Miniature high and low temperature test box based on semiconductor thermoelectric effect
Through the micro high and low temperature test chamber based on semiconductor thermoelectric effect, the semiconductor thermoelectric components and aluminum radiator are used to solve the problems of large volume and high power consumption of existing high and low temperature test chambers, and fast and accurate temperature control is achieved, suitable for Small quantity verification, small size and light weight, suitable for small volume products such as infrared detectors.
Patent Information
- Application Number
- CN202323611727.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2033-12-28
AI Technical Summary
The existing high and low temperature test chambers have large volume and high power consumption, which cannot meet the needs of small verification or power consumption limitations, and are complex in structure and high in cost.
Using a miniature high and low temperature test chamber based on semiconductor thermoelectric effect, a semiconductor thermoelectric component and an aluminum radiator are used, combined with PID control and PT100 temperature sensor, to achieve fast and accurate temperature control, reducing the size and weight of the equipment.
It realizes the accuracy and rapidity of temperature control, reduces power consumption and cost, and is suitable for rapid high and low temperature tests of small-volume products, small size and light weight, and is suitable for small-scale verification such as infrared detectors.
Smart Images
Figure CN222196986U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high and low temperature circulation and constant temperature and humidity, in particular to a micro high and low temperature test box based on semiconductor thermoelectric effect. Background Art
[0002] In the research, development and production of semiconductor optoelectronic devices, since most devices are sensitive to ambient temperature and various performance indicators vary greatly with temperature, high and low temperature performance tests are required to ensure product reliability.
[0003] In actual production applications, the traditional compressor-type high and low temperature test chambers in the market have high power consumption, large size, and are relatively bulky. They are often used in mass production operations, but some small-scale verification tests or scenes limited by power consumption cannot be adapted. The working principle of the traditional compressor-type high and low temperature test chamber is the same as that of the air conditioner. It is mainly composed of a compressor, an evaporator, a condenser, and an exhaust fan. During cooling, the compressor compresses the condensing agent into a liquid state, and the condensing agent absorbs heat through the evaporator and then takes the heat to the condenser through the pipeline and discharges it outdoors. During heating, the condensing agent flows in the opposite direction, and the liquid refrigerant flows to the outdoor unit to absorb heat and become a gas. The formed gas refrigerant flows to the indoor unit and returns to a liquid state after releasing heat indoors, thus completing the heating. This working process requires a series of energy transfers, with large energy loss and low effective power; the equipment must be equipped with a compressor, a condenser, an evaporator, and a condensation pipeline. The equipment is heavy, large in size, and has high power; in addition, the compressor should not be started and switched too frequently, and the condensing agent gas-liquid conversion time is long, which prolongs the cooling and heating time.
[0004] For example, the utility model with application number 201921182090.5 discloses a high and low temperature test box, including a bottom plate, a moving wheel, a test cabinet, a cabinet door, an observation window, a rack, an installation cabinet, an operation panel, a water overflow hole, a water level observation line, a water injection port, a drain port, a drive motor, a rotating shaft, a fan blade, a first mesh plate, a heating tube, an evaporation tube, a servo motor, a second mesh plate, a cylinder, a piston rod, a clamp, a water tank, a water guide pipe, a circulating water pump, a fixed frame and an annular water cooling pipe, the bottom four corners of the bottom plate are hinged with moving wheels, a test cabinet is provided on one side of the top of the bottom plate, and an installation cabinet is provided on the other side of the top of the bottom plate, the top middle of the test cabinet is fixed with a rack by bolts, the inner wall of the rack is welded with a drive motor, and the output end of the drive motor is connected to the rotating shaft, the utility model has a simple structure, good test effect, good fixing effect on the test piece, and can achieve uniform distribution of temperature in all directions of the test piece. However, the high and low temperature test box has a complex structure, a large volume, a high production cost, and is inconvenient to move and use.
[0005] For example, the utility model with application number 201720097443.6 relates to the technical field of experimental equipment, and in particular to a high and low temperature test chamber, including a chamber, a high temperature chamber and a low temperature chamber are arranged in the chamber, a heating chamber is arranged at one end of the high temperature chamber, a heating mechanism is arranged in the heating chamber, a closed door A and a driving mechanism A for driving the closed door A to open or close are arranged between the heating chamber and the high temperature chamber; a refrigeration chamber is arranged at one end of the low temperature chamber, a refrigeration mechanism is arranged in the refrigeration chamber, a closed door B and a driving mechanism B for driving the closed door B to open or close are arranged between the low temperature chamber and the refrigeration chamber; the chamber is also provided with a control panel, and the driving mechanism A and the driving mechanism B are both electrically connected to the control panel; the high temperature chamber is provided with a temperature sensor A, and the low temperature chamber is provided with a temperature sensor B, and the temperature sensor A and the temperature sensor B are both electrically connected to the control panel. The utility model can control the temperature of the high temperature chamber and the low temperature chamber within a controllable range, so that the temperature of the high temperature chamber and the low temperature chamber is in a stable state. However, the test chamber is composed of a high temperature chamber and a low temperature chamber to form a high and low temperature test chamber, which is large in size, and needs to be provided with two sets of heating and cooling systems, and the overall cost is high.
[0006] For example, the utility model with application number 201920226321.1 involves a high and low temperature test chamber, specifically a miniature high and low temperature test chamber for rapid high and low temperature testing of infrared detectors. The utility model solves the problems that traditional high and low temperature test chambers cannot meet the requirements of rapid high and low temperature testing of infrared detectors, have poor reliability in use, high power consumption, high noise, and high cost. A miniature high and low temperature test chamber for rapid high and low temperature testing of infrared detectors, including a miniature box, a left three-stage semiconductor refrigeration plate, a right three-stage semiconductor refrigeration plate, a left inner heat sink, a right inner heat sink, a left inner fan, a right inner fan, a left outer heat sink, a right outer heat sink, a left outer fan, a right outer fan, a thermostat, a cover plate, an upper circular glass sheet, a lower circular glass sheet, and a locking screw. The utility model is suitable for rapid high and low temperature testing of infrared detectors, and is also suitable for rapid high and low temperature testing of other small-volume products (such as ultraviolet detectors or various sensors). However, the overall structure of the utility model is complex and the cost is high, so it is not suitable for promotion. Utility Model Content
[0007] In view of the technical problems of large size and high power consumption of existing high and low temperature test chambers, the utility model proposes a miniature high and low temperature test chamber based on semiconductor thermoelectric effect, which has precise temperature control, fast heating and cooling, small size and light weight.
[0008] In order to achieve the above-mentioned purpose, the technical solution of the utility model is implemented as follows: a micro high and low temperature test chamber based on semiconductor thermoelectric effect, including a chassis, a constant temperature chamber is arranged on the upper side of the chassis, a power supply control module and a heat dissipation module are arranged on the lower side of the chassis, the constant temperature chamber includes an indoor radiator, an indoor DC fan and a semiconductor thermoelectric component, the indoor radiator is arranged at the bottom of the constant temperature chamber, the semiconductor thermoelectric component is arranged in the hole groove of the indoor radiator, the indoor DC fan is arranged at the top of the constant temperature chamber, the heat dissipation module is arranged at the bottom of the semiconductor thermoelectric component, and the indoor radiator, the indoor DC fan, the semiconductor thermoelectric component and the heat dissipation module are all connected to the power supply control module.
[0009] The power supply control module includes a temperature sensor, a display panel and a control power supply. The temperature sensor is arranged on one side of the constant temperature room, the display panel is arranged on the outside of the chassis, the control power supply is arranged inside the chassis, and the indoor radiator, indoor DC fan, semiconductor thermoelectric component, heat dissipation module, temperature sensor and display panel are all connected to the control power supply.
[0010] The control power supply comprises a power supply battery and a PID control center, and the indoor radiator, indoor DC fan, semiconductor thermoelectric component, heat dissipation module, temperature sensor, display panel and power supply battery are all connected to the PID control center.
[0011] The indoor radiator is an aluminum radiator, and heat dissipation teeth are arranged on the upper and lower sides of the aluminum radiator.
[0012] The power supply battery is a bidirectional constant temperature controlled power supply.
[0013] The heat dissipation module comprises an outdoor heat sink and an outdoor DC fan. The outdoor heat sink is arranged at the bottom of the semiconductor thermoelectric component, and the outdoor DC fan is arranged at the bottom of the chassis. The outdoor DC fan corresponds to the semiconductor thermoelectric component.
[0014] An air inlet is arranged on the top of the constant temperature chamber, an air outlet is arranged on the right side of the constant temperature chamber, valves are arranged on the outsides of the air inlet and the air outlet, and an optical fiber outlet and a device power connection port are arranged on one side of the constant temperature chamber.
[0015] An upper cover is arranged outside the constant temperature chamber, the upper cover is movably connected to the lower half of the chassis through a hinge, the lower half of the chassis is provided with a chassis lock, and the upper cover is connected to the chassis lock.
[0016] The semiconductor thermoelectric component is a semiconductor thermoelectric component based on the Peltier effect of a semiconductor.
[0017] Heat insulation cotton is arranged inside the constant temperature chamber.
[0018] The beneficial effects of the utility model are as follows: the utility model applies the Peltier effect of semiconductors, that is, a pair of thermocouples are composed of N and P type materials. When a direct current is passed into the thermocouple, heat absorption and heat release phenomena will occur at the thermocouple junction due to the different directions of the direct current passing. In this process, the heat is transferred from one side of the semiconductor thermoelectric component to the other side through the PN junction, and then the heat is taken away by the closely attached radiator. During the whole process, the semiconductor thermoelectric component has low power consumption, can start working quickly, has fast energy transfer, does not require a large space, and the control power supply adopts PID algorithm, which can accurately control the temperature in combination with the PT100 temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 This is the schematic diagram of the Peltier thermoelectric effect.
[0021] Figure 2 It is a schematic diagram of the principle of the utility model.
[0022] Figure 3 A schematic diagram of the internal structure of the utility model.
[0023] Figure 4 External schematic diagram of the utility model.
[0024] In the figure, 1 is a semiconductor thermoelectric component, 2 is an indoor radiator, 3 is an outdoor radiator, 4 is an outdoor DC fan, 5 is a PT100 temperature sensor, 6 is an optoelectronic device, 7 is a bidirectional constant temperature control power supply, 8 is a chassis, 9 is an indoor DC fan, 10 is a display panel, 11 is a chassis lock, 12 is an optical fiber outlet, 13 is a device power connection port, 14 is an air inlet, 15 is an air outlet, 16 is a constant temperature chamber, and 17 is an upper cover. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] like Figure 3As shown, a micro high and low temperature test box based on semiconductor thermoelectric effect includes a chassis 8, a constant temperature chamber 16 is arranged on the upper half of the chassis 8, a power supply control module and a heat dissipation module are arranged on the lower half of the chassis 8, the constant temperature chamber 16 includes an indoor radiator 2, an indoor DC fan 9 and a semiconductor thermoelectric component 1, the indoor radiator 2 is arranged at the bottom of the constant temperature chamber 16, the semiconductor thermoelectric component 1 is arranged in the hole groove of the indoor radiator 2, the indoor DC fan 9 is arranged at the top of the constant temperature chamber 16, the heat dissipation module is arranged at the bottom of the semiconductor thermoelectric component 1, and the indoor radiator 2, the indoor DC fan 9, the semiconductor thermoelectric component 1 and the heat dissipation module are all connected to the power supply control module. The chassis 8 is mainly used to place the power supply control module and the heat dissipation module, and the constant temperature chamber 16 is mainly used to provide an experimental space for the optoelectronic device 6. The power supply control module is mainly used to control the electronic components in the device, and the heat dissipation module is mainly used to cool the semiconductor thermoelectric component 1 to ensure the temperature of the constant temperature chamber 16 is stable.
[0027] Specifically, the semiconductor thermoelectric component 1 can produce the Peltier thermoelectric effect. The Peltier thermoelectric effect is a conversion effect between temperature difference and voltage. When direct current passes through, the material with thermoelectric energy conversion characteristics can produce a temperature difference, and when the positive and negative poles of the direct current are interchanged, the hot and cold surfaces on the top and bottom sides of the semiconductor thermoelectric component 1 will also be exchanged, that is, the hot surface becomes the cold surface, and the cold surface becomes the hot surface. By controlling the voltage, the semiconductor thermoelectric component 1 can be controlled to heat up or cool down. The semiconductor thermoelectric component 1 is affected by the melting point of the solder in its own internal structure and the manufacturing process. The hot surface of conventional components on the market cannot exceed 90°C, and the maximum temperature difference between the hot and cold surfaces is about 70°C. Therefore, under the condition of an ambient temperature of 25°C, based on the use experience of semiconductor thermoelectric components in other fields, the reasonable use temperature range that can be achieved in the high and low temperature test chamber is -20 to 90°C, and in the field of optoelectronic applications, the temperature is often -15 to 85°C, which fully meets the use conditions. Figure 1 As shown, when direct current is connected as shown in Figure a on the left, the H side absorbs heat and becomes the cold side, and the Z side releases heat and becomes the hot side; but when the polarity of the DC power supply is reversed as shown in Figure b on the right, the H side becomes the hot side and the Z side becomes the cold side. This characteristic is that the cold side becomes the hot side and the hot side becomes the cold side by changing the positive and negative poles of the power supply.
[0028] The indoor radiator 2 is attached to the top of the semiconductor thermoelectric component 1 through thermally conductive silica gel. When the semiconductor thermoelectric component 1 heats up, the indoor radiator 2 can help the semiconductor thermoelectric component 1 to quickly transfer heat to the optoelectronic device 6. The indoor radiator 2 is an aluminum radiator with heat dissipation teeth. Since the aluminum radiator surface has heat dissipation teeth, the heat dissipation area can be effectively increased, thereby accelerating the cooling speed. The indoor DC fan 9 is mainly used for stirring, and the gas in the constant temperature chamber 16 can be circulated to keep the indoor temperature balanced.
[0029] The power supply control module includes a temperature sensor 5, a display panel 10 and a control power supply, wherein the temperature sensor 5 is arranged on one side of the constant temperature room 16, the display panel 10 is arranged outside the chassis 8, and the control power supply is arranged inside the chassis 8. The control power supply includes a power supply battery and a PID control center, and the indoor radiator 2, the indoor DC fan 9, the semiconductor thermoelectric component 1, the heat dissipation module, the temperature sensor 5, the display panel 10 and the power supply battery are all connected to the PID control center.
[0030] Among them, the temperature sensor 5 is a PT100 temperature sensor mainly used to monitor the temperature in the constant temperature room 16 in real time, and the display panel 10 is mainly used to display the temperature information in the constant temperature room 16 in real time. At the same time, the staff can input the required temperature through the display panel 10, and then adjust the temperature in the constant temperature room 16. The control power supply is a bidirectional constant temperature control power supply 7, which has the function of AC to DC conversion and automatic control of positive and negative bidirectional output, and also has the function of PID algorithm to dynamically control the power size. The bidirectional constant temperature control power supply 7 needs to have 220V (AC) to 12V (DC), automatic control of positive and negative bidirectional output function, and accurate temperature control, up to ±0.1℃.
[0031] The heat dissipation module includes an outdoor radiator 3 and an outdoor DC fan 4. The outdoor radiator 3 is attached to the bottom of the semiconductor thermoelectric component 1 through thermally conductive silicone. The outdoor DC fan 4 is arranged at the bottom of the chassis 8. The outdoor DC fan 4 corresponds to the semiconductor thermoelectric component 1. The outdoor radiator 3 is mainly used to conduct and accelerate the heat accumulated on the outdoor side of the semiconductor thermoelectric component 1. The outdoor DC fan 4 diffuses the heat generated by the semiconductor thermoelectric component 1 outward.
[0032] like Figure 4 As shown, in order to ensure that the constant temperature chamber 16 is airtight, heat insulation cotton is arranged inside the constant temperature chamber 16. An air inlet 14 is arranged on the top of the constant temperature chamber 16, and an air outlet 15 is arranged on the right side of the constant temperature chamber 16. Valves are arranged on the outside of the air inlet 14 and the air outlet 15. In the process of cooling the constant temperature chamber 16, water vapor in the air will be condensed by condensation. Therefore, when starting the refrigeration, it is necessary to first introduce compressed air filtered by the dryer through the air inlet 14, and remove the original air in the constant temperature chamber through the air outlet 15 for dehumidification, or vacuum can be drawn through the air outlet 15.
[0033] A fiber outlet 12 and a device power port 13 are provided on one side of the constant temperature chamber 16. The fiber outlet 12 is mainly used to provide an optical fiber light source inlet and outlet for the experimental optoelectronic device 6. The device power port 13 is mainly used to provide power supply and communication control for the optoelectronic device 6.
[0034] The use process of the micro high and low temperature test chamber is as follows:
[0035] S1: Turn on the power, put the optoelectronic device 6 into the constant temperature chamber 16 of the high and low temperature test box, connect the power, connect the optoelectronic device 6 through the optical fiber outlet 12, after confirming that everything is correct, close the constant temperature chamber cover 17 and lock it with the chassis lock 11, and turn on the power through the display panel 10.
[0036] S2: Dehumidify the constant temperature chamber 16. Compressed air filtered by a dryer is introduced from the air inlet 14 of the constant temperature chamber 16, and the original air in the constant temperature chamber is discharged from the air outlet 15 for dehumidification, or vacuum dehumidification can be performed.
[0037] S3: Set the temperature of the constant temperature chamber 16. Set the required temperature of the high and low temperature test chamber on the display panel 10 interface, and start the power after confirmation, and the test chamber starts to cool down or heat up.
[0038] S4: After the measured temperature of the test box reaches the set temperature and the temperature displayed on the display panel 10 is stable, the optoelectronic device 6 test and other experiments can be carried out.
[0039] S5: After the high and low temperature test is completed, open the high and low temperature test chamber, turn off the power, remove the components, organize the materials, and complete the experiment.
[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A micro high and low temperature test chamber based on semiconductor thermoelectric effect, characterized in that: The invention comprises a chassis (8), a constant temperature chamber (16) is arranged on the upper side of the chassis (8), a power supply control module and a heat dissipation module are arranged on the lower side of the chassis (8), the constant temperature chamber (16) comprises an indoor radiator (2), an indoor DC fan (9) and a semiconductor thermoelectric component (1), the indoor radiator (2) is arranged at the bottom of the constant temperature chamber (16), the semiconductor thermoelectric component (1) is arranged in a hole groove of the indoor radiator (2), the indoor DC fan (9) is arranged at the top of the constant temperature chamber (16), the heat dissipation module is arranged at the bottom of the semiconductor thermoelectric component (1), and the indoor radiator (2), the indoor DC fan (9), the semiconductor thermoelectric component (1) and the heat dissipation module are all connected to the power supply control module.
2. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 1 is characterized in that: The power supply control module comprises a temperature sensor (5), a display panel (10) and a control power supply, wherein the temperature sensor (5) is arranged on one side of the constant temperature room (16), the display panel (10) is arranged on the outside of the chassis (8), the control power supply is arranged inside the chassis (8), and the indoor radiator (2), the indoor DC fan (9), the semiconductor thermoelectric component (1), the heat dissipation module, the temperature sensor (5) and the display panel (10) are all connected to the control power supply.
3. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 2 is characterized in that: The control power supply comprises a power supply battery and a PID control center, and the indoor radiator (2), the indoor DC fan (9), the semiconductor thermoelectric component (1), the heat dissipation module, the temperature sensor (5), the display panel (10) and the power supply battery are all connected to the PID control center.
4. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 3 is characterized in that: The indoor radiator (2) is an aluminum radiator, and heat dissipation teeth are arranged on the upper and lower sides of the aluminum radiator.
5. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 4 is characterized in that: The power supply battery is a bidirectional constant temperature control power supply (7).
6. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to any one of claims 3 to 5, characterized in that: The heat dissipation module comprises an outdoor heat sink (3) and an outdoor DC fan (4); the outdoor heat sink (3) is arranged at the bottom of the semiconductor thermoelectric component (1); the outdoor DC fan (4) is arranged at the bottom of the chassis (8); and the outdoor DC fan (4) corresponds to the semiconductor thermoelectric component (1).
7. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 6 is characterized in that: The constant temperature chamber (16) is provided with an air inlet (14) at the top, an air outlet (15) is provided on the right side of the constant temperature chamber (16), valves are provided on the outsides of the air inlet (14) and the air outlet (15), and an optical fiber outlet (12) and a device electrical connection port (13) are provided on one side of the constant temperature chamber (16).
8. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 7 is characterized in that: An upper cover (17) is arranged outside the constant temperature chamber (16), and the upper cover (17) is movably connected to the lower half of the chassis (8) via a hinge. The lower half of the chassis (8) is provided with a chassis lock (11), and the upper cover (17) is connected to the chassis lock (11).
9. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 8, characterized in that: The semiconductor thermoelectric component (1) is a semiconductor thermoelectric component based on the Peltier effect of a semiconductor.
10. The micro high and low temperature test chamber based on semiconductor thermoelectric effect according to claim 8 or 9, characterized in that: Heat insulation cotton is arranged inside the constant temperature chamber (16).