the conductive foam 1 by changing the overlapping distance from one end of the conductive foam 1 to the other end according to the needs of the application scenario. At the same time, this coating method is free from the limitation of the foam core and adopts a hollow wrapping design. It can compress the lower position while retaining low resilience. The minimum compression is 0.2 mm, and the compression force is less than 80 grams. It can be more than 2 times higher than the actual compression position to better fill the gap. When compressed back to 0.3 to 0.4 mm, the resistance value is less than 0.2 ohms. In addition, the polyimide film is resistant to high temperatures and has stable performance. It is not easy to lose elasticity in a long-term hot and humid environment. It can effectively enhance the life of the conductive foam 1 and facilitate the use of the conductive foam 1.

[0035] Embodiment 2:

[0036] The difference between the present embodiment and embodiment 1 is that: Figure 3After the conductive foam 1 is pasted, the conductive adhesive 14 is pasted on the side of the first conductive cloth layer 11 away from the second hot melt adhesive film layer 12, and the end of the conductive foam 1 away from the conductive adhesive 14 is bent so that the conductive cloth layer 11 is on the outside, and the polyimide film layer 13 is wrapped on the inside by the conductive cloth layer 11, and the end of the conductive foam 1 away from the conductive adhesive 14 is bent to be parallel to the end pasted with the conductive adhesive 14 and on the same horizontal plane, and the conductive cloth layer 11 is pasted on the conductive adhesive 14, and the part of the conductive foam 1 not pasted on the conductive adhesive 14 forms an arch, and when the two ends of the conductive foam 1 are pasted on the conductive adhesive 14, a gap is left between the two ends to form a hollow coating structure.

[0037] This method can be used to adjust the height of the arch formed by the non-overlapping part of the conductive foam 1 by changing the distance from one end of the conductive foam 1 to the other end attached to the conductive adhesive 14 according to the needs of the application scenario. At the same time, this coating method is also free from the limitation of the foam core. The hollow wrapping design can compress the lower position while retaining the low resilience, and can be more than 2 times higher than the actual compression position to better fill the gap. When the two ends of the conductive foam 1 are attached to the conductive adhesive 14, there is a gap between the two ends, which provides space for thermal expansion when the conductive foam 1 is heated, reduces the impact on the compression of the conductive foam 1, and facilitates the use of the conductive foam 1.

[0038] The implementation principle of the embodiment of the present application is as follows: when double-layer overlapping coating is performed, one end of the conductive foam 1 is bent to the top of the other end, and the conductive cloth layer 11 is attached to the polyimide film layer 13, and the height of the non-overlapping conductive foam 1 is changed by adjusting the range of the two ends overlapping. When single-layer gap coating is performed, one end of the conductive foam 1 is bent to be parallel to the other end and aligned on the same horizontal plane, and at the same time attached to the conductive adhesive 14, and the arch height of the non-overlapping part of the conductive foam 1 is changed by adjusting the gap between the two ends. Both coating structures can adjust the height of the arch of the conductive foam 1 according to the needs of the application scenario, and at the same time, the use of the foam core can be separated, which can better make up for the gap and facilitate the use of the conductive foam 1.

[0039] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A hollow wrapped conductive foam structure, characterized in that: It comprises a conductive foam (1), onto which a conductive adhesive (14) is attached, and one end of the conductive foam (1) is bent to overlap with the other end and adhered to the other end to form a hollow structure, or the conductive foam (1) is bent to be on the same horizontal plane as the other end and adhered to the conductive adhesive (14) to form a hollow structure.

2. A hollow wrapped conductive foam structure according to claim 1, characterized in that: One end of the conductive foam (1) is adhered to the top of the other end of the conductive foam (1) via an adhesive layer (15).

3. A hollow wrapped conductive foam structure according to claim 2, characterized in that: The adhesive layer (15) is made of a hot melt adhesive film.

4. The hollow wrapped conductive foam structure according to claim 1, characterized in that: When the conductive foam (1) is bent to be on the same horizontal plane as the other end and adhered to the conductive adhesive (14), gaps are left at both ends of the conductive foam (1).

5. The hollow wrapped conductive foam structure according to claim 1, characterized in that: The conductive foam (1) comprises a first conductive cloth layer (11), a second hot-melt adhesive film layer (12) being adhered to the first conductive cloth layer (11), a third polyimide film layer (13) being adhered to the first conductive cloth layer (11) via the second hot-melt adhesive film layer (12), and the conductive adhesive (14) being adhered to the side surface of the first conductive cloth layer (11) away from the third polyimide film layer (13).

6. A hollow wrapped conductive foam structure according to claim 5, characterized in that: The first conductive cloth layer (11) uses conductive cloth with a thickness of 0 to 0.02 mm as the first conductive cloth layer (11).

7. The hollow wrapped conductive foam structure according to claim 5, characterized in that: The third polyimide film layer (13) is a polyimide film with a thickness of 0 to 0.02 mm.

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